Original N-Channel Mosfet FQP2N60C 2N60C 2N60 600V 2A TO-220 New Fairchild https://authelectronic.com/original-n-channel-mosfet-fqp2n60c-2n60c-2n60-600v-2a-to-220-new-fairchild

1. ©2003 Fairchild Semiconductor Corporation Rev. A, September 2003
FQP2N60C/FQPF2N60C
QFETTM
FQP2N60C/FQPF2N60C
600V N-Channel MOSFET
General Description
These N-Channel enhancement mode power field effect
transistors are produced using Fairchild’s proprietary,
planar stripe, DMOS technology.
This advanced technology has been especially tailored to
minimize on-state resistance, provide superior switching
performance, and withstand high energy pulse in the
avalanche and commutation mode. These devices are well
suited for high efficiency switched mode power supplies,
active power factor correction, electronic lamp ballasts
based on half bridge topology.
Features
• 2.0A, 600V, RDS(on) = 4.7Ω @VGS = 10 V
• Low gate charge ( typical 8.5 nC)
• Low Crss ( typical 4.3 pF)
• Fast switching
• 100% avalanche tested
• Improved dv/dt capability
Absolute Maximum Ratings TC = 25°C unless otherwise noted
* Drain current limited by maximum junction temperature.
Thermal Characteristics
Symbol Parameter FQP2N60C FQPF2N60C Units
VDSS Drain-Source Voltage 600 V
ID Drain Current - Continuous (TC = 25°C) 2.0 2.0 * A
- Continuous (TC = 100°C) 1.35 1.35 * A
IDM Drain Current - Pulsed (Note 1) 8 8 * A
VGSS Gate-Source Voltage ± 30 V
EAS Single Pulsed Avalanche Energy (Note 2) 120 mJ
IAR Avalanche Current (Note 1) 2.0 A
EAR Repetitive Avalanche Energy (Note 1) 5.4 mJ
dv/dt Peak Diode Recovery dv/dt (Note 3) 4.5 V/ns
PD Power Dissipation (TC = 25°C) 54 23 W
- Derate above 25°C 0.43 0.18 W/°C
TJ, TSTG Operating and Storage Temperature Range -55 to +150 °C
TL
Maximum lead temperature for soldering purposes,
1/8" from case for 5 seconds
300 °C
Symbol Parameter FQP2N60C FQPF2N60C Units
RθJC Thermal Resistance, Junction-to-Case 2.32 5.5 °C/W
RθCS Thermal Resistance, Case-to-Sink Typ. 0.5 -- °C/W
RθJA Thermal Resistance, Junction-to-Ambient 62.5 62.5 °C/W
TO-220
FQP Series
G SD
TO-220F
FQPF Series
G SD
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▲▲▲▲
!!!!
!!!!
!!!!
◀◀◀◀
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●●●●
●●●●
▲▲▲▲
!!!!
!!!!
!!!!
◀◀◀◀
S
D
G

2. Rev. A, September 2003©2003 Fairchild Semiconductor Corporation
FQP2N60C/FQPF2N60C
Electrical Characteristics TC = 25°C unless otherwise noted
Notes:
1. Repetitive Rating : Pulse width limited by maximum junction temperature
2. L = 56mH, IAS = 2A, VDD = 50V, RG = 25 Ω, Starting TJ = 25°C
3. ISD ≤ 2A, di/dt ≤ 200A/µs, VDD ≤ BVDSS, Starting TJ = 25°C
4. Pulse Test : Pulse width ≤ 300µs, Duty cycle ≤ 2%
5. Essentially independent of operating temperature
Symbol Parameter Test Conditions Min Typ Max Units
Off Characteristics
BVDSS Drain-Source Breakdown Voltage VGS = 0 V, ID = 250 µA 600 -- -- V
∆BVDSS
/ ∆TJ
Breakdown Voltage Temperature
Coefficient
ID = 250 µA, Referenced to 25°C -- 0.6 -- V/°C
IDSS
Zero Gate Voltage Drain Current
VDS = 600 V, VGS = 0 V -- -- 1 µA
VDS = 480 V, TC = 125°C -- -- 10 µA
IGSSF Gate-Body Leakage Current, Forward VGS = 30 V, VDS = 0 V -- -- 100 nA
IGSSR Gate-Body Leakage Current, Reverse VGS = -30 V, VDS = 0 V -- -- -100 nA
On Characteristics
VGS(th) Gate Threshold Voltage VDS = VGS, ID = 250 µA 2.0 -- 4.0 V
RDS(on) Static Drain-Source
On-Resistance
VGS = 10 V, ID = 1 A -- 3.6 4.7 Ω
gFS Forward Transconductance VDS = 40 V, ID = 1 A (Note 4) -- 5.0 -- S
Dynamic Characteristics
Ciss Input Capacitance VDS = 25 V, VGS = 0 V,
f = 1.0 MHz
-- 180 235 pF
Coss Output Capacitance -- 20 25 pF
Crss Reverse Transfer Capacitance -- 4.3 3 pF
Switching Characteristics
td(on) Turn-On Delay Time
VDD = 300 V, ID = 2 A,
RG = 25 Ω
(Note 4, 5)
-- 9 28 ns
tr Turn-On Rise Time -- 25 60 ns
td(off) Turn-Off Delay Time -- 24 58 ns
tf Turn-Off Fall Time -- 28 66 ns
Qg Total Gate Charge VDS = 480 V, ID = 2 A,
VGS = 10 V
(Note 4, 5)
-- 8.5 12 nC
Qgs Gate-Source Charge -- 1.3 -- nC
Qgd Gate-Drain Charge -- 4.1 -- nC
Drain-Source Diode Characteristics and Maximum Ratings
IS Maximum Continuous Drain-Source Diode Forward Current -- -- 2 A
ISM Maximum Pulsed Drain-Source Diode Forward Current -- -- 8 A
VSD Drain-Source Diode Forward Voltage VGS = 0 V, IS = 2 A -- -- 1.4 V
trr Reverse Recovery Time VGS = 0 V, IS = 2 A,
dIF / dt = 100 A/µs (Note 4)
-- 230 -- ns
Qrr Reverse Recovery Charge -- 1.0 -- µC

3. Rev. A, September 2003©2003 Fairchild Semiconductor Corporation
FQP2N60C/FQPF2N60C
10
-1
10
0
10
1
10
-2
10
-1
10
0
VGS
Top : 15.0 V
10.0 V
8.0 V
7.0 V
6.5 V
6.0 V
5.5 V
5.0 V
Bottom: 4.5 V
※ Notes :
1. 250μ s Pulse Test
2. TC
= 25℃
ID,DrainCurrent[A]
VDS
, Drain-Source Voltage [V]
2 4 6 8 10
10
-1
10
0
10
1
150
o
C
25
o
C
-55
o
C
※Notes :
1. VDS
=40V
2. 250μ sPulseTest
ID,DrainCurrent[A]
VGS
, Gate-SourceVoltage[V]
10
-1
10
0
10
1
0
50
100
150
200
250
300
350
400
450
500
Ciss
=Cgs
+Cgd
(Cds
=shorted)
Coss
=Cds
+Cgd
Crss
=Cgd
※Note;
1. VGS
=0V
2. f = 1MHzCrss
Coss
Ciss
Capacitances[pF]
VDS
, Drain-SourceVoltage[V]
0 2 4 6 8 10
0
2
4
6
8
10
12
VDS
= 300V
VDS
= 120V
VDS
= 480V
※Note : ID
=2A
VGS,Gate-SourceVoltage[V]
QG
, Total GateCharge [nC]
0 1 2 3 4 5
0
2
4
6
8
10
12
VGS
=20V
VGS
=10V
※Note: TJ
=25℃
RDS(ON)[Ω],
Drain-SourceOn-Resistance
ID
, DrainCurrent [A]
0.2 0.4 0.6 0.8 1.0 1.2 1.4
10
-1
10
0
150℃
※ Notes:
1. VGS
= 0V
2. 250μ s PulseTest
25℃
IDR,ReverseDrainCurrent[A]
VSD
, Source-Drainvoltage[V]
Typical Characteristics
Figure 5. Capacitance Characteristics Figure 6. Gate Charge Characteristics
Figure 3. On-Resistance Variation vs
Drain Current and Gate Voltage
Figure 4. Body Diode Forward Voltage
Variation with Source Current
and Temperature
Figure 2. Transfer CharacteristicsFigure 1. On-Region Characteristics

4. Rev. A, September 2003©2003 Fairchild Semiconductor Corporation
FQP2N60C/FQPF2N60C
-100 -50 0 50 100 150 200
0.8
0.9
1.0
1.1
1.2
※Notes:
1. VGS
=0V
2. ID
=250μA
BVDSS,(Normalized)
Drain-SourceBreakdownVoltage
TJ
, JunctionTemperature[
o
C]
-100 -50 0 50 100 150 200
0.0
0.5
1.0
1.5
2.0
2.5
3.0
※Notes:
1. VGS
=10V
2. ID
=2.5A
RDS(ON),(Normalized)
Drain-SourceOn-Resistance
TJ
, JunctionTemperature[
o
C]
10
0
10
1
10
2
10
3
10
-2
10
-1
10
0
10
1
100 ms
DC
10 ms
1 ms
100 µs
Operation inThis Area
is Limitedby RDS(on)
※ Notes:
1. TC
= 25
o
C
2. TJ
= 150
o
C
3. SinglePulse
ID,DrainCurrent[A]
VDS
, Drain-Source Voltage[V]
10
0
10
1
10
2
10
3
10
-2
10
-1
10
0
10
1
100 ms
DC
10 ms
1 ms
100µs
OperationinThisArea
isLimitedbyRDS(on)
※ Notes:
1. TC
= 25
o
C
2. TJ
= 150
o
C
3. SinglePulse
ID,DrainCurrent[A]
VDS
, Drain-SourceVoltage[V]
25 50 75 100 125 150
0.0
0.4
0.8
1.2
1.6
2.0
2.4
ID,DrainCurrent[A]
TC
, Case Temperature [℃]
Typical Characteristics (Continued)
Figure 9-1. Maximum Safe Operating Area
for FQP2N60C
Figure 10. Maximum Drain Current
vs Case Temperature
Figure 7. Breakdown Voltage Variation
vs Temperature
Figure 8. On-Resistance Variation
vs Temperature
Figure 9-2. Maximum Safe Operating Area
for FQPF2N60C

5. Rev. A, September 2003©2003 Fairchild Semiconductor Corporation
FQP2N60C/FQPF2N60C
1 0
-5
1 0
-4
1 0
-3
1 0
-2
1 0
-1
1 0
0
1 0
1
1 0
-2
1 0
-1
1 0
0 ※ N ote s :
1 . Z θ JC
(t) = 5 .5 ℃ /W M a x.
2 . D u ty F ac tor, D = t1
/t2
3 . T JM
- T C
= P D M
* Z θ JC
(t)
s in g le p u ls e
D = 0 .5
0 .0 2
0 .2
0 .0 5
0 .1
0 .0 1
Z
θJC
(t),ThermalResponse
t1
, S q u a re W a ve P u ls e D u ra tio n [se c ]
t1
PDM
t2
Typical Characteristics (Continued)
Figure 11-1. Transient Thermal Response Curve for FQP2N60C
Figure 11-2. Transient Thermal Response Curve for FQPF2N60C
1 0
-5
1 0
-4
1 0
-3
1 0
-2
1 0
-1
1 0
0
1 0
1
1 0
-2
1 0
-1
1 0
0
※ N o tes :
1 . Z θ JC
(t) = 2 .3 2 ℃ /W M a x.
2 . D uty F ac to r, D = t1
/t2
3 . T JM
- T C
= P D M
* Z θ JC
(t)
s in g le p u ls e
D = 0 .5
0 .0 2
0 .2
0 .0 5
0 .1
0 .0 1
Z
θJC
(t),ThermalResponse
t1
, S q u a re W a v e P u ls e D u ra tio n [s e c ]
t1
PDM
t2

6. Rev. A, September 2003©2003 Fairchild Semiconductor Corporation
FQP2N60C/FQPF2N60C
Gate Charge Test Circuit & Waveform
Resistive Switching Test Circuit & Waveforms
Unclamped Inductive Switching Test Circuit & Waveforms
Charge
VGS
10V
Qg
Qgs Qgd
3mA
VGS
DUT
VDS
300nF
50KΩ
200nF12V
Same Type
as DUT
Charge
VGS
10V
Qg
Qgs Qgd
3mA
VGS
DUT
VDS
300nF
50KΩ
200nF12V
Same Type
as DUT
VGS
VDS
10%
90%
td(on)
tr
t on
t off
td(off) tf
VDD
10V
VDS
RL
DUT
RG
VGS
VGS
VDS
10%
90%
td(on)
tr
t on
t off
td(off) tf
VDD
10V
VDS
RL
DUT
RG
VGS
EAS = L IAS
2----
2
1
--------------------
BVDSS - VDD
BVDSS
VDD
VDS
BVDSS
t p
VDD
IAS
VDS (t)
ID (t)
Time
10V DUT
RG
L
I D
t p
EAS = L IAS
2----
2
1
EAS = L IAS
2----
2
1
----
2
1
--------------------
BVDSS - VDD
BVDSS
VDD
VDS
BVDSS
t p
VDD
IAS
VDS (t)
ID (t)
Time
10V DUT
RG
LL
I DI D
t p

7. Rev. A, September 2003©2003 Fairchild Semiconductor Corporation
FQP2N60C/FQPF2N60C
Peak Diode Recovery dv/dt Test Circuit & Waveforms
DUT
VDS
+
_
Driver
RG
Same Type
as DUT
VGS • dv/dt controlled by RG
• ISD controlled by pulse period
VDD
L
I SD
10V
VGS
( Driver )
I SD
( DUT )
VDS
( DUT )
VDD
Body Diode
Forward Voltage Drop
VSD
IFM , Body Diode Forward Current
Body Diode Reverse Current
IRM
Body Diode Recovery dv/dt
di/dt
D =
Gate Pulse Width
Gate Pulse Period
--------------------------
DUT
VDS
+
_
Driver
RG
Same Type
as DUT
VGS • dv/dt controlled by RG
• ISD controlled by pulse period
VDD
LL
I SD
10V
VGS
( Driver )
I SD
( DUT )
VDS
( DUT )
VDD
Body Diode
Forward Voltage Drop
VSD
IFM , Body Diode Forward Current
Body Diode Reverse Current
IRM
Body Diode Recovery dv/dt
di/dt
D =
Gate Pulse Width
Gate Pulse Period
--------------------------D =
Gate Pulse Width
Gate Pulse Period
--------------------------

8. Rev. A, September 2003©2003 Fairchild Semiconductor Corporation
FQP2N60C/FQPF2N60C
Package Dimensions
4.50 ±0.209.90 ±0.20
1.52 ±0.10
0.80 ±0.10
2.40 ±0.20
10.00 ±0.20
1.27 ±0.10
ø3.60 ±0.10
(8.70)
2.80±0.1015.90±0.20
10.08±0.3018.95MAX.
(1.70)
(3.70)(3.00)
(1.46)
(1.00)
(45°)
9.20±0.2013.08±0.20
1.30±0.10
1.30
+0.10
–0.05
0.50
+0.10
–0.05
2.54TYP
[2.54 ±0.20]
2.54TYP
[2.54 ±0.20]
TO-220
Dimensions in Millimeters

9. Rev. A, September 2003©2003 Fairchild Semiconductor Corporation
FQP2N60C/FQPF2N60C
Package Dimensions (Continued)
(7.00) (0.70)
MAX1.47
(30°)
#1
3.30±0.1015.80±0.20
15.87±0.20
6.68±0.20
9.75±0.30
4.70±0.20
10.16 ±0.20
(1.00x45°)
2.54 ±0.20
0.80 ±0.10
9.40 ±0.20
2.76 ±0.20
0.35 ±0.10
ø3.18 ±0.10
2.54TYP
[2.54 ±0.20]
2.54TYP
[2.54 ±0.20]
0.50
+0.10
–0.05
TO-220F
Dimensions in Millimeters

10. ©2003 Fairchild Semiconductor Corporation
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY
PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY
LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN;
NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR
CORPORATION.
As used herein:
1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the body,
or (b) support or sustain life, or (c) whose failure to perform
when properly used in accordance with instructions for use
provided in the labeling, can be reasonably expected to
result in significant injury to the user.
2. A critical component is any component of a life support
device or system whose failure to perform can be
reasonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.
PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification Product Status Definition
Advance Information Formative or In
Design
This datasheet contains the design specifications for
product development. Specifications may change in
any manner without notice.
Preliminary First Production This datasheet contains preliminary data, and
supplementary data will be published at a later date.
Fairchild Semiconductor reserves the right to make
changes at any time without notice in order to improve
design.
No Identification Needed Full Production This datasheet contains final specifications. Fairchild
Semiconductor reserves the right to make changes at
any time without notice in order to improve design.
Obsolete Not In Production This datasheet contains specifications on a product
that has been discontinued by Fairchild semiconductor.
The datasheet is printed for reference information only.
Rev. I5
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