The document contains engineering drawings and specifications for a telecommunications project. It includes 8 pages of drawings detailing dimensions, materials lists, and notes. The cover page notes that the materials are confidential property of Telenetix Technology Solutions and cannot be reproduced or shared without permission.
Thirteen (13) years of experience in piping engineering work for oil and gas, chemical, petrochemical and power plant industries. The experience covers both onshore and offshore works for feasibility study, conceptual design, basic engineering, and detail design and administration of 3D CAD tools (PDMS, E3D, SP3D, PDS).
I have been involved and worked in overseas such as: Japan, Brazil and Malaysia.
Positions of Responsibility are Piping Engineer / PDMS Administrator in TechnipFMC. Experience in various position including: Piping Engineer, Piping Designer, PDMS administrator, E3D Administrator, SP3D Administrator.
Knowledge in international codes and standards like ASME, API, ASTM, Shell DEP.
CV Steve Pender - Summary plus Ref - 2016 10Steve Pender
Steve Pender has over 20 years of experience in project engineering and management, specializing in control systems, communication systems, security systems, and ICT projects for the petrochemical and sugar industries. He has managed large, complex multi-discipline projects and provided services for Transnet's New Multi-Product Pipeline project from 2008 to 2016 as Senior Project Manager, overseeing control systems, communications infrastructure, and ICT networks. References from Transnet praise Pender's competence, dedication, and valuable experience in specialized fields like pipeline and terminal systems.
The document is a fabrication drawing for a corner piece of an ISO container. It provides dimensions and specifications for the corner piece including steel plates, reinforcing webs, casted corners, and pipe dimensions. Notes indicate dimensions may need revision if corner piece dimensions vary and all dimensions are in millimeters unless otherwise noted.
The document provides packaging information for the CD4027B integrated circuit:
- It is available in various package types including plastic dual-in-line packages, ceramic dual-in-line packages, small-outline packages, and thin shrink small-outline packages.
- The packages have 16 leads and are RoHS-compliant with lead-free finishes.
- Moisture sensitivity levels and peak reflow temperatures are provided for each package type.
plano esquematico de lenovo NM-D191REV1.0.pdfdepazmaguina
This document is a 68-page schematic and diagram for an L350 RENOIR+N18P-G61/G62 motherboard. It contains proprietary and confidential information for LC Future Center. The document includes a block diagram of the motherboard components and connections, as well as notes listing different board configurations and part numbers. Security markings on each page state that the document is the confidential property of LC Future Center and is not to be shared without permission.
This document contains schematics and block diagrams for a Broadwell motherboard made by Compal Electronics. It includes details on the processor, memory, ports, connectors and other components. The document is marked confidential and for internal use only by Compal Electronics. It contains 61 pages of engineering drawings and specifications for the motherboard.
The document is a technical data sheet from NTPC Limited, a Government of India enterprise, regarding flue gas desulphurisation (FGD) systems. It contains instructions for bidders on providing essential input/interface data along with the bid. The data sheet includes chapters on essential input/interface data to be provided, technical information to be submitted along with the bid, and technical information to be submitted after contract award. It requires bidders to provide auxiliary steam requirements, cooling water requirements, process water requirements, waste water characteristics and other interface data.
This document is a schematic document from Compal Electronics containing confidential information. It includes a block diagram showing the components and connections of a laptop, including an Intel processor, AMD GPU, memory, storage devices, ports, and more. It also includes power maps showing the power rails and voltages supplied to components in different power states like S1, S3, and S5. The document is marked as confidential property of Compal Electronics.
Thirteen (13) years of experience in piping engineering work for oil and gas, chemical, petrochemical and power plant industries. The experience covers both onshore and offshore works for feasibility study, conceptual design, basic engineering, and detail design and administration of 3D CAD tools (PDMS, E3D, SP3D, PDS).
I have been involved and worked in overseas such as: Japan, Brazil and Malaysia.
Positions of Responsibility are Piping Engineer / PDMS Administrator in TechnipFMC. Experience in various position including: Piping Engineer, Piping Designer, PDMS administrator, E3D Administrator, SP3D Administrator.
Knowledge in international codes and standards like ASME, API, ASTM, Shell DEP.
CV Steve Pender - Summary plus Ref - 2016 10Steve Pender
Steve Pender has over 20 years of experience in project engineering and management, specializing in control systems, communication systems, security systems, and ICT projects for the petrochemical and sugar industries. He has managed large, complex multi-discipline projects and provided services for Transnet's New Multi-Product Pipeline project from 2008 to 2016 as Senior Project Manager, overseeing control systems, communications infrastructure, and ICT networks. References from Transnet praise Pender's competence, dedication, and valuable experience in specialized fields like pipeline and terminal systems.
The document is a fabrication drawing for a corner piece of an ISO container. It provides dimensions and specifications for the corner piece including steel plates, reinforcing webs, casted corners, and pipe dimensions. Notes indicate dimensions may need revision if corner piece dimensions vary and all dimensions are in millimeters unless otherwise noted.
The document provides packaging information for the CD4027B integrated circuit:
- It is available in various package types including plastic dual-in-line packages, ceramic dual-in-line packages, small-outline packages, and thin shrink small-outline packages.
- The packages have 16 leads and are RoHS-compliant with lead-free finishes.
- Moisture sensitivity levels and peak reflow temperatures are provided for each package type.
plano esquematico de lenovo NM-D191REV1.0.pdfdepazmaguina
This document is a 68-page schematic and diagram for an L350 RENOIR+N18P-G61/G62 motherboard. It contains proprietary and confidential information for LC Future Center. The document includes a block diagram of the motherboard components and connections, as well as notes listing different board configurations and part numbers. Security markings on each page state that the document is the confidential property of LC Future Center and is not to be shared without permission.
This document contains schematics and block diagrams for a Broadwell motherboard made by Compal Electronics. It includes details on the processor, memory, ports, connectors and other components. The document is marked confidential and for internal use only by Compal Electronics. It contains 61 pages of engineering drawings and specifications for the motherboard.
The document is a technical data sheet from NTPC Limited, a Government of India enterprise, regarding flue gas desulphurisation (FGD) systems. It contains instructions for bidders on providing essential input/interface data along with the bid. The data sheet includes chapters on essential input/interface data to be provided, technical information to be submitted along with the bid, and technical information to be submitted after contract award. It requires bidders to provide auxiliary steam requirements, cooling water requirements, process water requirements, waste water characteristics and other interface data.
This document is a schematic document from Compal Electronics containing confidential information. It includes a block diagram showing the components and connections of a laptop, including an Intel processor, AMD GPU, memory, storage devices, ports, and more. It also includes power maps showing the power rails and voltages supplied to components in different power states like S1, S3, and S5. The document is marked as confidential property of Compal Electronics.
This document is a schematics document from Compal Electronics containing confidential engineering drawings and trade secret information. It includes block diagrams, notes lists, and power sequencing information for an Intel Braswell motherboard with an ATI R16M-M1-30/70 GPU. The document contains security warnings stating that it is the proprietary property of Compal Electronics and may not be transferred or shared without written consent.
This document is a material requisition for slurry storage tank agitators for a bauxite pipeline project in Paragominas, Brazil. It includes 6 agitators to be provided - 4 for mine site storage tanks and 2 for terminal site tanks. The scope of work includes design, fabrication, testing and delivery of the agitators. Drawings, manuals and other documentation are required to be submitted. Quality surveillance of the agitator manufacturing is also specified, requiring the supplier to allow access to their facilities for inspection. Technical specifications for aspects like painting, gearboxes and instruments are referenced.
This document contains confidential engineering drawings and schematics for Compal Electronics. It includes a cover page, block diagrams, notes lists, and other proprietary technical details. All sheets are marked as containing confidential and trade secret information, and any transfer or disclosure without permission is prohibited.
Wireline services refer to the telecommunications services that utilize physical wired connections to transmit data, voice, and video signals. These connections are typically established through fiber-optic cables, copper cables, or other similar wired mediums. Wireline services are known for their reliability, consistent performance, and high-speed capabilities, making them essential for various applications, including internet access, telephone services, and enterprise networking.
This document contains schematics and diagrams for an LC Future Center motherboard labeled DY512. It includes a block diagram showing the components and connections of the motherboard. The document contains several pages of detailed notes and specifications for the motherboard components. All pages contain a header stating that the document contains proprietary and confidential information belonging to LC Future Center and is not to be shared without permission.
Mo ict 2013 new data center design proposal - pts-0813-004006 - ptsp-c-13-0...khalid noman husainy
The document is a proposal from PTS Data Center Solutions, Inc. to the Ministry of Information & Communication of Bangladesh for designing a new 5,000 sq ft data center. The proposal includes:
1) An overview of the project background and objectives
2) A description of PTS' proposed approach and scope of services which includes conceptual design, modeling, cost estimating and reporting
3) Clarification that additional services like detailed design or construction management are not included in the proposed fees
This document contains confidential schematic drawings for a Compal Electronics motherboard. The document headings and watermarks indicate it contains proprietary information belonging to Compal Electronics. The document specifies that the schematic drawings and information they contain are not to be transferred, used or disclosed without prior written consent from Compal Electronics due to containing trade secrets. The schematic drawings depict the circuit design and components of the Compal motherboard.
(1) Instrumentation Limited is a public sector unit established in Kota, India in 1964 that manufactures products like PCBs, UPS systems, railway signaling relays, and defense electronics.
(2) The company's PCB Centre uses surface mount technology and through-hole plating techniques to assemble and test printed circuit boards on automated pick-and-place machines. Common applications for the PCBs include computers, cell phones, televisions, and industrial electronics.
(3) The author's training internship at Instrumentation Limited provided valuable experience in the manufacturing processes for PCBs and other electronic products, as well as hands-on learning through practical activities.
Dech Leanglum has over 5 years of experience in instrument and control engineering projects in various industries. He is responsible for designing control loops, generating wiring diagrams, and recommending products to customers. He has extensive experience using software such as INtools, SmartPlant, AutoCAD, and PDMS to design instrument cable routing, loop diagrams, and other documentation for major projects in Thailand.
This document contains confidential engineering drawings and schematics for a motherboard designed by Compal Electronics, Inc. It includes details of the motherboard components, power rails, and proprietary Compal intellectual property. The document states that the information and designs contained within are the sole property of Compal and may not be shared with or used by any third parties without Compal's prior written consent due to containing trade secrets.
Eduardo G. Macrohon Jr. has over 10 years of experience as a document controller and documentation clerk in the oil and gas industry. He has extensive experience managing technical documentation for engineering projects, including receiving, updating, distributing, storing, tracking, monitoring, archiving, and overall management of documents. He is proficient in Microsoft Office programs and knowledgeable in electronic document management systems.
This document contains confidential engineering drawings and schematics for Compal Electronics' LA-6841P motherboard. It includes 44 pages of diagrams, component lists, notes and other technical specifications. The document header on each page states that the information is proprietary property of Compal Electronics and contains trade secrets that may not be shared without written consent.
Original MOSFET N-Channel H5N2510DSTL 5N2510 5A 250V TO-252 NewAUTHELECTRONIC
This document provides specifications for the H5N2510DL and H5N2510DS silicon n-channel MOSFETs from Renesas Technology Corp. It includes maximum ratings, electrical characteristics, package dimensions, and ordering information for the fast switching power MOSFET devices.
HP ENVY M6 k010dx Sleekbook vpu11 LA-9851P Schematics.pdfHermilioValdizan3
This document contains schematics for the Compal Electronics LA-9851P motherboard. It includes 3 pages of schematics detailing the motherboard components and connections, such as the AMD Richland APU, memory connections, display outputs, and various ports and connections. The document is marked as confidential and property of Compal Electronics, and cannot be transferred or shared without permission. It was issued on November 7, 2012.
This document contains confidential schematics and design information for TOPSTAR's M46H motherboard. It includes a title page, system block diagram, power block diagram, notes, and a section describing modifications and the design history. The document contains a warning that the information is confidential and property of TOPSTAR and cannot be shared or used without written permission.
The document outlines the process for managing a TD Bank project from initiation through closeout. It includes 15 key steps: 1) Approving the project charter, 2) Assigning a project manager, 3) Holding a charter meeting, 4) Generating the project charter, 5) Approving the charter, 6) Generating capital requests, 7) Approving capital requests, 8) Contacting vendors, 9) Distributing and approving test fits, 10) Approving the test fit, 11) Completing initiation, 12) Reviewing and approving schematic designs, 13) Reviewing and approving design development drawings, 14) Freezing the plan and sending to vendors, and 15) Completing the design phase.
This document contains confidential engineering drawings and schematics for Compal Electronics. It includes security classification labels indicating the information is proprietary and contains trade secrets. The document specifies the information may not be transferred, used, or disclosed without prior written consent from Compal Electronics. It contains technical details and part numbers for circuit boards and components.
This document contains schematics and block diagrams for the Y760 motherboard. It includes confidential information about the motherboard components and connections. The document contains three sheets - a cover page with confidentiality information, a block diagram of the motherboard components and connections, and an expanded diagram (XDP) with more detail on the power and sensor connections.
This document contains engineering drawings and schematics for a laptop motherboard. It includes block diagrams showing the components and connections of the motherboard. The drawings contain proprietary and confidential information for Compal Electronics and may not be shared without permission. The document has security markings and the drawings are marked as confidential property of Compal Electronics.
The vendor, CIC - COMNET INDUSTRIES COMPANY, submitted several documents to Toyo-Vietnam Corporation for the UFC85/Formaldehyde Plant Project, including:
1. A vendor print index and schedule outlining 8 submitted documents for review and approval.
2. Manufacturer catalogs for the instrument fitting and condensate pot items.
3. A time schedule showing the planned manufacturing, inspection, packing and delivery dates from April to July 2015.
4. Inspection and test reports requiring Toyo-Vietnam's approval before fabrication.
This document is a schematics document from Compal Electronics containing confidential engineering drawings and trade secret information. It includes block diagrams, notes lists, and power sequencing information for an Intel Braswell motherboard with an ATI R16M-M1-30/70 GPU. The document contains security warnings stating that it is the proprietary property of Compal Electronics and may not be transferred or shared without written consent.
This document is a material requisition for slurry storage tank agitators for a bauxite pipeline project in Paragominas, Brazil. It includes 6 agitators to be provided - 4 for mine site storage tanks and 2 for terminal site tanks. The scope of work includes design, fabrication, testing and delivery of the agitators. Drawings, manuals and other documentation are required to be submitted. Quality surveillance of the agitator manufacturing is also specified, requiring the supplier to allow access to their facilities for inspection. Technical specifications for aspects like painting, gearboxes and instruments are referenced.
This document contains confidential engineering drawings and schematics for Compal Electronics. It includes a cover page, block diagrams, notes lists, and other proprietary technical details. All sheets are marked as containing confidential and trade secret information, and any transfer or disclosure without permission is prohibited.
Wireline services refer to the telecommunications services that utilize physical wired connections to transmit data, voice, and video signals. These connections are typically established through fiber-optic cables, copper cables, or other similar wired mediums. Wireline services are known for their reliability, consistent performance, and high-speed capabilities, making them essential for various applications, including internet access, telephone services, and enterprise networking.
This document contains schematics and diagrams for an LC Future Center motherboard labeled DY512. It includes a block diagram showing the components and connections of the motherboard. The document contains several pages of detailed notes and specifications for the motherboard components. All pages contain a header stating that the document contains proprietary and confidential information belonging to LC Future Center and is not to be shared without permission.
Mo ict 2013 new data center design proposal - pts-0813-004006 - ptsp-c-13-0...khalid noman husainy
The document is a proposal from PTS Data Center Solutions, Inc. to the Ministry of Information & Communication of Bangladesh for designing a new 5,000 sq ft data center. The proposal includes:
1) An overview of the project background and objectives
2) A description of PTS' proposed approach and scope of services which includes conceptual design, modeling, cost estimating and reporting
3) Clarification that additional services like detailed design or construction management are not included in the proposed fees
This document contains confidential schematic drawings for a Compal Electronics motherboard. The document headings and watermarks indicate it contains proprietary information belonging to Compal Electronics. The document specifies that the schematic drawings and information they contain are not to be transferred, used or disclosed without prior written consent from Compal Electronics due to containing trade secrets. The schematic drawings depict the circuit design and components of the Compal motherboard.
(1) Instrumentation Limited is a public sector unit established in Kota, India in 1964 that manufactures products like PCBs, UPS systems, railway signaling relays, and defense electronics.
(2) The company's PCB Centre uses surface mount technology and through-hole plating techniques to assemble and test printed circuit boards on automated pick-and-place machines. Common applications for the PCBs include computers, cell phones, televisions, and industrial electronics.
(3) The author's training internship at Instrumentation Limited provided valuable experience in the manufacturing processes for PCBs and other electronic products, as well as hands-on learning through practical activities.
Dech Leanglum has over 5 years of experience in instrument and control engineering projects in various industries. He is responsible for designing control loops, generating wiring diagrams, and recommending products to customers. He has extensive experience using software such as INtools, SmartPlant, AutoCAD, and PDMS to design instrument cable routing, loop diagrams, and other documentation for major projects in Thailand.
This document contains confidential engineering drawings and schematics for a motherboard designed by Compal Electronics, Inc. It includes details of the motherboard components, power rails, and proprietary Compal intellectual property. The document states that the information and designs contained within are the sole property of Compal and may not be shared with or used by any third parties without Compal's prior written consent due to containing trade secrets.
Eduardo G. Macrohon Jr. has over 10 years of experience as a document controller and documentation clerk in the oil and gas industry. He has extensive experience managing technical documentation for engineering projects, including receiving, updating, distributing, storing, tracking, monitoring, archiving, and overall management of documents. He is proficient in Microsoft Office programs and knowledgeable in electronic document management systems.
This document contains confidential engineering drawings and schematics for Compal Electronics' LA-6841P motherboard. It includes 44 pages of diagrams, component lists, notes and other technical specifications. The document header on each page states that the information is proprietary property of Compal Electronics and contains trade secrets that may not be shared without written consent.
Original MOSFET N-Channel H5N2510DSTL 5N2510 5A 250V TO-252 NewAUTHELECTRONIC
This document provides specifications for the H5N2510DL and H5N2510DS silicon n-channel MOSFETs from Renesas Technology Corp. It includes maximum ratings, electrical characteristics, package dimensions, and ordering information for the fast switching power MOSFET devices.
HP ENVY M6 k010dx Sleekbook vpu11 LA-9851P Schematics.pdfHermilioValdizan3
This document contains schematics for the Compal Electronics LA-9851P motherboard. It includes 3 pages of schematics detailing the motherboard components and connections, such as the AMD Richland APU, memory connections, display outputs, and various ports and connections. The document is marked as confidential and property of Compal Electronics, and cannot be transferred or shared without permission. It was issued on November 7, 2012.
This document contains confidential schematics and design information for TOPSTAR's M46H motherboard. It includes a title page, system block diagram, power block diagram, notes, and a section describing modifications and the design history. The document contains a warning that the information is confidential and property of TOPSTAR and cannot be shared or used without written permission.
The document outlines the process for managing a TD Bank project from initiation through closeout. It includes 15 key steps: 1) Approving the project charter, 2) Assigning a project manager, 3) Holding a charter meeting, 4) Generating the project charter, 5) Approving the charter, 6) Generating capital requests, 7) Approving capital requests, 8) Contacting vendors, 9) Distributing and approving test fits, 10) Approving the test fit, 11) Completing initiation, 12) Reviewing and approving schematic designs, 13) Reviewing and approving design development drawings, 14) Freezing the plan and sending to vendors, and 15) Completing the design phase.
This document contains confidential engineering drawings and schematics for Compal Electronics. It includes security classification labels indicating the information is proprietary and contains trade secrets. The document specifies the information may not be transferred, used, or disclosed without prior written consent from Compal Electronics. It contains technical details and part numbers for circuit boards and components.
This document contains schematics and block diagrams for the Y760 motherboard. It includes confidential information about the motherboard components and connections. The document contains three sheets - a cover page with confidentiality information, a block diagram of the motherboard components and connections, and an expanded diagram (XDP) with more detail on the power and sensor connections.
This document contains engineering drawings and schematics for a laptop motherboard. It includes block diagrams showing the components and connections of the motherboard. The drawings contain proprietary and confidential information for Compal Electronics and may not be shared without permission. The document has security markings and the drawings are marked as confidential property of Compal Electronics.
The vendor, CIC - COMNET INDUSTRIES COMPANY, submitted several documents to Toyo-Vietnam Corporation for the UFC85/Formaldehyde Plant Project, including:
1. A vendor print index and schedule outlining 8 submitted documents for review and approval.
2. Manufacturer catalogs for the instrument fitting and condensate pot items.
3. A time schedule showing the planned manufacturing, inspection, packing and delivery dates from April to July 2015.
4. Inspection and test reports requiring Toyo-Vietnam's approval before fabrication.
1. Date
Signiture
Project Manager
Date
Signiture
Chief Engineer
BLUE 2
PURPLE
BROWN
BLUE
GREEN
RED
MATERIAL LIST NOTES: Reason for Issue:Drawn ByDateRevision Scale
Description
Project
Approved for Construction
Drawing Number
RevSheet Number
Telenetix Technology Solutions (Pty) Ltd reserves all rights, titles and copyright in drawings, designs, specifications, manuals and technical information, herein after referred to as "materials", prepared for or provided to the recipient. The materials are provided in
strict confidence and will remain the property of Telenetix Technology Solutions (Pty) Ltd regardless. The recipient will refrain from reproduction of the materials, and will not disclose the materials to others in whole or in part except for the express purpouses of
accomplishing the objectives of Telenetix Technology Solutions (Pty) Ltd. Such divulgence of the materials by the recipient to other parties automatically binds the other party to the terms and conditions set out above.
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2. Date
Signiture
Project Manager
Date
Signiture
Chief Engineer
BLUE 2
PURPLE
BROWN
BLUE
GREEN
RED
MATERIAL LIST NOTES: Reason for Issue:Drawn ByDateRevision Scale
Description
Project
Approved for Construction
Drawing Number
RevSheet Number
Telenetix Technology Solutions (Pty) Ltd reserves all rights, titles and copyright in drawings, designs, specifications, manuals and technical information, herein after referred to as "materials", prepared for or provided to the recipient. The materials are provided in
strict confidence and will remain the property of Telenetix Technology Solutions (Pty) Ltd regardless. The recipient will refrain from reproduction of the materials, and will not disclose the materials to others in whole or in part except for the express purpouses of
accomplishing the objectives of Telenetix Technology Solutions (Pty) Ltd. Such divulgence of the materials by the recipient to other parties automatically binds the other party to the terms and conditions set out above.
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3. DETAIL X
SCALE 1 : 15
DETAIL Y
SCALE 1 : 15
Date
Signiture
Project Manager
Date
Signiture
Chief Engineer
BLUE 2
PURPLE
BROWN
BLUE
GREEN
RED
MATERIAL LIST NOTES: Reason for Issue:Drawn ByDateRevision Scale
Description
Project
Approved for Construction
Drawing Number
RevSheet Number
Telenetix Technology Solutions (Pty) Ltd reserves all rights, titles and copyright in drawings, designs, specifications, manuals and technical information, herein after referred to as "materials", prepared for or provided to the recipient. The materials are provided in
strict confidence and will remain the property of Telenetix Technology Solutions (Pty) Ltd regardless. The recipient will refrain from reproduction of the materials, and will not disclose the materials to others in whole or in part except for the express purpouses of
accomplishing the objectives of Telenetix Technology Solutions (Pty) Ltd. Such divulgence of the materials by the recipient to other parties automatically binds the other party to the terms and conditions set out above.
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4. 100
1000
10912
2226
5050
97371175
2397 1004
OVER HEAD AIR CON DUCT
OMITTED FOR CLARITY
Date
Signiture
Project Manager
Date
Signiture
Chief Engineer
BLUE 2
PURPLE
BROWN
BLUE
GREEN
RED
MATERIAL LIST NOTES: Reason for Issue:Drawn ByDateRevision Scale
Description
Project
Approved for Construction
Drawing Number
RevSheet Number
Telenetix Technology Solutions (Pty) Ltd reserves all rights, titles and copyright in drawings, designs, specifications, manuals and technical information, herein after referred to as "materials", prepared for or provided to the recipient. The materials are provided in
strict confidence and will remain the property of Telenetix Technology Solutions (Pty) Ltd regardless. The recipient will refrain from reproduction of the materials, and will not disclose the materials to others in whole or in part except for the express purpouses of
accomplishing the objectives of Telenetix Technology Solutions (Pty) Ltd. Such divulgence of the materials by the recipient to other parties automatically binds the other party to the terms and conditions set out above.
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5. Date
Signiture
Project Manager
Date
Signiture
Chief Engineer
BLUE 2
PURPLE
BROWN
BLUE
GREEN
RED
MATERIAL LIST NOTES: Reason for Issue:Drawn ByDateRevision Scale
Description
Project
Approved for Construction
Drawing Number
RevSheet Number
Telenetix Technology Solutions (Pty) Ltd reserves all rights, titles and copyright in drawings, designs, specifications, manuals and technical information, herein after referred to as "materials", prepared for or provided to the recipient. The materials are provided in
strict confidence and will remain the property of Telenetix Technology Solutions (Pty) Ltd regardless. The recipient will refrain from reproduction of the materials, and will not disclose the materials to others in whole or in part except for the express purpouses of
accomplishing the objectives of Telenetix Technology Solutions (Pty) Ltd. Such divulgence of the materials by the recipient to other parties automatically binds the other party to the terms and conditions set out above.
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6. Date
Signiture
Project Manager
Date
Signiture
Chief Engineer
BLUE 2
PURPLE
BROWN
BLUE
GREEN
RED
MATERIAL LIST NOTES: Reason for Issue:Drawn ByDateRevision Scale
Description
Project
Approved for Construction
Drawing Number
RevSheet Number
Telenetix Technology Solutions (Pty) Ltd reserves all rights, titles and copyright in drawings, designs, specifications, manuals and technical information, herein after referred to as "materials", prepared for or provided to the recipient. The materials are provided in
strict confidence and will remain the property of Telenetix Technology Solutions (Pty) Ltd regardless. The recipient will refrain from reproduction of the materials, and will not disclose the materials to others in whole or in part except for the express purpouses of
accomplishing the objectives of Telenetix Technology Solutions (Pty) Ltd. Such divulgence of the materials by the recipient to other parties automatically binds the other party to the terms and conditions set out above.
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7. 14400
1000 3156 1500 3156
100044002000
1104 12192 1104
Date
Signiture
Project Manager
Date
Signiture
Chief Engineer
BLUE 2
PURPLE
BROWN
BLUE
GREEN
RED
MATERIAL LIST NOTES: Reason for Issue:Drawn ByDateRevision Scale
Description
Project
Approved for Construction
Drawing Number
RevSheet Number
Telenetix Technology Solutions (Pty) Ltd reserves all rights, titles and copyright in drawings, designs, specifications, manuals and technical information, herein after referred to as "materials", prepared for or provided to the recipient. The materials are provided in
strict confidence and will remain the property of Telenetix Technology Solutions (Pty) Ltd regardless. The recipient will refrain from reproduction of the materials, and will not disclose the materials to others in whole or in part except for the express purpouses of
accomplishing the objectives of Telenetix Technology Solutions (Pty) Ltd. Such divulgence of the materials by the recipient to other parties automatically binds the other party to the terms and conditions set out above.
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8. 3482
459
981
2438 981
3613
3316
Date
Signiture
Project Manager
Date
Signiture
Chief Engineer
BLUE 2
PURPLE
BROWN
BLUE
GREEN
RED
MATERIAL LIST NOTES: Reason for Issue:Drawn ByDateRevision Scale
Description
Project
Approved for Construction
Drawing Number
RevSheet Number
Telenetix Technology Solutions (Pty) Ltd reserves all rights, titles and copyright in drawings, designs, specifications, manuals and technical information, herein after referred to as "materials", prepared for or provided to the recipient. The materials are provided in
strict confidence and will remain the property of Telenetix Technology Solutions (Pty) Ltd regardless. The recipient will refrain from reproduction of the materials, and will not disclose the materials to others in whole or in part except for the express purpouses of
accomplishing the objectives of Telenetix Technology Solutions (Pty) Ltd. Such divulgence of the materials by the recipient to other parties automatically binds the other party to the terms and conditions set out above.
A8 OF 81:25VODACOM BUSNESS
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