Testing strategies for electronics involve various techniques and methodologies to ensure the quality, functionality, and reliability of electronic components, circuits, devices, and systems. Here are some common testing strategies used in the electronics industry: Unit Testing: This involves testing individual electronic components, such as resistors, capacitors, transistors, integrated circuits (ICs), etc., to ensure they meet specifications and function correctly. Unit testing is typically performed using specialized equipment like multimeters, oscilloscopes, and function generators. Functional Testing: This tests the functionality of electronic devices or systems as a whole. It verifies whether the device or system performs its intended functions correctly according to the specifications. Functional testing often involves applying input signals and observing output responses. Automated test equipment (ATE) and test scripts are commonly used for functional testing. In-Circuit Testing (ICT): ICT is used to test electronic circuits and PCBs (Printed Circuit Boards) while they are still in production. It verifies the integrity of the connections and the functionality of individual components by applying test signals to specific nodes on the circuit and measuring responses. ICT can identify defects such as open circuits, short circuits, incorrect component values, etc. Boundary Scan Testing: Boundary scan, based on the IEEE 1149.1 standard (commonly known as JTAG), is used for testing digital integrated circuits. It allows for testing the interconnects between integrated circuits on a PCB and verifying the functionality of these connections. Boundary scan testing can be performed during manufacturing or in-circuit testing. Environmental Testing: This involves subjecting electronic devices or systems to various environmental conditions such as temperature extremes, humidity, vibration, and shock to assess their performance and reliability under different operating conditions. Environmental testing helps identify potential weak points and ensures products meet specified standards and requirements. Burn-In Testing: Burn-in testing involves subjecting electronic components or systems to prolonged operation under normal or accelerated conditions to identify potential early failures. This stress testing helps detect latent defects and ensures product reliability over its expected lifespan. Automated Testing: Automation of testing processes using specialized test equipment and software can improve efficiency, consistency, and reliability of testing. Automated test systems can execute test scripts, analyze test results, and provide detailed reports, reducing manual effort and human error. Regression Testing: For iterative development processes, regression testing ensures that modifications or updates to electronic components or systems do not adversely affect previously tested functionality. It involves rerunning previously conducted tests valid.

1. Testing Strategiesfor
Electronic Components
ALDRINE Y. TELERON

2. What are Passive Electronic
Components?
Passive electronic
components are those
that don’t have the ability
to control electric current
by means of another
electrical signal.
Examples of passive
electronic components
are
capacitors, resistors,
inductors, transformers, and

3. Circuit Symbols of Active and Passive Electronic
Components
Electronic
components, both
active and passive,
are lifeline of any
Printed Circuit Board
assembly.
They both play vital
roles in the functioning
of any electronic
device.
Electronic
Components are
intended to be
connected together,
usually by soldering

4. Dynamic Testing
• Electronics tests place a wide range of performance demands
on test equipment for static and dynamic test equipment.
The equipment is used to validate new designs, improve
manufacturing processes and prove the quality of end
products. Mechanical testing requirements involve static,
dynamic and fatigue testing in tensile, compression, shear
test modes.
• Testing the mechanical endurance and integrity of electronics
components and assemblies is important to validate designs,
improve manufacturing, and ensure the reliability of final
products.

6. In-Circuit Testing
In circuit test equipment provides a useful and efficient form
of printed circuit board test by measuring each component in turn
to check that it is in place and of the correct value. As most faults
on a board arise out of the manufacturing process and usually
consist of short circuits, open circuits or wrong components, this
form of testing catches most of the problems on a board. These
can easily be checked using simple measurements or resistance,
capacitance, and sometimes inductance between two points on
the circuit board.

7. In-circuit test equipment consists of a number of elements:
a.In circuit tester: The in circuit test system consists of a matrix of
drivers and sensors that are used to set up and perform the
measurements. There may be 1000 or more of these driver sensor
points. These are normally taken to a large connector conveniently
located on the system
b. Fixture: The in-circuit test system connector interfaces with the
second part of the tester - the fixture. In view of the variety of boards
this will be designed specifically for a particular board, and acts as
an interface between the board and the in circuit tester. It takes the
connections for the driver sensor points and routes them directly to
the relevant points on the board using a "bed of nails".
c.Software : Software is written for each board type that can be
tested. It instructs the test system what tests to perform, between
what points and details of the pass / fail criteria.