The document discusses the fabrication and metallization of micro vias in LCP substrates using mechanical punching. It examines wet chemical etching techniques to address fabrication issues like burrs. Direct current plating is shown to effectively fill 75um vias with 187.5um pitch, while reverse pulse plating is ineffective. Linear correlations are observed between plating thickness and time, with direct current plating providing faster deposition than reverse pulse plating.
SYNTHESIS AND CHARACTERIZATION OF A NOVEL MATERIAL FOR HIGH TEMPERATURE RESIS...Soutam Banerjee
Synthesized Lanthanum Zirconate (LZ) powder from solid state sintering and co-precipitation techniques
Carried out the compaction of the powders to form pellets and sintering at 1600 ᴼC
XRD analysis of solid state mixing sintered pellet and the co-precipitated sintered pellet
Micro-hardness and Weibull analysis of surface and cross-section of the co-precipitated sintered pellet
Brief
1. Car catalysts and their history
− Element basis and importance
2. Handheld X-ray fluorescence (XRF) basics
− Theory
− Instrument components
3. Handheld XRF results
− Accuracy
− Precision
SYNTHESIS AND CHARACTERIZATION OF A NOVEL MATERIAL FOR HIGH TEMPERATURE RESIS...Soutam Banerjee
Synthesized Lanthanum Zirconate (LZ) powder from solid state sintering and co-precipitation techniques
Carried out the compaction of the powders to form pellets and sintering at 1600 ᴼC
XRD analysis of solid state mixing sintered pellet and the co-precipitated sintered pellet
Micro-hardness and Weibull analysis of surface and cross-section of the co-precipitated sintered pellet
Brief
1. Car catalysts and their history
− Element basis and importance
2. Handheld X-ray fluorescence (XRF) basics
− Theory
− Instrument components
3. Handheld XRF results
− Accuracy
− Precision
Graphene field-effect transistor simulation with TCAD on top-gate dielectric ...TELKOMNIKA JOURNAL
This paper presents the influence of top-gate dielectric material for graphene field-effect transistor (GFET) using TCAD simulation. Apart from silicon-based dielectric that is typically used for top-gate structure, other high-dielectric constant (high-k) dielectric materials namely aluminum oxide and hafnium oxide are also involved in the analysis deliberately to improve the electrical properties of the GFET. The unique GFET current-voltage characteristics against several top-gate dielectric thicknesses are also investigated to guide the wafer fabrication engineers during the process optimization stage. The improvement to critical electrical parameters of GFET in terms of higher saturation drain current and greater on/off current ratio shows that the use of high-k dielectric material with very thin oxide layer is absolutely necessary.
Molybdenum-on-Chromium Dual Coating on SteelDeepak Rajput
A presentation on Molybdenum-on-Chromium Dual Coating on Steel made by Deepak Rajput at the Center for Laser Applications, the University of Tennessee Space Institute.
Influence of La3+ substitution on dielectric, ferroelectric and electrocalori...Mohammad Azam
Outline
Motivation
Dielectric properties of materials
Ferroelectric and Antiferroelectric
Electrocaloric Effect (EC)
Sample preparation method
Characterization techniques
Result and Discussion
Future Work
References
Slides of my first invited talk at a conference, the ALD 2005 conference in San Jose 2005, about ALD modelling. ALD is fantastic, but fantastic is not perfect :)
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R. L. Puurunen, Atomic-scale modelling of atomic layer deposition processes, American Vacuum Society Topical Conference on Atomic Layer Deposition (ALD 2005), San Jose, California, August 8-10, 2005. Invited talk.
International Journal of Engineering Research and Applications (IJERA) is an open access online peer reviewed international journal that publishes research and review articles in the fields of Computer Science, Neural Networks, Electrical Engineering, Software Engineering, Information Technology, Mechanical Engineering, Chemical Engineering, Plastic Engineering, Food Technology, Textile Engineering, Nano Technology & science, Power Electronics, Electronics & Communication Engineering, Computational mathematics, Image processing, Civil Engineering, Structural Engineering, Environmental Engineering, VLSI Testing & Low Power VLSI Design etc.
PlasmaTech - a start-up company of the University of Pisa - presents the last ultra-pure metal nanoparticles by laser ablation for nanotechnology applications: from nanobiotechnology to advanced materials
Synthesis & Characterization of Fluorescent Silver Nanoparticles stabilized b...IJERA Editor
Synthesis of silver nanoparticles (Ag-NPs) was achieved by a simple green procedure using Tinospora Cordifolia leaf extract as stabilizer/reducing agents. Ag-NPs in the size range of 2–19 nm is obtained by the treatment of aqueous silver ions with leaf extracts of Tinospora Cordifolia. This eco-friendly approach is simple, amenable for large scale commercial production and technical applications. Further, photoluminiscence studies of these Ag-NPs were recorded & suggested that the present particles were suitable for fluorescence emitting probes. These red emitting Ag-NPs exhibited distinct fluorescence properties (both emission and stokeshift).
Graphene field-effect transistor simulation with TCAD on top-gate dielectric ...TELKOMNIKA JOURNAL
This paper presents the influence of top-gate dielectric material for graphene field-effect transistor (GFET) using TCAD simulation. Apart from silicon-based dielectric that is typically used for top-gate structure, other high-dielectric constant (high-k) dielectric materials namely aluminum oxide and hafnium oxide are also involved in the analysis deliberately to improve the electrical properties of the GFET. The unique GFET current-voltage characteristics against several top-gate dielectric thicknesses are also investigated to guide the wafer fabrication engineers during the process optimization stage. The improvement to critical electrical parameters of GFET in terms of higher saturation drain current and greater on/off current ratio shows that the use of high-k dielectric material with very thin oxide layer is absolutely necessary.
Molybdenum-on-Chromium Dual Coating on SteelDeepak Rajput
A presentation on Molybdenum-on-Chromium Dual Coating on Steel made by Deepak Rajput at the Center for Laser Applications, the University of Tennessee Space Institute.
Influence of La3+ substitution on dielectric, ferroelectric and electrocalori...Mohammad Azam
Outline
Motivation
Dielectric properties of materials
Ferroelectric and Antiferroelectric
Electrocaloric Effect (EC)
Sample preparation method
Characterization techniques
Result and Discussion
Future Work
References
Slides of my first invited talk at a conference, the ALD 2005 conference in San Jose 2005, about ALD modelling. ALD is fantastic, but fantastic is not perfect :)
---
R. L. Puurunen, Atomic-scale modelling of atomic layer deposition processes, American Vacuum Society Topical Conference on Atomic Layer Deposition (ALD 2005), San Jose, California, August 8-10, 2005. Invited talk.
International Journal of Engineering Research and Applications (IJERA) is an open access online peer reviewed international journal that publishes research and review articles in the fields of Computer Science, Neural Networks, Electrical Engineering, Software Engineering, Information Technology, Mechanical Engineering, Chemical Engineering, Plastic Engineering, Food Technology, Textile Engineering, Nano Technology & science, Power Electronics, Electronics & Communication Engineering, Computational mathematics, Image processing, Civil Engineering, Structural Engineering, Environmental Engineering, VLSI Testing & Low Power VLSI Design etc.
PlasmaTech - a start-up company of the University of Pisa - presents the last ultra-pure metal nanoparticles by laser ablation for nanotechnology applications: from nanobiotechnology to advanced materials
Synthesis & Characterization of Fluorescent Silver Nanoparticles stabilized b...IJERA Editor
Synthesis of silver nanoparticles (Ag-NPs) was achieved by a simple green procedure using Tinospora Cordifolia leaf extract as stabilizer/reducing agents. Ag-NPs in the size range of 2–19 nm is obtained by the treatment of aqueous silver ions with leaf extracts of Tinospora Cordifolia. This eco-friendly approach is simple, amenable for large scale commercial production and technical applications. Further, photoluminiscence studies of these Ag-NPs were recorded & suggested that the present particles were suitable for fluorescence emitting probes. These red emitting Ag-NPs exhibited distinct fluorescence properties (both emission and stokeshift).
International Journal of Engineering and Science Invention (IJESI)inventionjournals
International Journal of Engineering and Science Invention (IJESI) is an international journal intended for professionals and researchers in all fields of computer science and electronics. IJESI publishes research articles and reviews within the whole field Engineering Science and Technology, new teaching methods, assessment, validation and the impact of new technologies and it will continue to provide information on the latest trends and developments in this ever-expanding subject. The publications of papers are selected through double peer reviewed to ensure originality, relevance, and readability. The articles published in our journal can be accessed online.
http://www.surfacetreatments.it/thinfilms
Plasma Etching of Niobium surfaces: Studies on samples and Single-Cell Cavities (AnneMarie Valente - 30')
Speaker: AnneMarie Valente - Jefferson Lab - Newport News (VA) USA | Duration: 30 min.
Abstract
Plasma based surface modification provides an excellent opportunity to eliminate impurities and defects in the penetration depth region of Nb SRF cavity surfaces. It also allows a better control of the final SRF surface as final surface modifications like oxidation or nitridation can be done in the same process cycle.
In the framework of a collaboration between ODU and Jefferson Lab, we are pursuing the use of environmentally friendly dry etching of SRF cavity in an Ar/Cl2 discharge. The experimental conditions in the microwave glow discharge system with a barrel-type reactor have been optimized. The viability of plasma etching as an alternative surface preparation method for bulk Nb surfaces has been demonstrated on flat samples by achieving etching rates comparable to wet processes, such as BCP or EP.
The optimized experimental conditions are now being applied to the preparation of single cell cavities. The geometry of SRF cavities made of bulk Nb defines the use of asymmetric RF discharge configuration for plasma etching. The asymmetry in the surface area of a driven and grounded electrode creates a difference in the voltage drop over the plasma sheath attached to the driven electrode and the plasma sheath attached to the cavity surface. A specially designed single cell cavity with sample holders is used to study these asymmetric discharges. The sample holder ports can be used for both diagnostics and sample etching purposes. The approach is to combine radially and spectrally resolved profiles of optical intensity of the discharge with direct etched surface diagnostics to obtain an optimum combination of etching rates, roughness and homogeneity in a variety of discharge types, conditions and sequences.
erimental Investigation of Process Parameter on Tensile Strength of Selective...ijsrd.com
Selective Laser Melting (SLM) is an emerging, fast growing rapid prototyping (RP) technology due to its ability to build functional parts having complex geometrical shape in reasonable time period. The quality of built parts highly depends on many process variables in selective laser melting. In this study, three important SLM process parameters such as layer thickness, orientation angle and scan speed are considered. Their influence on tensile strength of test specimen is studied. Margining Steel having grade 1.2709 was the material, commercially named CL50WS, which is used for fabricate Tensile Specimen in SLM. The experiments are conducted based on Taguchi's L8 orthogonal array. The validity of process parameter and response is tested by using analysis of variance (ANOVA). The multi linear regression model is developed in order to predict Tensile strength of test specimen. The experimental data and data obtained by regression equation is closely correlated which validated the models. The layer thickness and scan speed is highly affect the quality of SLM fabricated parts whereas orientation angle have little important.
Improvement of Surface Roughness of Nickel Alloy Specimen by Removing Recast ...IJMER
Abstract: In this investigation, experimental work and computational work are combined to obtain improvement in the surface roughness of nickel alloy specimen, the machining is carried out by means of CNC wire electric discharge machining (WEDM). Brass wire is used as the tool electrode and nickel alloy (Inconel600) is used as the work piece material. The machining parameters such as Pulse-On time (Ton), Pulse-Off time (Toff), Peak Current (Ip), and Bed speed are considered as input parameters for this project. Surface roughness and Recast layer are considered the output parameters. The experiments
with the pre-planned set of input parameters are designed based on Taguchi’s orthogonal array. The surface roughness is measured using stylus type roughness tester and the thickness of the Recast layer is measured using Scanning Electron Microscope (SEM). The results obtained from the experiments are fed to the Minitab software and optimum input parameters for the desired output parameters are identified. The software uses the concept of analysis of variance (ANOVA) and indicates the nature of effect of input parameters on the output parameters and confirmation is done by validation
experiments. Once the recast layer thickness is obtained Chemical Etching and abrasive blasting is performed in order to remove the recast layer and again the surface roughness is measured by using stylus type roughness tester. Finally from the obtained results it was found that there was significant improvement in the Surface roughness of the nickel alloy material. In addition using regression analysis this work is stimulated by computational method and the results are obtained
Improvement of Surface Roughness of Nickel Alloy Specimen by Removing Recast ...IJMER
In this investigation, experimental work and computational work are combined to obtain
improvement in the surface roughness of nickel alloy specimen, the machining is carried out by means
of CNC wire electric discharge machining (WEDM). Brass wire is used as the tool electrode and nickel
alloy (Inconel600) is used as the work piece material. The machining parameters such as Pulse-On time
(Ton), Pulse-Off time (Toff), Peak Current (Ip), and Bed speed are considered as input parameters for this
project. Surface roughness and Recast layer are considered the output parameters. The experiments
with the pre-planned set of input parameters are designed based on Taguchi’s orthogonal array. The
surface roughness is measured using stylus type roughness tester and the thickness of the Recast layer
is measured using Scanning Electron Microscope (SEM). The results obtained from the experiments are
fed to the Minitab software and optimum input parameters for the desired output parameters are
identified. The software uses the concept of analysis of variance (ANOVA) and indicates the nature of
effect of input parameters on the output parameters and confirmation is done by validation
experiments. Once the recast layer thickness is obtained Chemical Etching and abrasive blasting is
performed in order to remove the recast layer and again the surface roughness is measured by using
stylus type roughness tester. Finally from the obtained results it was found that there was significant
improvement in the Surface roughness of the nickel alloy material. In addition using regression
analysis this work is stimulated by computational method and the results are obtained.
Larry phillips plasma etching for cleaning and surface preparation of niobi...thinfilmsworkshop
The current status of plasma etching as a complete cleaning and surface preparation process for niobium will be discussed. A comparison with other methods will be given.
Larry phillips plasma etching for cleaning and surface preparation of niobi...
Imaps 2010 Mohammad Chowdhury
1. Understanding Wet Chemical Etching and Metallization of Micro Vias Fabricated Using Micro Mechanical Punching in LCP Substrate Mohammad K. Chowdhury, 1 Li Sun, 2 Shawn Cunningham, 2 and Ajay P. Malshe 1* 1 Materials and Manufacturing Research Lab University of Arkansas, Fayetteville, AR 72701 2 WiSpry Inc., Irvine, CA 92618 * Contact : [email_address] IMAPS 2010 Research Triangle, Raleigh, NC November 3 rd , 2010
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4. µ-Via Fabrication by Mechanical Punching: January 30, 2011 IMAPS 2010, Raleigh Convention Center, Raleigh, NC Die Bushing Pin LCP Copper Copper LCP Copper Copper Before Punching Copper Copper LCP After Punching APS 8718 Automatic Punching System Pacific Trinetics Corporation 6” x 6” Sample Holder Punch Pin Holder & Die Bushing LCP Copper Copper LCP Copper Copper Copper Copper LCP Figure: Uniform and nice via formation
5. Driver Applications: January 30, 2011 IMAPS 2010, Raleigh Convention Center, Raleigh, NC Ref:http://www.mpdigest.com/issue/Articles/2009/june/mmic/Default.asp MMIC (Microwave Monolithic IC) Ref: http://www.pcdandf.com/cms/magazine/220-2009-issues 3D Packaging & MCM Module Ref:http://www.cmst.be/projects/img9.jpg Flexible Electronics Ref: http://www.techwear-weblog.com Wearable Electronics www.smalltimes.com RF-MEMS Devices in Cell Phone www.ec.europa.eu – ANASTASIA Project Satellite and Aerospace Applications
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7. Via Pitch and Array Dependency of Z-axis Expansion REF: “Mechanically Punched Micro Via Fabrication Process in LCP Substrate for RF-MEMS and Related Electronic Packaging Applications,” Mohammad K. Chowdhury , Li Sun, Shawn Cunningham, and Ajay P. Malshe, 42 nd International Symposium on Microelectronics (IMAPS 2009) Proceedings , pg. 174-180, November 1 - 5, 2009
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10. Chemical Etching Using Promoters January 30, 2011 IMAPS 2010, Raleigh Convention Center, Raleigh, NC PROMOTER 3308A (20 – 40 % NaMnO 4 ) @ 85 0 C PROMOTER 3308B (NaOH < 30%) @ 85 0 C 3314 Neutralizer (3% H 2 SO 4 + 3% H 2 O 2 ) Sample 1 5 Min 1 Min 5 Min Sample 2 5 Min 5 Min 5 Min Sample 3 5 Min 10 Min 5 Min Experimental Matrix - 1 PROMOTER 3308A (20 – 40 % NaMnO 4 ) @ 85 0 C PROMOTER 3308B (NaOH < 30%) @ 85 0 C 3314 Neutralizer (3% H 2 SO 4 + 3% H 2 O 2 ) Sample 4 1 Min 5 Min 5 Min Sample 5 5 Min 5 Min 5 Min Sample 6 10 Min 5 Min 5 Min Experimental Matrix - 2 PROMOTER 3308A (20 – 40 % NaMnO 4 ) @ 85 0 C PROMOTER 3308B (NaOH < 30%) @ 85 0 C 3314 Neutralizer (3% H 2 SO 4 + 3% H 2 O 2 ) Sample 7 5 Min 5 Min 1 Min Sample 8 5 Min 5 Min 5 Min Sample 9 5 Min 5 Min 10 Min Experimental Matrix - 3
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22. Plating Fixture January 30, 2011 IMAPS 2010, Raleigh Convention Center, Raleigh, NC Power Supply (+) To Cu Anode (-) To Sample Holder From Pump To Pump
![Understanding Wet Chemical Etching and Metallization of Micro Vias Fabricated Using Micro Mechanical Punching in LCP Substrate Mohammad K. Chowdhury, 1 Li Sun, 2 Shawn Cunningham, 2 and Ajay P. Malshe 1* 1 Materials and Manufacturing Research Lab University of Arkansas, Fayetteville, AR 72701 2 WiSpry Inc., Irvine, CA 92618 * Contact : [email_address] IMAPS 2010 Research Triangle, Raleigh, NC November 3 rd , 2010](https://image.slidesharecdn.com/imaps2010mohammadchowdhury-12964313571688-phpapp02/85/Imaps-2010-Mohammad-Chowdhury-1-320.jpg)
![Acknowledgements January 30, 2011 IMAPS 2010, Raleigh Convention Center, Raleigh, NC ,[object Object],[object Object],[object Object],[object Object],[object Object],[object Object]](data:image/gif;base64,R0lGODlhAQABAIAAAAAAAP///yH5BAEAAAAALAAAAAABAAEAAAIBRAA7)