88 Equipment Q1 2015 members bios expertise

1. 2/5/2015© 2014 88 Equipment
Equipment Engineering
and Process Consulting

2. © 2014 88 Equipment 2/5/2015 2CONFIDENTIAL
Member Biographies
Peter J. Nowosad - President and Director of Operations
 20+ yrs. experience in project and customer support management WW
 Broad semiconductor and equipment background
 CAD design for high-tech chemical/gas distribution systems
 Knowledgeable in diffusion, CVD, ALD, PVD, and Etch
 Based and living in Taiwan since 2000
Todd O. Curtis - V.P. and Chief Technical Officer
 40 yrs. experience in III-V and Silicon: CVD/ALD processing and integration
 R&D with IBM, Intel, TI, Motorola, SEMATECH, SELETE Japan, TSMC, ST…
 Semi-Materials R&D Apps. Lab Mngr: equip, metro, staff, training, facilities…
 Over 25 articles: CVD & ALD, silicon and III-V materials, device integration
 Technology consultant to the 22nm node, selective deposition patent
 Semi, Solar, LED, and Raw Materials Engineering. Taiwan resident
Michel D. Ouaknine - Vice-President of European Operations
 µProcessor Apps Mgr. for 12 years with Intel, Intersil, and Zilog
 Authored 2 books on µP’s and ~ 40 technical & scientific papers
 CNAM ingénieur thesis on selective EPROM programming, 1976
 Coordinator with EU organizations: CE standardization, working with IMEC,
LETI & Fraunhofer Institute
 SEMI S23 standard on Energy Conservation. Paris resident

3. © 2014 88 Equipment 2/5/2015 3CONFIDENTIAL
Todd O. Curtis: Expanded Bio
Todd started his semiconductor career in 1973 at the Hewlett-Packard Opto-Electronics Division in Palo
Alto California. He spent the next 15 years in L.E.D. and MESFET III-V materials production and
development epitaxial operations at such notable companies as Siemens, Fairchild, Avantek, Gould-
Dexcel, and Watkins-Johnson Microwave Group.
In 1989 he began his silicon materials career in Watkins-Johnson Semiconductor Products Division in
Scotts Valley California at the cusp of the industry evolution from 150mm to 200mm wafers. Todd spent
the next 15 years with Watkins-Johnson in equipment and process engineering working in production
and R&D device and materials operations. Todd worked with and co-published technical papers with
companies world-wide including INTEL, TSMC, UMC, Texas Instruments, ST Microelectronics, Motorola,
IBM, Chartered, Samsung, Sematech, SMIC, Toshiba, Sony, and NEC.
His process development work in the early 1990’s on STI (shallow trench isolation), ILD (inter-level
dielectrics) and IMD (inter-metal dielectrics) became mainstream production processes used in over
80% of the semiconductor factories world-wide. His last R&D project was at the 22 nano-meter
technology node for ALD (atomic layer deposition) for high-K gate dielectrics and ALD tunable work-
function metal gates.
His 40+ years of materials research and production experience includes III-V's for L.E.D. and
MESFET's, and over 30 types of silicon related oxides, nitrides, and metals utilized in front-end and
back-end applications.
He has been an independent technology consultant since 2003 for equipment and process in the fields
of semiconductor, solar, and LED operations. He has lived in Taiwan since the year 2000 and travels
frequently to Vietnam in support of his current projects.

4. © 2014 88 Equipment 2/5/2015 4CONFIDENTIAL
Todd O. Curtis
Companies-Position-R&D Sites
Technicon 1971
Electrician
Hewlett-Packard
1973-1978
LED Epi & Xtal
Growth Ops.
Siemens Opto
1978-1979
GaAsP Epi R&D
Fairchild Opto
1979-1982
LPE, MOCVD
III-V EPI R&D
Avantek GaAs
1982-1983
Military GaAs
Epi & Implant
Dexcel-Gould
1983-1986
Military GaAs
AsCl3 Epi & Dev.
Si-Fab
1986-1988
Silicon Fab
Equipment
WJ Microwave
1988-89
Military
III-V MBE
WJ Semi. Equip.
1989-2000
APCVD, MOCVD
Apps. Lab R&D
ASML Thermal
2000-2003
ALD, APCVD,
MOCVD R&D
Consulting 03-06
Genus-Aixtron
2006-2007
ALD R&D CVD W
2007-Current
Used Equip.
Technical
Consulting

5. © 2014 88 Equipment 2/5/2015
GaAs ~ III-V
Process, Materials, Device, Equip.
CONFIDENTIAL 5
Hewlett-Packard
1973-1978
Epi & Xtal Growth
GaAs, GaAsP, GaP
Siemens Opto
1978-1979
GaAsP VPE
Epi R&D
Fairchild Opto
1979-1982
LPE, MOCVD
III-V EPI R&D
Ternary & Quaternary
Avantek Microwave
1982-1983
Military GaAs
VPE Epi & Implant
Dexcel-Gould
1983-1986
Military GaAs
AsCl3, MBE Epi &
Device Process
WJ Microwave
1988-89
Military
III-V MBE
Genus-Aixtron
2006-2007
ALD & EPI R&D
MOCVD
Over 15 yrs. of
III-V Experience
Process Materials Device Equipment
AVANTEK

6. © 2014 88 Equipment 2/5/2015
GaAs ~ III-V
Process, Materials, Device, Equip.
CONFIDENTIAL 6
Process
Epitaxy
MBE-MOCVD
LPE-VPE
Cl3 & AsCl3
Solid and
Semi Solid
Sources
Materials
GaAs
GaAsP
GaP
AlGaAs
InAlGaAs
P or N Doped
Device
L.E.D.
MESFETS
Lo-noise
Power
T and Y-gates
Air Bridges
HEMT-Quad-
Layers
Equip.
Reactors
Metals
Metrology
Parametric
Test
Cleans
All Types

7. © 2014 88 Equipment 2/5/2015 7CONFIDENTIAL
Michel D. Ouaknine: Expanded Bio
• Started as Design Engineer: frequency counters, real time control equipment, digital intelligent clock
for industrial applications, data acquisition systems, microcomputer memory tester controller…
• Microprocessor support at Intel. Handled Intel’s microprocessor courses & technical seminars in
France. Started Intel’s European Applications Lab (with DRAM/EPROM test & analysis).
• Managed Intersil South Europe Applications & microprocessor courses. At Zilog, launched Z800 &
Z8000 microprocessor families and specialized in communications controller support.
• Created Western Digital South Europe subsidiary organization: sales, applications, marketing,
customer service, bonded warehouse... to address the 3 WD markets simultaneously. Qualified WD’s
X.25 communications products with all key South Europe organizations (CNET, Transpac, Telefonica…)
and customers (Olivetti, Bull, HP …).
• Started Genus European operations: sales, service & process engineers, inventories in strategic
locations... Introduced Genus technologies (mostly tungsten silicide CVD and high energy implant into
key European accounts and grew EU sales to approximately 12 % of Genus revenues.
• Joined Mattson Technology to handle South Europe Sales: introduced & qualified Mattson ICP strip
into all major semiconductor manufacturers in France & Italy (& their US operations). Became Global
Account Manager for a major EU manufacturer, directly reporting to Mattson’s President; developed
partnership, joint papers & seminars; filed 2 joint patents. Promoted to the responsibility of RTP
European Sales on January 1st, 2000.
• Launched WaferMasters EU organization to develop its unique RTP technology: get qualified with EU
semiconductor companies, organized a EU Applications Lab, European support. Got WaferMasters
involved with the key European R&D organizations, organized all EU certifications and involved
WaferMasters with the SEMI S23 standard on Energy Conservation. Represented my company at
several scientific seminar on RTP & authored several papers.

8. © 2014 88 Equipment 2/5/2015 8CONFIDENTIAL
Michel D. Ouaknine: Expanded Bio
Vast applications-oriented background.
o Author of « La pratique des microprocesseurs », 1977, Paris & Intersil IM6100 µP course book.
o Published ~40 papers in French & US magazines and for scientific symposia.
o Design then applications manager for 12 years, mostly in control logic & microcomputer real time
and data acquisition systems.
o Initiated microprocessor & microcomputer courses for Intel customers & representatives.
o Started the European DRAM memory test & analysis laboratory and designed the first EPROM
programmer for Intel development systems.
o Organized technical presentations & lectures to scientific seminars for new equipment & processes;
participating to the demos: preparation, execution & results review.
Managing vision/Understanding customers
o Started the European operations for 4 different US companies: Western Digital (1984), Genus
(1992), Mattson Technology (1996) and WaferMasters (2001).
o Set up & organized the European branch offices in synchronization with operations growth: sales,
applications, marketing, customer service, bonded warehouse & administration.
o Organized operations to provide total customer satisfaction: exposition to advanced systems or
process, technical service and all administrative support.
o Developed partnerships: JDP, joint patents, papers and participation to scientific symposiums.
o Familiar with EU organizations while involved in Corporate projects : CE standardization, design
center in Nice, France, distribution center in Amsterdam, The Netherlands...

9. © 2014 88 Equipment 2/5/2015 9CONFIDENTIAL
Michel D. Ouaknine
Companies-Position
Dyna Electronique
1972-1974
Design Mngr.
Intel
1974-1977
Apps. Engineer
Intersil
1977-1982
Applications Manager
Zilog
1982-1983
Applications Manager
Western Digital
1984-1990
Managing Director
Genus Inc.
1992-1996
Europe Director of
Operations
Mattson Technology
1996-2001
RTP Sales Manager
WaferMasters
2001-2004
Europe Operations
Manager
Technical and Sales
Consulting
2004 to current

10. © 2014 88 Equipment 2/5/2015 10CONFIDENTIAL
Dr. Len Mei joins 88 Equipment as Key Advisor
for International Business and Technology
Feb 15
Dating back to the early 1980’s, Dr. Mei has been at the forefront of advanced semiconductor
development and manufacturing on an International scale with over 30+ years of academic and
industrial experience in semiconductors.
 Fab director at Read-Rite California, managing thin film disk head fab ops and dev.
 Process manager at Fairchild Semiconductor for advanced memories .
 Process manager at Data General for microprocessor development and pilot line.
 Director of planning at Elebra, designing the first 8” advanced wafer for Brazil in 1987.
In academics, he has been a professor at the University of Campinas, Brazil and a visiting
Research Associate Professor at Stanford Electronics Lab, Department of EE - Stanford University.
From 1997-2009:
 EVP of Operations and Business Development for ProMOS Technologies - responsible for all
aspects of ProMOS manufacturing operations including four front end wafer fabs with total
capacity exceeding 80K/month 12” wafers and back end operation, product engineering,
strategic planning, automation for equipment, factory and data. He managed up to 4,000 head-
count and 65 nm technology in volume production with annual capex exceeding $1 billion.
After 2006, Dr. Mei became responsible for new technology and business development at ProMOS.
In this capacity, he founded CapsoVision, a company dedicated for the research and production of
capsule camera for medical applications. CapsoVision’s device is pending on FDA approval in
2015.
Dr. Mei holds more than 20 US international patents in semiconductor technology and is the
author of the book "Practices of Wafer Fab Operations“.
He received his Ph.D. in Metallurgy from University of Illinois at Urbana-Champaign, USA.