12. 曝 光 光阻製程評估與品管 硬 烤 PEB PED 顯 影 DRM DE 光阻性能評估 Resolution Process Window Thermal Stability … ...
13. 封裝技術與材料之關係 Solder Joint Sollsder Bal and Tacky Flux Soldermask Polyimide Flex Laminate and BT/Glass Laminate Thermal Interface Material Silver Filled Epoxy Die Attach Gold Bond Wires Epoxy Overmold or Encapsulant W20.088nw-standardarray STANDARD ARRAY PACKAGE MATERALS
14. Connection Type IC Substrate Metal : leadfrme Ceramic : Al 2 O 3 PCB : FR-4, BT Wire bonding Flip Chip BGA Conductive Paste gold wire Die attach adhesive underfill ACF or NCF
25. LED 產品 傳統 LED 燈泡 指示燈 高亮度 LED 燈泡 交通號誌 超高亮度 LED( 食人魚 ) 汽車煞車燈 裝套產品 ( 指示燈驗鈔筆 ) 表面黏著型 LED 手機背光源 LED 顯示器
26. Ink-jet Printing PLED Display cell phone 2 x 3 cm, 60 x 90 pixels PI 110 um Pixel 220 um PPV layers under PEDOT 0.1 um thick ITO Monochrome Display Layout Color Display Layout PI 35 um Pixels 75 um