This document presents research on developing perching mechanisms for robots. It discusses developing micro spines inspired by how birds perch on surfaces. Various micro spine designs are explored with different shapes at the tip and top. Mechanical tests are conducted to evaluate the designs. The document also discusses alternative perching mechanisms using ionic polymer metal composites (IPMCs) that change shape when stimulated by electric fields similar to Venus flytrap plants. IPMCs are fabricated and tests show they actuate under applied voltages. The goal is to develop effective perching abilities for small robots to climb structures like birds and insects.
Oxinium oxidized zirconium and counterface reviewmsorem
This document provides an overview of OXINIUM oxidized zirconium as an orthopedic bearing material. It discusses the desired attributes of hard bearings, existing bearing material choices, and the characteristics of OXINIUM. Key points about OXINIUM include that it has a ceramic oxide surface formed through oxidation of a zirconium-niobium alloy, giving it hardness and wear resistance. Laboratory studies showed OXINIUM reduces polyethylene wear in knee and hip simulators. Clinical studies demonstrated good safety and performance of OXINIUM in knees with 5+ year follow-up. Retrieval analyses found less wear and damage of OXINIUM components compared to cobalt chrome.
This document summarizes the progress of a project to design a low-cost multi-axial ankle and foot prosthesis. The team confirmed materials suitable for use in low-income countries, designed an ankle that functions multi-axially with a foot, and developed a manufacturing procedure. An initial prototype was constructed and tested, and further iterative designs were developed and modeled, including rounding the ankle design and adding a second bushing and locking mechanism. Testing and finite element analysis were performed on the design. Project specifications and an iterative design process comparing material choices are also summarized.
This document summarizes a seminar on advances in tribology presented by Apurv Verma. It discusses topics such as friction, lubrication, wear mechanisms, types of motion, tribology applications in piston rings and cylinder liners, recent developments like soybean oil and PVD coatings as lubricants, tribology concerns in MEMS devices, and the economic impacts of tribology research. Application areas covered include integrated circuits, sensors, catalysts, micromachines, and more.
This document provides information on preparing thin films using the Successive Ionic Layer Adsorption and Reaction (SILAR) method. It discusses what thin films are, common thin film deposition techniques like physical vapor deposition and chemical vapor deposition, and the SILAR method specifically. SILAR involves alternating immersion of a substrate in cationic and anionic precursor solutions to deposit materials like cadmium sulfide in a layer-by-layer process. Parameters like concentration, pH, temperature, and deposition time must be optimized to produce adherent thin films. The document also outlines some applications of SILAR-deposited cadmium sulfide thin films and factors that influence thin film characteristics.
Thin films have a variety of applications including solar cells, transistors, optical coatings, and batteries. Thin film solar cells are cheaper to produce than crystalline silicon cells and can be made flexible. Thin film transistors are used in LCD displays as switches to turn pixels on and off. Optical coatings made of thin films can reduce reflections and improve optics. Thin film batteries use solid state electrolytes and deposition techniques, making them lightweight and flexible compared to conventional batteries. Overall, thin films allow modifying material properties for miniaturized devices across many technologies.
The document provides information on metallographic sample preparation and examination. It discusses objectives like studying microstructure and phases. It describes grinding, polishing, etching, and examining samples under a microscope. The goal is to reveal grain boundaries, phases, and microstructural features. Safety is important when handling corrosive etchants. Proper sectioning, mounting, grinding, polishing and etching allows examination of material properties at the microscopic level.
This document discusses the design and manufacturing of a testing machine to analyze the tribological behavior of sliding contact materials. It provides background information on tribology and its importance. The testing machine was designed and manufactured to measure the dynamic coefficient of friction of various materials in order to evaluate their potential for applications requiring low friction and wear resistance. Common problems with mechanical seals are also summarized, including failure due to restricted motion, thermal degradation, material attacks, and incorrect installation.
Oxinium oxidized zirconium and counterface reviewmsorem
This document provides an overview of OXINIUM oxidized zirconium as an orthopedic bearing material. It discusses the desired attributes of hard bearings, existing bearing material choices, and the characteristics of OXINIUM. Key points about OXINIUM include that it has a ceramic oxide surface formed through oxidation of a zirconium-niobium alloy, giving it hardness and wear resistance. Laboratory studies showed OXINIUM reduces polyethylene wear in knee and hip simulators. Clinical studies demonstrated good safety and performance of OXINIUM in knees with 5+ year follow-up. Retrieval analyses found less wear and damage of OXINIUM components compared to cobalt chrome.
This document summarizes the progress of a project to design a low-cost multi-axial ankle and foot prosthesis. The team confirmed materials suitable for use in low-income countries, designed an ankle that functions multi-axially with a foot, and developed a manufacturing procedure. An initial prototype was constructed and tested, and further iterative designs were developed and modeled, including rounding the ankle design and adding a second bushing and locking mechanism. Testing and finite element analysis were performed on the design. Project specifications and an iterative design process comparing material choices are also summarized.
This document summarizes a seminar on advances in tribology presented by Apurv Verma. It discusses topics such as friction, lubrication, wear mechanisms, types of motion, tribology applications in piston rings and cylinder liners, recent developments like soybean oil and PVD coatings as lubricants, tribology concerns in MEMS devices, and the economic impacts of tribology research. Application areas covered include integrated circuits, sensors, catalysts, micromachines, and more.
This document provides information on preparing thin films using the Successive Ionic Layer Adsorption and Reaction (SILAR) method. It discusses what thin films are, common thin film deposition techniques like physical vapor deposition and chemical vapor deposition, and the SILAR method specifically. SILAR involves alternating immersion of a substrate in cationic and anionic precursor solutions to deposit materials like cadmium sulfide in a layer-by-layer process. Parameters like concentration, pH, temperature, and deposition time must be optimized to produce adherent thin films. The document also outlines some applications of SILAR-deposited cadmium sulfide thin films and factors that influence thin film characteristics.
Thin films have a variety of applications including solar cells, transistors, optical coatings, and batteries. Thin film solar cells are cheaper to produce than crystalline silicon cells and can be made flexible. Thin film transistors are used in LCD displays as switches to turn pixels on and off. Optical coatings made of thin films can reduce reflections and improve optics. Thin film batteries use solid state electrolytes and deposition techniques, making them lightweight and flexible compared to conventional batteries. Overall, thin films allow modifying material properties for miniaturized devices across many technologies.
The document provides information on metallographic sample preparation and examination. It discusses objectives like studying microstructure and phases. It describes grinding, polishing, etching, and examining samples under a microscope. The goal is to reveal grain boundaries, phases, and microstructural features. Safety is important when handling corrosive etchants. Proper sectioning, mounting, grinding, polishing and etching allows examination of material properties at the microscopic level.
This document discusses the design and manufacturing of a testing machine to analyze the tribological behavior of sliding contact materials. It provides background information on tribology and its importance. The testing machine was designed and manufactured to measure the dynamic coefficient of friction of various materials in order to evaluate their potential for applications requiring low friction and wear resistance. Common problems with mechanical seals are also summarized, including failure due to restricted motion, thermal degradation, material attacks, and incorrect installation.
Lecture14_Leed_Fiberglass production and engineeringJavadAndi1
This document provides an overview of fiberglass processing, with a focus on continuous filament and wool fiber production methods. It describes the continuous filament process, including melting, conditioning, bushings design and operation, and the importance of fiber sizing. For wool fiber production, it outlines the rotary, cascade, and flame attenuation processes. Key parameters like viscosity and liquidus temperature are discussed in relation to fiber forming. The complex fiberization environment and design considerations for rotary fiberizers are also summarized.
1. The document describes the key steps in the manufacturing process for computer chips, including transforming silicon ingots into wafers and fabricating transistors on the wafers through photolithography, etching, ion implantation, and other processes.
2. It provides illustrations at the scale of an entire 300mm wafer and also zoomed in to the individual transistor level to show how features are patterned down to 50-200nm in size.
3. The process involves hundreds of precise steps to create layered structures through techniques like thermal oxidation, deposition of materials like silicon dioxide and polysilicon, and selective removal of portions by etching.
Microelectronics involves the study and fabrication of very small electronic components, usually on the micrometer scale. The document discusses the evolution from discrete components to integrated circuits and the advantages of integrated circuits. It describes the basic process of integrated circuit fabrication including wafer preparation, epitaxial growth, oxidation, photolithography, diffusion, metallization, testing, dicing, packaging, and encapsulation. Key steps like Czochralski growth, oxidation, lithography, and diffusion are explained in more detail.
Spin coating is a process that uses centrifugal force to spread a liquid solution evenly and create a thin film on a surface, such as a semiconductor wafer. It involves depositing fluid onto a substrate that is then spun to evenly distribute the fluid via centrifugal force. The spinning causes the coating to thin at a rate dependent on viscosity and spinning velocity until the solvent evaporates, leaving a uniform thin film of specific thickness. Spin coating is widely used in microelectronics manufacturing to apply coatings like photoresist and insulating layers. Common defects include bubbles, swirling patterns, and streaks caused by issues with deposition uniformity or process parameters.
Overview of advantages and fabrication of solar cells made from silicon nanowires. IT includes few slides of conventional solar cells and benefits of using silicon nanowire.
SOFT CONTACT LENS FITTING
1. Alternative names of soft contact lens.
2. Need to know fitting requirement and performance requirements.
3. Centration and decentration of soft contact lens. -- There are cartesian system and binasal system.
4. what governs fitting of lens.
5. There are need to know about physical properties of soft contact lens.
6. Now, what is sag and sagital depth.
7. Finally, SAME SAG AND SAME DIAMETER but DIFFERENT DESIGN AND DIFFERENT BEHAVIOUR.
8. Parameters of soft contact lens -
total diameter
back optic zone radius
centre thickness
front optic zone radius
water content
9. There are two types of prescribing methods -
empirical prescribing
trial fit prescribing
10. Effect of a blink with soft contact lens - too flat and too steep.
11. Requirements of lens movement.
12. Lens lag position - primary gaze, up gaze and lateral gaze position.
13. Compulsory of lower lid push up test.
14. Ranges of fitting of soft contact lens - either too fit or too loose or ideal fitting.
15. All step of soft contact lens fitting is done.
MONOLITHIC IC PROCESSES A monolithic integrated circuit (IC) is a set of circuitry on a single semiconductor plate or chip rather than built of separate elements as a discrete circuit is.
Introduction to thin film growth and molecular beam epitaxyOleg Maksimov
This document provides an introduction to thin film growth techniques focusing on molecular beam epitaxy (MBE). It describes various physical vapor deposition and chemical vapor deposition methods. MBE is explained in detail, including the advantages of growth in an ultra-high vacuum environment with independent material sources and in-situ monitoring via RHEED. Different growth modes such as Frank-van der Merwe, Volmer-Weber, and Stranski-Krastanov are also summarized.
This document discusses the design of contact lenses. It covers key aspects of soft and rigid gas permeable (RGP) lens design including lens parameters, materials, curvature, thickness, edge design, and standards. For soft lenses, factors like water content, diameter, curvature, thickness, and material properties are important. RGP lens design focuses on parameters like back surface design, optic zone diameter, thickness, and edge configuration to achieve optimal fit and performance. Proper consideration of these design elements helps to maximize vision, comfort, and wearing time.
This document provides an overview of zirconia as a dental biomaterial. It discusses the properties and history of zirconia, its phase transformations when heated, and how adding yttria stabilizes its phases. The document outlines the various uses of zirconia in dentistry including crowns, bridges, implants, and more. It also discusses challenges with bonding to zirconia and various surface treatment techniques to improve bonding, such as air abrasion, silica coating, and MDP resin cements.
The document discusses advanced ceramic substrates for microelectronic systems. It describes desired substrate properties such as high electrical resistivity and thermal conductivity. It also discusses common ceramic materials used as substrates like silicon carbide and aluminum nitride and their fabrication methods. The document outlines the definitions, thermal, mechanical, and electrical properties to consider for ceramic substrates. It also covers metallization techniques for ceramic substrates, such as thick film and thin film processes.
The document discusses X-ray film, its characteristics, composition, and processing. It can be summarized as follows:
X-ray film contains a radiation-sensitive emulsion coated on a transparent base. The emulsion contains light-sensitive silver halide crystals suspended in gelatin. When exposed to X-rays, the crystals form a latent image which is chemically developed to create the visible image. Development converts the latent image into metallic silver through a redox reaction using developer chemicals. The film then undergoes fixing and washing to remove unexposed silver halide.
This document discusses resin bonded fixed partial dentures (FPDs). It begins by defining resin bonded FPDs and describing their history. It then covers indications and contraindications, advantages and disadvantages, classifications based on retention type, and fabrication process including tooth preparation, impressions, provisionals, and bonding. Resin bonded FPDs are adhesive bridges that replace missing teeth using thin metal retainers bonded to abutment teeth with resin cement. They conserve tooth structure and have advantages over traditional FPDs like reduced cost and chairtime.
This presentation explains in brief how piezo motor works. It also displays different type of piezo motors. It consists of a comparison of Piezo Motors and Electromagnetic motors.
Integrated circuits have increased dramatically in complexity over time due to advances in fabrication technology allowing for higher densities of components on silicon chips. The fabrication process involves growing high purity silicon crystals, depositing layers, doping for conductivity, patterning circuits using photolithography, and packaging individual dies. Advances like shrinking transistor sizes and cleaner room environments have allowed integration to scale while maintaining reliability.
This document provides an overview of the principles of external fixation. It discusses the historical progression of external fixator designs from 1st generation rigid frames to modern circular and hexapod frames. Key components of external fixation like pins, clamps, and rods are described. The document emphasizes improving frame stability through increasing pin size and decreasing the distance between pins and fractures. It covers applications of uniplanar, biplanar, circular, and articulating frames and discusses the concept of damage control surgery using temporary external fixation.
Ultrasonic machining (USM) and abrasive jet machining (AJM) are unconventional machining processes. USM uses ultrasonic vibrations to cause abrasive particles in a liquid slurry to impact and remove material from a workpiece. It can machine very hard materials with high accuracy and no heat generation. AJM uses a high-velocity stream of abrasive particles in gas to erode material. It is useful for cutting brittle materials and can access difficult areas. Laser beam machining uses an intense laser beam to melt and vaporize material with precision and no physical contact.
Electric discharge machining (EDM) is a machining process that uses electrical sparks to erode metals. It works by maintaining a precise gap between an electrode tool and a metal workpiece submerged in a dielectric fluid. Repeated electrical sparks are generated to melt and vaporize small amounts of metal from both the tool and workpiece, allowing complex and hard-to-machine shapes to be produced. EDM can machine metals regardless of hardness and without mechanical force, giving it advantages over traditional machining methods for difficult-to-cut materials.
The document provides an overview of integrated circuit (IC) manufacturing. It discusses what an IC is, provides a brief history, and outlines the key steps in the manufacturing process. The process begins with purifying silicon ingots, slicing them into wafers, and polishing the wafers. The wafers then undergo multiple lithography, etching, and deposition steps to build transistors and interconnects. After processing, the dies on each wafer are tested and good dies are diced and packaged. The document explains some of the basic wafer processing steps like oxidation, resist coating, lithography, and etching in more detail. It aims to provide fundamentals of IC manufacturing.
Lecture14_Leed_Fiberglass production and engineeringJavadAndi1
This document provides an overview of fiberglass processing, with a focus on continuous filament and wool fiber production methods. It describes the continuous filament process, including melting, conditioning, bushings design and operation, and the importance of fiber sizing. For wool fiber production, it outlines the rotary, cascade, and flame attenuation processes. Key parameters like viscosity and liquidus temperature are discussed in relation to fiber forming. The complex fiberization environment and design considerations for rotary fiberizers are also summarized.
1. The document describes the key steps in the manufacturing process for computer chips, including transforming silicon ingots into wafers and fabricating transistors on the wafers through photolithography, etching, ion implantation, and other processes.
2. It provides illustrations at the scale of an entire 300mm wafer and also zoomed in to the individual transistor level to show how features are patterned down to 50-200nm in size.
3. The process involves hundreds of precise steps to create layered structures through techniques like thermal oxidation, deposition of materials like silicon dioxide and polysilicon, and selective removal of portions by etching.
Microelectronics involves the study and fabrication of very small electronic components, usually on the micrometer scale. The document discusses the evolution from discrete components to integrated circuits and the advantages of integrated circuits. It describes the basic process of integrated circuit fabrication including wafer preparation, epitaxial growth, oxidation, photolithography, diffusion, metallization, testing, dicing, packaging, and encapsulation. Key steps like Czochralski growth, oxidation, lithography, and diffusion are explained in more detail.
Spin coating is a process that uses centrifugal force to spread a liquid solution evenly and create a thin film on a surface, such as a semiconductor wafer. It involves depositing fluid onto a substrate that is then spun to evenly distribute the fluid via centrifugal force. The spinning causes the coating to thin at a rate dependent on viscosity and spinning velocity until the solvent evaporates, leaving a uniform thin film of specific thickness. Spin coating is widely used in microelectronics manufacturing to apply coatings like photoresist and insulating layers. Common defects include bubbles, swirling patterns, and streaks caused by issues with deposition uniformity or process parameters.
Overview of advantages and fabrication of solar cells made from silicon nanowires. IT includes few slides of conventional solar cells and benefits of using silicon nanowire.
SOFT CONTACT LENS FITTING
1. Alternative names of soft contact lens.
2. Need to know fitting requirement and performance requirements.
3. Centration and decentration of soft contact lens. -- There are cartesian system and binasal system.
4. what governs fitting of lens.
5. There are need to know about physical properties of soft contact lens.
6. Now, what is sag and sagital depth.
7. Finally, SAME SAG AND SAME DIAMETER but DIFFERENT DESIGN AND DIFFERENT BEHAVIOUR.
8. Parameters of soft contact lens -
total diameter
back optic zone radius
centre thickness
front optic zone radius
water content
9. There are two types of prescribing methods -
empirical prescribing
trial fit prescribing
10. Effect of a blink with soft contact lens - too flat and too steep.
11. Requirements of lens movement.
12. Lens lag position - primary gaze, up gaze and lateral gaze position.
13. Compulsory of lower lid push up test.
14. Ranges of fitting of soft contact lens - either too fit or too loose or ideal fitting.
15. All step of soft contact lens fitting is done.
MONOLITHIC IC PROCESSES A monolithic integrated circuit (IC) is a set of circuitry on a single semiconductor plate or chip rather than built of separate elements as a discrete circuit is.
Introduction to thin film growth and molecular beam epitaxyOleg Maksimov
This document provides an introduction to thin film growth techniques focusing on molecular beam epitaxy (MBE). It describes various physical vapor deposition and chemical vapor deposition methods. MBE is explained in detail, including the advantages of growth in an ultra-high vacuum environment with independent material sources and in-situ monitoring via RHEED. Different growth modes such as Frank-van der Merwe, Volmer-Weber, and Stranski-Krastanov are also summarized.
This document discusses the design of contact lenses. It covers key aspects of soft and rigid gas permeable (RGP) lens design including lens parameters, materials, curvature, thickness, edge design, and standards. For soft lenses, factors like water content, diameter, curvature, thickness, and material properties are important. RGP lens design focuses on parameters like back surface design, optic zone diameter, thickness, and edge configuration to achieve optimal fit and performance. Proper consideration of these design elements helps to maximize vision, comfort, and wearing time.
This document provides an overview of zirconia as a dental biomaterial. It discusses the properties and history of zirconia, its phase transformations when heated, and how adding yttria stabilizes its phases. The document outlines the various uses of zirconia in dentistry including crowns, bridges, implants, and more. It also discusses challenges with bonding to zirconia and various surface treatment techniques to improve bonding, such as air abrasion, silica coating, and MDP resin cements.
The document discusses advanced ceramic substrates for microelectronic systems. It describes desired substrate properties such as high electrical resistivity and thermal conductivity. It also discusses common ceramic materials used as substrates like silicon carbide and aluminum nitride and their fabrication methods. The document outlines the definitions, thermal, mechanical, and electrical properties to consider for ceramic substrates. It also covers metallization techniques for ceramic substrates, such as thick film and thin film processes.
The document discusses X-ray film, its characteristics, composition, and processing. It can be summarized as follows:
X-ray film contains a radiation-sensitive emulsion coated on a transparent base. The emulsion contains light-sensitive silver halide crystals suspended in gelatin. When exposed to X-rays, the crystals form a latent image which is chemically developed to create the visible image. Development converts the latent image into metallic silver through a redox reaction using developer chemicals. The film then undergoes fixing and washing to remove unexposed silver halide.
This document discusses resin bonded fixed partial dentures (FPDs). It begins by defining resin bonded FPDs and describing their history. It then covers indications and contraindications, advantages and disadvantages, classifications based on retention type, and fabrication process including tooth preparation, impressions, provisionals, and bonding. Resin bonded FPDs are adhesive bridges that replace missing teeth using thin metal retainers bonded to abutment teeth with resin cement. They conserve tooth structure and have advantages over traditional FPDs like reduced cost and chairtime.
This presentation explains in brief how piezo motor works. It also displays different type of piezo motors. It consists of a comparison of Piezo Motors and Electromagnetic motors.
Integrated circuits have increased dramatically in complexity over time due to advances in fabrication technology allowing for higher densities of components on silicon chips. The fabrication process involves growing high purity silicon crystals, depositing layers, doping for conductivity, patterning circuits using photolithography, and packaging individual dies. Advances like shrinking transistor sizes and cleaner room environments have allowed integration to scale while maintaining reliability.
This document provides an overview of the principles of external fixation. It discusses the historical progression of external fixator designs from 1st generation rigid frames to modern circular and hexapod frames. Key components of external fixation like pins, clamps, and rods are described. The document emphasizes improving frame stability through increasing pin size and decreasing the distance between pins and fractures. It covers applications of uniplanar, biplanar, circular, and articulating frames and discusses the concept of damage control surgery using temporary external fixation.
Ultrasonic machining (USM) and abrasive jet machining (AJM) are unconventional machining processes. USM uses ultrasonic vibrations to cause abrasive particles in a liquid slurry to impact and remove material from a workpiece. It can machine very hard materials with high accuracy and no heat generation. AJM uses a high-velocity stream of abrasive particles in gas to erode material. It is useful for cutting brittle materials and can access difficult areas. Laser beam machining uses an intense laser beam to melt and vaporize material with precision and no physical contact.
Electric discharge machining (EDM) is a machining process that uses electrical sparks to erode metals. It works by maintaining a precise gap between an electrode tool and a metal workpiece submerged in a dielectric fluid. Repeated electrical sparks are generated to melt and vaporize small amounts of metal from both the tool and workpiece, allowing complex and hard-to-machine shapes to be produced. EDM can machine metals regardless of hardness and without mechanical force, giving it advantages over traditional machining methods for difficult-to-cut materials.
The document provides an overview of integrated circuit (IC) manufacturing. It discusses what an IC is, provides a brief history, and outlines the key steps in the manufacturing process. The process begins with purifying silicon ingots, slicing them into wafers, and polishing the wafers. The wafers then undergo multiple lithography, etching, and deposition steps to build transistors and interconnects. After processing, the dies on each wafer are tested and good dies are diced and packaged. The document explains some of the basic wafer processing steps like oxidation, resist coating, lithography, and etching in more detail. It aims to provide fundamentals of IC manufacturing.
1. 10/7/2012
By
Sakthivel.R (09MI08)
PSG College of Technology Coimbatore.
,
Under the guidance of
Dr. P. Radhakrishnan, Director, PSG IAS.
And Co – Guided by
Mrs. Bindu Salim, PSG IAS
Courtesy: [1]
• Ability to attach or get clanged to inclined
surfaces or elevated positions.
• To develop appropriate perching devices for
Robots to perch on rough and glazed surfaces
• Small aircraft model robot can perch on vertical
surfaces using simple mechanical and suction-
based gripping systems.
1
2. 10/7/2012
• Direct contact
• Data on current condition
• Bring samples
• Accurate information
• Automatic inspection and repair
• Ride out bad weather
• Preserve their energy
• Interchangeability of technology
• Watch out for the target
[3]
[5]
[4]
2
3. 10/7/2012
The basic sequence of action through which the robot shall perch the vertical
surface shall be inspired from the perching action of birds.
identifying the slowing down itself striking the surface with Perching on the
surface in the when on the path the help of spine surface
mode of flight of perch
(Courtesy : Lillian Stakes 2008; [2])
possible velocities and orientations
mecha nical properties of the s uspension
• action of impact over a sudden period of time
• for rough surfaces the mechanical strengths of
the spine and asperity become the factors
• for smoother surfaces friction is more
important and the ability to pull in toward the
surface is much reduced
3
4. 10/7/2012
• Arrays of small spines.
• Supported by a nonlinear suspension
• No power for clinging
• Relatively unaffected by films of dirt
and moisture
• Support large loads
[4]
4
5. 10/7/2012
• Spine tip radius
• Distribution of asperities
• Average asperity size
• Surface roughness properties
• Narrowness and slant of peaks and valleys
• Number of spines per foot
Normal Force
SMD1
Tangential Force
Spine
SMD2
Spine Loading Cycle SMD3
5
8. 10/7/2012
• Spring Steel High Carbon
of Indian Standard IS
4454 Part I Grade 3
• Cutting a spring steel
blank of 1mm diameter
• Grinding one edge
• Bent to the required
radius at the top and tip
• Bent at the bottom
•Extruded acrylic sheet
•Laser cutting process
•5mm thick sheets
•Central sheet sawed
and cut for the invert
shape of the spine
•Holes using manual
drilling machine
•Load limiting pin was
glued.
8
10. 10/7/2012
Ty pe 1 Ty pe 2 Ty pe 3
•Type 1: the top was bent for 4 mm inclined to an angle of
45°and spine tip wasbent with a radiusof 1mm.
•Type 2: the top was bent for 4 mm inclined to an angle of
45°and spine tip wasnot bent.
•Type 3: the top was bent for 4 mm inclined to an angle of
50°and spine tip wasnot bent.
•Inference: Type 1 was more smooth due to the tip bent
and type 3 slipped off often due to steep top bent.
Part Amount (INR)
Micro Spine 10.00
Spring Unit (one compression and
15.00
two tensile springs)
Fastening Rods and Load Limiting Pin 10.00
Spine holder, Side plates, Revolving
250.00
joint and assembling
Total 285.00
10
11. 10/7/2012
• Shape change when stimulated by electric field
• When voltage applied, they contract in width
due to electrostatic forces and become longer
• Perfluorinated ionic polymers sandwiched
between thin noble metal electrodes
• Selectively pass ions inside the polymer network
• Embedded distributed circulatory system
11
13. 10/7/2012
• Si l ver Oxi de Formation
• Uni form Coat of Electrode
• Surfa ce Roughening and Stretching
• Annealing
• Dehydration
The chemical constituent solutions used in reference to the bottle numbers.
II – Sodium Hydroxide, III – Millipore Water, IV – Chromic Acid, V – Ammonia Solution,
VI – Silv er Nitrate Solution, VII – Sodium Borohydrate Solution
13
14. 10/7/2012
• Pre-Treatment of Membrane
• Silver – Amine Complex Solution is prepared by using 30mg
of silver nitrate in 10ml water and 1 ml of NH4 OH (1ml
ammonia in 10ml of water).
• Rinsed Nafion® substrate was put into the prepared silver –
®
amine complex solution and kept immersed for 10 minutes.
No colour change was observed in the membrane.
• The Strip is then rinsed, wiped and then immersed in
Sodium Borohydrate solution (30mg of NaBH4 in 20ml of
water) for 10 minutes.
• The silver deposition was identified from the appearance of
bright silver colour on the substrate.
• Solution of Sodium Hydroxide (10 pellets of NaOH
in 20ml of water) for 30 min and rinsed with water
• Dipped and taken at once in dilute chromic acid
• A substrate of Nafion® is dipped in a beaker
®
containing water and kept in ultrasonic cleaner
for 10 minutes.
14
15. 10/7/2012
• The Membrane was dipped in Chromic Acid
Solution for 20 minutes.
• The Membrane is then rinsed with water and
wiped.
• A substrate of Nafion® was cleaned in a solution of
water and wiped using tissue paper.
• The water used in the entire process of Silver
coating over Nafion Membrane is de-ionized
millipore water.
Method 1
Method 2
Method 3
15
17. 10/7/2012
• Contact wire soldered to
nylon fixture.
• DC supply - 1 to 3 volts.
• AC supply - square wave
of 1.5Vpp of 0.1Hz
frequency.
• 5 mm of the 30mm length
IPMC was kept inside the
fixture.
• The IPMC was hydrated
for 50 minutes.
• Responsive in the range
of 1 to 3 volts
• Response time - 2 to 3
seconds
• Step response
• Slow initial response due
to threshold limit of
IPMC.DC.wmv energy
17
18. 10/7/2012
• Responsive in 2.5 to 3.5 volts
• Responded for 5 to 6 cycle times
• Degrading response for every
cycle time
• No response change after
3.5 volts.
• Back relaxation
• IPMC remained in its actuated position
IPMC AC voltage.wmv
• There was significant actuation response from
the IPMC.
• There was actuation response for both AC and
DC voltages. Back relaxation was found clearly
on application of AC voltage.
• The IPMC was effectively responding only for
the first actuation after every hydration.
18
19. 10/7/2012
Fig. 2. Bending Response of Venus Flytrap [12].
• The i ono-elastic tri gger hairs generates an action potential
• This move hydrogen ions into thei r cell walls, lowering the pH
a nd l oosening the extracellular components.
• Osmotic effect - K+ is released into the leaf tissues and makes
the cel ls on one surface of the leaves swell.
19
20. 10/7/2012
NEED FOR EFFICIENT ENERGY CONVERSION
DEMAND FOR ENERGY
DEVICE
USE OF DIRECT ENERGY CONVERSION
DEVICES
• Limitations of Vacuum Pump
– Working area
– Weight
– Pressure drop
– Usage of a pump
20
22. 10/7/2012
Development of IPMC model
• from membrane theory [9]
The forces a cting on the displaced membrane, restoring
forces and the dynamic equation governing the vi brating
membrane a re given by
F r is f orce in r-η plane
F Ө is f orce in Ө-η plane
P is the tension f orce
σ is the mass per unit
area of the membrane
material
22
23. 10/7/2012
Development of IPMC model
• from lipid bilayers [10]
The converse flexoelectric effect describes the generation of
curva tures induced by a pplied electric fields and the
equilibrium radius of the tether as
IPMC ANALYSIS CASE STUDY [11]
23
24. 10/7/2012
Material Properties
orthotropic relativ e permittivity 0.031
density : 2975 kg/m 3
[12]
dielectric constant of 0.00032 and
corresponding ANEL Matrix
24
25. 10/7/2012
DEVELOPMENT OF IPMC MODEL FOR
CIRCULAR CONFIGURATION
Diameter = 40mm
Thickness = 0.3mm
Results
Displacement = 14.436mm
• The maximal tip displacement can nearly reach radius
• create a cup shape.
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26. 10/7/2012
• No s i gnificant response.
• Li ttl e a ctuation response - bending force created not enough
to overcome the constrained provi ded by the hollow plate.
• Significant actuation
• Did not form cup shape
• Bend about an axis along the diameter determined by initial
curvature of the membrane
• The IPMC was effectively responding for three actuations MOV06819.AVI
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27. 10/7/2012
• Cup shape by using two cantilever IPMC kept
crossed to each other.
• Suction creation using the setup.
• Integration of micro spine and IPMC assembly
to the robot
• Gripping force to be generated to resist wind
• Ways to detect failing of the grip is failing and
recovery before the plane falls
1. Analysis And Development Of Technology For Perching Mechanism For Flying
Robots for “National Seminar On Recent Adv ances In PIE And Remote
Technologies For Nuclear Fuel Cycle (RAPT 2010)” on September 23-24, 2010
at SRI Conv ention Centre, Anupuram, Kalpakkam.
2. Develop ment Of Technology For Perching Robots Using Ionic Polymer Metal
Co mposite f or “The First National Conf erence On Energy Efficient Mechanical
System Design And Manuf acturing” on 11th-12th March, 2011 at Department Of
Mechanical Engineering, PSG College of Technology, Coimbatore
3. Develop ment Of Micro Spine Technology For Perching Robots, f or “The First
National Conf erence on emerging Trends in CAD, Cam, CIM”, Department Of
Mechanical Engineering” on 29th April 2011 at Department Of Mechanical
Engineering, PSG College Of Technology, Coimbatore.
4. Develop ment And Performance Of Circular Shaped Ionic Polymer Metal
Co mposite f or “National Conf erence on Design and Manuf acturing 2011” on
27th – 28th May 2011 at IIT Madras Campus, Chennai. Also published in
“International journal of Applied Engineering Research” Volume 6, No.5.
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