IEEE CPMT IMPACT Paper_2013_early preview
•
0 likes•903 views
The document discusses a study on the effects of wire type and mold compound on the wearout reliability of semiconductor flash Fineline BGA. It outlines the experimental matrix used to test different wire and mold compound combinations via high-temperature storage life and high-temperature operating life. The results are analyzed using wearout reliability plotting and scanning electron microscopy to determine the wearout mechanisms and effects of different materials. Future work is proposed to further characterize the wearout reliability and intermetallic compound diffusion kinetics for various wire types, including palladium-doped copper wire.
Report
Share
Report
Share
Download to read offline
Recommended
Thermo-Mechanical Simulation of Through Silicon Stack Assembly
The electronics industry has been using Finite Element Analysis (FEA) to model IC package assembly process for understanding the effects of process conditions, material choice as well as design parameters. What was already practiced as an engineering-art within packaging organizations for monolithic IC packages has now become more complex due to the need for collaboration across organizational walls in the case of 3D stacking. The holistic solution needed for collaborative engineering of 3D stacking process calls for streamlined methodologies and information exchange protocols.
This presentation will introduce the idea of automated chip stacking process modeling approach with detailed discussions on inputs needed, gaps in existing modeling methodologies and output metrics of engineering relevance. The presentation will discuss wafer level warpage due to thinning and RDL films, their control, assembly implications of different under filling and encapsulation processes and pre attach warpage at reflow temperature
Plastic package reliability
Today, plastic packaged integrated circuits are ubiquitous even for high-reliability applications. Reliability testing and standards play a key role in reliability engineering to achieve the necessary reliability performance. Traditional stress-based standards are easy to use but often over- or under-stress units and don’t focus on key vulnerabilities, particularly moisture-related ones. Knowledge-based standards have evolved to fix this, but rely on knowledge of mechanisms, control of board manufacturing conditions, and understanding and specifying end use conditions. This motivates a survey of plastic package mechanisms and testing with particular focus on moisture-related mechanisms and testing. The moisture-related examples will cover HAST testing, and the “popcorn” mechanism.
Learning Objectives
1.Understand the philosophy and methods behind reliability testing of ICs as applied to plastic-packaged ICs.
2.Learn the historical development of the JEDEC temperature-humidity-bias (HAST) moisture reliability testing standard.
3.Get a practical overview of key thermal, thermo-mechanical, moisture (chemical), and moisture (“popcorn”) mechanisms.
4.Appreciate how transformation of environmental conditions to conditions at the site of failure in the package is used to “scale” reliability models.
The Product Wall Release Planning Workshop by Alan Dayley
Multi-team Release Planning, as it is often executed, fails to bring alignment beyond one-time inter-team coordination. This hands-on session teaches the techniques and exercises for a Product Wall Release Planning Workshop. The Product Wall Release Planning Workshop brings together all the elements of business needs, user experience, value proposition, dependency resolution, risk mitigation and user story planning. By combining various Agile collaboration techniques in a guided sequence, your multi-team Release Planning can create alignment through learning together and building together a clear path to success, from the release vision all the way to Sprint Backlogs.
Alan Dayley brings more than 25 years of software engineering experience to his Agile Coaching practice. Agile Coach, CSM, CSPO, CSP. Alan works to strengthen the people side of creative work. Alan loves to help people learn and create innovation in their life. Besides Agile coaching, he spreads this passion as a founding member of the Phoenix Scrum User Group and speaker coach for the Ignite Phoenix series of events.
Recommended
Thermo-Mechanical Simulation of Through Silicon Stack Assembly
The electronics industry has been using Finite Element Analysis (FEA) to model IC package assembly process for understanding the effects of process conditions, material choice as well as design parameters. What was already practiced as an engineering-art within packaging organizations for monolithic IC packages has now become more complex due to the need for collaboration across organizational walls in the case of 3D stacking. The holistic solution needed for collaborative engineering of 3D stacking process calls for streamlined methodologies and information exchange protocols.
This presentation will introduce the idea of automated chip stacking process modeling approach with detailed discussions on inputs needed, gaps in existing modeling methodologies and output metrics of engineering relevance. The presentation will discuss wafer level warpage due to thinning and RDL films, their control, assembly implications of different under filling and encapsulation processes and pre attach warpage at reflow temperature
Plastic package reliability
Today, plastic packaged integrated circuits are ubiquitous even for high-reliability applications. Reliability testing and standards play a key role in reliability engineering to achieve the necessary reliability performance. Traditional stress-based standards are easy to use but often over- or under-stress units and don’t focus on key vulnerabilities, particularly moisture-related ones. Knowledge-based standards have evolved to fix this, but rely on knowledge of mechanisms, control of board manufacturing conditions, and understanding and specifying end use conditions. This motivates a survey of plastic package mechanisms and testing with particular focus on moisture-related mechanisms and testing. The moisture-related examples will cover HAST testing, and the “popcorn” mechanism.
Learning Objectives
1.Understand the philosophy and methods behind reliability testing of ICs as applied to plastic-packaged ICs.
2.Learn the historical development of the JEDEC temperature-humidity-bias (HAST) moisture reliability testing standard.
3.Get a practical overview of key thermal, thermo-mechanical, moisture (chemical), and moisture (“popcorn”) mechanisms.
4.Appreciate how transformation of environmental conditions to conditions at the site of failure in the package is used to “scale” reliability models.
The Product Wall Release Planning Workshop by Alan Dayley
Multi-team Release Planning, as it is often executed, fails to bring alignment beyond one-time inter-team coordination. This hands-on session teaches the techniques and exercises for a Product Wall Release Planning Workshop. The Product Wall Release Planning Workshop brings together all the elements of business needs, user experience, value proposition, dependency resolution, risk mitigation and user story planning. By combining various Agile collaboration techniques in a guided sequence, your multi-team Release Planning can create alignment through learning together and building together a clear path to success, from the release vision all the way to Sprint Backlogs.
Alan Dayley brings more than 25 years of software engineering experience to his Agile Coaching practice. Agile Coach, CSM, CSPO, CSP. Alan works to strengthen the people side of creative work. Alan loves to help people learn and create innovation in their life. Besides Agile coaching, he spreads this passion as a founding member of the Phoenix Scrum User Group and speaker coach for the Ignite Phoenix series of events.
Performance analysis of ultrathin junctionless double gate vertical MOSFETs
The main challenge in MOSFET minituarization is to form an ultra-shallow source/drain (S/D) junction with high doping concentration gradient, which requires an intricate S/D and channel engineering. Junctionless MOSFET configuration is an alternative solution for this issue as the junction and doping gradients is totally eliminated. A process simulation has been developed to investigate the impact of junctionless configuration on the double-gate vertical MOSFET. The result proves that the performance of junctionless double-gate vertical MOSFETs (JLDGVM) are superior to the conventional junctioned double-gate vertical MOSFETs (JDGVM). The results reveal that the drain current (ID) of the n-JLVDGM and p-JLVDGM could be tremendously enhanced by 57% and 60% respectively as the junctionless configuration was applied to the double-gate vertical MOSFET. In addition, junctionless devices also exhibit larger ION/IOFF ratio and smaller subthreshold slope compared to the junction devices, implying that the junctionless devices have better power consumption and faster switching capability.
Comprehensive Development and Comparison of two Feed Forward Back Propagation...
The development of an intelligent system for the establishment of relationship between input parameters and the
responses utilizing both reverse and forward modeling of artificial neural networks is the main objective of the
present research work. Prediction of quality characteristics such as front width, back width, front height and
back height of the weld bead geometry in Tungsten Inert Gas welding process of AA5083; H111 Aluminum
alloy is the aim in forward modeling from known set of process parameters such as current, %balance, welding
speed, arc gap, gas flow rate, and frequency. Reverse modeling meets the industrial requirements of automatic
welding to predict the recommended weld bead geometry characteristics. Comprehensive approach for the
development of two back propagation networks viz. feed forward back propagation (FFBP) and Elman back
propagation (EBP) neural networks is adopted. 212 Face centered central composite design based experimental
data is utilized for the development of both supervised learning networks with batch mode training approach. A
comparison of performance of FFBPP and EBP neural networks are made with that of stepwise multiple
regression statistical modeling. Analysis of results showed that both neural network modeling outperformed the
statistical approach in making better predictions and the models are efficient in selection of parameters
effectively for the desired responses. FFBP performance found to marginally better than that of EBP neural
network. Also the forward modeling performance was better than that of reverse modeling in both neural
networks.
Lf3420252035
International Journal of Engineering Research and Applications (IJERA) is an open access online peer reviewed international journal that publishes research and review articles in the fields of Computer Science, Neural Networks, Electrical Engineering, Software Engineering, Information Technology, Mechanical Engineering, Chemical Engineering, Plastic Engineering, Food Technology, Textile Engineering, Nano Technology & science, Power Electronics, Electronics & Communication Engineering, Computational mathematics, Image processing, Civil Engineering, Structural Engineering, Environmental Engineering, VLSI Testing & Low Power VLSI Design etc.
Wireless power transfer through metal using inductive link
Wireless power transfer through metal using inductive linkInternational Journal of Power Electronics and Drive Systems
This paper presents a highly efficient power transfer system based on a co-design of a class-E power amplifier (PA) and a pair of inductively coupled Helical coils for through-metal-wall power transfer. Power is transferred wirelessly through a 3.1-mm thick aluminum barrier without any physical penetration and contact. Measurement results show that the class-E PA achieves a peak power gain of 25.2 dB and a maximum collector efficiency of 57.3%, all at 200 Hz. The proposed system obtains a maximum power transfer efficiency of 9% and it can deliver 5 W power to the receiver side through the aluminum barrier.Welcome to International Journal of Engineering Research and Development (IJERD)
http://www.ijerd.com
De35589591
International Journal of Engineering Research and Applications (IJERA) is an open access online peer reviewed international journal that publishes research and review articles in the fields of Computer Science, Neural Networks, Electrical Engineering, Software Engineering, Information Technology, Mechanical Engineering, Chemical Engineering, Plastic Engineering, Food Technology, Textile Engineering, Nano Technology & science, Power Electronics, Electronics & Communication Engineering, Computational mathematics, Image processing, Civil Engineering, Structural Engineering, Environmental Engineering, VLSI Testing & Low Power VLSI Design etc.
Design and performance analysis of front and back Pi 6 nm gate with high K d...
Advanced high electron mobility transistor (HEMT) with dual front gate, back gate with silicon nitride/aluminum oxide (Si3N4/Al2O3) as passivation layer, has been designed. The dependency on DC characteristics and radio frequency characteristics due to GaN cap layers, multi gate (FG and BG), and high K dielectric material is established. Further compared single gate (SG) passivated HEMT, double gate (DG) passivated HEMT, double gate triple (DGT) tooth passivated HEMT, high K dielectric front Pi gate (FG) and back Pi gate (BG) HEMT. It is observed that there is an increased drain current (Ion) of 5.92 (A/mm), low leakage current (Ioff) 5.54E-13 (A) of transconductance (Gm) of 3.71 (S/mm), drain conductance (Gd) of 1.769 (S/mm), Cutoff frequency (fT) of 743 GHz maximum oscillation frequency (Fmax) 765 GHz, minimum threshold voltage (𝑉𝑡ℎ) of -4.5 V, on resistance (Ron) of 0.40 (Ohms) at 𝑉𝑔𝑠 = 0 V. These outstanding characteristics and transistor structure of proposed HEMT and materials involved to apply for upcoming generation high-speed GHz frequency applications.
Optimization of 14 nm double gate Bi-GFET for lower leakage current
In recent years, breakthroughs in electronics technology have resulted in upgrades in the physical properties of the metal oxide semiconductor field effect transistor (MOSFET) toward smaller sizes and improvements in both quality and performance. Hence, the growth field effect transistor (GFET) is being promoted as one of the worthy contenders due to its superior material characteristics. A 14 nm horizontal double-gate bilayer graphene FET with a high-k/metal gate is proposed, which is composed of hafnium dioxide (HfO2) and tungsten silicide (WSix) respectively. It is simulated and modelled using silvaco ATHENA and ATLAS technology computer-aided design (TCAD) tools, as well as the Taguchi L9 orthogonal array (OA). The threshold voltage (VTH) adjustment implant dose, VTH adjustment implant energy, source/drain (S/D) implant dose, and S/D implant energy have all been investigated as process parameters. While the VTH adjustment tilt angle and the S/D implant tilt angle have both been investigated as noise factors. When compared to the initial findings before optimization, the IOFF has a value of 29.579 nA/µm, indicating a significant improvement. Findings from the optimization technique demonstrate excellent device performance with an IOFF of 28.564 nA/µm, which is closer to the international technology roadmap semiconductor (ITRS) 2013 target than before
Optimal Preamble Design for Short Packet Circularly Pulse-Shaped OFDM Transmi...
IEEE GLOBECOM 2020
SPC1: SIGNAL PROCESSING FOR OFDM AND VLC
Title: Optimal Preamble Design for Short Packet Circularly Pulse-Shaped OFDM Transmissions
Authors: Yenming Huang, Polin Huang, and Borching Su
Kg3418451855
International Journal of Engineering Research and Applications (IJERA) is an open access online peer reviewed international journal that publishes research and review articles in the fields of Computer Science, Neural Networks, Electrical Engineering, Software Engineering, Information Technology, Mechanical Engineering, Chemical Engineering, Plastic Engineering, Food Technology, Textile Engineering, Nano Technology & science, Power Electronics, Electronics & Communication Engineering, Computational mathematics, Image processing, Civil Engineering, Structural Engineering, Environmental Engineering, VLSI Testing & Low Power VLSI Design etc.
Network cable types and specifications
This note is about Cables & Connectors of computer networks. It contains detailed information on different types of cables- Coaxial Cable, Twisted Pair Cable, and Fiber Optic Cable.
Synthetic Fiber Construction in lab .pptx
Synthetic fiber production is a fascinating and complex field that blends chemistry, engineering, and environmental science. By understanding these aspects, students can gain a comprehensive view of synthetic fiber production, its impact on society and the environment, and the potential for future innovations. Synthetic fibers play a crucial role in modern society, impacting various aspects of daily life, industry, and the environment. ynthetic fibers are integral to modern life, offering a range of benefits from cost-effectiveness and versatility to innovative applications and performance characteristics. While they pose environmental challenges, ongoing research and development aim to create more sustainable and eco-friendly alternatives. Understanding the importance of synthetic fibers helps in appreciating their role in the economy, industry, and daily life, while also emphasizing the need for sustainable practices and innovation.
Acetabularia Information For Class 9 .docx
Acetabularia acetabulum is a single-celled green alga that in its vegetative state is morphologically differentiated into a basal rhizoid and an axially elongated stalk, which bears whorls of branching hairs. The single diploid nucleus resides in the rhizoid.
More Related Content
Similar to IEEE CPMT IMPACT Paper_2013_early preview
Performance analysis of ultrathin junctionless double gate vertical MOSFETs
The main challenge in MOSFET minituarization is to form an ultra-shallow source/drain (S/D) junction with high doping concentration gradient, which requires an intricate S/D and channel engineering. Junctionless MOSFET configuration is an alternative solution for this issue as the junction and doping gradients is totally eliminated. A process simulation has been developed to investigate the impact of junctionless configuration on the double-gate vertical MOSFET. The result proves that the performance of junctionless double-gate vertical MOSFETs (JLDGVM) are superior to the conventional junctioned double-gate vertical MOSFETs (JDGVM). The results reveal that the drain current (ID) of the n-JLVDGM and p-JLVDGM could be tremendously enhanced by 57% and 60% respectively as the junctionless configuration was applied to the double-gate vertical MOSFET. In addition, junctionless devices also exhibit larger ION/IOFF ratio and smaller subthreshold slope compared to the junction devices, implying that the junctionless devices have better power consumption and faster switching capability.
Comprehensive Development and Comparison of two Feed Forward Back Propagation...
The development of an intelligent system for the establishment of relationship between input parameters and the
responses utilizing both reverse and forward modeling of artificial neural networks is the main objective of the
present research work. Prediction of quality characteristics such as front width, back width, front height and
back height of the weld bead geometry in Tungsten Inert Gas welding process of AA5083; H111 Aluminum
alloy is the aim in forward modeling from known set of process parameters such as current, %balance, welding
speed, arc gap, gas flow rate, and frequency. Reverse modeling meets the industrial requirements of automatic
welding to predict the recommended weld bead geometry characteristics. Comprehensive approach for the
development of two back propagation networks viz. feed forward back propagation (FFBP) and Elman back
propagation (EBP) neural networks is adopted. 212 Face centered central composite design based experimental
data is utilized for the development of both supervised learning networks with batch mode training approach. A
comparison of performance of FFBPP and EBP neural networks are made with that of stepwise multiple
regression statistical modeling. Analysis of results showed that both neural network modeling outperformed the
statistical approach in making better predictions and the models are efficient in selection of parameters
effectively for the desired responses. FFBP performance found to marginally better than that of EBP neural
network. Also the forward modeling performance was better than that of reverse modeling in both neural
networks.
Lf3420252035
International Journal of Engineering Research and Applications (IJERA) is an open access online peer reviewed international journal that publishes research and review articles in the fields of Computer Science, Neural Networks, Electrical Engineering, Software Engineering, Information Technology, Mechanical Engineering, Chemical Engineering, Plastic Engineering, Food Technology, Textile Engineering, Nano Technology & science, Power Electronics, Electronics & Communication Engineering, Computational mathematics, Image processing, Civil Engineering, Structural Engineering, Environmental Engineering, VLSI Testing & Low Power VLSI Design etc.
Wireless power transfer through metal using inductive link
Wireless power transfer through metal using inductive linkInternational Journal of Power Electronics and Drive Systems
This paper presents a highly efficient power transfer system based on a co-design of a class-E power amplifier (PA) and a pair of inductively coupled Helical coils for through-metal-wall power transfer. Power is transferred wirelessly through a 3.1-mm thick aluminum barrier without any physical penetration and contact. Measurement results show that the class-E PA achieves a peak power gain of 25.2 dB and a maximum collector efficiency of 57.3%, all at 200 Hz. The proposed system obtains a maximum power transfer efficiency of 9% and it can deliver 5 W power to the receiver side through the aluminum barrier.Welcome to International Journal of Engineering Research and Development (IJERD)
http://www.ijerd.com
De35589591
International Journal of Engineering Research and Applications (IJERA) is an open access online peer reviewed international journal that publishes research and review articles in the fields of Computer Science, Neural Networks, Electrical Engineering, Software Engineering, Information Technology, Mechanical Engineering, Chemical Engineering, Plastic Engineering, Food Technology, Textile Engineering, Nano Technology & science, Power Electronics, Electronics & Communication Engineering, Computational mathematics, Image processing, Civil Engineering, Structural Engineering, Environmental Engineering, VLSI Testing & Low Power VLSI Design etc.
Design and performance analysis of front and back Pi 6 nm gate with high K d...
Advanced high electron mobility transistor (HEMT) with dual front gate, back gate with silicon nitride/aluminum oxide (Si3N4/Al2O3) as passivation layer, has been designed. The dependency on DC characteristics and radio frequency characteristics due to GaN cap layers, multi gate (FG and BG), and high K dielectric material is established. Further compared single gate (SG) passivated HEMT, double gate (DG) passivated HEMT, double gate triple (DGT) tooth passivated HEMT, high K dielectric front Pi gate (FG) and back Pi gate (BG) HEMT. It is observed that there is an increased drain current (Ion) of 5.92 (A/mm), low leakage current (Ioff) 5.54E-13 (A) of transconductance (Gm) of 3.71 (S/mm), drain conductance (Gd) of 1.769 (S/mm), Cutoff frequency (fT) of 743 GHz maximum oscillation frequency (Fmax) 765 GHz, minimum threshold voltage (𝑉𝑡ℎ) of -4.5 V, on resistance (Ron) of 0.40 (Ohms) at 𝑉𝑔𝑠 = 0 V. These outstanding characteristics and transistor structure of proposed HEMT and materials involved to apply for upcoming generation high-speed GHz frequency applications.
Optimization of 14 nm double gate Bi-GFET for lower leakage current
In recent years, breakthroughs in electronics technology have resulted in upgrades in the physical properties of the metal oxide semiconductor field effect transistor (MOSFET) toward smaller sizes and improvements in both quality and performance. Hence, the growth field effect transistor (GFET) is being promoted as one of the worthy contenders due to its superior material characteristics. A 14 nm horizontal double-gate bilayer graphene FET with a high-k/metal gate is proposed, which is composed of hafnium dioxide (HfO2) and tungsten silicide (WSix) respectively. It is simulated and modelled using silvaco ATHENA and ATLAS technology computer-aided design (TCAD) tools, as well as the Taguchi L9 orthogonal array (OA). The threshold voltage (VTH) adjustment implant dose, VTH adjustment implant energy, source/drain (S/D) implant dose, and S/D implant energy have all been investigated as process parameters. While the VTH adjustment tilt angle and the S/D implant tilt angle have both been investigated as noise factors. When compared to the initial findings before optimization, the IOFF has a value of 29.579 nA/µm, indicating a significant improvement. Findings from the optimization technique demonstrate excellent device performance with an IOFF of 28.564 nA/µm, which is closer to the international technology roadmap semiconductor (ITRS) 2013 target than before
Optimal Preamble Design for Short Packet Circularly Pulse-Shaped OFDM Transmi...
IEEE GLOBECOM 2020
SPC1: SIGNAL PROCESSING FOR OFDM AND VLC
Title: Optimal Preamble Design for Short Packet Circularly Pulse-Shaped OFDM Transmissions
Authors: Yenming Huang, Polin Huang, and Borching Su
Kg3418451855
International Journal of Engineering Research and Applications (IJERA) is an open access online peer reviewed international journal that publishes research and review articles in the fields of Computer Science, Neural Networks, Electrical Engineering, Software Engineering, Information Technology, Mechanical Engineering, Chemical Engineering, Plastic Engineering, Food Technology, Textile Engineering, Nano Technology & science, Power Electronics, Electronics & Communication Engineering, Computational mathematics, Image processing, Civil Engineering, Structural Engineering, Environmental Engineering, VLSI Testing & Low Power VLSI Design etc.
Network cable types and specifications
This note is about Cables & Connectors of computer networks. It contains detailed information on different types of cables- Coaxial Cable, Twisted Pair Cable, and Fiber Optic Cable.
Similar to IEEE CPMT IMPACT Paper_2013_early preview (20)
Performance analysis of ultrathin junctionless double gate vertical MOSFETs
Performance analysis of ultrathin junctionless double gate vertical MOSFETs
Comprehensive Development and Comparison of two Feed Forward Back Propagation...
Comprehensive Development and Comparison of two Feed Forward Back Propagation...
Wireless power transfer through metal using inductive link
Wireless power transfer through metal using inductive link
Welcome to International Journal of Engineering Research and Development (IJERD)
Welcome to International Journal of Engineering Research and Development (IJERD)
Design and performance analysis of front and back Pi 6 nm gate with high K d...
Design and performance analysis of front and back Pi 6 nm gate with high K d...
Optimization of 14 nm double gate Bi-GFET for lower leakage current
Optimization of 14 nm double gate Bi-GFET for lower leakage current
Evolutions of bonding wires used in semiconductor electronics perspective ove...
Evolutions of bonding wires used in semiconductor electronics perspective ove...
Optimal Preamble Design for Short Packet Circularly Pulse-Shaped OFDM Transmi...
Optimal Preamble Design for Short Packet Circularly Pulse-Shaped OFDM Transmi...
Recently uploaded
Synthetic Fiber Construction in lab .pptx
Synthetic fiber production is a fascinating and complex field that blends chemistry, engineering, and environmental science. By understanding these aspects, students can gain a comprehensive view of synthetic fiber production, its impact on society and the environment, and the potential for future innovations. Synthetic fibers play a crucial role in modern society, impacting various aspects of daily life, industry, and the environment. ynthetic fibers are integral to modern life, offering a range of benefits from cost-effectiveness and versatility to innovative applications and performance characteristics. While they pose environmental challenges, ongoing research and development aim to create more sustainable and eco-friendly alternatives. Understanding the importance of synthetic fibers helps in appreciating their role in the economy, industry, and daily life, while also emphasizing the need for sustainable practices and innovation.
Acetabularia Information For Class 9 .docx
Acetabularia acetabulum is a single-celled green alga that in its vegetative state is morphologically differentiated into a basal rhizoid and an axially elongated stalk, which bears whorls of branching hairs. The single diploid nucleus resides in the rhizoid.
Chapter 3 - Islamic Banking Products and Services.pptx
Chapter 3 - Islamic Banking Products and Services.pptxMohd Adib Abd Muin, Senior Lecturer at Universiti Utara Malaysia
This slide is prepared for master's students (MIFB & MIBS) UUM. May it be useful to all.1.4 modern child centered education - mahatma gandhi-2.pptx
Child centred education is an educational approach that priorities the interest, needs and abilities of the child in the learning process.
Best Digital Marketing Institute In NOIDA
Safalta Digital marketing institute in Noida, provide complete applications that encompass a huge range of virtual advertising and marketing additives, which includes search engine optimization, virtual communication advertising, pay-per-click on marketing, content material advertising, internet analytics, and greater. These university courses are designed for students who possess a comprehensive understanding of virtual marketing strategies and attributes.Safalta Digital Marketing Institute in Noida is a first choice for young individuals or students who are looking to start their careers in the field of digital advertising. The institute gives specialized courses designed and certification.
for beginners, providing thorough training in areas such as SEO, digital communication marketing, and PPC training in Noida. After finishing the program, students receive the certifications recognised by top different universitie, setting a strong foundation for a successful career in digital marketing.
Model Attribute Check Company Auto Property
In Odoo, the multi-company feature allows you to manage multiple companies within a single Odoo database instance. Each company can have its own configurations while still sharing common resources such as products, customers, and suppliers.
Operation Blue Star - Saka Neela Tara
Operation “Blue Star” is the only event in the history of Independent India where the state went into war with its own people. Even after about 40 years it is not clear if it was culmination of states anger over people of the region, a political game of power or start of dictatorial chapter in the democratic setup.
The people of Punjab felt alienated from main stream due to denial of their just demands during a long democratic struggle since independence. As it happen all over the word, it led to militant struggle with great loss of lives of military, police and civilian personnel. Killing of Indira Gandhi and massacre of innocent Sikhs in Delhi and other India cities was also associated with this movement.
TESDA TM1 REVIEWER FOR NATIONAL ASSESSMENT WRITTEN AND ORAL QUESTIONS WITH A...
TESDA TM1 REVIEWER FOR NATIONAL ASSESSMENT WRITTEN AND ORAL QUESTIONS WITH ANSWERS.
Unit 2- Research Aptitude (UGC NET Paper I).pdf
This slide describes the research aptitude of unit 2 in the UGC NET paper I.
2024.06.01 Introducing a competency framework for languag learning materials ...
http://sandymillin.wordpress.com/iateflwebinar2024
Published classroom materials form the basis of syllabuses, drive teacher professional development, and have a potentially huge influence on learners, teachers and education systems. All teachers also create their own materials, whether a few sentences on a blackboard, a highly-structured fully-realised online course, or anything in between. Despite this, the knowledge and skills needed to create effective language learning materials are rarely part of teacher training, and are mostly learnt by trial and error.
Knowledge and skills frameworks, generally called competency frameworks, for ELT teachers, trainers and managers have existed for a few years now. However, until I created one for my MA dissertation, there wasn’t one drawing together what we need to know and do to be able to effectively produce language learning materials.
This webinar will introduce you to my framework, highlighting the key competencies I identified from my research. It will also show how anybody involved in language teaching (any language, not just English!), teacher training, managing schools or developing language learning materials can benefit from using the framework.
Chapter -12, Antibiotics (One Page Notes).pdf
This is a notes for the D.Pharm students and related to the antibiotic drugs.
Digital Artifact 2 - Investigating Pavilion Designs
Digital Artifact 2 - Pavilions
NGV Architecture Commission Competition
MPavilion Commission Competition
Other Pavilion Designs
Recently uploaded (20)
Chapter 3 - Islamic Banking Products and Services.pptx
Chapter 3 - Islamic Banking Products and Services.pptx
1.4 modern child centered education - mahatma gandhi-2.pptx
1.4 modern child centered education - mahatma gandhi-2.pptx
Group Presentation 2 Economics.Ariana Buscigliopptx
Group Presentation 2 Economics.Ariana Buscigliopptx
TESDA TM1 REVIEWER FOR NATIONAL ASSESSMENT WRITTEN AND ORAL QUESTIONS WITH A...
TESDA TM1 REVIEWER FOR NATIONAL ASSESSMENT WRITTEN AND ORAL QUESTIONS WITH A...
Multithreading_in_C++ - std::thread, race condition
Multithreading_in_C++ - std::thread, race condition
2024.06.01 Introducing a competency framework for languag learning materials ...
2024.06.01 Introducing a competency framework for languag learning materials ...
Digital Artifact 2 - Investigating Pavilion Designs
Digital Artifact 2 - Investigating Pavilion Designs
IEEE CPMT IMPACT Paper_2013_early preview
- 1. TOPIC : Effects of Wire Type & Mold Compound on Wearout Reliability of Semiconductor flash Fineline BGA MAIN AUTHOR : C.L. Gan CO-AUTHORS : F.C. Classe, B.L. Chan, E.K. Ng, U. Hashim AFFILIATION : Spansion (Penang) Sdn Bhd Email : chong-leong.gan@spansion.com Paper Code: AS008-1 Date: Thurs, Oct 24, 2013
- 2. OUTLINE 1 INTRODUCTION, BACKGROUND OF THE STUDY, IMPORTANCE 2 EXPERIMENTAL MATRIX 3 WEAROUT MECHANISMS (HAST, TC) 4 WEAROUT RELIABILITY PLOTTING & SEM ANALYSIS (HAST, TC) 5 EFFECTS OF WIRE TYPE, EMC TYPE 6 CONCLUSION & FUTURE WORKS 7 QUESTION & ANSWER 2
- 3. Future Works • Wear out reliability knowledge based reliability testing, derivation of HAST Eaa, HTSL Eaa – To proliferate to Pd-doped Cu wire • IMC diffusion kinetics study for various wire types included Pd-doped Cu wire
- 4. 20
- 5. 21 The End Thank you for your listening! IMPACT 2013 Oct 22 (Tues) – 25 (Fri) Taipei Nangang Exhibition Hall