The document describes the ATR-300 series of atmospheric wafer transfer robots. It has a modular design combining simplicity, proven reliability and performance to outperform competitors in throughput, reliability, repeatability and cleanliness. Key features include ISO class 3 cleanroom compatibility, brushless motors, absolute encoders, independence of axis control, and payloads up to 3kg. It is available with two or three link arms with varying reach and Z-axis stroke. Applications include wafer handling systems and reticle handling.

1. VDesign
OEM Systems
Atmospheric wafer transfer robots
ATR-300 Series
Design description
Based on detailed analysis of latest developments in
semiconductor automation and robotics, the design of
atmospheric wafer handling robots ATR-300 series combines
simplicity and components with proven reliability and
performance with completely new modular concept to create an
advanced modular robot design that outperforms competition in
throughput, reliability, repeatability and cleanliness. These
innovative handling solutions are designed to handle wafers and
masks and feature extremely high precision and combines
reliability and performance.
Robots from ATR-300 series utilize low inertia, quick response
brushless servomotors coupled with zero-backlash Harmonic
Drive® gear reducers and absolute encoders. The controller
assures accurate motion profiling along multiple path segments.
The robot designs ATR-300 series meet or even exceed
expectations for wafer handling throughput and reliability. The
modular design concept guarantees a maximum of flexibility and
capability. Robot base is designed with fewer parts to improve
reliability. The backbone frame design provides increased
stiffness and flexible mounting. Brushless DC motors eliminate
brush wear and assure higher MTBF. Its arm is made from
single piece cast aluminum housings. Direct-coupled drive arm
system provides better repeatability and independence of axes
control. Advanced arm design assures superior planarity,
stiffness, extended reach and motion flexibility by using of
additional wrist axis, an end-effector exchanger, integrated laser
wafer mapping, etc. The innovative robot design is ISO
cleanroom class 3 compatible.
Robots from ATR-300 series are designed with different radial
reach capabilities. Standard is two-link 200-200 mm arm,
making total available reach equal to 650 mm plus end-effector
length. If longer reaches are required, three-link arm 150-300-
150 mm with 600 mm reach is available. Standard Z-axis
vertical travel is 340 mm. Also strokes of 188, 254 and 425 mm
are available.
Features
• ISO class 3 cleanroom compatible design
• Increased reliability, repeatability and enhanced kinematic
parameters (speed, accelerations etc.)
• High MTBF and low MTTR
• Extended motion ranges in comparison with other competitive
robots
• Modular construction for ease of maintenance
• Brushless AC servomotors
• Absolute or incremental encoders
• Better performance and dynamic behavior
• Full independence of axes control
• Possibility for attachment of normal or heavy duty robot arm
(for different applications)
• Possibility for additional wrist (yaw) axis
• Possibility for end effector exchanger mounting
• Robot layout dimensions allowing possibility for “drop-in”
replacement of competitive products
• Integrated motion controller, servo-amplifier and power supply
within the robot body

2. Applications
• Wafer handling systems such as EFEM’s, wafer sorters,
wafer packers etc.
• Reticle (photomask) handling systems
• Small glass, solar, FPD and LCD panels handling systems
Options
• Two-link or three-link robot arm
• Vacuum or edge grip endeffectors
• Independent wrist (Yaw) axis
• External controller and interconnecting cabling
Specifications
Cleanliness (ISO 14 644) Class 3 (Class 1 US Fed. Std. 209E)
Payload Max. 1.0 kg (heavy duty arm 3.0 kg )*
Motion range Z axis 340 mm (200, 280, 440 mm)
Motion range T axis 380° (no dead zone)**
Motion range R axis ±400 mm (±600 mm)
Repeatability Z axis ±0.05 mm
Repeatability T axis ±0.1°
Repeatability R axis ±0.05 mm
Speed Z axis 300 mm/sec
Speed T axis 360° /sec
Speed R axis 1600 mm/sec
Throughput 4 sec/wafer
MTBF More than 50,000 hours
MTTR < 2h
Weight 28.5 kg (30.5 kg)
Wafer presence sensing By vacuum sensor
Wafer mapping sensor Laser (optionally)
Power supply AC 110/230 V 50/60 Hz ***
Vacuum Requirements 0.9 bar 2 l/min
Note : * by reduced speed and acceleration
** motion range expandable up to 600° continuous rotation
*** optionally 48 VDC (by using of external controller and supply)
Layout drawings
Two-link arm Three-link arm

3. VDesign
OEM Systems
Robot ATR-300/2L
Atmospheric wafer transfer robot
Design elements
Based on detailed analysis of latest developments in
semiconductor automation and robotics, the design of
atmospheric wafer handling robot ATR-300/2L combines
simplicity and components with proven reliability and
performance with completely new modular concept to create an
advanced modular robot design that outperforms competition in
throughput, reliability, repeatability and cleanliness. These
innovative handling solutions are designed to handle wafers and
masks and feature extremely high precision and combines
reliability and performance.
ATR-300/2L robot is designed with low inertia, quick response
brushless servomotors coupled with zero-backlash Harmonic
Drive® gear reducers and absolute encoders. The controller
assures accurate motion profiling along multiple path segments.
The ATR-300/2L robot design meets or even exceeds
expectations for wafer handling throughput and reliability. The
modular design concept guarantees a maximum of flexibility and
capability. Robot base is designed with fewer parts to improve
reliability. The backbone frame design provides increased
stiffness and flexible mounting. Brushless DC motors eliminate
brush wear and assure higher MTBF. Its arm is made from
single piece cast aluminum housings. Direct-coupled drive arm
system provides better repeatability and axes control
independence. Advanced arm design provides superior
planarity, extended reach and flexibility using an end-effector
exchanger, integrated laser wafer mapping, additional wrist axis
etc. The innovative robot design is ISO cleanroom class 3
compatible.
Standard design features two-link 200-200 mm arm, making
total available reach equal to 650 mm plus end-effector length.
Z-axis standard vertical travel is 340 mm (extendable to 440
mm).
Features
• Clean room compatible robot design
• Increased reliability, repeatability and enhanced kinematic
parameters (speed, accelerations etc.)
• High MTBF and low MTTR
• Extended motion ranges in comparison with other competitive
robots
• Modular construction for ease of maintenance
• Better performance and dynamic behavior
• Full independence of axes control
• Possibility for attachment of normal or heavy duty robot arm
(for different load applications)
• Possibility for additional wrist (yaw) axis
• Possibility for end effector exchanger mounting
• Robot layout dimensions allowing possibility for “drop-in”
replacement of competitive products
• Absolute or incremental encoders
• Independent wrist (Yaw) axis
• Integrated motion controller, servo-amplifier and power supply
within the robot body
• Optionally external controller and interconnecting cabling

4. Applications
• Wafer handling systems such as EFEM’s, wafer sorters,
wafer packers etc.
• Reticle (photomask) handling systems.
• Small glass, solar, FPD and LCD panels handling systems.
Specifications
Cleanliness (ISO 14 644) Class 3 (Class 1 US Fed. Std. 209E)
Payload Max. 1.0 kg (heavy duty arm 3.0 kg ) *
Motion range Z axis 340 mm (200, 280, 440 mm)
Motion range T axis 380° (no dead zone) **
Motion range R axis ±400 mm
Repeatability Z axis ±0.05 mm
Repeatability T axis ±0.1°
Repeatability R axis ±0.05 mm
Speed Z axis 300 mm/sec
Speed T axis 360° /sec
Speed R axis 1600 mm/sec
Throughput 4 sec/wafer
MTBF More than 50,000 hours
MTTR < 2h
Weight 28.5 kg (30.5 kg)
Wafer presence sensing By vacuum sensor
Wafer mapping sensor Laser (optionally)
Power supply AC 110/230 V 50/60 Hz ***
Vacuum Requirements 0.9 bar 2 l/min
Note : * by reduced speed and acceleration
** motion range expandable up to 600° continuous rotation
*** optionally 48 VDC (by using of external controller and supply)
Layout drawing ATR-3002L

5. VDesign
OEM Systems
Atmospheric wafer transfer robot Robot ATR-300/3L
Design elements
Based on detailed analysis of latest developments in
semiconductor automation and robotics, the design of
atmospheric wafer handling robot ATR-300/3L combines
simplicity and components with proven reliability and
performance with completely new modular concept to create an
advanced modular robot design that outperforms competition in
throughput, reliability, repeatability and cleanliness. These
innovative handling solutions are designed to handle wafers and
masks and feature extremely high precision and combines
reliability and performance.
ATR-300/3L robot is designed with low inertia, quick response
brushless servomotors coupled with zero-backlash Harmonic
Drive® gear reducers and absolute encoders. The controller
assures accurate motion profiling along multiple path segments.
The ATR-300/3L robot design should meet or even exceed
expectations for wafer handling throughput and reliability. The
modular design concept guarantees a maximum of flexibility and
capability. Robot base is designed with fewer parts to improve
reliability. The backbone frame design provides increased
stiffness and flexible mounting. Brushless DC motors eliminate
brush wear and assure higher MTBF. Its arm housings are
made from single piece cast aluminum. Direct-coupled drive
arm system provides better repeatability and axes control
independence. Advanced arm design provides superior
planarity, extended reach and flexibility using an end-effector
exchanger, integrated laser wafer mapping, additional wrist axis
etc The innovative robot design is ISO cleanroom class 3
compatible (class 1 at FED 209E).
ATR-300/3L is designed with extended radial reach capabilities.
Its three-link arm 150-300-150 mm assures total available reach
600 mm plus end-effector length.
Z-axis standard vertical travel is 340 mm (extendable to 440
mm).
Features
• Clean room compatible robot design
• Increased reliability, repeatability and enhanced kinematic
parameters (speed, accelerations etc.)
• High MTBF and low MTTR
• Extended motion ranges in comparison with other competitive
robots
• Modular construction for ease of maintenance
• Better performance and dynamic behavior
• Full independence of axes control
• Possibility for attachment of normal or heavy duty robot arm
(for different load applications)
• Possibility for additional wrist (yaw) axis
• Possibility for end effector exchanger mounting
• Robot layout dimensions allowing possibility for “drop-in”
replacement of competitive products
• Absolute or incremental encoders
• Independent wrist (Yaw) axis
• Integrated motion controller, servo-amplifier and power supply
within the robot body
• Optionally external controller and interconnecting cabling

6. Applications
• Wafer handling systems such as EFEM’s, wafer sorters,
wafer packers etc.
• Reticle (photomask) handling systems.
• Small glass, solar, FPD and LCD panels handling systems.
Specifications
Cleanliness (ISO 14 644) Class 3 (Class 1 US Fed. Std. 209E)
Payload Max. 1.0 kg (heavy duty arm 3.0 kg ) *
Motion range Z axis 340 mm (200, 280, 440 mm)
Motion range T axis 380° (no dead zone) **
Motion range R axis ±600 mm
Repeatability Z axis ±0.05 mm
Repeatability T axis ±0.1°
Repeatability R axis ±0.05 mm
Speed Z axis 300 mm/sec
Speed T axis 360° /sec
Speed R axis 1600 mm/sec
Throughput 4 sec/wafer
MTBF More than 50,000 hours
MTTR < 2h
Weight 28.5 kg (30.5 kg)
Wafer presence sensing By vacuum sensor
Wafer mapping sensor Laser (optionally)
Power supply AC 110/230 V 50/60 Hz ***
Vacuum Requirements 0.9 bar 2 l/min
Note : * by reduced speed and acceleration
** motion range expandable up to 600° continuous rotation
*** optionally 48 VDC (by using of external controller and supply)
Layout drawing ATR-3003L

7. VDesign
OEM Systems
Dual arm wafer transfer robot
ADTR-300 Series
Design elements
Based on detailed analysis of latest developments in
semiconductor automation and robotics, the design of
atmospheric wafer handling robot ADTR-300 combines
simplicity and components with proven reliability and
performance with completely new modular concept to create an
advanced modular robot design that outperforms competition in
throughput, reliability, repeatability and cleanliness. This
innovative handling solution is designed to handle wafers and
masks and feature extremely high precision and combines
reliability and performance.
The ADTR-300 robot design meets or even exceeds
expectations for wafer handling throughput and reliability. The
modular design concept guarantees a maximum flexibility and
capability. Robot base is designed with fewer parts to improve
reliability. The backbone frame design provides increased
stiffness and flexible top or bottom mounting. Brushless motors
eliminate brush wear and assure higher MTBF. Direct-coupled
arm drive system provides better repeatability. Advanced arm
design provides superior planarity and flexibility using flip
modules, integrated laser wafer mapping. The innovative robot
design is ISO cleanroom class 3 compatible. It can be easily
attached to track system in top-mounted or bottom mounted
configuration.
Robot ADTR-300 is designed with standard arms 200-200 mm,
making total available reach equal to 600 mm with end-effector
length. Z-axis vertical travel standard is 340 mm. It can be
extended to 440 mm.
Features
• Clean room compatible design
• Increased reliability, repeatability and enhanced kinematic
parameters (speed, accelerations etc.)
• High MTBF and low MTTR
• Extended motion ranges in comparison with other competitive
robots
• Modular construction for ease of maintenance
• Top or bottom mounted
• Better performance and dynamic behavior
• Full independence of axes control
• Fast wafer swap
• Possibility for attachment of flip modules on both of arms
• Robot layout dimensions allowing possibility for “drop-in”
replacement of competitive products
• Absolute or incremental encoders
• Integrated motion controller, servo-amplifier and power supply
within the robot body
• Optionally external controller and interconnecting cabling

8. Applications
• Wafer handling systems such as EFEM’s, high throughput
wafer sorters, wafer packers etc.
• Reticle (photomask) handling systems.
Specifications
Cleanliness (ISO 14 644) Class 3 (Class 1 US Fed. Std. 209E)
Payload Max. 2.5 kg *
Motion range Z axis Standard 340 mm (extended 440 mm)
Motion range T axis 380° (no dead zone) **
Motion range R1 axis ± 400 mm
Motion range R2 axis ± 400 mm
Repeatability Z axis ± 0.05 mm
Repeatability T axis ± 0.1°
Repeatability R axes ± 0.05 mm
Speed Z axis 400 mm/sec
Speed T axis 360° /sec
Speed R axes 1600 mm/sec
Throughput 4 sec/wafer
MTBF More than 40,000 hours
MTTR < 2h
Weight 36.5 kg
Wafer presence sensing By vacuum sensor
Wafer mapping sensor Optionally on lower arm
Power supply AC 110/230 V 50/60 Hz ***
Vacuum Requirement 0.9 bar 2 l/min
Note : * by reduced speed and acceleration
** expandable to 600° continuous rotation
*** optionally 48 VDC (by using of external controller and supply)
Layout drawing

9. VDesign
OEM Systems
End-effector exchanger
End-effector exchanger for wafer transfer robots
Design
For realization of different process or control operations in
semiconductor manufacturing sometimes is necessary
wafer handling robot to be equipped with more than one
end-effector. Typical applications are using the same
robot for 200 mm and 300 mm wafer handling (by bridge
tools) or handling of cold and hot wafers with the same
robot, carrying of different sizes of masks and mask
adapters etc. One of possible solutions is usage of end-
effector exchanger. End-effector exchanger gives
possibility for changing of peripherals at the same robot
interface. Such of device assures enhancement of the
robot flexibility and significantly increases robot
manipulating possibilities.
The end-effector exchanger has unique cleanroom
compatible design. It assures high reliability and safety
due to unique fail-safe-locking mechanism. Special
kinematic coupling gives high positional repeatability of
exchanged end-effectors or other attached peripherals.
Features
• ISO class 3 cleanroom compatible design
• High reliability
• High safety due to fail-safe locking mechanism
• High positional repeatability (±0.025 mm)
• Actuated with vacuum only (no supply source
environment contamination)
• Allows transmission of several different power media to
end-effector at the same time (air pressure, vacuum,
electrical signals)
• Low exchanger height and small footprint.
• Simple design, all moving parts are closed (no airborne
contamination)
• Allows at the same time attachment of different types of
end-effectors (vacuum holding end-effector and edge
gripping end-effector, pneumatically or electrically driven)
• Allows manipulation of different wafer dimensions with
the same robot
• Fast lock/unlock operation and reliable end-effector
holding
• Ease for control and operation.
• Reliable sensing of holding status by means of
proximity sensor
• High MTBF and low MTTR
• Assures end-effector exhaust line when needed

10. Standard interface (power sources) transmitted via
exchanger
• Pressure ………………………………… up to 3.2 bar
• Vacuum ……………………..………….. up to 2.4 l/min
• Electrical signals ……………………….. up to 12 lines
Specifications
Cleanliness (ISO 14 644) Class 3 (Class 1 US Fed. Std. 209E)
Lock/Unlock Time 0.5 seconds
Vacuum 0.8 bar (exchanger actuation)
Power 24V DC ±5% (proximity sensor)
Power transmitted 24V DC 3A max.
Vacuum transmitted 2.0 l/min (end-effector exhaust line)
Air pressure transmitted (up to 3.0 bar)
MTBF 100,000 cycles
MTTR < 1h
Weight 0.52 kg
Power supply 24 V DC (Presence sensor)
Vacuum exhaust line 2 l/min at 0.9 bar
Overall dimensions

11. VDesign
OEM Systems
High vacuum compatible wafer transfer robot VTR-300 Vacuum Robot VTR-300
Design elements
Newly developed vacuum robot design VTR-300 is a significant
advancement in vacuum compatible R-Theta-Z robot design
and architecture.
The robot should offers superior reliability and precision. The
-6
innovative design is UHV compatible to 10 Torr. By choosing
components with proven performance, and combined them with
a completely new driving concept to create a vacuum robot
design that outperforms others in reproducibility, reliability,
stiffness, and throughput.
Benefiting from the technological advances of today's
components, the VTR-300 robot utilize fast, quick response
zero-backlash DC Harmonic Drive® actuators enabled with
incremental or absolute encoders. The controller assures
accurate fast and smooth motion.
VTR-300 robot is designed with standard two-link arm 200-200
mm, making total available reach equal to 650 mm (plus end-
effector length). Vertical travel is 25 mm. Additional options
include extended vertical travel (up to 50 mm) and advanced
vacuum compatible edge grip end-effector.
Features
• UHV compatible robot design
• High reliability and repeatability, performance and dynamic
behavior.
• Modular construction for ease of maintenance
• Full independence of axes control
• High MTBF and low MTTR
• Coaxial ferrofluidic seal and metal bellow
• Possibility for attachment of normal or heavy duty robot arm
(for different payload applications)
• Absolute or incremental encoders
• External controller and interconnecting cabling

12. Applications
• Mid-size vacuum chambers
• High speed wafer transfer
Options
• Absolute encoders
• Advanced design of edge grip end-effector enable to work in
high vacuum environment
Technical Specifications
-8
UHV compatibility Up to 10 Torr
Payload 2.5 kg (heavy duty arm 5.0 kg )
Motion range Z axis 25 mm (50 mm)
Motion range T axis 380° *
Motion range R axis ±400 mm (±500 mm)
Repeatability Z axis ±0.020 mm
Repeatability T axis ±0.01°
Repeatability R axis ±0.025 mm
Speed Z axis 250 mm/sec
Speed T axis 360° /sec
Speed R axis 1200 mm/sec
Throughput 4 sec/wafer
MTBF 25,000 hours
MTTR < 2h
Weight 24.5 kg
Power supply AC 110/230 V **
Note : * expandable to 900° continuous rotation
** optionally 24 V DC (by using of external supply)
Layout drawing
V-Design OEM Systems
Tel. (+49) 6142 2200030
E-mail: v.design@mail.bg
http://www.vdesign.bg
Dipl. Eng. Vesselin Dantchev
Cell. (+49) 162 8876400
vdantchev@mail.bg