The importance of creating scalable, powerful, and efficient data centers continues to increase, and many designs are based on assembling the data center from modules. We present our design and prototype for a scalable, low-cost network for modular data centers that leverages commodity 10Gbps Light Peak technology. However, these modular designs depend critically on having a low-cost, high bandwidth network to connect the servers inside each module and connect the modules together. We present our design and prototype for a scalable, low-cost network for modular data centers that leverages commodity 10Gbps “Light Peak technology”.

1. LIGHT PEAK TECHNOLOGY
PRESENTED BY
SUMALATHA K PATIL
Under the Guidance of
Smt. SUNITHA R B.E., M.TECH
Asst. Professor
Department of Electronics and Communication
Engineering
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2. CONTENTS
 Objectives
 Introduction
 Light Peak Technology
 Industry Perspective
 Working
 Components Overview
 Data Transfer Speed Comparison
 Light Peak Technology v/s USB 3.0
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3. CONTD….
 Advantages
 Disadvantages
 Applications
 Conclusion
 References
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4. OBJECTIVES
 The implemented design which supports bandwidth from
10Gb/s up to 100Gb/s
 To confirms its performance, simplicity, and flexibility
 This technology is compatible with all communicating devices
 It has fast mechanism compare to USB 3.0
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5. INRODUCTION
 Light peak is the code name
for the high speed optical cable
technology
 Developed by Intel to connect
computing and consumer
electronic devices
 It allows computers to connect
peripheral devices or other
computers via an optical
connector
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6. CONTD….
 It is a high-bandwidth, inexpensive optical interconnect
technology
 Delivers bandwidth of 10Gb/s with a potential to scale to
100Gb/s
 This kind of speed are even sustained over a 100-meter distance,
which is really impressive.
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7. LIGHT PEAK TECHNOLOGY
 Light Peak is a new high-speed optical
cable technology designed to connect
electronic devices to each other in a
peripheral bus
 Light Peak will have fewer and smaller
connectors, longer and thinner cables,
higher bandwidth, and can run multiple
protocols on a single cable
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Fig.1: Light Peak Cable

8. CONTD….
 The Light Peak cable contains pairs of optical fibers that are used
for upstream and downstream traffic
 This means that Light Peak offers a same transmission data rate
in both directions at the same time
 The maximum length of the Light Peak cable is 100 meters & it
is made up of plastic layer coating for protection
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9. CONTD….
 Intel’s Light Peak chip
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Fig.1: Intel’s Light Peak Chip Fig.2: Configuration

10. WORKING
 Intel's Peak light technology interconnect a PC and other devices,
transmitting and receiving data for both PCIe and Display Ports
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Fig.3: Interfacing with I/O devices

11. CONTD….
 Peak Light cable is bidirectional.
 By this technology, users get the benefit of full bandwidth in
both directions, over a single cable
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Fig.4: Light Peak cable

12. CONTD….
 It supports plug and play option, working become easier to the
users
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Fig.5: Workstation I/O in a laptop

13. COMPONENTS OVERVIEW
 Major components in Light Peak Technology are
1) Optical Module
2) Controller Chip
3) Connector
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Fig.6: Components Overview

14. 1) OPTICAL MODULE
 An optical fiber module is also
called fiber optic transmitter and
receiver
 The role of the optical module is
photoelectric
 Optical Module is two way chip
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Fig.7: Optical Transceiver Module

15. CONTD….
 Either a light emitting diode (LED) or a laser diode is used as
the light source
 Consists of photo detectors
 In the fiber optics, information is end in the form of pulses of
the light
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16. CONTD….
 Light Source: The light source is often the most important element
of an optical communication system
 There are two types of light sources in widespread use: the Laser
Diode (LD) and the Light Emitting Diode (LEDs)
 Light Detectors: Light detectors convert an optical signal to an
electrical signal
 The most common light detector is a photodiode
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17. 2) COTROLLER CHIP
 A chipset is a set of electronic
components in an integrated
circuit.
 It manages the data flow between
the processor, memory and
peripherals
 Chipsets are usually designed to
work with a specific family of
microprocessors
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18. DATA TRANSFER SPEED COMPARISION
1) Wireless Network : The Light Peak compare with the latest
technologies, the slowest is wireless
 Wireless (802.11) can reach 160 Mb/s in the real world. Light
Peak is about 60 times faster
2) USB 3.0: USB 3.0 is rated at 4.8 Gb/s It will be only half the
speed of Light Peak
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19. LIGHT PEAK VS USB 3.0
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4 Optical Fibre Cable
Speed-10 Gb/sec
Universal
Max Cable Length-100m
9 Copper Wires
Speed-3 Gb/sec
Only USB Protocol
Max Cable Length-9m

20. ADVANTAGES
 It supports data transfer speed of 10Gbit/s over optical cable (up
to 100 metres in length)
 It connects to multiple devices at the same time
 Bi-Directional transfer of the data
 Cable length can be extended upto 100m
 Hot Pluggable
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21. DISADVANTAGES
 Light Peak technology would required complete new set of
peripheral devices to achieve its parameters
 Difficulty of transition from electric to optic & vice versa.
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22. APPLICATIONS
 Used in the industries to obtain higher data transmission rate
 Used to connect peripheral devices with computer for quick data
exchange
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23. INDUSTRY PERSPECTIVE
“Sony is excited about the potential for Light Peak technology
that has been developing, and believe it could enable a new
generation of high-speed device connectivity.”
“Nokia believes that Light Peak technology enables new wired
connectivity solutions for Mobile Computers and Smart phones,
and looks forward to working to create a global standard based
on Light Peak technology.”
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24. CONCLUSION
 LIGHT PEAK is an high speed optical i/o architecture for the
next decade and beyond
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25. REFERENCES
[1]Addagatla, Sreenivas, et al. "Direct network prototype
leveraging Light Peak technology." High Performance
Interconnects (HOTI), 2010 IEEE 18th Annual Symposium on.
IEEE, 2010.
[2] Hardy, John W. "Active optics: a new technology for the control
of light." Proceedings of the IEEE 66, no. 6 (2011): 651-697.
[3] Okuley, James M., and Kimi Jensen. "Electronic device." U.S.
Patent No. D694,748. 3 Dec. 2013.
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26. THANK YOU…… 
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27. ANY QUERIES…..?
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