Introduction to IEEE STANDARDS and its different types.pptx
Electrodeposition of Indium Sulfide
1. SUMMER RESEARCH 2013
TO-DO LIST
Maqsood Ali Mughal
50266185
06/18/2013
2013 Summer Weekly Research Meeting
June 18th
, 2013
Electronics Lab LSW 156
Arkansas State University
Advisor: Dr. Robert Engelken
2. Reported Papers on Electrodeposition of Semiconductor Thin Films with Crack Morphology
Semiconductor
Material
Electrolyte
Potential Cause for Cracks
Thickness
Incorporation of
solutes with
Solvent/addition
of agent
Substrates
%
composition
of precursor
Chemicals
Solvent Deposition
Temperature
Deposition
Voltage
Current
Density
Piezoelectric
Effect
Surface
Contamination
CdS1 Organic √
CdS2 DEG-water
mixtures
√
√
Si3 Ionic Liquid √ √ √
Bi2S3
4
Organic √
CIGS5 Aqueous √
CdS6 Organic √ √
Cu-Ga-Se7 Aqueous √ √
CdSe8 Aqueous
√
√
4. 2. AVOIDING SURFACE
CONTAMINANTS AND CLEANING
PROCEDURES9
1. Immersed substrate in soapy water bath for 10
min. Use brush to rub the surface clean. Rinse it
with distilled water and dry it.
2. Immersed the substrate in acetone and sonicate it
for 10 min
3. Remove the substrate from the beaker and blow
dry it.
4. Repeat step 2 with isopropanol
5. Remove the substrate, rinse it with distilled
water. Blow dry it.
5. 3. SLIGHT MODIFICATIONS IN
EXPERIMENT
1. Avoiding thermal shock, post-electrodeposition-
treatment process
2. Pre-heating substrate prior to electrodeposition
*Thermal stress occurs because film depositions are usually made above room
temperature. Upon cooling from the deposition temperature to room temperature, the
difference in the thermal expansion coefficients of the substrate and the film cause
thermal stress10
10. REFERENCES
1 H. Chen, et. al., (2011). Electrodeposited Crack-Free CdS Thin Films Using Organic
Solvents. Advance Material Research 194-196, 2404-2408
2. M. Mammodov (2012). Electrodeposition of CdS. International Journal of Thin Films
Science and Technology, 2, 43-53
3. A. Martinez et. al., (2010). Electyrodeposition of Silicon Thin Films from Ionic
Liquids. Electrocemical Society, 25(107), 107-118.
5. V. S. Saji et. al, (2011). CIGS Thin Film Solar Cells by Electrodeposition. Journal of
the Electrochemical Society, 14(2), 61-70.
7. R. Chowdhury et. al., (2012). Characterized of Electrodeposited CIGS Thin Films.
Dhaka University Journal of Science, 60(1), 137-140.
8. H. Wynands et.al., (1991). Improveents in the Structure and Adhesion of
Electrodeposited Thin Film CdSe. American Chemica Society, 3, 143-149
9 Cleaning procedures for glass substrates. INRF
10 http://flipchips.com/tutorial/process/controlling-stress-in-thin-films/
11 http://www.specialtytest.com/pdf/DepositStressBrochure.pdf
Editor's Notes
Intrinsic stress results from the microstructure created in the film as atoms are deposited on the substrate. Tensile stress results from microvoids in the thin film, because of the attractive interaction of atoms across the voids.Figure 1. Tensile stress, conceptual diagram. The film wants to be “smaller” than the substrate because it was “stretched” to fit.
Compressive stress results when heavy ions or energetic particles strike the film during deposition. The impacts are like hitting the film with a hammer, packing the atoms more tightly.
Figure 2.Compressive stress, conceptual diagram. The film wants to be “larger” than the substrate, because it was “compressed” to fit.
