The document provides an overview of the mineralography sample preparation process using Struers equipment and methods. It discusses sampling techniques using the Accutom-50 or Discoplan-TS to cut samples, lapping samples flat, grinding glass slides, cementing samples to glass slides, and cutting off excess material. The goal is to produce thin sections that are plane parallel without cracks or relief between phases for analysis under transmitted or reflected light microscopy.

1. Mineralography
The Struers Way.. The Struers Way

2. P t ti O iPresentation Overview
1. Intro Mineralography – preparation definition(s)
2. Equipment
3. Installation and use of Accutom-50
4. The Struers TS-Method – concentration on A-50
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3. MineralographyMineralography
Groups
Minerals: Geological, petrographical samples, ores
Derived products: Refractories ceramics glassDerived products: Refractories, ceramics, glass
Mixed minerals: Cement, concrete products, densits
Common Properties
Hard, brittle, porous large hardness difference and little adhesion between
phasesp
 Common Preparation Problems
Material will easily break risk for pull outs great tendency of relief buildingMaterial will easily break, risk for pull-outs, great tendency of relief building
and sometimes also water sensitive.
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4. Sample T pesSample Types
1) Thin Sections (+ cover glass)
For transmitted light
Sample 25 µm
Glue 5µ
Cover slide
Glass slide
S l 25
Glue 5µ
Sample 25 µm
Glass slide
2) Polished Thin Sections
For transmitted & reflected light
3) P li h d S l
Sample
Embedding
Material
3) Polished Samples
For reflected light only
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5. MineralographyMineralography
Demands - true structure
To remove deformed layer from cuttingTo remove deformed layer from cutting.
To obtain a surface without cracks,
scratches and no pull-outs.
Get a smooth and plane surface
Free from relief between hard & soft
phasesphases.
Plane parallel surface
Reflective
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6. Equipment Used
Accutom-50
Tegramin-30
Discoplan-TS
LaboPol-35 / LaboForce-MI
Epovac / CitoVac
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7. Accutom 50Accutom-50
G C ff
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Grinding – using cup wheel Cutting – using cut-off wheel

8. TegraminTegramin
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9. Discoplan TSDiscoplan-TS
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10. LaboPol 35 / LaboForce MILaboPol-35 / LaboForce-MI
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11. LaboPol-35 / LaboForce-MI / LaboDoserLaboPol-35 / LaboForce-MI / LaboDoser
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12. RotoPol 35 / PdM Force 20RotoPol-35 / PdM-Force-20
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13. Epovac / CitoVacEpovac / CitoVac
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14. Installation - Discoplan-TSInstallation - Discoplan-TS
Mount cut-off wheel
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15. Installation - Discoplan-TSInstallation Discoplan TS
Mounting and aligning cup wheel
1 Group washers in equals hights1. Group washers in equals hights
2. Group 3 x 3
3. Screw cup wheel on
4 Align to perfection by means of4. Align to perfection by means of
the dial gauge and Allen screw
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16. Installation Discoplan TSInstallation - Discoplan-TS
Plane grind vacuum chucks
1 Draw with a pencil1. Draw with a pencil.
2. Grind until lines are removed.
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17. Installation – Accutom-50Installation – Accutom-50
Plane grind vacuum chucks
1. Draw with a pencil.
2. Grind until lines are removed.
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18. The Struers TS-Method®The Struers TS Method
The steps to a perfect Thin Section
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19. The Struers TS-Method®The Struers TS Method
The steps to a perfect Thin Section
1 Sampling1. Sampling
2. Cutting
4. Glass slide
6 Mounting sample onto glass slide
3. Lapping sample5. Grinding glass slides
6. Mounting sample onto glass slide
7. Cutting surplus of sample
8 Grinding of Thin Section
9. Lapping (BORTY)
8. Grinding of Thin Section
10. Polishing (TYNDS)
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11. Completion

20. 1 S li (Di l TS)1. Sampling (Discoplan-TS)
Sample size: max 70-100mm
Use a diamond cut-off wheel (20TRE)
• Will not be wedge-shaped
• Thinner layer of deformation
• More economical
Use the jig to cut one side flat
Cut the other side 90º
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21. 1 S li (Di l TS)1. Sampling (Discoplan-TS)
Safety guard
Thumb screw
Safety guard
Holder for large
rocks
Guide PlateGuide Plate
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22. 1 Sampling (Accutom 50)1. Sampling (Accutom-50)
Sample size: max 40 mm (limitation) – for larger
samples use Discotom-6/Labotom-5 with
vertical clamping
U di d ff h l (M0D10/M0D13)Use a diamond cut-off wheel (M0D10/M0D13)
• Will not be wedge-shaped
• Thinner layer of deformation
M i l• More economical
Use a suitable jig to cut one side flat
Make a drawing on the specimen
where to make a thin section
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23. 2 Cutting Sample2. Cutting Sample
On left side of Discoplan-TS
Cut sample manually to a size of 8 x 20 x 30 mm
(St t d d)(Struers standard)
Use jig (3 sizes of cut)j g ( )
Use low force at the end of cutting to avoid
breakoutsbreakouts
Alternatively: Use Accutom-50
(see next slide)
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24. 2 Cutting Sample using jig2. Cutting Sample – using jig
On left side of Discoplan-TS
Moveable stopMoveable stop
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25. 2 C tti S l (A t 50)2. Cutting Sample (Accutom-50)
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26. 3. Lapping of Sample3. Lapping of Sample
LaboPol-35/LaboForce-MI + cast iron disc
(GRICO)
Lap one side of the sample (to be adhered to
glass slide)glass slide)
Use square sample mover plate (FOTON)
Cast iron lapping disc + SiC powder mixed in
glycerol/water #220 & #1000
Tip: use only a small amount of SiC-
powder, a tip of a teaspoon.
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27. After lappingAfter lapping
Turn on the hotplate and set the temperature at 135-140°C.
Make sure the hotplate has a layer of paper or tin foil on it.
Set your sample on the hotplate for at least 10–15 minutes
(l if th l i(longer if the sample is
porous or soft) so that it is completely dry before coming into
contact with epoxy.
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28. Lapping Mounted SamplesLapping Mounted Samples
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29. LappingLapping
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30. 4 Glass Slides Requirements4. Glass Slides - Requirements
Thickness: 1300-1500 µm (1.3 - 1.5mm)
Size: 27 x 46 mm or 28 x 48 mm
Edges: Preferably ground or sandblasted
• (stress free and safer)
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31. 5. Grind Glass Slides5. Grind Glass Slides
On Discoplan-TS using Diamond cup-wheel
G i d l lid t l ( +/ 2 )Grind glass slides to planeness (accuracy +/- 2 μm)
Use diamond cup wheel 01TYN.
Final Thickness:
1.164 for thin sections
1.150 for polished thin sections
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32. 5 Grind Glass Slides (size 1x3 inch)5. Grind Glass Slides (size 1x3 inch)
On Discoplan-TS using Diamond cup-wheel
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33. 5 Grind Glass Slides (Accutom 50)5. Grind Glass Slides (Accutom-50)
G i d l lid t l ( / 2 )Grind glass slides to planeness (accuracy +/- 2 μm)
Use diamond cup wheel .
Final Thickness – for use in BORTY:
1.164 for thin sections
1.150 for polished thin sections
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34. 5. Grind Glass Slides (Accutom-50)( )
- method set up -
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35. Gl Thi k ft G i diGlass Thickness after Grinding
Thin sections (with cover glass)
Glass 1.164 mm
Polished Thin sections
• Glass 1.150 mm
Epoxy 0.005
Thin section 0.025
“underlapping” 0.010
• Epoxy 0.005
• Thin section* 0.039
• “underlapping” 0.010
TOTAL thickness 1.204 • TOTAL thickness 1.204
* Before polishing
Sample 25 µm
Glue
Cover slide
Sample 39 µm
Glue
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Glass slide Glass slide

36. Measure Glass Slides thicknessMeasure Glass Slides thickness
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37. Gl Thi k ft G i di A t 50Glass Thickness after Grinding Accutom-50
Thin sections (with cover glass)
Glass 1.300 mm
Polished Thin sections
• Glass 1.300 mm
Epoxy 0.005
Thin section 0.025
“underlapping” 0.010
• Epoxy 0.005
• Thin section* 0.039
• “underlapping” 0.010
TOTAL thickness 1.340 • TOTAL thickness 1.354
* Before polishing
Sample 25 µm
Glue
Cover slide
Sample 39 µm
Glue
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Glass slide Glass slide

38. 6 Cementing Sample to Glass Slide6. Cementing Sample to Glass Slide
Use vacuum impregnation unit, Epovac + Epoxy.
Clean & dry samples thoroughly before mountingClean & dry samples thoroughly before mounting.
Cement the lapped side of sample to ground side of
glass slide.
Use Epovac and pressure rod to obtain extremely thinUse Epovac and pressure rod to obtain extremely thin
epoxy layer (5 μm).
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39. 6 Cementing Sample to Glass Slide6. Cementing Sample to Glass Slide
Use vacuum impregnation unit, CitoVac + Epoxy.
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40. 6 Cementing Sample to Glass Slide6. Cementing Sample to Glass Slide
• Turn on the hotplate and set the temperature at 35°C
• Make sure the hotplate has a layer of paper or foil on it.
• Set your sample on the hotplate for at least 10–15 minutesSet your sample on the hotplate for at least 10 15 minutes.
• Mix a batch of epoxy.
• When your sample is completely dry, get out a clean glass slide. Remove
your sample from the hotplate (careful, it will be hot!) and set it in front ofyour sample from the hotplate (careful, it will be hot!) and set it in front of
you with the face to be mounted pointed up.
• Place a small drop of epoxy on the surface of the sample and press a
clean glass slide onto the surface of the sample.g p
• You have a few minutes to position the glass, remove any bubbles, and/or
add additional epoxy before the epoxy begins to harden.
• To remove air bubbles, place a popsicle stick on the glass and slowly and
carefully “chase” the air bubbles to the edge of the sample by drawing
another popsicle stick from the middle of the sample to the edge.
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41. 6 Cementing Sample to Glass Slide6. Cementing Sample to Glass Slide
Once there are no more bubbles and the glass is properly centered, turn the sample
over and set it back on the hotplate at 80 C to cure with the glass slide up.
At this point you need to keep some pressure on the sample either with a weight orp y p p p g
with a pressure system on the hot plate.
All th t f i t l 45 i t d th l t it l ff thAllow the epoxy to cure for approximately 45 minutes, and then let it cool off the
hotplate for a while (time will vary depending on the sample) before handling it further.
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42. 6. Cementing Sample to Glass Slideg p
- handling process
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43. 6 Cementing Sample to Glass Slide6. Cementing Sample to Glass Slide
Let the sample cure with the glass slide
upwards and under a cupupwards and under a cup.
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44. 7 Cut-off Sample Surplus7. Cut off Sample Surplus
~ Re-sectioning
After Epoxy resin has cured, cut off
surplus material to a samplesurplus material to a sample
thickness of 0.5-1 mm
depending on the material.
Fix the sample on the vacuum
chuck at the left side of the
Discoplan TSDiscoplan-TS.
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45. 7 Re-sectioning (size 1x3 inch)7. Re-sectioning (size 1x3 inch)
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46. 7. Cut-off Sample Surplusp p
Accutom-50
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47. 8. Grinding of Thin Sectiong
On Discoplan-TS using Diamond cup-wheel
G i d i di d h lGrind specimen on diamond cup-wheel
(01TYN) to a total thickness of approx. 80 μm
(section + resin)
Slide + sample + epoxy = 1.250 mm
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48. 8. Grinding of Thin Section8. Grinding of Thin Section
On Accutom-50 using Diamond cup-wheel
Grind specimen on diamond cup-wheel (M0P10 –
40 μm) to a total thickness of approx. 80 μm and
final grinding with M0P10 – 25 μm (section + resin)
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49. 9 Lapping of Thin section9. Lapping of Thin section
In BORTY on LaboPol-35 / LaboForce-MI
Lap sample (SiC powder #1000)
Use BORTY thin section holder
Lapping on a cast iron disc
Lap to desired thickness egLap to desired thickness eg.
• 25-30 µm for thin sections
• 30-35 μm for polished thin sections
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50. Microcover GlassMicrocover Glass
• Glue cover glass on by means of EUKITT
Cover slide
Sample 25 µm
Glue
Glass slide
Cover slide
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Glass slide

51. 10 Polishing in TYNDS10. Polishing in TYNDS
If polishing is required stop lapping or grinding with a sampleIf polishing is required, stop lapping or grinding with a sample
thickness of 30-35 μm as polishing removes further 5-10 µm.
SUse TYNDS thin section holder and polish.
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52. 11 Completed Sample11. Completed Sample
Sample 20 μmp μ
Epoxy layer 5 μm
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53. 11 Completed Sample11. Completed Sample
S l 30
Biotite
Sample 30 μm
Epoxy layer 5 μm
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54. 11 Completed Sample11. Completed Sample
S l 30
Metorite
Sample 30 μm
Epoxy layer 5 μm
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55. Polishing in TYNDSPolishing in TYNDS
Polishing the sample from 40µ down to required thickness
U TYNDS thi ti h ld d li hUse TYNDS thin section holder and polish.
Tegramin-30 / TegraSystem / LaboSystem - max 70 rpm
Time and force depends on the hardness of the material
Step
S f
Polishing 2Polishing1 Polishing 3
Surface
Abrasive
MD-Largo MD-Dac
DP-A DP-A
MD-Dac/Dur
DP-A
Grit /
grain size
Lubricant
6 µm 3 µm
Blue Blue
1 µm
Blue
[rpm]
Force
[N]
70 70
7.5 per sample 7.5 per sample
70
7.5 per sample
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Time
[min] 3-5 3-5 3-5

56. Polished thin section hard materialPolished thin section – hard material
Step Polishing 2Polishing1 Polishing 3Step
Surface
Polishing 2
MD-Largo MD-Pan/Dac MD-Dac/Dur
Polishing1 Polishing 3
Grit /
Abrasive DP-A DP-A DP-A
Grit /
grain size
Lubricant
9/6 µm 3 µm
Blue Blue
1 µm
Blue
[rpm] 70 70 70
Time
[min]
Force
[N] 10-15 per sample 10-15 per sample
3 5 3-5
10-15 per sample
3-5
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[min] 3-5 3 5 3 5

57. Polished thin section soft materialPolished thin section – soft material
Step Polishing 2Polishing1 Polishing 3Step
Surface
Polishing 2
MD-Pan MD-Dac MD-Dac/Dur
Polishing1 Polishing 3
Grit /
Abrasive DP-A DP-A DP-A
Grit /
grain size
Lubricant
6 µm 3 µm
Blue Blue
1 µm
Blue
[rpm] 70 70 70
Time
[min]
Force
[N] 5-10 per sample 5-10 per sample
3 5 3-5
5-10 per sample
3-5
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[min] 3-5 3 5 3 5

58. Lapping Cast Iron DiscLapping – Cast Iron Disc
Equipment: Discoplan-TS CitoVacEquipment: Discoplan-TS, CitoVac,
LaboPol-35/LaboForce-MI and accessories
#220: 80 ml powder + 1 liter
glycerine
#1000: 90 ml powder + 1 liter
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#1000: 90 ml powder + 1 liter
mixed glycerine/ water (1:3)

59. Polished thin section new methodPolished thin section – new method
E i t Di l TS Cit VEquipment: Discoplan-TS, CitoVac,
LaboPol-35/LaboForce-MI and accessories
#220: 80 ml powder + 1 liter glycerine
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#1000: 90 ml powder + 1 liter mixed glycerine/ water (1:3)

60. Polished thin section old methodPolished thin section – old method
Equipment: Discoplan-TS, CitoVac,
LaboPol-35/LaboForce-MI and accessories
#220: 80 ml powder + 1 liter glycerine
#1000 90 l d 1 lit i d l i / t (1 3)
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#1000: 90 ml powder + 1 liter mixed glycerine/ water (1:3)

61. SummarySummary
The Struers TS-method®
11 Steps to a Perfect Thin Section
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62. Ensuring Certaintyg y
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