1. MIKE FIRMSTONE
29 Wallace Drive
Eaton Bray Status : Married, 2 (adult) children
Dunstable Telephone : +44 (0) 1525 220 946
Beds Mobile : +44 (0) 7917 581 883
LU6 2DF e-mail : mfirmstone@aol.co.uk
Experienced and successful in the development and marketing of high performance advanced products
for electronics packaging, thermal management and interconnect.Strong instinct for combining technical
merit/innovation with commercial opportunity using vision and creativity with sound strategy,
organisation and discipline to produce solid, quality results. Well published, senior figure with extensive
network of contacts in Europe, Japan and the USA.
QUALIFICATIONS / ATTRIBUTES
 Graduate of the Institute of Physics  Member of IMAPS and IPC
 Experienced international professional  Proficient with current business software
PUBLICATIONS ANDPATENTS - At end of CV
CAREER HISTORY
Mid 2010 - Present Semi Retired
Still consulting. Currently working with Graphene materials to provide enhanced electrical and thermal
conductivity, heat sinks, substrates and conductive traces. Also nano scale silver derived from organo-
metallic compounds for high power die attach and conductive inks/adhesives. New projects include nano-
diamonds to improve thermal conductivity in adhesives and thermal interface materials (conductive and
insulating) and novel die attach adhesives.
Mid 2014 - Present Carbodeon Ltd -Vantaa (nano -diamond products)
Consultant Applications Manager (Electronics)
Focussed on use of nano-diamonds for thermal management materials in HBLEDsand other
high power electronics
2011 -2014 Cambridge Nanotherm - Haverhill (advanced thermalmanagement substrates for power
electronics)
Consultant
Technology, applications, sales leadsinput. market focus advice.
Mid 2006 – mid 2010 Thermastrate Ltd – Cramlington (advanced thermalmanagement solutions)
Technical Director/Product Development Manager (as consultant)
Developed the Ultratherm® plated copper on ceramic technology, see
www.thermastrate.com). Focussed the applications,marketing and sales effortson HBLED
market. Developed supply chain of specialist collaborators and sub-contractors. Specified
and procured prototype and production equipment. Managing company involvement in
UPTEMP collaborative project (electronics for 250C operation down wells)

2. Jan 2001 – Mid 2006 LORD Corporation – Cary NC and Manchester UK
Business Development Manager and European Technical Manager for Thermoset™
products in Europe
Promoted a completely unknown supplier of Electronics Materials into Europe.
Developed brand awareness and significant sales and partnerships with tier 1 companies
1994 – End 2000 Loctite-Multicore (formerly Multicore Solders Ltd) – Hemel Hempstead UK
Global Manager,Advanced Products Division SBU
(materials and technologies for electronics packaging and interconnect)
Engineered a $60m+ p.a. revenue stream license deal with Texas Instruments-USA
1986 – 1994 ICI Electronics / Zeneca Luxtrak business – Runcorn UK
Process Manager - Advanced Interconnect Centre (semi-additive High Density Interconnect)
Applications Manager- Luxtrak business (photocuring adhesives and films for electronics)
Developed and marketed (licensed and sold) unique electro-plated HDI technology
1979 – 1986 Electro Materials Corp ofAmerica (EMCA) (now part of Ferro)
Mamaroneck N.Y. USA and Cambridge UK
Project Manager USA – Potentiometer materials development
European Technical Manager
European General Manager
(Thick Film and associated electronic materials for hybrid microcircuits)
Developed potentiometer ink system – Restructured European operation; doubled turnover
1969- 1979 Allen Bradley Electronics Ltd – JarrowUK
Project Leader - New (thick film) technologies
Technical Manager- Electronic components – potentiometers, resistor networks, Hybrid
Microcircuits, precision thin film resistors
General Manager - Hybrid Microcircuits business unit
Installed Thick Filmtechnology and products – Managed Hybrid unit into profit
1962 – 1969 Arborite Ltd - North Shields UK
Production Superintendent (manufacture of prepregs and laminates)
Devised unique decorative embossing process – Supervised 3 shift manufacturing
ACHIEVEMENTS ANDEXPERIENCE
LORD Corporation – European BusinessDevelopment Manager and Technical Manager
- Located, appointed and trained 12 distributors servicing 18 countries in Western and Eastern
Europe
- Developed sales covering complete product range with tier one companies such as Apple, Tyco,
Mettler, Solectron, Siemens, Miele, Thales, Ericsson, and Celestica

3. - Achieved technical success (best in test) with VTT for Nokia, Alstom, Kitron and initiated major
projects with Sclumberger, Bosch, Bookham, Alcatel space,Ericsson Micro, C-Mac,Solectron
and Thales
- Orchestrated campaign to take > £ 1 million business at Schrader leading to success against 12
competitors (including the usual suspects)
- Latterly, refocused the business onto automotive electronics/electrics forming development
partnerships with Siemens VDO,Visteon, Delphi, Valeo and Schrader.
Multicore Solders Ltd – Global Manager, Advanced Products Division
- Formulated strategy and created a successful“niche” SBU based on revolutionary materials and
technologies for electronics packaging and interconnect – Multicore Advanced Products Division, a
30% ROS business providing advanced and environment friendly enabling technologies.
- Conceived, implemented and marketed a unique identity package for Advanced Products Division
resulting in raising market perception of the company from low tech commodity supplier to the point
of partnering majors e.g. Nokia, FCT, TI in advanced microelectronics packaging technologies
- Personally negotiated several joint development and license deals, managing these into launched
products with high industry acceptance. Notably, a collaboration with Texas Instruments providing
an income stream worth $ tens of millions in combined royalties and (captive) materials sales.
- Selected, trained and managed specialist distributors in Europe achieving visibility and market
penetration with personal access to senior decision makers throughout Europe and Nordic
- Analysed electronics packaging techno-commercial trends and developed product portfolio focussed
on innovative but solid solutions. True enabling technologies which guaranteed both technology
seminars and product evaluation with world class players, e.g. Siemens, Bosch, Philips, Lucent,
Celestica
- Negotiated an advantageous license with ASAHI for Surface Mount Adhesive, installed production
facilities and launched products winning prestigious customers from the competition e.g .Daewoo
- Negotiated exclusive USA distributorship for ASAHI Polymer Thick Film products, specified and
installed dedicated support lab and hired specialist Manager attaining $1.5m sales in the first year
with quality customers e.g. Motorola, 3M, Sheldahl, WUS, Ibiden.
- Strengthened and secured market position via aggressive patent and brand image policy. Two
patents granted, two close to grant and registration granted for Endur, Polymet, and Chip-Loc
trade names.
ICI Electronics Division – Process Manager, Advanced Interconnect Centre
- Created unique High Density Interconnect technology using PCB industry technologies, imaging,
plating, etching, combined with semiconductor processing practice – has performance,reliability and
features previously unattainable
- Extended technology to 4 plated layers and the incorporation of air fired thick film materials.
Notably air fired resistors with plated copper conductors and photo-imageable dielectric.
- co-inventor of resistor process
- Broadened the technology with the invention of Organo-metallic compounds which enhanced
adhesion to a range of ceramic substrates, Alumina, Aluminium Nitride, dielectrics and compatible
with eutectic die attach.
- Initiated collaborations / partnerships with both MoD and merchant electronics companies.

4. Achieved technical success and sales to MoD. Negotiated successfultechnology license with high
end hybrid microcircuit company in the UK which is still operating.
- Created market awareness and demand via technical presentations at prestigious conferences
combined with commercial presence at accompanying exhibitions
ZENECA (demerged from ICI) Luxtrak business – Applications Manager
- Selected and trained and supported European distributors. Developed action plans, milestones and
performance reviews resulting in 50% increase in sales in 2 years
- Conceived and implemented new generation of market focussed product brochures including
application notes per market sector. Achieved 200% increase in enquiry rate in 6 months.
- Carried out market survey for adhesives, sealants and encapsulants in the European electronics
industry including in depth profile on global competition. Identified opportunities and sharpened
business planning.
- Negotiated joint development and exploitation strategies with partners to lever route to market.
Notably; I initiated the “Ablestik / Nat Starch connection”.
Electro Materials Corp ofAmerica (EMCA) – European Operations Manager
- Invented high performance thick film resistor/conductor system for Potentiometers and developed
applications and performance data, customer focussed brochure and quality customer (Litton).
- Formulated range of thick film inks addressing market drivers viz, low cost, thin print conductors,
conductor/dielectric multilayer combinations and photo-imageable microvia dielectrics.
- Restructured the European business via relocation to new premises, recruitment and training of
functional managers, rationalisation of purchasing and pricing policies, introduction of new products
and applications training of distributors. Achieved 100% increase in sales plus 15% GM
improvement in two years.
- Enhanced European market presence by introduction of technology seminars, rapid response tech
service facility and personally providing problem solving and applications support winning business
at majors e.g. Philips from strong corporate (DuPont) competition.
- Established long lasting and special relationships with customers plus an enviable reputation for
commercial integrity and technical excellence.
Allen Bradley Electronics Ltd – General Manager, Hybrid circuits SBU
- Transferred resistor network technology from the USA plant. Established high volume production
facility and developed improvements resulting in 5 fold capacity increase and near 100% yield.
- attained BS 9450 capability approval for the facility -
- Designed and resourced one of the first industrial dedicated Thick Film R&D laboratories in the UK.
As an acknowledged centre of excellence the facility developed technology and materials to enable
entrée into full blown “chip and wire” hybrid microcircuits plus support for core (passive) products.
- Managed the Hybrid circuit business unit into profitability and 40 % increase in sales over budget.
Installed both reflow solder and state of the art “chip and wire” assembly technology with full active
laser trimming. Resultant custom capability enabled market differentiation and expanded quality
customer base.

5. - As Technical Manager – recruited,trained and managed a 14 strong team of R&D engineers and
production process controllers for all thick and thin film products
Arborite Ltd - Production Superintendent
- Developed unique low cost decorative embossing process with versatile design capability
- Supervised 3 shift continuous manufacturing improving impregnation process to double capacity
- Member of BS technical committee setting standards for laminate
MIKE FIRMSTONE
PUBLICATIONS ANDPATENTS
EKTN webcast - Thermalmanagement materials review and selection criteria – see
http://thermal.electronics-ktn.com/thermal/webcasts/mfirmstone/player.html
“Basic Thermal Interface Parameters and Review of materials for complete Thermal Management”
M Firmstone IMAPS France February 2006
“Development of true Printed Circuits using Active Metallurgy Conductive Ink”
M Firmstone, D Lowrie, IMAPS Nordic Sept 2000
“True printed Circuits on Organic Substrates – Polymer-Metal ink prints Solderable Conductors”.
D Lowrie, M Firmstone, B Chowdrey – Multicore Solders Ltd, H Craig, SVT
IMAPS Boston Sept 2000
“The Development of a Novel, Low Stress,Non Popcorning, Glob Top and Encapsulant”
M Firmstone, PM Bartholomew, D Lowrie – MSL, D W Smith, NL Matttey - DERA.
EC-MCM ’99, Jan 1999
“Thermal and Electrical Evaluation of a Novel Polyurethane Semiconductor Encapsulant”
M Firmstone, P M Bartholomew, D Lowrie – MSL, D W Smith, N L Mattey – DERA
IMAPS Europe Harrogate June 1999
“An Innovation in Thermoplastic, Reworkable, Adhesive pastes”
R Dietz, D Peck – Diemat,M Firmstone - MSL. IEPS USA 1994
“Innovative Redesign Using COB Significantly Reduces Solder Content”
M Firmstone –MSL,N Edwards – CIL. Proceedings IMAPS UK Jan 1995
“Benefits of Thermoplastic Conductive Adhesive in Advanced Packaging Applications”
M Firmstone et al, “ Adhesive Joining in Electronics”, Eindhoven Sept 1995
“Enhancing Thermal Conductivity in Organic Adhesives”
R Dietz, M Firmstone et al. “Adhesives in Electronics” Stockholm 1996
“ High Power Applications with Advanced, High k, Thermoplastic Adhesives”
M Firmstone, P M Bartholomew – MSL, R Dietz, P Robinson – Diemat.
ISHM Venice May 1997
“The Characterisation of Enhanced, Reworkable, Thermoplastic Adhesives in Solder
Replacement and Die Attach Applications” M Firmstone, PM Bartholomew.
IMAPS Nordic Sept 1997
“Enhanced Thermoplastic Conductive Adhesives for Multichip Modules”

6. M Firmstone, P M Bartholomew. IMAPS MCM Conf London Jan 1998
“The Moulded Electronic Package – Irresistible combination of planarised embedded components
and HDI additive circuitry in a recyclable solderless substrate”
D Lowrie, M Firmstone, P M Bartholomew – MSL, B Green Elpac. IMAPS Dallas, April 1999
“The Moulded Electronic Package” M Firmstone, D Lowrie, P Bartholomew, - MSL – B Green, Elpac.
IMAPS Nordic Sept 1999
“Evaluation of Predeposited (no flow) Underfill for Flip Chip / CSP Assembly”
M Firmstone et al – MSL, S H Mannan, D A Hutt – Loughboro’ University.
IMAPS Nordic Sept 1998
“New Generation Pre-Deposited Underfill for Low Cost Flip Chip Assembly”
M Firmstone et al, Adhesives in Electronics, Binghamton USA Oct 1998
WORKSHOP “Breakthroughs in Electronics Packaging and Manufacture” - ICM full day
Mike Firmstone, Nepcon ’99 Mines Exhibition Centre Kuala Lumpur- June 1999
ARTICLE -“Benefits of Thermoplastic Conductive Adhesive in Advanced Electronics Packaging” –
M Firmstone et al. Microelectronics International May 1997
ARTICLE – “Flip Chip Barrier Lowered” -Mike Firmstone. Electronics Production Feb 1998
ARTICLE – “ No Cure for Adhesives” – Mike Firmstone, Ray Dietz, David Peck.
Electronics Manufacture and Test June 1997
ARTICLE – “COB Ousts Tin / Lead” – Mike Firmstone.
Electronics Manufacture and Test, March 1995
ARTICLE -“Review of Polymer Thick Film” – Mike Firmstone, Dr Tim Lawrence EM &T march 1994
"State of the Art Microcircuit Interconnect Fabricated by Copper Plating on Ceramic"
Michael G Firmstone ,Transactions of IMF Vol. 67 part 2 1989. (Paper presented in Apri11988)
"High Density Multilayer Interconnects incorporating Electroplated Copper and Air Firing Thick
Film Resistors". M G Firmstone, A A Lindley, P K Majithia, T W Dekleva.
Proceedings of 7th European Hybrid Microelectronics Conference -Hamburg 24-26 May 1989.
"High Density Multilayer Circuits incorporating Electroplated Copper and Air Firing Thick Film
Resistors" M G Firmstone, A A Lindley, T W Dekleva, D B James.
Transactions of IEPS USA Sept 1989
"Laser Trimming of Thick Film Resistors on Multilayer Dielectric"
M Firmstone and J Hain "Internepcon" 1982
PATENTS APPLIED FOR
1 "Thick Film Resistor/Integrated Circuit Substrate and Method of Manufacture"
Inventors-M G Firmstone T W Dekleva filing date 13.9.89

7. 2 "Compositions" -Inventors -M G Firmstone R A Stephens
(seed layer material for electronic circuits) filing date 2.10.89
3 "Compositions" -Inventors -M G Firmstone A A Lindley
(seed layer material for electronic circuits) filing date 27.4.89
4 "Compositions" -Inventors -M G Firmstone M E Ellwood
(seed layer material for electronic circuits) filing date 2.10.89