The document discusses various types of breakdown that can occur in solid dielectric materials. It describes intrinsic breakdown, which includes electronic and avalanche breakdown caused by electrons gaining energy from an electric field. It also discusses electromechanical breakdown that occurs when electrostatic forces exceed the material's mechanical strength. Thermal breakdown is caused by heat generated from current flow exceeding the material's ability to dissipate heat. Treeing and tracking refer to the formation of conductive pathways over time from electrical discharges partially eroding the material surface. The document provides details on the mechanisms and factors that influence different types of breakdown in solids.