![High-k Materials for Future Electronics
Tyndall-Intel collaborative research
into high-k/III-V MOSFETs
• Industrial Relevance: high speed and low
power transistors for future CMOS using Prototype High Mobility FETs for future
high-k/III-V materials on silicon. high speed and low power logic
• Key Challenge: Control and understanding of Pd
the high-k/III-V interface defect density (DIT)
High-k
can lead to improved MOSFET performance.
InGaAs
• Tyndall Research Achievement: Marked
i
improvement of high-k/III-V interface using
novel interface control layers (MgO and Reducing high-k/III-V interface DIT is critical
Al2O3) and in-situ H2S passivation. for high mobility and switching speed
• Full In0.53Ga0.47As high-k/III-V MOSFETs show bility µ [cm /Vs]
In0.53Ga0.47As Mobility comparison
carrier mobility 4x greater than obtained
2
1200
for In0.53Ga0.47As
with strained silicon. 800 high-k/III-V and a
Strained
high-k/Si based
• Strong collaboration with Intel (i Ireland and
S ll b i ih l (in l d d Silicon
Sili
Peak Mob
400
Silicon MOSFET
USA), involving joint materials research and 0
16
an Intel researcher in residence at Tyndall.
www.tyndall.ie](https://image.slidesharecdn.com/rogerwhatmore-100428070820-phpapp02/75/Roger-Whatmore-16-2048.jpg)
Uploaded byEngineers Ireland
Roger Whatmore
The document discusses the role of Tyndall National Institute in advancing research and innovation within Ireland, emphasizing the importance of a highly educated workforce and collaboration with industries. It introduces concepts of closed and open innovation, outlining Tyndall's research activities in various fields such as photonics and microelectronics, and its contributions to societal challenges like energy and health. The institute's achievements include significant partnerships, successful spinouts, and advancements in technology that address both industrial needs and academic research goals.
Roger Whatmore
- 1. Research Leadership, Innovation and Tyndall National Institute Roger W. Wh t R W Whatmore CEO Tyndall National Institute y 1 www.tyndall.ie
- 2. Why Do Research? •Why Does Society Fund Research? – F d Fundamentally t ll • Jobs and Wealth Creation – Innovation • Attracting new investment • Creating new companies addressing new markets g p g – People • Education levels must increase with time • Irish people must be as highly educated as possible – National Prestige • “Feel Good” factor “Feel-Good” www.tyndall.ie
- 3. “Closed” Innovation The “Closed Paradigm” Research Development Boundary of Firm Research Projects Market Examples: Bell Laboratories The “Virtuous Circle” Xerox PARC Fundamental Technology Breakthroughs Increasing investment in R&D New Products and Features Increasing Sales and Profits Via Existing Business Model Chesborough: “Open Innovation” www.tyndall.ie
- 4. “Open” Innovation Research Development New Market Boundary of Firm Research Projects Traditional Market Examples: Produces: CISCO Dynamic environment Intel Drive to innovate Ability to address new markets quickly Chesborough: “Open Innovation” www.tyndall.ie
- 5. Open Innovation Needs •Creative, dynamic environments – New ideas and companies being rapidly created (and destroyed) •“ “Smart”, well educated people ” ll d d l – Risk, entrepreneurship • Access to excellence – At least at internationally-competitive levels y p • Good, rapid access to new, developing markets www.tyndall.ie
- 6. Role of theResearch Institute • Producing research excellence • Producing “smart” highly educated PG s smart PG’s and PD’s • Providing an attractive research environment – International researchers – Facilities and infrastructure – Access to National research funding • Industry Access – Physical – Intellectual www.tyndall.ie
- 7. Working with FDI/ IDA / SFI – Photonics for Exascale Computing • IBM has established exascale stream computing research collaboratory in Dublin • Exploits Tyndall’s core photonics technologies and expertise in exascale computer interconnect – Multidisciplinary collaboration also includes researchers from Trinity College Dublin, NUI Galway, University College Cork & IRCSET, with support from IDA NEC Earth Simulator (#1 i t 500 li t 2002 2004) in top500 list 2002-2004) Exascale ~ 1018 FLOP/sec IBM Blue Gene/L : Lawrence Livermore National Lab (photo: Wired, Feb 2008) • >40% o $ 50 p oject cost 0% of $250M project in interconnection network 7 www.tyndall.ie
- 8. Tyndall National Institute • Established in 2004 • >420 research engineers, scientists, students, interns & support staff • Critical mass of researchers h • Largest research institute in Ireland • >€200M capital p investment 8 www.tyndall.ie
- 9. Tyndall’s Technical Activity& Market Areas Photonics – Micro/Nanoelectronics - Microsystems MIcrobolometer Red VCSL Quantum dots Photonics Microsystems Microsensor module • Telecoms • Wireless Sensing • Automotive • Analysis • Lighting • Healthcare • Energy • Environment Component Integration & Energy Scavenger Packaging g g Micro/nanoelectronics • Health • Mobility y Coherent WDM 50nm nanopores • Security • Communications • Entertainment High-κ Materials 9 SOI NanoTransistor & molecular electronics www.tyndall.ie
- 10. Technology or “GrandChallenges”? “Grand Challenges” for society • Communications & Computation • Energy • Health • Sustainable development 10 www.tyndall.ie
- 11. Science, Technology, Innovation& Education Science, Technology and Innovation High Quality Science & Engineering PIs & Researchers Delivering leading edge research results Outputs: p Enterprise, Solutions for Communications Innovation and Industry nics Industry Growth Licenses anoelectron crosystems High quality Photonics Health Hi Pot Start-ups Commercialisation PIs Innovation & Partnerships Researchers Environment E i t Microna Mic Industry Delivering collaboration Commercialisable Solutions & Value from Energy Patents Research R h Foreground Ph µNe µSy Shared IP Output: Students p Outputs: Science, Technology, Publications & Patents and Post-Docs Background Tyndall IP 11 www.tyndall.ie
- 12. Tyndall and HumanCapital – Research Students Physics trical Engineering Chemistry 160 oelectronics Microelectronics mistry 140 Masters nce sics Electrical Eng Chem Scien Micro Phys Elect 120 PhD Other Sciences 100 80 60 40 20 0 2006 2007 2008 2009 2010 (to Date) Unique features of graduate education at Tyndall: • Multi-disciplinary approach to ICT education and strong project team ethos • Close affiliation to industry through project themes and direct industry participation through EU and EI projects • Provision of state-of-the-art R&D infrastructure and hosting of undergraduate and postgraduate students www.tyndall.ie
- 13. Funding Diversity -PRTLI / SFI / EI Synergy Examples PRTLI SFI EI Output E-beam J-P Colinge Junctionless Transistor PI Grant MOCVD E. Pelucchi Quantum PI Grant Dots & Lasers ALD/ M. Pemble Oxide Coatings AVD PI Grant & FORME SRC Photonics PiFAS SRC Packaged Packaging P k i lasers l www.tyndall.ie
- 14. Some examples ofInnovative Success • A license deal • Collaborative R&D with a major FDI multi-national multi national • Servicing the technical business needs of a major FDI multi-national j lti ti l • A Tyndall spinout • A high-tech device fabrication and supply service www.tyndall.ie
- 15. New materials fortransparent electronics CRYSTAL STRUCTURE OF Ba-doped SrCu2O2; Challenge: A p-type transparent blue=Ba, green=Sr, pink=Cu, red=O. conducting oxide (TCO) for transparent electronics. Question Posed: Can we use modelling to design a new p-type TCO instead of traditional trial-and- error approach? Result: Predicted a novel TCO, with optimal composition for Ba distorts the structure, reducing Cu-Cu interactions transparency: Ba-doped SrCu2O2. and increasing the transparency to visible light. By contrast, other dopants reduce the transparency. Experiments by European partners confirmed its properties. Material SrCu S C 2 O2 Ba-doped B d d SrCu2O2 was patented and licensed to doping widens band gap Umicore. more transparent to visible light European ICT-FET project: ‘Novel ICT FET Novel advanced transparent conductive SCHEMATIC ELECTRONIC STRUCTURE showing gap between conduction band and Cu-derived valence band oxides’ (NATCO). www.tyndall.ie
- 16. High-k Materials forFuture Electronics Tyndall-Intel collaborative research into high-k/III-V MOSFETs • Industrial Relevance: high speed and low power transistors for future CMOS using Prototype High Mobility FETs for future high-k/III-V materials on silicon. high speed and low power logic • Key Challenge: Control and understanding of Pd the high-k/III-V interface defect density (DIT) High-k can lead to improved MOSFET performance. InGaAs • Tyndall Research Achievement: Marked i improvement of high-k/III-V interface using novel interface control layers (MgO and Reducing high-k/III-V interface DIT is critical Al2O3) and in-situ H2S passivation. for high mobility and switching speed • Full In0.53Ga0.47As high-k/III-V MOSFETs show bility µ [cm /Vs] In0.53Ga0.47As Mobility comparison carrier mobility 4x greater than obtained 2 1200 for In0.53Ga0.47As with strained silicon. 800 high-k/III-V and a Strained high-k/Si based • Strong collaboration with Intel (i Ireland and S ll b i ih l (in l d d Silicon Sili Peak Mob 400 Silicon MOSFET USA), involving joint materials research and 0 16 an Intel researcher in residence at Tyndall. www.tyndall.ie
- 17. Design Technology Evaluation Solving Industrial Problems Tyndall in support of ADI product developments: • Electrical measurement of new and re-designed IC's. IC Design Evaluation. TLP Measurements. • Process transfer comparative p performance evaluations. • Application specific performance measurements. • TLP assessment of ESD structures. • FIB adjustment of designs and re- Design and technology Intellectual Property evaluations. protection investigation and claim charting. • P Process monitoring. i i • Patent infringement investigation. Wafer level parameter measurements, 1/f noise • Benchmarking of designs and and RF performance technologies. technologies characterisation. 17 www.tyndall.ie
- 18. Tyndall Spinout –Avalanche Photodiode Array SensL, Silicon Photomultiplier Array ( (SPMArray) based on Avalanche y) Photodiode (APD) technology Fabricated in the Tyndall silicon processing facility • World-leading technology – Capable of detecting single photons of light – Developed from 10 years+ Tyndall research – Major applications in Medical diagnostics, Nuclear Medicine and Low Light Imaging i l di Fl Li h I i including Fluorescence of Bi h i l species f Biochemical i – The SPMArray is the first commercially available, solid-state, large array detector based on silicon photomultiplier technology. 18 www.tyndall.ie
- 19. Devices to Industry- Radiation Transducers RAD1 RADFET chip Sicel’s OneDose system: dosimeter patch with RAD1 and the reader • RADFET = Radiation Sensing Field Effect Transistor • World-leading supplier of RADFETs (ESA, NASA, JAXA, CERN, …) • OneDose surface dosimetry system: already in the US market y y y – Radiotherapy treatment – First FDA approval of Tyndall technology • Annual RADFET sales 350,000 units • Order for 240,000 units received Q3 2007 240 000 www.tyndall.ie
- 20. EU Funding • EUFunding has been, and is critical to been is, Tyndall’s development and activity • Brings: – Funding – C ll b ti across th whole of EU with Collaboration the h l f ith 100’s of companies and RTD organisations – W ld l World-class international collaborations i t ti l ll b ti • Allows us to bring-in Irish companies www.tyndall.ie
- 21. EU Project Example- PIEMAN Partners • Challenge – Develop a radically-new optical fibre network concept that will deliver: • Substantial increases in broadband communication rates for residential and business users • Significant network simplification – Lower equipment cost – Lower operational cost – Easier to manage and maintain www.tyndall.ie
- 22. Network Today Customers connectedby copper Core Metro Exchange building • Electronic switching nodes • Power hungry • Numerous (~6000 in typical large EU country) business and Access residential customers www.tyndall.ie
- 23. Network Evolution: Fibre-to-the-home Customersconnected by Fibre Higher bandwidths, but network complexity and cost remains hi h d t i high www.tyndall.ie
- 24. Network Evolution: PIEMAN PIEMAN Advantages Simplifies network • All optical network p reducing equipment & operating costs − 5 × Span (100km) − 10 × Bandwidth − 10 × No of Customers No. − Highly shared (WDM) • Enables elimination of electronics and exchanges − From ~6000 to ~ 200 in typical large EU country − Major power savings relative to the copper network www.tyndall.ie
- 25. Innovation • Open Innovation – Widely adopted as a successful business approach to Research and Technology Development – Irish environment is well suited to servicing this need with: • High quality people • High quality facilities • Access to flexible funding instruments www.tyndall.ie
- 26. The Immediate Future SustainingR&D investment is key to economic recovery • Retaining our experts • Training our graduates • Maintaining our reputation for excellence • Leading in state-of-the art • Remaining attractive to FDI • Building upon our success • Generating growth Innovate our way into economic recovery and growth www.tyndall.ie
- 27. Thank You! Any Questions? 27 www.tyndall.ie