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P-Channel 60 V (D-S) MOSFET
FEATURES
• TrenchFET®
Power MOSFET
• Material categorization:
APPLICATIONS
• Load Switch
Notes:
a. Duty cycle  1 %.
b. When mounted on 1" square PCB (FR-4 material).
c. See SOA curve for voltage derating.
d. Package limited.
PRODUCT SUMMARY
VDS (V) RDS(on) () ID (A)
- 60
0.045 at VGS = - 10 V - 40d
0.054 at VGS = - 4.5 V - 40d
TO-252
SG D
Top View
S
G
D
P-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted)
Parameter Symbol Limit Unit
Drain-Source Voltage VDS - 60
V
Gate-Source Voltage VGS ± 20
Continuous Drain Current (TJ = 175 °C)
TC = 25 °C
ID
- 40d
A
TC = 125 °C - 27.5
Pulsed Drain Current IDM - 110
Avalanche Current IAS - 30
Single Pulse Avalanche Energya L = 0.1 mH EAS 125 mJ
Power Dissipation
TC = 25 °C
PD
113c
W
TA = 25 °C 2.5b, c
Operating Junction and Storage Temperature Range TJ, Tstg - 55 to 150 °C
THERMAL RESISTANCE RATINGS
Parameter Symbol Typical Maximum Unit
Junction-to-Ambientb
t  10 s
RthJA
15 18
°C/WSteady State 40 50
Junction-to-Case RthJC 0.82 1.1
DTU40P06
www.din-tek.jp
2
Notes:
a. Pulse test; pulse width  300 µs, duty cycle  2 %.
b. Guaranteed by design, not subject to production testing.
c. Independent of operating temperature.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
SPECIFICATIONS (TJ = 25 °C, unless otherwise noted)
Parameter Symbol Test Conditions Min. Typ. Max. Unit
Static
Drain-Source Breakdown Voltage VDS VGS = 0 V, ID = - 250 µA - 60
V
Gate Threshold Voltage VGS(th) VDS = VGS, ID = - 250 µA - 1 - 3
Gate-Body Leakage IGSS VDS = 0 V, VGS = ± 20 V ± 100 nA
Zero Gate Voltage Drain Current IDSS
VDS = - 60 V, VGS = 0 V - 1
µAVDS = - 60 V, VGS = 0 V, TJ = 125 °C - 50
VDS = - 60 V, VGS = 0 V, TJ = 150 °C - 100
On-State Drain Currenta ID(on) VDS = -5 V, VGS = - 10 V - 50 A
Drain-Source On-State Resistancea RDS(on)
VGS = - 10 V, ID = - 5 A 0.045 0.050

VGS = - 10 V, ID = - 10 A, TJ = 125 °C 0.060
VGS = - 10 V, ID = - 10 A, TJ = 150 °C 0.073
VGS = - 4.5 V, ID = - 5 A 0.060
Forward Transconductancea gfs VDS = - 15 V, ID = - 17 A 61 S
Dynamicb
Input Capacitance Ciss
VGS = 0 V, VDS = - 25 V, f = 1 MHz
4950
pFOutput Capacitance Coss 480
Reverse Transfer Capacitance Crss 405
Total Gate Chargec Qg
VDS = - 30 V, VGS = - 10 V, ID = - 40 A
110 165
nCGate-Source Chargec Qgs 19
Gate-Drain Chargec Qgd 28
Turn-On Delay Timec td(on)
VDD = - 30 V, RL = 0.6 Ω
ID ≅ - 40 A, VGEN = - 10 V, RG = 6
Ω
15 23
ns
Rise Timec tr 70 105
Turn-Off Delay Timec td(off) 175 260
Fall Timec tf 175 260
Source-Drain Diode Ratings and Characteristics TC = 25 °Cb
Continuous Current IS - 40
A
Pulsed Current ISM - 80
Forward Voltagea VSD IF = - 40 A, VGS = 0 V - 1 - 1.6 V
Reverse Recovery Time trr IF = - 40 A, dI/dt = 100 A/µs 45 70 ns
DTU40P06
www.din-tek.jp
0.054
3
TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
Output Characteristics
Transconductance
Capacitance
VDS - Drain-to-Source Voltage (V)
-DrainCurrent(A)ID
-3 V
0
10
20
30
40
50
60
70
80
0 1 2 3 4 5
VGS = -10 thru -4 V
0
20
40
60
80
100
0 10 20 30 40 50 60
VGS - Gate-to-Source Voltage (V)
-Transconductance(S)gfs
TC = - 55 °C 25 °C
125 °C
0
1000
2000
3000
4000
5000
6000
7000
8000
0 10 20 30 40 50 60
VDS - Drain-to-Source Voltage (V)
C-Capacitance(pF)
Ciss
Coss
Crss
Transfer Characteristics
On-Resistance vs. Drain Current
Gate Charge
0
10
20
30
40
50
60
70
80
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0
VGS - Gate-to-Source Voltage (V)
-DrainCurrent(A)ID
25 °C
- 55 °C
TC = 125 °C
0.000
0.030
0.040
0.050
0.060
0.070
0 10 20 30 40 50 60 70 80
-On-Resistance(Ω)
ID - Drain Current (A)
RDS(on)
VGS = 10 V
VGS = 4.5 V
0
2
4
6
8
10
0 20 40 60 80 100 120
-Gate-to-SourceVoltage(V)
Qg - Total Gate Charge (nC)
VGS
VDS = 30 V
ID = 40 A
DTU40P06
www.din-tek.jp
4
TYPICAL CHARACTERISTICS
THERMAL RATINGS (25 °C, unless otherwise noted)
On-Resistance vs. Junction Temperature
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
(Normalized)-On-Resistance
TJ - Junction Temperature (°C)
RDS(on)
VGS = 10 V
ID = 17 A
- 50 - 25 0 25 50 75 100 125 150
Source-Drain Diode Forward Voltage
0.0 0.3 0.6 0.9 1.2 1.5
VSD - Source-to-Drain Voltage (V)
-SourceCurrent(A)IS
100
10
1
TJ = 25 °C
TJ = 150 °C
Drain Current vs. Case Temperature
TC - Case Temperature (°C)
-DrainCurrent(A)ID
0
5
10
20
30
40
50
0 25 50 75 100 125 150
Safe Operating Area
1
10
100
0.1 1 10 100
-DrainCurrent(A)ID
TC = 25 °C
Single Pulse
RDS(on)*Limited by
P(t) = 0.01
P(t) = 0.001
P(t) = 0.0001
P(t) = 1
P(t) = 0.1
BVDSS
Limited
VDS - Drain-to-Source Voltage (V)
* VGS > minimum VGS at which RDS(on) is specified
Normalized Thermal Transient Impedance, Junction-to-Case
Square Wave Pulse Duration (s)
2
1
0.1
0.01
10-4 10-3 10-2 10-1
NormalizedEffectiveTransient
ThermalImpedance
1
0.2
0.1
0.05
Duty Cycle = 0.5
Single Pulse
0.02
DTU40P06
www.din-tek.jp
1
TO-252AA CASE OUTLINE
Note
• Dimension L3 is for reference only.
L3
D
L4
L5
b b2
e1
E1
D1
C
A1
gageplaneheight(0.5mm)
e
b3
E
C2
A
L
H
MILLIMETERS INCHES
DIM. MIN. MAX. MIN. MAX.
A 2.18 2.38 0.086 0.094
A1 - 0.127 - 0.005
b 0.64 0.88 0.025 0.035
b2 0.76 1.14 0.030 0.045
b3 4.95 5.46 0.195 0.215
C 0.46 0.61 0.018 0.024
C2 0.46 0.89 0.018 0.035
D 5.97 6.22 0.235 0.245
D1 5.21 - 0.205 -
E 6.35 6.73 0.250 0.265
E1 4.32 - 0.170 -
H 9.40 10.41 0.370 0.410
e 2.28 BSC 0.090 BSC
e1 4.56 BSC 0.180 BSC
L 1.40 1.78 0.055 0.070
L3 0.89 1.27 0.035 0.050
L4 - 1.02 - 0.040
L5 1.14 1.52 0.045 0.060
ECN: X12-0247-Rev. M, 24-Dec-12
DWG: 5347
Package Information
www.din-tek.jp
1
APPLICATIONNOTE
RECOMMENDED MINIMUM PADS FOR DPAK (TO-252)
0.420
(10.668)
Recommended Minimum Pads
Dimensions in Inches/(mm)
0.224
(5.690)
0.180
(4.572)
0.055
(1.397)
0.243
(6.180)
0.087
(2.202)
0.090
(2.286)
Application Note
www.din-tek.jp
1
Disclaimer
ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE
RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.
Din-Tek Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively,
“Din-Tek”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other
disclosure relating to any product.
Din-Tek makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or
the continuing production of any product. To the maximum extent permitted by applicable law, Din-Tek disclaims (i) any and all
liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special,
consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular
purpose, non-infringement and merchantability.
Statements regarding the suitability of products for certain types of applications are based on Din-Tek’s knowledge of typical
requirements that are often placed on Din-Tek products in generic applications. Such statements are not binding statements
about the suitability of products for a particular application. It is the customer’s responsibility to validate that a particular
product with the properties described in the product specification is suitable for use in a particular application. Parameters
provided in datasheets and/or specifications may vary in different applications and performance may vary over time. All
operating parameters, including typical parameters, must be validated for each customer application by the customer’s
technical experts. Product specifications do not expand or otherwise modify Din-Tek’s terms and conditions of purchase,
including but not limited to the warranty expressed therein.
Except as expressly indicated in writing, Din-Tek products are not designed for use in medical, life-saving, or life-sustaining
applications or for any other application in which the failure of the Din-Tek product could result in personal injury or death.
Customers using or selling Din-Tek products not expressly indicated for use in such applications do so at their own risk. Please
contact authorized Din-Tek personnel to obtain written terms and conditions regarding products designed for such applications.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by
any conduct of Din-Tek. Product names and markings noted herein may be trademarks of their respective owners.
Material Category Policy
Din-Tek Intertechnology, Inc. hereby certifies that all its products that are identified as RoHS-Compliant fulfill the
definitions and restrictions defined under Directive 2011/65/EU of The European Parliament and of the Council
of June 8, 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment
(EEE) - recast, unless otherwise specified as non-compliant.
Please note that some Din-Tek documentation may still make reference to RoHS Directive 2002/95/EC. We confirm that
all the products identified as being compliant to Directive 2002/95/EC conform to Directive 2011/65/EU.
Din-Tek Intertechnology, Inc. hereby certifies that all its products that are identified as Halogen-Free follow Halogen-Free
requirements as per JEDEC JS709A standards. Please note that some Din-Tek documentation may still make reference
to the IEC 61249-2-21 definition. We confirm that all the products identified as being compliant to IEC 61249-2-21
conform to JEDEC JS709A standards.
Legal Disclaimer Notice
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Original P-Channel Mosfet DTU40P06 40P06 TO-252 60V 27A New

  • 1. 1 P-Channel 60 V (D-S) MOSFET FEATURES • TrenchFET® Power MOSFET • Material categorization: APPLICATIONS • Load Switch Notes: a. Duty cycle  1 %. b. When mounted on 1" square PCB (FR-4 material). c. See SOA curve for voltage derating. d. Package limited. PRODUCT SUMMARY VDS (V) RDS(on) () ID (A) - 60 0.045 at VGS = - 10 V - 40d 0.054 at VGS = - 4.5 V - 40d TO-252 SG D Top View S G D P-Channel MOSFET ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted) Parameter Symbol Limit Unit Drain-Source Voltage VDS - 60 V Gate-Source Voltage VGS ± 20 Continuous Drain Current (TJ = 175 °C) TC = 25 °C ID - 40d A TC = 125 °C - 27.5 Pulsed Drain Current IDM - 110 Avalanche Current IAS - 30 Single Pulse Avalanche Energya L = 0.1 mH EAS 125 mJ Power Dissipation TC = 25 °C PD 113c W TA = 25 °C 2.5b, c Operating Junction and Storage Temperature Range TJ, Tstg - 55 to 150 °C THERMAL RESISTANCE RATINGS Parameter Symbol Typical Maximum Unit Junction-to-Ambientb t  10 s RthJA 15 18 °C/WSteady State 40 50 Junction-to-Case RthJC 0.82 1.1 DTU40P06 www.din-tek.jp
  • 2. 2 Notes: a. Pulse test; pulse width  300 µs, duty cycle  2 %. b. Guaranteed by design, not subject to production testing. c. Independent of operating temperature. Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. SPECIFICATIONS (TJ = 25 °C, unless otherwise noted) Parameter Symbol Test Conditions Min. Typ. Max. Unit Static Drain-Source Breakdown Voltage VDS VGS = 0 V, ID = - 250 µA - 60 V Gate Threshold Voltage VGS(th) VDS = VGS, ID = - 250 µA - 1 - 3 Gate-Body Leakage IGSS VDS = 0 V, VGS = ± 20 V ± 100 nA Zero Gate Voltage Drain Current IDSS VDS = - 60 V, VGS = 0 V - 1 µAVDS = - 60 V, VGS = 0 V, TJ = 125 °C - 50 VDS = - 60 V, VGS = 0 V, TJ = 150 °C - 100 On-State Drain Currenta ID(on) VDS = -5 V, VGS = - 10 V - 50 A Drain-Source On-State Resistancea RDS(on) VGS = - 10 V, ID = - 5 A 0.045 0.050  VGS = - 10 V, ID = - 10 A, TJ = 125 °C 0.060 VGS = - 10 V, ID = - 10 A, TJ = 150 °C 0.073 VGS = - 4.5 V, ID = - 5 A 0.060 Forward Transconductancea gfs VDS = - 15 V, ID = - 17 A 61 S Dynamicb Input Capacitance Ciss VGS = 0 V, VDS = - 25 V, f = 1 MHz 4950 pFOutput Capacitance Coss 480 Reverse Transfer Capacitance Crss 405 Total Gate Chargec Qg VDS = - 30 V, VGS = - 10 V, ID = - 40 A 110 165 nCGate-Source Chargec Qgs 19 Gate-Drain Chargec Qgd 28 Turn-On Delay Timec td(on) VDD = - 30 V, RL = 0.6 Ω ID ≅ - 40 A, VGEN = - 10 V, RG = 6 Ω 15 23 ns Rise Timec tr 70 105 Turn-Off Delay Timec td(off) 175 260 Fall Timec tf 175 260 Source-Drain Diode Ratings and Characteristics TC = 25 °Cb Continuous Current IS - 40 A Pulsed Current ISM - 80 Forward Voltagea VSD IF = - 40 A, VGS = 0 V - 1 - 1.6 V Reverse Recovery Time trr IF = - 40 A, dI/dt = 100 A/µs 45 70 ns DTU40P06 www.din-tek.jp 0.054
  • 3. 3 TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted) Output Characteristics Transconductance Capacitance VDS - Drain-to-Source Voltage (V) -DrainCurrent(A)ID -3 V 0 10 20 30 40 50 60 70 80 0 1 2 3 4 5 VGS = -10 thru -4 V 0 20 40 60 80 100 0 10 20 30 40 50 60 VGS - Gate-to-Source Voltage (V) -Transconductance(S)gfs TC = - 55 °C 25 °C 125 °C 0 1000 2000 3000 4000 5000 6000 7000 8000 0 10 20 30 40 50 60 VDS - Drain-to-Source Voltage (V) C-Capacitance(pF) Ciss Coss Crss Transfer Characteristics On-Resistance vs. Drain Current Gate Charge 0 10 20 30 40 50 60 70 80 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 VGS - Gate-to-Source Voltage (V) -DrainCurrent(A)ID 25 °C - 55 °C TC = 125 °C 0.000 0.030 0.040 0.050 0.060 0.070 0 10 20 30 40 50 60 70 80 -On-Resistance(Ω) ID - Drain Current (A) RDS(on) VGS = 10 V VGS = 4.5 V 0 2 4 6 8 10 0 20 40 60 80 100 120 -Gate-to-SourceVoltage(V) Qg - Total Gate Charge (nC) VGS VDS = 30 V ID = 40 A DTU40P06 www.din-tek.jp
  • 4. 4 TYPICAL CHARACTERISTICS THERMAL RATINGS (25 °C, unless otherwise noted) On-Resistance vs. Junction Temperature 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 (Normalized)-On-Resistance TJ - Junction Temperature (°C) RDS(on) VGS = 10 V ID = 17 A - 50 - 25 0 25 50 75 100 125 150 Source-Drain Diode Forward Voltage 0.0 0.3 0.6 0.9 1.2 1.5 VSD - Source-to-Drain Voltage (V) -SourceCurrent(A)IS 100 10 1 TJ = 25 °C TJ = 150 °C Drain Current vs. Case Temperature TC - Case Temperature (°C) -DrainCurrent(A)ID 0 5 10 20 30 40 50 0 25 50 75 100 125 150 Safe Operating Area 1 10 100 0.1 1 10 100 -DrainCurrent(A)ID TC = 25 °C Single Pulse RDS(on)*Limited by P(t) = 0.01 P(t) = 0.001 P(t) = 0.0001 P(t) = 1 P(t) = 0.1 BVDSS Limited VDS - Drain-to-Source Voltage (V) * VGS > minimum VGS at which RDS(on) is specified Normalized Thermal Transient Impedance, Junction-to-Case Square Wave Pulse Duration (s) 2 1 0.1 0.01 10-4 10-3 10-2 10-1 NormalizedEffectiveTransient ThermalImpedance 1 0.2 0.1 0.05 Duty Cycle = 0.5 Single Pulse 0.02 DTU40P06 www.din-tek.jp
  • 5. 1 TO-252AA CASE OUTLINE Note • Dimension L3 is for reference only. L3 D L4 L5 b b2 e1 E1 D1 C A1 gageplaneheight(0.5mm) e b3 E C2 A L H MILLIMETERS INCHES DIM. MIN. MAX. MIN. MAX. A 2.18 2.38 0.086 0.094 A1 - 0.127 - 0.005 b 0.64 0.88 0.025 0.035 b2 0.76 1.14 0.030 0.045 b3 4.95 5.46 0.195 0.215 C 0.46 0.61 0.018 0.024 C2 0.46 0.89 0.018 0.035 D 5.97 6.22 0.235 0.245 D1 5.21 - 0.205 - E 6.35 6.73 0.250 0.265 E1 4.32 - 0.170 - H 9.40 10.41 0.370 0.410 e 2.28 BSC 0.090 BSC e1 4.56 BSC 0.180 BSC L 1.40 1.78 0.055 0.070 L3 0.89 1.27 0.035 0.050 L4 - 1.02 - 0.040 L5 1.14 1.52 0.045 0.060 ECN: X12-0247-Rev. M, 24-Dec-12 DWG: 5347 Package Information www.din-tek.jp
  • 6. 1 APPLICATIONNOTE RECOMMENDED MINIMUM PADS FOR DPAK (TO-252) 0.420 (10.668) Recommended Minimum Pads Dimensions in Inches/(mm) 0.224 (5.690) 0.180 (4.572) 0.055 (1.397) 0.243 (6.180) 0.087 (2.202) 0.090 (2.286) Application Note www.din-tek.jp
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