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Design of low power preamplifier IC for cochlear implant using split folded
cascode technique
Article in Microsystem Technologies · September 2021
DOI: 10.1007/s00542-020-05158-0
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TECHNICAL PAPER
Design of low power preamplifier IC for cochlear implant using split
folded cascode technique
Sourav Nath1 • N. M. Laskar1 • Swagata Devi1 • Koushik Guha1 • K. L. Baishnab1 • Jacopo Iannacci2
Received: 23 November 2020 / Accepted: 27 November 2020
Ó The Author(s), under exclusive licence to Springer-Verlag GmbH, DE part of Springer Nature 2021
Abstract
According to the WHO (World Health Organization) report, out of 360 million people, i.e. over 5% of world population,
have a disabling hearing loss. Designing a low-cost cochlear implant for hearing aid device is therefore of great impor-
tance. The overall cochlear system consists of several blocks, namely, the microphone for sensing the sound waves, the
preamplifier for boosting the signal level and the signal processing unit to generate electrical pulses for the electrode to
stimulate the auditory nerve. In this paper, we address the design of the High-gain Low Power Preamplifier block for
cochlear implants, as it plays a crucial role for the incoming signal to be further processed. In particular, a new technique
named Split Folded Cascode (SFC) for designing the Operational Transconductance Amplifier (OTA) is proposed. This
arrangement enhances the performance of normal cascode solutions. This technique splits the current in two different
branches and increases the overall transconductance by 1.414 times. Simulations and post layout analysis have been carried
out for the proposed preamplifier in Cadence Virtuoso using Semi-Conductor Laboratory (SCL) 180 nm technology
parameters. In this proposed design a mid-band gain of 43.7 dB, bandwidth of 18–20 kHz and noise 473.47 nV/HHz at
4 kHz are obtained.
1 Introduction
With growing advancement in technology, the design of
portable electronics systems in biomedical applications has
become a challenge for the developers. The designed sys-
tem must meet some critical specification requirements, so
that it can give accurate and precise reading for biomedical
tests and other applications. Among various biomedical
systems, cochlear implants design has attracted various
researchers. A cochlear implant is a device that stimulates
the cochlear nerve. The implant has external and internal
parts. The external part picks up sounds with a microphone.
It then processes the sound and transmits it to the internal
part of the implant. The incoming signals from the
microphone are first boosted up by using a preamplifier,
and then feed the Analog to Digital Converter (ADC) to
convert the signal in digital form to process further. These
small components collectively form an Analog Front End
(AFE). For better understanding, a complete overall block
diagram of a cochlear system is shown in Fig. 1. An AFE is
a set of analogue signal conditioning circuitry that uses
sensitive analogue amplifiers, filters and other circuits to
provide a reconfigurable and flexible electronics functional
block, to interface a variety of sensors to ADC or micro-
controller. Low-power AFEs are enabling many emerging
applications, particularly in the healthcare field, ranging
from speech processing systems to biomedical wearable
devices. Additionally, AFE power consumption has
become a significant part of the systems power budget. So,
designing a power efficient AFE is of utmost importance
and to design an optimised preamplifier for AFE is also
& Jacopo Iannacci
iannacci@fbk.eu
Sourav Nath
nathsourav945@gmail.com
N. M. Laskar
naushad.0015@gmail.com
Swagata Devi
swagatadevi90@gmail.com
Koushik Guha
koushikguha2009@gmail.com
K. L. Baishnab
klbaishnab@gmail.com
1
National Institute of Technology Silchar, Assam 788010,
India
2
Center for Materials and Microsystems, Fondazione Bruno
Kessler (FBK), Via Sommarive, 18, 38123 Trento, Italy
123
Microsystem Technologies
https://doi.org/10.1007/s00542-020-05158-0(0123456789().,-volV)
(0123456789().
,- volV)
important. The main challenge is to overcome the noise-
power trade off in designing the preamplifier. Many works
have been reported in literature for what concerns design-
ing an optimised preamplifier block. A relevant contribu-
tion is that by Ryoo et al. (2016), which involves designing
a charge amplifier and a programmable gain amplifier with
feedback from the ADC to adjust the gain. However, large
array of capacitors is present in the design, which con-
sumes a large area. The SNR (Signal to Noise Ration)
achieved is lower and the circuit consumes high power.
(Ryoo et al. 2016). Bandwidth adaptive technique is also
used to optimise the power consumption. Depending upon
the input signal, certain bandwidth is selected by band-
width extraction block attached with the preamplifier.
Nonetheless, the circuit complexity is high and as a
result, it consumes large chip area (Du and odame 2013). In
some works, chopper-based techniques are introduced to
reduce the flicker noise modulation and demodulation cir-
cuitry is used, which is termed as chopper circuit. PMOS
input based folded cascode amplifier is used for amplifi-
cation. The circuit complexity is mainly due to 4th order
filter. The two 2nd order filters along with the Common
Mode Feedback (CMFB) circuit make it bulky and the
power consumption is also relevant (Uma et al. 2018). In
some works, Micro-Electro-Mechanical Systems (MEMS)
varactors are used as off chip capacitors to reduce the chip
area as well as the flicker noise (Iannacci 2018, 2017;
Tazzoli et al. 2009; Persano et al. 2016). The gain of the
preamplifier is slightly enhanced as compared to other
reported works (Oh et al. 2017). In some other literature
items, a combined gain-controlled circuit is proposed. The
design employs a MOS-Resistive Feedback structure and a
gain control unit to achieve high accuracy and dynamic
range. However, noise performance is low and it has also
low output swing (Kim et al. 2014). In most of the works it
is observed that they use the capacitive feedback topology
rather than the open loop one, although open loop tech-
nique offers lower area and power consumption. This is
because open loop topology results in a higher input
referred noise, which is an important design criterion for
preamplifiers. In this paper, the design of the preamplifier
block for cochlear implants has been targeted. A high
swing folded cascode with current scaling technology is
used rather than standard folded cascode solutions. Con-
ventional folded cascode has low output swing as well as
high power consumption. In order to get better perfor-
mance in terms of gain, output swing as well as low noise
and relatively low power, a modified structure starting from
a conventional folded cascode is used. Here the input
transistors are used as PMOS transistors, as it is more
immune to noise (Razavi 2002). The folded cascode pairs
are split in the proposed design with equal aspect ratio, and
as such, the effective transconductance (gm) of the input
pair is increased by 1.414 times. Current scaling resistor is
used to get low noise. A diode-connected cascode MOS
current mirror is used to provide high output swing. Instead
of a normal current mirror load, a cascode current mirror
one is used to get high Rout at the output, as well as to get
high gain.
The proposed preamplifier simulations have been per-
formed in Cadence Virtuoso using SCL 180 nm technology
parameters. The post-layout analysis for the proposed
design has also been performed, which indicates a close
agreement with pre-layout simulations. Finally, the tape-
out of the Amplifier has been designed. Simulation results
reveal that the proposed amplifier yielded a high mid-band
gain of 43.5 dB with a -3 dB bandwidth of 20 kHz, which
is suitable for cochlear implant device. The amplifier input-
referred noise has been found to be 368 nV while con-
suming 4.47 lW of power from a 1.8 V supply.
1.1 Preamplifier design
In this section, the proposed amplifier is discussed in detail.
The overall schematic of the closed loop preamplifier is
shown below in Fig. 2. The topology is the same as pro-
posed in Ryoo et al. (2016), which exploits the capacitive
Fig. 1 Overall block diagram of a cochlear system
Fig. 2 Overall schematic of closed loop preamplifier
Microsystem Technologies
123
feedback and Cin, Cf are used to control the gain. The
topology is slightly modified here. Instead of passive single
resistor, Mf1 and Mf2 are used as pseudo-resistors, realised
in diode connected mode that aids to get better flexibility in
controlling the cut-off frequency. The series capacitance
along with the input source are used to realise the Micro-
phone (Ryoo et al. 2016). Vref is used as biasing voltage.
The mid band gain is controlled by the ratio of Cin/Cf,
which is approximately found to be 43.5 dB with input
capacitance Cin= 20 pF and Cf = 120 fF. The Cin is actually
used as AC coupling capacitor to cancel the DC offset and
Cf is the feedback capacitance. The block diagram of the
proposed system is shown in Fig. 2. Within the schematic
in Fig. 3, Cp models the parasitic gate capacitances at the
input, while Gm and Ro are used to model the OTA
transconductance and output impedance. Moreover, Rp is
used to realize the overall resistance offered by the series
pseudo-resistors and CL is the load capacitance, the com-
bination of which controls the cut-off frequency of the
overall amplifier. From the block diagram, the overall
transfer function is given by Eq. (1).
H s
ð Þ ¼
voutðsÞ
vinðsÞ
¼ 
Cin
Cf

sRPCL
1 þ sRPCL
ð1Þ
The mid-band gain of the amplifier is given by Eq. (2)
Av ¼ 
Cin
Cf
ð2Þ
The input-referred noise of the gain stage of the OTA
can be related to the input-referred noise of the overall
amplifier, as it is shown in Eq. (3)

vn,amp2
¼
Cin þ Cf þ Cp;in
Cin
 2
 
vn2
ð3Þ
where, vn;amp
2
is the input-referred noise of the amplifier
and vn
2
is the input referred noise of the OTA.
1.2 Split folded cascode (SFC) OTA design
For designing the 1st stage of the proposed preamplifier,
Folded Cascode OTA topology has been used as it allows
reduced supply margins and is a self-compensating one
(Razavi 2002). The design uses a normal folded cascode
structure with split input transistor and the folded transistor
set to the same aspect ratio. The idea of doing this is to split
the current in two different branches and to increase the
overall transconductance of the amplifier. This arrange-
ment helps to use low bias current to get sufficient gain,
which results in low power consumption. In Fig. 4 the split
folded cascode is shown. The arrangement and mathe-
matical proof are stated below. The proposed schematic
circuit diagram is shown in Fig. 5. Here the input transistor
M1a, M1b, M2a, M2b are split, i.e. instead of one, a pair of
transistors are connected, similarly to complement the
splitting, a pair of folded transistors is also connected as
M5a, M5b, M6a, and M6b. As a result of splitting with
lower aspect ratio, the same performance is achieved,
which in turn helps in reducing the area as well as the
parasitic resistance and capacitance in the backend design.
As it can be seen, source degenerated current sources are
employed as in Laskar et al. (2018), rather than normal
current sources, which provides a significant improvement
in noise performance as compared to a conventional Folded
Cascode OTA. Resistance R2, R3, R4, R5 are connected to
scale the current. They are configured to draw less current
through, therefore leading to lower noise (Laskar et al.
2018).
Here the cascode current mirror load is used instead of
normal current mirror to enhance the gain. One extra
transistor is being used, i.e. M13, to give high swing out-
put, as we know folded cascode has low output swing
(Laskar et al. 2018). In Table 1 all the design parameters
are listed after calculation.
Fig. 3 Block diagram of the
proposed system (Laskar et al.
2018)
Microsystem Technologies
123
Fig. 4 a Normal folded cascode
b Split folded cascode (SFC)
Fig. 5 Circuit diagram of
proposed OTA
Table 1 Parameter values used
in design
Parameter Value
VDD 1.8 V
Ibias 490 nA
Cf 120fF
Cin 20pF
(W/L)1a = (W/L)1b = (W/L)2a = (W/L)2b 20 lm /2 lm
(W/L)3a = (W/L)3b = (W/L)4a = (W/L)4b (W/L)15 0.42 lm /8 lm
(W/L)5a = (W/L)5b = (W/L)6a = (W/L)6b 0.42 lm /0.18 lm
(W/L)7 = (W/L)8 10 lm /5 lm
(W/L)9 = (W/L)10 5 lm /5 lm
(W/L)13 2 lm /0.18 lm
(W/L)11 = (W/L)12=(W/L)14 14 lm / 10 lm
Microsystem Technologies
123
1.3 Small signal modelling
Under the assumption of neglecting the body effect, the
complete small signal analysis is performed. This is done
because the body terminal of the PMOS is connected
directly to the positive terminal of the power supply and the
body of the NMOS is connected directly to the ground. The
small signal diagram of the proposed circuit is shown
below in Fig. 6 considering the half circuit method.
Small signal transconductance.
The small signal transconductance is an important
parameter to be determined. The overall transconductance
is calculated from the Fig. 6 shown below.
Referring to the schematic in Fig. 6,
R8 ¼ ðð gm3br03b
ð Þ k R4Þ k r01aÞ ð4Þ
R9 ¼ gm6ar06a ð5Þ
R6 ¼ ðð gm4br04b
ð Þ k R5Þ k r01bÞ ð6Þ
R7 ¼ gm6br06b ð7Þ
Iout ¼ Iout1 þ Iout2 ð8Þ
Moreover, Iout1 ¼ Iout2, R6 ¼ R8andR9 ¼ R7: Since all
the aspect ratios of the transistor are the same, the resis-
tance value of R4 and R5 are the same, as well. Hence from
Eq. (8)
Iout ¼ 2Iout1 ¼ 2Iout2 ð9Þ
After solving the small signal model, the overall
transconductance Gm can be written as:
Gm ¼
2gm1a
1 þ R9
R8
gm1a
1 þ R9
R8
¼
gm1b
1 þ R7
R6
ð10Þ
Replacing the values of R9, and R8 in Eq. (10)
Gm ¼
2gm1a
1 þ gm6ar06a
ðð gm3br03b
ð ÞkR4Þkr01aÞ
ð11Þ
1.4 Small signal output resistance
The output resistance is the parallel combination of the
current mirror load with parallel combination of input
transistor and the source degeneration resistor. Equa-
tion (12) shown below is the total output resistance
Rout ¼ ðgm8
ro8ro10Þ k ð gm6a
ro6aro1a
 
k ðro3b k R4Þ
 
k ð gm6b
ro6bro1b
 
k ðro4b k R5ÞÞÞ ð12Þ
1.5 Small signal gain
The small signal gain of the proposed preamplifier is given
by the product of the obtained transconductance and the
output resistance calculated. Equation (13) shown below
gives the gain of the amplifier:
Av ¼ Gm  Rout
Av ¼
2gm1a
1 þ gm6ar06a
ðð gm3br03b
ð ÞkR4Þkr01aÞ
ðgm8
ro8ro10Þ
k ð gm6a
ro6aro1a
 
k ðro3b k R4Þ
 
k ð gm6b
ro6bro1b
 
k ðro4b k R5ÞÞÞ
ð13Þ
1.6 Noise analysis
The main source of noise, as shown in Fig. 2, is given by
the contribution by all non-cascode transistors, as the
cascode transistors do not contribute to noise (Razavi
2002). The total noise analysis is done by considering half
circuit, as the circuit is symmetric. Then the final expres-
sion of noise is obtained by multiplying the half circuit
noise by two. Therefore, the main contributing component
for noise is the differential pair input transistors M1a, M1b,
the resistors R4 and R5, the current mirror transistors M9
and M10, and the high swing active resistor M13. The
overall noise of the amplifier would then be the integration
of the OTA noise over the amplifier noise bandwidth. The
total noise for any circuit is given by the contribution of
thermal noise, which is due to random motion of charge
Fig. 6 Small signal model
Microsystem Technologies
123
carriers (Razavi 2002), and flicker noise due to trapping of
charge carriers at the gate. The flicker noise is the dominant
noise in case of low frequencies. The thermal noise is
shown in Eq. (14) and the flicker noise is shown in
Eq. (13). The overall input referred noise for the proposed
OTA is shown in Eq. (17).
In the equations below,
gm1 ¼ gm1a¼gm1b; 2gm1 ¼ gm1a þ gm1b
Similarly, gm2 ¼ gm2a¼gm2b; 2gm2 ¼ gm2a þ gm2b;
gm3 ¼ gm3a¼gm3b; 2gm3 ¼ gm3a þ gm3b
gm4 ¼ gm4a¼gm4b; 2gm4 ¼ gm4a þ gm4b
Moreover, as known: gm ¼
ffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffi
2lnCox
W
L
q
ID
Bearing this in mind, the mentioned equations are for-
mulated as follows:
I2
n;Thermal ¼ 4KT
4gm1
3
þ
4gm2
3
þ
4gm3
3
þ
4gm4
3
þ
2gm13
3

þ
4gm9
3
þ
1
R2
þ
1
R3
þ
1
R4
þ
1
R5
Þð14Þ
ð14Þ
I2
n;Flicker ¼
Kp
Coxf
2gm1
2
W1L1
þ
2gm2
2
W2L2
þ
2KNgm3
2
KpW3L3
þ
gm13
2
W13L13
þ
2gm9
2
W9L9
 
15
ð Þ
ð15Þ
V2
n;Total ¼ ðI2
n;Thermal þ I2
n;FlickerÞ  Rout
2
ð16Þ
2 Results and discussions
For validating the performance of the proposed preampli-
fier, simulations have been carried out in Cadence Virtuoso
using SCL 180 nm technology parameters, and setting the
design parameters as previously shown in Table 1. The
post-layout analysis of the design was performed and
results indicate very low deviation as compared to pre-
layout, which further validates the consistency of the per-
formance of the proposed preamplifier for the said appli-
cation. It can be observed that the proposed preamplifier
shows a very good mid-band gain of around 43.7 dB at the
-3 dB cut-off frequencies of 18 Hz (lower) and 20 kHz
(upper) (see Fig. 7). It can be inferred that at low fre-
quencies the flicker noise significantly dominates the noise,
which decreases with the increase in frequency. After the
corner frequency, there is a flat frequency response indi-
cating that the noise is dominated by thermal noise (see
Fig. 8). Finally, the power dissipation plot in Fig. 9 shows
a very low deviation in power dissipation from 4.6 lW to
4.63 lW after the post-layout analysis has been performed,
thereby indicating the negligible impact of parasitic
capacitances on the overall load of the amplifier. The
results are listed in Table 2 showing some deviation,
however limited to less than 2% and the results are in close
agreement, thereby validating the consistency in the per-
formance of the proposed amplifier. The comparative
Fig. 7 Post layout simulation of
gain
V2
n;TotalInputRefered ¼
1
Gm
2
½4KT
4gm1
3
þ
4gm2
3
þ
4gm3
3
þ
4gm4
3
þ
2gm13
3
þ
4gm9
3
þ
1
R2
þ
1
R3
þ
1
R4
þ
1
R5
 
þ
Kp
Coxf
2gm1
2
W1L1
þ
2gm2
2
W2L2
þ
2KNgm3
2
KpW3L3
þ
gm13
2
W13L13
þ
2gm9
2
W9L9
 
 ð17Þ
Microsystem Technologies
123
analysis of the proposed amplifier with some other state of
art designs (Ryoo et al. 2016; Croce et al. 2016; Du and
odame 2013; Uma et al. 2018; Oh et al. 2017; Kim et al.
2014) is shown in Table 3. The power dissipation of the
proposed preamplifier has also been found to be very low,
maintaining the audio bandwidth having a value around
4.7 lW. Thus, the proposed amplifier gives better perfor-
mance in terms of an improved mid-band gain, higher
bandwidth and a comparable noise and power dissipation
as compared to the present state of the art design. Monte
Carlo analysis is also done to check the mean value of the
gain with respect to process variations, and the corre-
sponding output is shown in Fig. 10. From the analysis it is
found that the proposed design has mid band gain as
43.7 dB throughout the distribution. Furthermore, the
complete chip tape-out is shown in Fig. 11.
3 Conclusion
The main focus of this paper is to report a power efficient
preamplifier for cochlear implants. The design was chosen
after extensive literature survey and evaluation of the
current state of the art available design solutions. The
topology used for the preamplifier is folded cascode with
cascode current mirror load to obtain high gain. The
Fig. 8 Post layout simulation of
noise
Fig. 9 Post layout simulation of dynamic power
Table 2 Performance analysis of the preamplifier
Parameter Pre-layout Post layout Deviation %
Gain (dB) 43.8 43.7 0.22
BW (kHz) 20.8 20.6 0.96
Power (lW) 4.6 4.63 0.65
Noise (nV/HHz) 478.17 473.47 0.98
Table 3 Comparison with existing work
Year Work Parameters
Gain
(dB)
BW (Hz) Noise
(V/HHz)
Power
(W)
2016 Ryoo et al.
2016
33 400-8 k 331n 167.7u
2016 Croce et al.
(2016)
18 20-20 k NA 230u
2013 Du and odame
(2013)
20 4 k 3uV 65u
2018 Uma et al.
(2018)
17.49 NA 100n NA
2017 Oh et al. (2017) 9.6 20-20 k 7.3u NA
2005 Kim et al.
(2014)
NA 8 k 3.8u 60u
This Work 43.7 18.7–20.6 k 473.47nV 4.6u
Microsystem Technologies
123
Fig. 10 Post layout monte carlo analysis of gain
Fig. 11 Tape-out of
preamplifier
Microsystem Technologies
123
proposed design is based on the split folded cascode
technique, where the folded cascode transistors are split
with the same aspect ratio transistors to get sufficiently
high gain with low bias current. The small signal
transconductance along with gain and output resistance are
calculated and it is found that there is an improvement in
the overall transconductance and output resistance in
comparison to conventional folded cascode techniques.
However, there is a slight increment in the noise due to the
extra transistors used. We know that there is a noise power
trade-off. Therefore, for low power design, there must be
additive noise to compensate the trade-off. The overall
power consumption can be reduced by designing efficient
bias circuit. Post layout simulations of the proposed
preamplifier are performed using SCL 180 nm technology
and the tape-out of the preamplifier chip is done. The
simulation result of both the pre and post layout are shows
very low deviation.
Acknowledgement The authors are deeply grateful to the Ministry of
Information Technology, (MeitY) Govt. of India and SCL Mohali for
supporting this work by necessary grants-in-aid, EDA Tools and
technology files under the SMDP-C2SD Project.
References
Croce M, De Berti C, Crespi L, Malcovati P, Baschirotto A (2016)
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ICSENS.2016.7808720
Du D, Odame KM (2013) A bandwidth-adaptive preamplifier. IEEE J
Solid-State Circuits 48(9):2142–2153
Iannacci J (2017) RF-MEMS for high-performance and widely
reconfigurable passive components – A review with focus on
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Microsystem Technologies
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Nath2021_Article_DesignOfLowPowerPreamplifierIC.pdf

  • 1. See discussions, stats, and author profiles for this publication at: https://www.researchgate.net/publication/348161669 Design of low power preamplifier IC for cochlear implant using split folded cascode technique Article in Microsystem Technologies · September 2021 DOI: 10.1007/s00542-020-05158-0 CITATION 1 READS 170 6 authors, including: Some of the authors of this publication are also working on these related projects: MEMS-based Energy Harvesting (EH-MEMS) powering the Internet of Things (IoT) View project Fog Computing Assisted Smart-Healthcare by Maintaining EHR Security View project Sourav Nath National Institute of Technology, Silchar 27 PUBLICATIONS 129 CITATIONS SEE PROFILE Naushad Manzoor Laskar VIT University 36 PUBLICATIONS 207 CITATIONS SEE PROFILE Swagata Devi BVRIT 12 PUBLICATIONS 20 CITATIONS SEE PROFILE Koushik Guha National Institute of Technology, Silchar (An Institution of National Importance u… 242 PUBLICATIONS 1,040 CITATIONS SEE PROFILE All content following this page was uploaded by Jacopo Iannacci on 27 January 2021. The user has requested enhancement of the downloaded file.
  • 2. TECHNICAL PAPER Design of low power preamplifier IC for cochlear implant using split folded cascode technique Sourav Nath1 • N. M. Laskar1 • Swagata Devi1 • Koushik Guha1 • K. L. Baishnab1 • Jacopo Iannacci2 Received: 23 November 2020 / Accepted: 27 November 2020 Ó The Author(s), under exclusive licence to Springer-Verlag GmbH, DE part of Springer Nature 2021 Abstract According to the WHO (World Health Organization) report, out of 360 million people, i.e. over 5% of world population, have a disabling hearing loss. Designing a low-cost cochlear implant for hearing aid device is therefore of great impor- tance. The overall cochlear system consists of several blocks, namely, the microphone for sensing the sound waves, the preamplifier for boosting the signal level and the signal processing unit to generate electrical pulses for the electrode to stimulate the auditory nerve. In this paper, we address the design of the High-gain Low Power Preamplifier block for cochlear implants, as it plays a crucial role for the incoming signal to be further processed. In particular, a new technique named Split Folded Cascode (SFC) for designing the Operational Transconductance Amplifier (OTA) is proposed. This arrangement enhances the performance of normal cascode solutions. This technique splits the current in two different branches and increases the overall transconductance by 1.414 times. Simulations and post layout analysis have been carried out for the proposed preamplifier in Cadence Virtuoso using Semi-Conductor Laboratory (SCL) 180 nm technology parameters. In this proposed design a mid-band gain of 43.7 dB, bandwidth of 18–20 kHz and noise 473.47 nV/HHz at 4 kHz are obtained. 1 Introduction With growing advancement in technology, the design of portable electronics systems in biomedical applications has become a challenge for the developers. The designed sys- tem must meet some critical specification requirements, so that it can give accurate and precise reading for biomedical tests and other applications. Among various biomedical systems, cochlear implants design has attracted various researchers. A cochlear implant is a device that stimulates the cochlear nerve. The implant has external and internal parts. The external part picks up sounds with a microphone. It then processes the sound and transmits it to the internal part of the implant. The incoming signals from the microphone are first boosted up by using a preamplifier, and then feed the Analog to Digital Converter (ADC) to convert the signal in digital form to process further. These small components collectively form an Analog Front End (AFE). For better understanding, a complete overall block diagram of a cochlear system is shown in Fig. 1. An AFE is a set of analogue signal conditioning circuitry that uses sensitive analogue amplifiers, filters and other circuits to provide a reconfigurable and flexible electronics functional block, to interface a variety of sensors to ADC or micro- controller. Low-power AFEs are enabling many emerging applications, particularly in the healthcare field, ranging from speech processing systems to biomedical wearable devices. Additionally, AFE power consumption has become a significant part of the systems power budget. So, designing a power efficient AFE is of utmost importance and to design an optimised preamplifier for AFE is also & Jacopo Iannacci iannacci@fbk.eu Sourav Nath nathsourav945@gmail.com N. M. Laskar naushad.0015@gmail.com Swagata Devi swagatadevi90@gmail.com Koushik Guha koushikguha2009@gmail.com K. L. Baishnab klbaishnab@gmail.com 1 National Institute of Technology Silchar, Assam 788010, India 2 Center for Materials and Microsystems, Fondazione Bruno Kessler (FBK), Via Sommarive, 18, 38123 Trento, Italy 123 Microsystem Technologies https://doi.org/10.1007/s00542-020-05158-0(0123456789().,-volV) (0123456789(). ,- volV)
  • 3. important. The main challenge is to overcome the noise- power trade off in designing the preamplifier. Many works have been reported in literature for what concerns design- ing an optimised preamplifier block. A relevant contribu- tion is that by Ryoo et al. (2016), which involves designing a charge amplifier and a programmable gain amplifier with feedback from the ADC to adjust the gain. However, large array of capacitors is present in the design, which con- sumes a large area. The SNR (Signal to Noise Ration) achieved is lower and the circuit consumes high power. (Ryoo et al. 2016). Bandwidth adaptive technique is also used to optimise the power consumption. Depending upon the input signal, certain bandwidth is selected by band- width extraction block attached with the preamplifier. Nonetheless, the circuit complexity is high and as a result, it consumes large chip area (Du and odame 2013). In some works, chopper-based techniques are introduced to reduce the flicker noise modulation and demodulation cir- cuitry is used, which is termed as chopper circuit. PMOS input based folded cascode amplifier is used for amplifi- cation. The circuit complexity is mainly due to 4th order filter. The two 2nd order filters along with the Common Mode Feedback (CMFB) circuit make it bulky and the power consumption is also relevant (Uma et al. 2018). In some works, Micro-Electro-Mechanical Systems (MEMS) varactors are used as off chip capacitors to reduce the chip area as well as the flicker noise (Iannacci 2018, 2017; Tazzoli et al. 2009; Persano et al. 2016). The gain of the preamplifier is slightly enhanced as compared to other reported works (Oh et al. 2017). In some other literature items, a combined gain-controlled circuit is proposed. The design employs a MOS-Resistive Feedback structure and a gain control unit to achieve high accuracy and dynamic range. However, noise performance is low and it has also low output swing (Kim et al. 2014). In most of the works it is observed that they use the capacitive feedback topology rather than the open loop one, although open loop tech- nique offers lower area and power consumption. This is because open loop topology results in a higher input referred noise, which is an important design criterion for preamplifiers. In this paper, the design of the preamplifier block for cochlear implants has been targeted. A high swing folded cascode with current scaling technology is used rather than standard folded cascode solutions. Con- ventional folded cascode has low output swing as well as high power consumption. In order to get better perfor- mance in terms of gain, output swing as well as low noise and relatively low power, a modified structure starting from a conventional folded cascode is used. Here the input transistors are used as PMOS transistors, as it is more immune to noise (Razavi 2002). The folded cascode pairs are split in the proposed design with equal aspect ratio, and as such, the effective transconductance (gm) of the input pair is increased by 1.414 times. Current scaling resistor is used to get low noise. A diode-connected cascode MOS current mirror is used to provide high output swing. Instead of a normal current mirror load, a cascode current mirror one is used to get high Rout at the output, as well as to get high gain. The proposed preamplifier simulations have been per- formed in Cadence Virtuoso using SCL 180 nm technology parameters. The post-layout analysis for the proposed design has also been performed, which indicates a close agreement with pre-layout simulations. Finally, the tape- out of the Amplifier has been designed. Simulation results reveal that the proposed amplifier yielded a high mid-band gain of 43.5 dB with a -3 dB bandwidth of 20 kHz, which is suitable for cochlear implant device. The amplifier input- referred noise has been found to be 368 nV while con- suming 4.47 lW of power from a 1.8 V supply. 1.1 Preamplifier design In this section, the proposed amplifier is discussed in detail. The overall schematic of the closed loop preamplifier is shown below in Fig. 2. The topology is the same as pro- posed in Ryoo et al. (2016), which exploits the capacitive Fig. 1 Overall block diagram of a cochlear system Fig. 2 Overall schematic of closed loop preamplifier Microsystem Technologies 123
  • 4. feedback and Cin, Cf are used to control the gain. The topology is slightly modified here. Instead of passive single resistor, Mf1 and Mf2 are used as pseudo-resistors, realised in diode connected mode that aids to get better flexibility in controlling the cut-off frequency. The series capacitance along with the input source are used to realise the Micro- phone (Ryoo et al. 2016). Vref is used as biasing voltage. The mid band gain is controlled by the ratio of Cin/Cf, which is approximately found to be 43.5 dB with input capacitance Cin= 20 pF and Cf = 120 fF. The Cin is actually used as AC coupling capacitor to cancel the DC offset and Cf is the feedback capacitance. The block diagram of the proposed system is shown in Fig. 2. Within the schematic in Fig. 3, Cp models the parasitic gate capacitances at the input, while Gm and Ro are used to model the OTA transconductance and output impedance. Moreover, Rp is used to realize the overall resistance offered by the series pseudo-resistors and CL is the load capacitance, the com- bination of which controls the cut-off frequency of the overall amplifier. From the block diagram, the overall transfer function is given by Eq. (1). H s ð Þ ¼ voutðsÞ vinðsÞ ¼ Cin Cf sRPCL 1 þ sRPCL ð1Þ The mid-band gain of the amplifier is given by Eq. (2) Av ¼ Cin Cf ð2Þ The input-referred noise of the gain stage of the OTA can be related to the input-referred noise of the overall amplifier, as it is shown in Eq. (3) vn,amp2 ¼ Cin þ Cf þ Cp;in Cin 2 vn2 ð3Þ where, vn;amp 2 is the input-referred noise of the amplifier and vn 2 is the input referred noise of the OTA. 1.2 Split folded cascode (SFC) OTA design For designing the 1st stage of the proposed preamplifier, Folded Cascode OTA topology has been used as it allows reduced supply margins and is a self-compensating one (Razavi 2002). The design uses a normal folded cascode structure with split input transistor and the folded transistor set to the same aspect ratio. The idea of doing this is to split the current in two different branches and to increase the overall transconductance of the amplifier. This arrange- ment helps to use low bias current to get sufficient gain, which results in low power consumption. In Fig. 4 the split folded cascode is shown. The arrangement and mathe- matical proof are stated below. The proposed schematic circuit diagram is shown in Fig. 5. Here the input transistor M1a, M1b, M2a, M2b are split, i.e. instead of one, a pair of transistors are connected, similarly to complement the splitting, a pair of folded transistors is also connected as M5a, M5b, M6a, and M6b. As a result of splitting with lower aspect ratio, the same performance is achieved, which in turn helps in reducing the area as well as the parasitic resistance and capacitance in the backend design. As it can be seen, source degenerated current sources are employed as in Laskar et al. (2018), rather than normal current sources, which provides a significant improvement in noise performance as compared to a conventional Folded Cascode OTA. Resistance R2, R3, R4, R5 are connected to scale the current. They are configured to draw less current through, therefore leading to lower noise (Laskar et al. 2018). Here the cascode current mirror load is used instead of normal current mirror to enhance the gain. One extra transistor is being used, i.e. M13, to give high swing out- put, as we know folded cascode has low output swing (Laskar et al. 2018). In Table 1 all the design parameters are listed after calculation. Fig. 3 Block diagram of the proposed system (Laskar et al. 2018) Microsystem Technologies 123
  • 5. Fig. 4 a Normal folded cascode b Split folded cascode (SFC) Fig. 5 Circuit diagram of proposed OTA Table 1 Parameter values used in design Parameter Value VDD 1.8 V Ibias 490 nA Cf 120fF Cin 20pF (W/L)1a = (W/L)1b = (W/L)2a = (W/L)2b 20 lm /2 lm (W/L)3a = (W/L)3b = (W/L)4a = (W/L)4b (W/L)15 0.42 lm /8 lm (W/L)5a = (W/L)5b = (W/L)6a = (W/L)6b 0.42 lm /0.18 lm (W/L)7 = (W/L)8 10 lm /5 lm (W/L)9 = (W/L)10 5 lm /5 lm (W/L)13 2 lm /0.18 lm (W/L)11 = (W/L)12=(W/L)14 14 lm / 10 lm Microsystem Technologies 123
  • 6. 1.3 Small signal modelling Under the assumption of neglecting the body effect, the complete small signal analysis is performed. This is done because the body terminal of the PMOS is connected directly to the positive terminal of the power supply and the body of the NMOS is connected directly to the ground. The small signal diagram of the proposed circuit is shown below in Fig. 6 considering the half circuit method. Small signal transconductance. The small signal transconductance is an important parameter to be determined. The overall transconductance is calculated from the Fig. 6 shown below. Referring to the schematic in Fig. 6, R8 ¼ ðð gm3br03b ð Þ k R4Þ k r01aÞ ð4Þ R9 ¼ gm6ar06a ð5Þ R6 ¼ ðð gm4br04b ð Þ k R5Þ k r01bÞ ð6Þ R7 ¼ gm6br06b ð7Þ Iout ¼ Iout1 þ Iout2 ð8Þ Moreover, Iout1 ¼ Iout2, R6 ¼ R8andR9 ¼ R7: Since all the aspect ratios of the transistor are the same, the resis- tance value of R4 and R5 are the same, as well. Hence from Eq. (8) Iout ¼ 2Iout1 ¼ 2Iout2 ð9Þ After solving the small signal model, the overall transconductance Gm can be written as: Gm ¼ 2gm1a 1 þ R9 R8 gm1a 1 þ R9 R8 ¼ gm1b 1 þ R7 R6 ð10Þ Replacing the values of R9, and R8 in Eq. (10) Gm ¼ 2gm1a 1 þ gm6ar06a ðð gm3br03b ð ÞkR4Þkr01aÞ ð11Þ 1.4 Small signal output resistance The output resistance is the parallel combination of the current mirror load with parallel combination of input transistor and the source degeneration resistor. Equa- tion (12) shown below is the total output resistance Rout ¼ ðgm8 ro8ro10Þ k ð gm6a ro6aro1a k ðro3b k R4Þ k ð gm6b ro6bro1b k ðro4b k R5ÞÞÞ ð12Þ 1.5 Small signal gain The small signal gain of the proposed preamplifier is given by the product of the obtained transconductance and the output resistance calculated. Equation (13) shown below gives the gain of the amplifier: Av ¼ Gm Rout Av ¼ 2gm1a 1 þ gm6ar06a ðð gm3br03b ð ÞkR4Þkr01aÞ ðgm8 ro8ro10Þ k ð gm6a ro6aro1a k ðro3b k R4Þ k ð gm6b ro6bro1b k ðro4b k R5ÞÞÞ ð13Þ 1.6 Noise analysis The main source of noise, as shown in Fig. 2, is given by the contribution by all non-cascode transistors, as the cascode transistors do not contribute to noise (Razavi 2002). The total noise analysis is done by considering half circuit, as the circuit is symmetric. Then the final expres- sion of noise is obtained by multiplying the half circuit noise by two. Therefore, the main contributing component for noise is the differential pair input transistors M1a, M1b, the resistors R4 and R5, the current mirror transistors M9 and M10, and the high swing active resistor M13. The overall noise of the amplifier would then be the integration of the OTA noise over the amplifier noise bandwidth. The total noise for any circuit is given by the contribution of thermal noise, which is due to random motion of charge Fig. 6 Small signal model Microsystem Technologies 123
  • 7. carriers (Razavi 2002), and flicker noise due to trapping of charge carriers at the gate. The flicker noise is the dominant noise in case of low frequencies. The thermal noise is shown in Eq. (14) and the flicker noise is shown in Eq. (13). The overall input referred noise for the proposed OTA is shown in Eq. (17). In the equations below, gm1 ¼ gm1a¼gm1b; 2gm1 ¼ gm1a þ gm1b Similarly, gm2 ¼ gm2a¼gm2b; 2gm2 ¼ gm2a þ gm2b; gm3 ¼ gm3a¼gm3b; 2gm3 ¼ gm3a þ gm3b gm4 ¼ gm4a¼gm4b; 2gm4 ¼ gm4a þ gm4b Moreover, as known: gm ¼ ffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffiffi 2lnCox W L q ID Bearing this in mind, the mentioned equations are for- mulated as follows: I2 n;Thermal ¼ 4KT 4gm1 3 þ 4gm2 3 þ 4gm3 3 þ 4gm4 3 þ 2gm13 3 þ 4gm9 3 þ 1 R2 þ 1 R3 þ 1 R4 þ 1 R5 Þð14Þ ð14Þ I2 n;Flicker ¼ Kp Coxf 2gm1 2 W1L1 þ 2gm2 2 W2L2 þ 2KNgm3 2 KpW3L3 þ gm13 2 W13L13 þ 2gm9 2 W9L9 15 ð Þ ð15Þ V2 n;Total ¼ ðI2 n;Thermal þ I2 n;FlickerÞ Rout 2 ð16Þ 2 Results and discussions For validating the performance of the proposed preampli- fier, simulations have been carried out in Cadence Virtuoso using SCL 180 nm technology parameters, and setting the design parameters as previously shown in Table 1. The post-layout analysis of the design was performed and results indicate very low deviation as compared to pre- layout, which further validates the consistency of the per- formance of the proposed preamplifier for the said appli- cation. It can be observed that the proposed preamplifier shows a very good mid-band gain of around 43.7 dB at the -3 dB cut-off frequencies of 18 Hz (lower) and 20 kHz (upper) (see Fig. 7). It can be inferred that at low fre- quencies the flicker noise significantly dominates the noise, which decreases with the increase in frequency. After the corner frequency, there is a flat frequency response indi- cating that the noise is dominated by thermal noise (see Fig. 8). Finally, the power dissipation plot in Fig. 9 shows a very low deviation in power dissipation from 4.6 lW to 4.63 lW after the post-layout analysis has been performed, thereby indicating the negligible impact of parasitic capacitances on the overall load of the amplifier. The results are listed in Table 2 showing some deviation, however limited to less than 2% and the results are in close agreement, thereby validating the consistency in the per- formance of the proposed amplifier. The comparative Fig. 7 Post layout simulation of gain V2 n;TotalInputRefered ¼ 1 Gm 2 ½4KT 4gm1 3 þ 4gm2 3 þ 4gm3 3 þ 4gm4 3 þ 2gm13 3 þ 4gm9 3 þ 1 R2 þ 1 R3 þ 1 R4 þ 1 R5 þ Kp Coxf 2gm1 2 W1L1 þ 2gm2 2 W2L2 þ 2KNgm3 2 KpW3L3 þ gm13 2 W13L13 þ 2gm9 2 W9L9 ð17Þ Microsystem Technologies 123
  • 8. analysis of the proposed amplifier with some other state of art designs (Ryoo et al. 2016; Croce et al. 2016; Du and odame 2013; Uma et al. 2018; Oh et al. 2017; Kim et al. 2014) is shown in Table 3. The power dissipation of the proposed preamplifier has also been found to be very low, maintaining the audio bandwidth having a value around 4.7 lW. Thus, the proposed amplifier gives better perfor- mance in terms of an improved mid-band gain, higher bandwidth and a comparable noise and power dissipation as compared to the present state of the art design. Monte Carlo analysis is also done to check the mean value of the gain with respect to process variations, and the corre- sponding output is shown in Fig. 10. From the analysis it is found that the proposed design has mid band gain as 43.7 dB throughout the distribution. Furthermore, the complete chip tape-out is shown in Fig. 11. 3 Conclusion The main focus of this paper is to report a power efficient preamplifier for cochlear implants. The design was chosen after extensive literature survey and evaluation of the current state of the art available design solutions. The topology used for the preamplifier is folded cascode with cascode current mirror load to obtain high gain. The Fig. 8 Post layout simulation of noise Fig. 9 Post layout simulation of dynamic power Table 2 Performance analysis of the preamplifier Parameter Pre-layout Post layout Deviation % Gain (dB) 43.8 43.7 0.22 BW (kHz) 20.8 20.6 0.96 Power (lW) 4.6 4.63 0.65 Noise (nV/HHz) 478.17 473.47 0.98 Table 3 Comparison with existing work Year Work Parameters Gain (dB) BW (Hz) Noise (V/HHz) Power (W) 2016 Ryoo et al. 2016 33 400-8 k 331n 167.7u 2016 Croce et al. (2016) 18 20-20 k NA 230u 2013 Du and odame (2013) 20 4 k 3uV 65u 2018 Uma et al. (2018) 17.49 NA 100n NA 2017 Oh et al. (2017) 9.6 20-20 k 7.3u NA 2005 Kim et al. (2014) NA 8 k 3.8u 60u This Work 43.7 18.7–20.6 k 473.47nV 4.6u Microsystem Technologies 123
  • 9. Fig. 10 Post layout monte carlo analysis of gain Fig. 11 Tape-out of preamplifier Microsystem Technologies 123
  • 10. proposed design is based on the split folded cascode technique, where the folded cascode transistors are split with the same aspect ratio transistors to get sufficiently high gain with low bias current. The small signal transconductance along with gain and output resistance are calculated and it is found that there is an improvement in the overall transconductance and output resistance in comparison to conventional folded cascode techniques. However, there is a slight increment in the noise due to the extra transistors used. We know that there is a noise power trade-off. Therefore, for low power design, there must be additive noise to compensate the trade-off. The overall power consumption can be reduced by designing efficient bias circuit. Post layout simulations of the proposed preamplifier are performed using SCL 180 nm technology and the tape-out of the preamplifier chip is done. The simulation result of both the pre and post layout are shows very low deviation. Acknowledgement The authors are deeply grateful to the Ministry of Information Technology, (MeitY) Govt. of India and SCL Mohali for supporting this work by necessary grants-in-aid, EDA Tools and technology files under the SMDP-C2SD Project. References Croce M, De Berti C, Crespi L, Malcovati P, Baschirotto A (2016) ‘‘Cap-less audio preamplifiers for silicon microphones,’’ IEEE Sensors, Orlando, FL, 2016, pp. 1–3. https://doi.org/10.1109/ ICSENS.2016.7808720 Du D, Odame KM (2013) A bandwidth-adaptive preamplifier. IEEE J Solid-State Circuits 48(9):2142–2153 Iannacci J (2017) RF-MEMS for high-performance and widely reconfigurable passive components – A review with focus on future telecommunications, Internet of Things (IoT) and 5G applications. Elsevier J King Saud University Sci 29(4):436–443. https://doi.org/10.1016/j.jksus.2017.06.011 Iannacci J (2018) RF-MEMS technology as an enabler of 5G: Low- loss ohmic switch tested up to 110 GHz. Elsevier Sensors Actuators A Phys 279:624–629. https://doi.org/10.1016/j.sna. 2018.07.005 Kim HS, Baek KJ, Lee DH, Kim YS, Na KY (2014) OPAMP Design Using Optimized Self-Cascode Structures. Trans Electrical Electron Mater 15(3):149–154 Laskar NM, Guha K, Nath S, Chanda S, Baishnab KL, Paul PK, Rao KS (2018) Design of high gain, high bandwidth neural amplifier IC considering noise-power trade-off. Microsystem Technolo- gies, 1–15 Oh S, Jang T, Choo KD, Blaauw D, Sylvester D (2017) A 4.7 lW switched-bias MEMS microphone preamplifier for ultra-low- power voice interfaces. In 2017 Symposium on VLSI Cir- cuits (pp. C314-C315). IEEE Persano A et al (2016) Influence of design and fabrication on RF performance of capacitive RF MEMS switches. Springer Microsyst Technol 22:1741–1746. https://doi.org/10.1007/ s00542-016-2829-z Razavi B (2002) Design of Analog CMOS-Integrated Circuits. McGraw Hill Education (India), New Delhi Ryoo K, Chilukuri M, Jung S (2016) A low power and low noise preamplifier circuit for hearing aid devices. In 2016 IEEE Dallas Circuits and Systems Conference (DCAS) (pp. 1–4). IEEE Tazzoli A et al (2009) ‘‘Evolution of electrical parameters of dielectric-less ohmic RF-MEMS switches during continuous actuation stress,’’ Proc. European Solid State Device Research Conference (ESSDERC), pp. 343–346, 2009 https://doi.org/10. 1109/ESSDERC.2009.5331307 Uma A, Selva Gangai C, Kalpana P (2018) Design of chopper stabilized preamplifier for ECG monitoring system. In 2018 4th International Conference on Devices, Circuits and Systems (ICDCS) (pp. 126–129). IEEE Publisher’s Note Springer Nature remains neutral with regard to jurisdictional claims in published maps and institutional affiliations. Microsystem Technologies 123 View publication stats