The document describes the STR-W605xS series of current mode control PWM regulator ICs for switching power supplies. The ICs incorporate a power MOSFET and PWM controller on a single die in a TO-220 package. Key features include current mode PWM control, random switching to reduce EMI, slope compensation, auto-standby mode, noise suppression, and various protection functions. Electrical characteristics and performance curves are provided for the MOSFETs and ICs.
The HART (Highway Addressable Remote Transducer) is a master/slave communication protocol which provides for up to two masters. The secondary master can be used to monitor/control the information of the HART bus. HART can be used in various modes such as point-to-point or multi-drop for communicating information to/from smart field instruments and central control or monitoring systems.
Learn more: http://www.icpdas-usa.com/hart_gateways.html?r=slideshare
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The HART (Highway Addressable Remote Transducer) is a master/slave communication protocol which provides for up to two masters. The secondary master can be used to monitor/control the information of the HART bus. HART can be used in various modes such as point-to-point or multi-drop for communicating information to/from smart field instruments and central control or monitoring systems.
Learn more: http://www.icpdas-usa.com/hart_gateways.html?r=slideshare
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PCIe Gen3 presentation by PLDA at 4th FPGA Camp in Santa Clara, CA. For more details visit http://www.fpgacentral.com/fpgacamp or http://www.fpgacentral.com
October 8, 2014 Webcast Identifying PCI Express 3.0 Dynamic Equalization Problems
Dynamic equalization training is a unique capability in modern day serial data communication. Through optimization of transmitter and receiver equalization parameters we can push the limits of serial data rates. Troubleshooting dynamic equalization problems at the Physical and Protocol layers requires testing for proper functionality and compliance.
Join Teledyne LeCroy's Stephen Mueller for this webinar to understand how to address this measurement challenge. The presentation will include real measurement examples and debugging techniques to pinpoint problems in the physical and protocol layers.
Various processor architectures are described in this presentation. It could be useful for people working for h/w selection and processor identification.
VLSI DESIGN OF AMBA BASED AHB2APB BRIDGEVLSICS Design
The Advanced Microcontroller Bus Architecture (AMBA) is an open System-on-Chip bus protocol for highperformance
buses to communicate with low-power devices. In the AMBA Advanced High Performance bus (AHB) a system bus is used to connect a processor, a DSP, and high-performance memory controllers where as the AMBA Advanced Peripheral Bus (APB) is used to connect (Universal Asynchronous Receiver Transmitter) UART. It also contains a Bridge, which connects the AHB and APB buses. Bridges are standard bus-to-bus interfaces that allow IPs connected to different buses to communicate with each other in a standardized way. So AHB2APB bridge is designed, implemented using VERILOG tool and tested using Verilog testbench and is reported in this paper. A synthesizable RTL code of a complex interface
bridge between AHB and APB is developed and known as AHB2APB Bridge. The simulated AHB2APB Bridge results are promising and can be further tested for its verstality by writing a verification program using UVM in future.
Webinar: Desmistificando projetos de fontes chaveadasEmbarcados
Possibilitar engenheiros com pouca familiaridade com eletronica de potencia a desenvolver fontes chaveadas. São apresentadas também soluções para o projeto de fontes chaveadas da ST.
Video do Webinar: https://www.embarcados.com.br/webinars/webinar-desmistificando-projetos-de-fontes-chaveadas/
October 8, 2014 Webcast Identifying PCI Express 3.0 Dynamic Equalization Problems
Dynamic equalization training is a unique capability in modern day serial data communication. Through optimization of transmitter and receiver equalization parameters we can push the limits of serial data rates. Troubleshooting dynamic equalization problems at the Physical and Protocol layers requires testing for proper functionality and compliance.
Join Teledyne LeCroy's Stephen Mueller for this webinar to understand how to address this measurement challenge. The presentation will include real measurement examples and debugging techniques to pinpoint problems in the physical and protocol layers.
Various processor architectures are described in this presentation. It could be useful for people working for h/w selection and processor identification.
VLSI DESIGN OF AMBA BASED AHB2APB BRIDGEVLSICS Design
The Advanced Microcontroller Bus Architecture (AMBA) is an open System-on-Chip bus protocol for highperformance
buses to communicate with low-power devices. In the AMBA Advanced High Performance bus (AHB) a system bus is used to connect a processor, a DSP, and high-performance memory controllers where as the AMBA Advanced Peripheral Bus (APB) is used to connect (Universal Asynchronous Receiver Transmitter) UART. It also contains a Bridge, which connects the AHB and APB buses. Bridges are standard bus-to-bus interfaces that allow IPs connected to different buses to communicate with each other in a standardized way. So AHB2APB bridge is designed, implemented using VERILOG tool and tested using Verilog testbench and is reported in this paper. A synthesizable RTL code of a complex interface
bridge between AHB and APB is developed and known as AHB2APB Bridge. The simulated AHB2APB Bridge results are promising and can be further tested for its verstality by writing a verification program using UVM in future.
Webinar: Desmistificando projetos de fontes chaveadasEmbarcados
Possibilitar engenheiros com pouca familiaridade com eletronica de potencia a desenvolver fontes chaveadas. São apresentadas também soluções para o projeto de fontes chaveadas da ST.
Video do Webinar: https://www.embarcados.com.br/webinars/webinar-desmistificando-projetos-de-fontes-chaveadas/
Original Power Supply IC TOP233YN TOP233Y TOP233 TO-220-7 New Power IntegrationAUTHELECTRONIC
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The UNO-2.0-I and UNO-2.5-I are the latest single phase string inverters in the line. A new-look inverter but packed with ABB’s proven high performing technology. The new look inverter has new features including a special built-in heat sink compartment and front panel display system.
Catalog Contactor Fuji Electric - Beeteco.comBeeteco
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www.beeteco.com @ Công ty TNHH TM KT ASTER
Số 7 Đại Lộ Độc Lập, KCN Sóng Thần 1, P. Dĩ An, Tx. Dĩ An, Bình Dương
Công ty cổ phần Hạo Phương xin gửi đến Quý Khách hàng bộ catalog các dòng Contactor Fuji Electric mới nhất 2019 bao gồm: contactor SK, contactor SC, contactor FJ.
Contactor (Khởi động từ) Fuji Electric là dòng sản phẩm thuộc nhóm thiết bị đóng ngắt mạch điện. Các sản phẩm Fuji hiện đang được phân phối bởi Công ty Hạo Phương, nhà phân phối thiết bị điện và là nhà tích hợp hệ thống hàng đầu Việt Nam.
Quý khách có nhu cầu mua hàng hoặc hợp tác cùng chúng tôi xin vui lòng liên hệ theo địa chỉ :
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Trụ sở chính:
Địa chỉ: Số 88 đường Vĩnh Phú 40, Kp. Hòa Long, P. Vĩnh Phú, Thuận An, Bình Dương.
Văn phòng Hà Nội:
Địa chỉ: Số 95 TT4 - KĐT Mỹ Đình Sông Đà - Phường Mỹ Đình - Q. Nam Từ Liêm - Hà Nội
Chi nhánh Cambodia:
Địa chỉ: The Park Land SenSok, Borey Chip Mong, House Number 22, P11.Sangkat Phnom Penh Thmey, Khan San Sok, Phnom Penh.
Email: cs@haophuong.com - Website: haophuong.com
Facebook: https://www.facebook.com/haophuongcompany/
HOTLINE: 1800 6547
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Str w6051 s-str-w6052s-str-w6053s-datasheet
1. STR-W605xS
Current Mode Control PWM Regulator IC
For Switching Power Supplies
Features and Benefits Description
▪ TO-220F power package with 30 to 90 W power output The STR-W605xS series are power ICs for switching power
▪ Current Mode PWM control supplies, incorporating a power MOSFET and a current mode
▪ Built-in Random Switching function, reducing EMI noise, PWM controller IC. Including a startup circuit and a standby
and simplifying EMI filters, and therefore reducing cost function in the controller, the product achieves low power
▪ Built-in Slope Compensation function, avoiding consumption, low standby power, and high cost-effectiveness
subharmonic oscillation power supply systems with few external components.
▪ Built-in Auto Standby function (Input Power, PIN < 30 mW
at no load) The STR-W605xS internal MOSFET has a VDSS of 650 V (min),
▫ Normal operation: PWM mode and an RDS(on) of 1.9 Ω (max) to 3.95 Ω (max) with a frequency
▫ Light load operation: Standby mode (burst oscillation) of 67 kHz. Power output is rated at 45 to 90 W at 230 VAC
▪ Built-in Audible Noise Suppression function during input and 30 to 60 W at wide input range (85 to 265 VAC).
Standby mode The device is provided in an industry-standard TO-220 package,
▪ Built-in Startup Circuit, reducing power consumption in with heatsink mounting flange and pin 2 removed for increased
standby operation, and eliminating external components. supply isolation.
▪ Bias-Assist function, improving startup operation,
suppressing VCC voltage drop in operation, and allowing
use of smaller VCC capacitor
Applications:
▪ Built-in Leading Edge Blanking function
For switching power supplies used in:
Continued on the next page…
• White goods
• Consumer electronics
Package: 6-Pin fully molded
• Office automation
TO-220F-6L (FM207) • Industrial equipment
• Communication equipment
Not to scale
Typical Application
VOU T
VAC
GND
STR-W6000S
FB/OLP
S/ OCP
D/ST
GND
V CC
BR
1 3 4 5 6 7
Brown-In/Brown-Out function
disabled by connecting BR
terminal to GND.
STR-W605xS-DS
2. Current Mode Control PWM Regulator IC
STR-W605xS
For Switching Power Supplies
Features and Benefits (continued)
▪ Two-chip structure, with a controller and a power MOSFET compensation circuit to minimize OCP point variation on
with guaranteed avalanche energy available to simplify surge AC input voltage
absorber circuits ▫ Overload Protection function (OLP): auto-restart, built-in
▪ Protection functions:
timer, reduces heat during overload condition, and no external
▫ Brown-In and Brown-Out Protection function: auto-restart,
prevention of excess input current and heat rise at low components required
input voltage ▫ Overvoltage Protection function (OVP): Auto-restart
▫ Overcurrent Protection function (OCP): pulse-by-pulse built-in ▫ Thermal Shutdown Protection function (TSD): Auto-restart
Selection Guide
MOSFET RDS(on) POUT*
fOSC (W)
Part Number
(kHz)
VDSS(min) (max) Package Packing
(V) (Ω) 230 V Wide
STR-W6051S 3.95 45 30
TO-220F-6L (Sanken FM207)
STR-W6052S 67 650 2.8 60 40 50 pieces per tube
with pin 2 removed
STR-W6053S 1.9 90 60
* The listed output power is based on the package thermal ratings, and the peak output power can be 120% to 140% of the
value stated here. At low output voltage and short duty cycle, the output power may be less than the value stated here.
Allegro MicroSystems, Inc. 2
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
3. Current Mode Control PWM Regulator IC
STR-W605xS
For Switching Power Supplies
Absolute Maximum Ratings1 Valid at TA = 25°C, unless otherwise specified
Characteristic Symbol Notes Terminals Rating Unit
STR-W6051S 1–3 5.0 A
Drain Peak Current2 IDpeak Single pulse STR-W6052S 1–3 7.0 A
STR-W6053S 1–3 9.5 A
STR-W6051S 1–3 5.0 A
Maximum Switching Current3 IDMAX TA = –20°C to 125°C STR-W6052S 1–3 7.0 A
STR-W6053S 1–3 9.5 A
STR-W6051S 1–3 47 mJ
Single pulse, VDD = 99 V,
EAS STR-W6052S 1–3 62 mJ
L = 20 mH
STR-W6053S 1–3 86 mJ
Single Pulse Avalanche Energy4
STR-W6051S 1–3 2.0 A
Single pulse, VDD = 99 V,
ILpeak STR-W6052S 1–3 2.3 A
L = 20 mH
STR-W6053S 1–3 2.7 A
S/OCP Terminal Voltage VOCP 3–5 –2 to 6 V
Controller IC (MIC) Supply Input Voltage VCC 4–5 32 V
FB/OLP Terminal Voltage VFB 6–5 –0.3 to 14 V
FB/OLP Terminal Sink Current IFB 6–5 1.0 mA
BR Terminal Voltage VBR 7–5 –0.3 to 7 V
BR Terminal Sink Current IBR 7–5 1.0 mA
STR-W6051S 1–3 22.3 W
With infinite heatsink STR-W6052S 1–3 23.6 W
MOSFET Power Dissipation5 PD1
STR-W6053S 1–3 26.5 W
Without heatsink 1–3 1.3 W
Controller IC (MIC) Power Dissipation PD2 Specified by VCC × ICC 4–5 0.13 W
Internal Frame Temperature in Operation TF – –20 to 115 °C
Maximum recommended
Operating Ambient Temperature TOP internal leadframe – –20 to 115 °C
temperature, TF(max) = 105°C
Storage Temperature Tstg – –40 to 125 °C
Channel Temperature Tch – 150 °C
1Current characteristics are defined based on IC as sink ( +), or source ( –).
2Refer to MOSFET Safe Operating Area Curve.
3I
DMAX is the drain current on the D/ST pin determined by the drive voltage of the IC and the threshold voltage, Vth , of the MOSFET.
4Refer to MOSFET Avalanche Energy Derating Coefficient Curve.
5Refer to MOSFET Temperature versus Power Dissipation Curve.
Allegro MicroSystems, Inc. 3
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
4. Current Mode Control PWM Regulator IC
STR-W605xS
For Switching Power Supplies
Functional Block Diagram
VCC D/ST
4 Startup 1
UVLO REG VREG OVP TSD
BR Brown-In/
7 Brown-Out
DRV
PWM OSC SQ
R
OCP
VCC OLP
Drain Peak Current
Compe nsa tion
FB/OLP Fe edback
LEB 3
6 Control
S/OCP
Slope GND
5
Compensation
Pin-out Diagram
Terminal List Table
Number Name Function
1 D/ST MOSFET drain, and input for startup current
2 – (Pin removed)
3 S/OCP MOSFET source, and input for Overcurrent Protection detection signal
4 VCC Input for power supply for control circuit
5 GND Ground
6 FB/OLP Input for constant voltage control signal, and input for Overload Protection signal
7 BR Input for Brown-In and Brown-Out Protection detection voltage
1 2 3 4 5 6 7
Allegro MicroSystems, Inc. 4
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
5. Current Mode Control PWM Regulator IC
STR-W605xS
For Switching Power Supplies
Electrical Characteristics1 Valid at VCC = 18 V, TA = 25°C, unless otherwise specified
Characteristic Symbol Terminal Min. Typ. Max. Unit
Operation Start Voltage VCC(ON) 4–5 13.8 15.3 16.8 V
Operation Stop Voltage2 VCC(OFF) 4–5 7.3 8.1 8.9 V
Circuit Current in Operation ICC(ON) 4–5 – – 2.5 mA
Minimum Startup Voltage VST(ON) 4–5 – 40 – V
Startup Current ISTARTUP 4–5 –3.9 –2.5 –1.1 mA
Startup Current Supply Threshold Voltage2 VCC(BIAS) 4–5 8.5 9.5 10.5 V
Average Switching Frequency fOSC(av) 1–5 60 67 74 kHz
Switching Frequency Variance Range ∆f 1–5 – 5 – kHz
Maximum Duty Cycle DMAX 1–5 63 71 79 %
Leading Edge Blanking Time tBW – – 390 – ns
OCP Compensation Coefficient DPC – – 18 – mV/μs
Maximum Duty Cycle for OCP Compensation DDPC – – 36 – %
OCP Threshold Voltage at Zero Duty Cycle VOCP(L) 3–5 0.70 0.78 0.86 V
OCP Threshold Voltage at 36% Duty Cycle VOCP(H) 3–5 0.79 0.88 0.97 V
Maximum Feedback Current IFB(MAX) 6–5 –340 –230 –150 μA
Minimum Feedback Current IFB(MIN) 6–5 –30 –15 –7 μA
Oscillation Stop FB/OLP Voltage VFB(OFF) 6–5 0.85 0.95 1.05 V
OLP Threshold Voltage VFB(OLP) 6–5 7.3 8.1 8.9 V
Operation Current After OLP ICC(OLP) 4–5 – 300 – μA
OLP Delay Time tOLP 1–5 54 68 82 ms
FB/OLP Terminal Clamp Voltage VFB(CLAMP) 6–5 11 12.8 14 V
Brown-In Threshold Voltage VBR(IN) 7–5 5.2 5.6 6 V
Brown-Out Threshold Voltage VBR(OUT) 7–5 4.45 4.8 5.15 V
BR Terminal Clamp Voltage VBR(CLAMP) 7–5 6 6.4 7 V
BR Function Disabling Threshold VBR(DIS) 7–5 0.3 0.48 0.7 V
OVP Threshold Voltage VCC(OVP) 4–5 26 29 32 V
Thermal Shutdown Operating Temperature TJ(TSD) – 130 – – °C
1Current characteristics are defined based on IC as sink ( +), or source ( –).
2V
CC(BIAS) > VCC(OFF).
MOSFET Electrical Characteristics Valid at TA = 25°C, unless otherwise specified
Characteristic Symbol Device Terminal Min. Typ. Max. Unit
Drain-to-Source Breakdown Voltage VDSS – 1–3 650 – – V
Drain Leakage Current IDSS – 1–3 – – 300 μA
STR-W6051S 1–3 – – 3.95 Ω
On-Resistance RDS(on) STR-W6052S 1–3 – – 2.8 Ω
STR-W6053S 1–3 – – 1.9 Ω
Switching Time tf – 1–3 – – 250 ns
STR-W6051S – – – 2.63 °C/W
Thermal Resistance* RθchF STR-W6052S – – – 2.26 °C/W
STR-W6053S – – – 1.95 °C/W
*Between channel and internal frame.
Allegro MicroSystems, Inc. 5
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
6. Current Mode Control PWM Regulator IC
STR-W605xS
For Switching Power Supplies
Characteristic Performance
STR-W6051S
MOSFET Safe Operating Area Curve
100
TA = 25°C;
Single pulse
S. O. A. Temperature Derating Coefficient Curve
100
Temperature Derating Coefficient (%)
10 Drain current limited
by on-resistance 0.1 ms
80
Drain Current, ID (A)
Safe Operating Area
60
1 ms
1
40
20
0.1
0
0 20 40 60 80 100 120
To use this graph, apply the S.O.A
Internal Frame Temperature, TF (°C) temperature derating coefficient
taken from the graph at the left
0.01
1 10 100 1000
Drain-to-Source Voltage, VDS (V)
MOSFET Avalanche Energy Derating Coefficient Curve MOSFET Temperature versus Power Dissipation Curve
100 25
Allowable Power Dissipation, PD1 (W)
Temperature Derating Coefficient (%)
With infinite heatsink
PD1 = 22.3 W at TA ≤ 25°C
80 20
60 15
EAS
40 10
20 5
Without heatsink
PD1 = 1.3 W at TA ≤ 25°C
0 0
25 50 75 100 125 150 0 20 40 60 80 100 120 140 160
Channel Temperature, Tch (°C) Ambient Temperature, TA (°C)
Transient Thermal Resistance Curve
10
Resistance, Rθch-c (°C/W)
Transient Thermal
1
0.1
0.01
10-6 10-5 10-4 10-3 10-2 10-1
Time (s)
Allegro MicroSystems, Inc. 6
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
7. Current Mode Control PWM Regulator IC
STR-W605xS
For Switching Power Supplies
Characteristic Performance
STR-W6052S
MOSFET Safe Operating Area Curve
100
TA = 25°C;
Single pulse
S. O. A. Temperature Derating Coefficient Curve
100 Drain current limited
Temperature Derating Coefficient (%)
by on-resistance
10 0.1 ms
80
Drain Current, ID (A)
Safe Operating Area
60 1 ms
1
40
20
0.1
0
0 20 40 60 80 100 120
To use this graph, apply the S.O.A
Internal Frame Temperature, TF (°C) temperature derating coefficient
taken from the graph at the left
0.01
1 10 100 1000
Drain-to-Source Voltage, VDS (V)
MOSFET Avalanche Energy Derating Coefficient Curve MOSFET Temperature versus Power Dissipation Curve
100 25
Allowable Power Dissipation, PD1 (W)
Temperature Derating Coefficient (%)
With infinite heatsink
PD1 = 23.6 W at TA ≤ 25°C
80 20
60 15
EAS
40 10
20 5
Without heatsink
PD1 = 1.3 W at TA ≤ 25°C
0 0
25 50 75 100 125 150 0 20 40 60 80 100 120 140 160
Channel Temperature, Tch (°C) Ambient Temperature, TA (°C)
Transient Thermal Resistance Curve
10
Resistance, Rθch-c (°C/W)
Transient Thermal
1
0.1
0.01
10-6 10-5 10-4 10-3 10-2 10-1
Time (s)
Allegro MicroSystems, Inc. 7
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
8. Current Mode Control PWM Regulator IC
STR-W605xS
For Switching Power Supplies
Characteristic Performance
STR-W6053S
MOSFET Safe Operating Area Curve
100
TA = 25°C;
Single pulse
S. O. A. Temperature Derating Coefficient Curve
100 Drain current limited
Temperature Derating Coefficient (%)
by on-resistance 0.1 ms
10
80
Drain Current, ID (A)
Safe Operating Area
60 1 ms
1
40
20
0.1
0
0 20 40 60 80 100 120
To use this graph, apply the S.O.A
Internal Frame Temperature, TF (°C) temperature derating coefficient
taken from the graph at the left
0.01
1 10 100 1000
Drain-to-Source Voltage, VDS (V)
MOSFET Avalanche Energy Derating Coefficient Curve MOSFET Temperature versus Power Dissipation Curve
100 30
Allowable Power Dissipation, PD1 (W)
Temperature Derating Coefficient (%)
With infinite heatsink
PD1 = 26.5 W at TA ≤ 25°C
80 25
20
60
EAS
15
40
10
20
5 Without heatsink
PD1 = 1.3 W at TA ≤ 25°C
0 0
25 50 75 100 125 150 0 20 40 60 80 100 120 140 160
Channel Temperature, Tch (°C) Ambient Temperature, TA (°C)
Transient Thermal Resistance Curve
10
Resistance, Rθch-c (°C/W)
Transient Thermal
1
0.1
0.01
10-6 10-5 10-4 10-3 10-2 10-1
Time (s)
Allegro MicroSystems, Inc. 8
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
9. Current Mode Control PWM Regulator IC
STR-W605xS
For Switching Power Supplies
Typical Application
VOU T
VAC
GND
STR-W6000S
FB/OLP
S/ OCP
D/ST
GND
V CC
BR
1 3 4 5 6 7
Brown-In/Brown-Out function
enabled by connecting BR
terminal to resistive divider.
Allegro MicroSystems, Inc. 9
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
10. Current Mode Control PWM Regulator IC
STR-W605xS
For Switching Power Supplies
Package Outline Drawing, TO-220F-6L (FM207)
10.0±0.2
4.2±0.2
Gate burr
2.8±0.2
0.5
4±0.2
7.9±0.2
φ3.2±0.2
16.9±0.3
STR
a
b
2.6±0.1
Dimensions from root
2.8
6-0.74±0.15
5.0±0.5
6-0.65 +0.2
10.4±0.5
R-end
-0.1
(2
-R1
(5.4)
)
0.45 +0.2
-0.1
6×P1.27±0.15=7.62±0.15
Dimensions between roots 5.08±0.6
Dimensions between roots
0.5 0.5 0.5 0.5
Plan view Side view
1 2 3 4 5 6 7
a. Type Number: W6051S
Leadform: 2003 b. Lot Number:
1st letter: Last digit of year
Material of terminal: Cu 2nd letter: Month
Treatment of terminal: Solder plating (Pb-free) 1 to 9 for Jan. to Sept.
Weight: Approximately 2.3 g O for Oct.
Dashed line at Gate Burr indicates N for Nov.
protrusion of 0.3 mm (max) D for Dec.
Unit: mm 3rd and 4th letter: Day of month
5th letter: Sanken Registration Number
Leadframe plating Pb-free. Device composition
compliant with the RoHS directive.
Allegro MicroSystems, Inc. 10
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
11. Current Mode Control PWM Regulator IC
STR-W605xS
For Switching Power Supplies
Packing Specifications
+0.4 1.4 5.1
4.8 0 9 × R0.6
8.9
+0.3
9.5–0.1
35.0
(15.4)
Side marked
2.85 “ANTISTATIC”
(3.6) +0.3
1.3 –0.2
14.3
Tube dimensions (mm)
Spacer
620
Carton
(side
view) Tube
Tube
125
Spacer 185
Carton dimensions (mm)
Capacity:
36 tubes per carton (3 rows, 12 tubes per row)
50 pieces per tube
1800 pieces maximum per carton
Allegro MicroSystems, Inc. 11
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
12. Current Mode Control PWM Regulator IC
STR-W605xS
For Switching Power Supplies
Because reliability can be affected adversely by improper storage Soldering
environments and handling methods, please observe the following • Leadframe temperature, TF , should not exceed 115°(max)
cautions. • When soldering the products, please be sure to minimize the
Cautions for Storage working time, within the following limits:
• Ensure that storage conditions comply with the standard 260±5°C 10 s
temperature (5°C to 35°C) and the standard relative humidity 350±5°C 3 s (solder iron)
(around 40% to 75%); avoid storage locations that experience • To avoid an internal chip damaged, soldering on each of lead-pins
extreme changes in temperature or humidity. should be at a distance of at least 2 mm away from the body of
• Avoid locations where dust or harmful gases are present and the products
avoid direct sunlight. Assembly
• Reinspect for rust on leads and solderability of products that have • Recommended screw torque through the mounting tab is 0.588 to
been stored for a long time. 0.785 N • m (6 to 8 kgf • cm).
Cautions for Testing and Handling Electrostatic Discharge
When tests are carried out during inspection testing and other • When handling the products, the operator must be grounded.
standard test periods, protect the products from power surges Grounded wrist straps worn should have at least 1 MΩ of
from the testing device, shorts between the product pins, and resistance from the operator to ground to prevent shock hazard,
wrong connections. and it should be placed near the operator.
Remarks About Using Silicone Grease with a Heatsink • Workbenches where the products are handled should be
• When silicone grease is used in mounting this product on a grounded and be provided with conductive table and floor mats.
heatsink, it shall be applied evenly and thinly. If more silicone • When using measuring equipment such as a curve tracer, the
grease than required is applied, it may produce excess stress. equipment should be grounded.
• Volatile-type silicone greases may crack after long periods of • When soldering the products, the head of soldering irons or the
time, resulting in reduced heat radiation effect. Silicone grease solder bath must be grounded in other to prevent leak voltages
with low consistency (hard grease) may cause cracks in the mold generated by them from being applied to the products.
resin when screwing the product to a heatsink. • The products should always be stored and transported in Sanken
• Our recommended silicone greases for heat radiation purposes, shipping containers or conductive containers, or be wrapped in
which will not cause any adverse effect on the product life, are aluminum foil.
indicated below:
Type Suppliers
G746 Shin-Etsu Chemical Co., Ltd.
YG6260 Momentive Performance Materials Holding, Inc.
SC102 Dow Corning Toray Co., Ltd.
Allegro MicroSystems, Inc. 12
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com