Indium sulfide for solar applications
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Electrodeposition of indium (III) sulfide
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Indium sulfide for solar applications
- 1. SUMMER RESEARCH 2013 TO-DO LIST Maqsood Ali Mughal 50266185 06/18/2013 2013 Summer Weekly Research Meeting June 18th , 2013 Electronics Lab LSW 156 Arkansas State University Advisor: Dr. Robert Engelken
- 2. Reported Papers on Electrodeposition of Semiconductor Thin Films with Crack Morphology Semiconductor Material Electrolyte Potential Cause for Cracks Thickness Incorporation of solutes with Solvent/addition of agent Substrates % composition of precursor Chemicals Solvent Deposition Temperature Deposition Voltage Current Density Piezoelectric Effect Surface Contamination CdS1 Organic √ CdS2 DEG-water mixtures √ √ Si3 Ionic Liquid √ √ √ Bi2S3 4 Organic √ CIGS5 Aqueous √ CdS6 Organic √ √ Cu-Ga-Se7 Aqueous √ √ CdSe8 Aqueous √ √
- 3. 1. SOLVENTS Dimethyl Sulfoxide (DMSO) – b.p. 189o C Dimethyl Formamide (DMF) – b.p. 154o C Triethylene Glycol (TEG) – b.p. 285o C Mixed Solvents (EG, TEG, DMSO, DMF)
- 4. 2. AVOIDING SURFACE CONTAMINANTS AND CLEANING PROCEDURES9 1. Immersed substrate in soapy water bath for 10 min. Use brush to rub the surface clean. Rinse it with distilled water and dry it. 2. Immersed the substrate in acetone and sonicate it for 10 min 3. Remove the substrate from the beaker and blow dry it. 4. Repeat step 2 with isopropanol 5. Remove the substrate, rinse it with distilled water. Blow dry it.
- 5. 3. SLIGHT MODIFICATIONS IN EXPERIMENT 1. Avoiding thermal shock, post-electrodeposition- treatment process 2. Pre-heating substrate prior to electrodeposition *Thermal stress occurs because film depositions are usually made above room temperature. Upon cooling from the deposition temperature to room temperature, the difference in the thermal expansion coefficients of the substrate and the film cause thermal stress10
- 6. 4. Deposition Stress Analyzer11 Tensile Stress Compressive Stress
- 7. 5. MANUAL FOR EDS AND ELEMENTAL MAPPING FEATURE
- 8. 6. ELECTRON BEAM EVAPORATION SYSTEM
- 9. 7. LOOK FOR SCHOLARSHIPS/GRANTS
- 10. REFERENCES 1 H. Chen, et. al., (2011). Electrodeposited Crack-Free CdS Thin Films Using Organic Solvents. Advance Material Research 194-196, 2404-2408 2. M. Mammodov (2012). Electrodeposition of CdS. International Journal of Thin Films Science and Technology, 2, 43-53 3. A. Martinez et. al., (2010). Electyrodeposition of Silicon Thin Films from Ionic Liquids. Electrocemical Society, 25(107), 107-118. 5. V. S. Saji et. al, (2011). CIGS Thin Film Solar Cells by Electrodeposition. Journal of the Electrochemical Society, 14(2), 61-70. 7. R. Chowdhury et. al., (2012). Characterized of Electrodeposited CIGS Thin Films. Dhaka University Journal of Science, 60(1), 137-140. 8. H. Wynands et.al., (1991). Improveents in the Structure and Adhesion of Electrodeposited Thin Film CdSe. American Chemica Society, 3, 143-149 9 Cleaning procedures for glass substrates. INRF 10 http://flipchips.com/tutorial/process/controlling-stress-in-thin-films/ 11 http://www.specialtytest.com/pdf/DepositStressBrochure.pdf
Editor's Notes
- Intrinsic stress results from the microstructure created in the film as atoms are deposited on the substrate. Tensile stress results from microvoids in the thin film, because of the attractive interaction of atoms across the voids.Figure 1. Tensile stress, conceptual diagram. The film wants to be “smaller” than the substrate because it was “stretched” to fit. Compressive stress results when heavy ions or energetic particles strike the film during deposition. The impacts are like hitting the film with a hammer, packing the atoms more tightly. Figure 2.Compressive stress, conceptual diagram. The film wants to be “larger” than the substrate, because it was “compressed” to fit.