The document discusses radiation detection technologies from IDEAS, a Norwegian company. It provides details on various gamma camera and X-ray counting systems using CZT and LaBr detectors that can be customized for applications in healthcare, science, security, space, and industry. It also mentions neutron detector modules and readout ASICs like the IDE3380 SiPM readout chip that are available off the shelf or within short lead times. In general, the document advertises IDEAS' radiation detection solutions and stock components.
My slides that I presented on behalf of IDEAS at the NDIP conference in Tours 2017. The presentation is about the 16-channel SiPM readout ASIC, called SIPHRA. We have manufactured the chips and sell off-the-shelf, also with development kit. We have acquired the gamma ray spectra with the development kit, and measured 4% FWHM energy resolution at 511keV as expected.
Ideas ASIC products with possibilities for use in neutron detectionGunnar Maehlum
Application of Integrated Detector Electronics (IDEAS) ASICs to neutron detection as defined by the needs of the European Spallation Source, Lund, Sweden.
Overview of Integrated Detector Electronics products including Application Specific Integrated Circuits, ROICs and low noise amplifiers for radiation detection.
This is a company products presentation by IDEAS - Integrated Detector Electronics AS, Norway. Presentation given at the IEEE NSS/MIC 2018.
The company designs integrated circuits, radiation detectors and imaging systems.
My slides that I presented on behalf of IDEAS at the NDIP conference in Tours 2017. The presentation is about the 16-channel SiPM readout ASIC, called SIPHRA. We have manufactured the chips and sell off-the-shelf, also with development kit. We have acquired the gamma ray spectra with the development kit, and measured 4% FWHM energy resolution at 511keV as expected.
Ideas ASIC products with possibilities for use in neutron detectionGunnar Maehlum
Application of Integrated Detector Electronics (IDEAS) ASICs to neutron detection as defined by the needs of the European Spallation Source, Lund, Sweden.
Overview of Integrated Detector Electronics products including Application Specific Integrated Circuits, ROICs and low noise amplifiers for radiation detection.
This is a company products presentation by IDEAS - Integrated Detector Electronics AS, Norway. Presentation given at the IEEE NSS/MIC 2018.
The company designs integrated circuits, radiation detectors and imaging systems.
SPICE MODEL of TK65E10N1 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TK65E10N1 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPC8115 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPC8115 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of GT25Q101 (Standard Without Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of GT25Q101 (Standard Without Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPC8115 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPC8115 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TK65L60V (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TK65L60V (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
Instrumentation: Test and Measurement Methods and Solutions - VE2013Analog Devices, Inc.
Tilt Measurement: Tilt measurement is fast becoming a fundamental analysis tool in many fields including automotive, industrial, and healthcare. Navigation, vehicle dynamic control, building sway indication, and motion detection systems all rely on this simple, cheap, and precise way of angle monitoring. MEMS accelerometers are better suited to inclination measurement than other methodologies. This session will address the challenges encountered when designing a dual-axis tilt sensor using a MEMS accelerometer including measurement resolution, signal conditioning, single- vs. dual-axis, angle computation, and calibration.
Impedance Measurement: The measurement of complex impedance is widely used across industrial, commercial, automotive, healthcare, and consumer markets, and can include applications such as proximity sensing, inductive transducers, metallurgy and corrosion detection, loudspeaker impedance, biomedical, virus detection, blood coagulation factor, and network impedance analysis. This session will cover the concepts, approaches, and challenges of performing complex impedance measurements and will present a system-level solution for impedance conversion.
Weigh Scale Measurement: Most common industrial weigh scale applications use a bridge-type load-cell sensor, with a voltage output that is directly proportional to the load weight placed on it. This session examines the basic parameters of a bridge-type load-cell sensor, such as the number of varying elements, impedance, excitation, sensitivity (mV/V), errors, and drift. It will also discuss the various components of the signal conditioning chain and present solutions with high dynamic range.
A brief introduction to the history of semiconductor technology and industry. Also discussed it the limitation of scaling, which drives the technology for the last 5 decades. The evolution of nanowire transistors, 3D memory, and advanced packaging. Also discussed the evolution of industry, fab construction, factory automation and wafer fab economy,
SPICE MODEL of TPCA8062-H (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPCA8062-H (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPCA8064-H (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPCA8064-H (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPCP8R01 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPCP8R01 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of IRG4IBC20KD (Standard+FWDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of IRG4IBC20KD (Standard+FWDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK4017 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK4017 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK4017 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK4017 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
IDEAS company presentation given at the IEEE NSS/MIC 2022. The topic of this presentation was recent products from IDEAS in radiation detection and imaging.
SPICE MODEL of TK65E10N1 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TK65E10N1 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPC8115 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPC8115 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of GT25Q101 (Standard Without Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of GT25Q101 (Standard Without Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPC8115 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPC8115 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TK65L60V (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TK65L60V (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
Instrumentation: Test and Measurement Methods and Solutions - VE2013Analog Devices, Inc.
Tilt Measurement: Tilt measurement is fast becoming a fundamental analysis tool in many fields including automotive, industrial, and healthcare. Navigation, vehicle dynamic control, building sway indication, and motion detection systems all rely on this simple, cheap, and precise way of angle monitoring. MEMS accelerometers are better suited to inclination measurement than other methodologies. This session will address the challenges encountered when designing a dual-axis tilt sensor using a MEMS accelerometer including measurement resolution, signal conditioning, single- vs. dual-axis, angle computation, and calibration.
Impedance Measurement: The measurement of complex impedance is widely used across industrial, commercial, automotive, healthcare, and consumer markets, and can include applications such as proximity sensing, inductive transducers, metallurgy and corrosion detection, loudspeaker impedance, biomedical, virus detection, blood coagulation factor, and network impedance analysis. This session will cover the concepts, approaches, and challenges of performing complex impedance measurements and will present a system-level solution for impedance conversion.
Weigh Scale Measurement: Most common industrial weigh scale applications use a bridge-type load-cell sensor, with a voltage output that is directly proportional to the load weight placed on it. This session examines the basic parameters of a bridge-type load-cell sensor, such as the number of varying elements, impedance, excitation, sensitivity (mV/V), errors, and drift. It will also discuss the various components of the signal conditioning chain and present solutions with high dynamic range.
A brief introduction to the history of semiconductor technology and industry. Also discussed it the limitation of scaling, which drives the technology for the last 5 decades. The evolution of nanowire transistors, 3D memory, and advanced packaging. Also discussed the evolution of industry, fab construction, factory automation and wafer fab economy,
SPICE MODEL of TPCA8062-H (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPCA8062-H (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPCA8064-H (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPCA8064-H (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of TPCP8R01 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of TPCP8R01 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of IRG4IBC20KD (Standard+FWDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of IRG4IBC20KD (Standard+FWDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK4017 (Professional+BDP Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK4017 (Professional+BDP Model) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
SPICE MODEL of 2SK4017 (Standard+BDS Model) in SPICE PARKTsuyoshi Horigome
SPICE MODEL of 2SK4017 (Standard+BDS) in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.
IDEAS company presentation given at the IEEE NSS/MIC 2022. The topic of this presentation was recent products from IDEAS in radiation detection and imaging.
Slides from my presentation at the IEEE NSS/MIC 2019 in Manchester.
IDEAS designs electronic integrated circuits, radiation detectors and imaging systems. IDEAS is a fabless IC and systems supplier.
IDEAS - Integrated Detector Electronics AS, headquarter in Oslo, Norway. The company
designs radiation detectors and
imaging systems with
proprietary readout electronics. These are slides from their products presentation at the IEEE NSS MIC RTSD conference in Vancouver in November 2023.
NIRCA a digitizer and controller for focal plane arraysGunnar Maehlum
An application specific integrated circuit for focal plane array readout and control is described. The circuit is designed for cryogenic operation and is single event latch-up immune.
In this deck from the RISC-V Workshop in Barcelona, Mateo Valero, Director of the Barcelona Supercomputer center, explains how the RISC-V architecture can play a main role in new supercomputer architectures.
"RISC-V is an open, free ISA enabling a new era of processor innovation through open standard collaboration. Born in academia and research, RISC-V ISA delivers a new level of free, extensible software and hardware freedom on architecture, paving the way for the next 50 years of computing design and innovation."
Watch the video interview:
Learn more: https://tmt.knect365.com/risc-v-workshop-barcelona/
In this deck from the the 2018 RISC-V Workshop in Barcelona, Director Prof. Mateo Valero presents: European Processor Initiative & RISC-V.
Watch the video: https://wp.me/p3RLHQ-kHU
Sign up for our insideHPC Newsletter: http://insidehpc.com/newsletter
Learn more: https://riscv.org/2018/05/risc-v-workshop-in-barcelona-proceedings/
and
https://www.european-processor-initiative.eu/
Building a Raspberry Pi Robot with Dot NET 8, Blazor and SignalR - Slides Onl...Peter Gallagher
In this session delivered at Leeds IoT, I talk about how you can control a 3D printed Robot Arm with a Raspberry Pi, .NET 8, Blazor and SignalR.
I also show how you can use a Unity app on an Meta Quest 3 to control the arm VR too.
You can find the GitHub repo and workshop instructions here;
https://bit.ly/dotnetrobotgithub
Google Calendar is a versatile tool that allows users to manage their schedules and events effectively. With Google Calendar, you can create and organize calendars, set reminders for important events, and share your calendars with others. It also provides features like creating events, inviting attendees, and accessing your calendar from mobile devices. Additionally, Google Calendar allows you to embed calendars in websites or platforms like SlideShare, making it easier for others to view and interact with your schedules.
IDEAS Technology for Radiation Detection and Imaging, Year 2016
1. Spoiler
2016-‐11-‐02
dirk.meier@ideas.no,
h8p://www.ideas.no
1
...now
everybody
can
build
their
spectrometer.
2. Technology
for
RadiaFon
DetecFon
and
Imaging
IDEAS
–
Integrated
Detector
Electronics
AS
dirk.meier@ideas.no
on
behalf
of
the
IDEAS
development
team
InformaFon
about
IDEAS
company
h8p://www.ideas.no
2016-‐11-‐02
dirk.meier@ideas.no,
h8p://www.ideas.no
2
3. IDEAS
since
1992
2016-‐11-‐02
dirk.meier@ideas.no,
h8p://www.ideas.no
3
HQ
in
Oslo
Norway
and
Resellers
in
China
and
Korea
4. IDEAS
Products
2016-‐11-‐02
dirk.meier@ideas.no,
h8p://www.ideas.no
4
SoluFons
for
radiaFon
detecFon
and
imaging
Readout
ICs
and
ASICs
RadiaFon
Detector
Modules
X-‐ray
and
Gamma
Cameras
Further
informaFon
at
h8p://www.ideas.no
-‐>
Products
5. ApplicaFons
2016-‐11-‐02
dirk.meier@ideas.no,
h8p://www.ideas.no
5
• Hot
Spot
Locator
• RadiaFon
Awareness
Environment
• Nuclear
Medicine
• Radiology
with
x-‐rays
• Dosimetry
in
Radiotherapy
Healthcare
• Nuclear
and
parFcle
physics
• Neutron
faciliFes
Science
• Screening
and
portal
imaging
• Nuclear
proliferaFon
miFgaFon
Security
• RadiaFon
Monitoring
• Fundamental
physics
• Imaging
for
science
and
Earth
observaFon
Space
• Process
and
flow
tomography
• Food
processing
for
safety
and
quality
assurance
Industry
6. Gamma
Camera
2016-‐11-‐02
dirk.meier@ideas.no,
h8p://www.ideas.no
6
Detector
CZT
FOV
12.7
cm
x
12.7
cm
Power
9
W
Weight
2
kg
Energy
18
keV
to
490
keV
Energy
resoluFon
6
keV
FWHM
Input
rate
max
50
kcps
per
FOV
Output
rate
max
50
kcps
list
mode
Interface
Ethernet,
API
<
3
months
lead
Fme
Configure
number
and
placement
of
modules
9. XCS
–
Xray
CounFng
System
2016-‐11-‐02
dirk.meier@ideas.no,
h8p://www.ideas.no
9
Detector
CZT
FOV
18.2
cm
x
1.28
cm
Power
12
W
Weight
3
kg
Energy
30
keV
to
130
keV
Erg.
Res.
6keV
FWHM
Input
rate
500
kcps
per
pixel
Output
rate
<1000
Hz
frames
I/F
Ethernet,
API
OpFonal:
3
or
6
energy
bins
<
3
months
lead
Fme
10. XCS
in
Flow
Tomograph
2016-‐11-‐02
dirk.meier@ideas.no,
h8p://www.ideas.no
10
5
XCS
units
assembled
in
the
flow
tomograph
Image
from
phantom
h8p://prototech.no/projects/10503/gamma-‐ray-‐tomographer/
11. LaBr/SiPM/IDE3380
2016-‐11-‐02
dirk.meier@ideas.no,
h8p://www.ideas.no
11
Monolithic
LaBr/SiPM
Image
Univ.
College
Dublin,
SensL
SiPM
array
16
SiPMs
SiPM
Readout
with
IDE3380
and
Zync
ARM
13. SoNDe
SKADI
Neutron
at
ESS
2016-‐11-‐02
dirk.meier@ideas.no,
h8p://www.ideas.no
13
Detector
Li-‐Glass
scin3llator/H8500
FOV
module
5
x
5
cm2
Power
3W
per
module
Weight
100g
w/o
detector
Input
charge
80
pC
max.
Erg.
Res.
6keV
FWHM
Input
rate
100kcps
per
pixel
Output
rate
1000Hz
frames
or
50kps
list
mode
I/F
Ethernet,
API
h8ps://europeanspallaFonsource.se/arFcle/skadi-‐diffractometer-‐enlarging-‐field-‐small-‐angle-‐neutron-‐sca8ering
DOI:
10.1016/j.nima.2014.04.024
RO
modules
<
3
month
lead
Fme
14. Development
System
with
SiPM/LaBr
2016-‐11-‐02
dirk.meier@ideas.no,
h8p://www.ideas.no
14
Readout
<
1
month
lead
Fme
15. ASIC
Development
System
Available
for
• IDE3380
(SiPM
R/O)
• VATA64HDR16
• IDE1163
(wire
chamber
R/O)
• Other
ROICs
2016-‐11-‐02
dirk.meier@ideas.no,
h8p://www.ideas.no
15
Stock
item
16. NGRM
Space
RadiaFon
Monitor
2016-‐11-‐02
dirk.meier@ideas.no,
h8p://www.ideas.no
16
h8ps://www.ruag.com/fileadmin/ruag/Divisions/Space/Products/Satellite_Instruments/RadiaFon_Monitors/PDF/NGRM_datasheet.pdf
17. RADEM
Space
RadiaFon
Monitor
2016-‐11-‐02
dirk.meier@ideas.no,
h8p://www.ideas.no
17
18. IC
Overview
Stock
Items
2016-‐11-‐02
dirk.meier@ideas.no,
h8p://www.ideas.no
18
Pre-‐amplifiers
and
shapers
VA
–
Viking
ASICs
Pre-‐amplifiers,
shapers,
comparators,
counters
VATA
and
CA
–
Triggers
and
Counters
LNA,
ADC,
Micro-‐
controller
IR
–
Infrared
ASICs
Further
informaFon
at
h8p://www.ideas.no/product-‐category/readout-‐ics/
19. SIPHRA
IDE3380
SiPM
ROIC
2016-‐11-‐02
dirk.meier@ideas.no,
h8p://www.ideas.no
19
Chip
acFve
area:
7.6
mm×6.8
mm
Planned
Packaging
OpFons:
PlasFc
PQFP120,
Bare-‐Die
DOI:
10.13140/RG.2.1.1460.8882
Available
from
stock
20. SIPHRA
Features
and
Block
Diagram
2016-‐11-‐02
dirk.meier@ideas.no,
h8p://www.ideas.no
20
IDE3380
(SIPHRA)
Features
-‐
16
readout
channels
16
current
sensiFve
inputs
(≤
16
nC)
1
summing
channel
-‐
Programmable
aKenua3on
to
handle
charge
up
to
-‐16
nC,
-‐8
nC,
-‐4
nC,
-‐400
pC
at
AIN
inputs,
or
+40
pC,
+4
pC,
+0.4
pC
at
FIN
inputs
-‐
Programmable
shaping
3me
200
ns,
400
ns,
800
ns,
1600
ns
-‐
16
inputs
(AIN)
with
programmable
offset
voltage
-‐
Pulse
height
spectroscopy
16
shapers
followed
by
track-‐and-‐hold
Programmable
hold
Fming
Analog
and/or
12-‐bit
digital
readout
3
ksps/channel
max.
-‐
Trigger
genera3on
Internal
from
charge
discriminator
via
programmable
threshold
in
every
channel
External
(trigger
on
input,
trigger
on
sum)
-‐
Power
15
mW
without
CMIS,
30
mW
with
CMIS
acFve
Flexible
power
down
scheme
of
channels
or
funcFons
-‐
SEL/SEU
radia3on
hardened
-‐
SPI
Interface
h8p://www.ideas.no/products/ide3380/
22. RADEM
ASIC
IDE3466
for
ESA
JUICE
Mission
to
Jupiter
2016-‐11-‐02
dirk.meier@ideas.no,
h8p://www.ideas.no
22
IC
front-‐end
readout
of
array
and
stacked
silicon
diodes.
T.A.
Stein
et
al.,
IDEAS
IDE3466
ASIC
for
RADEM,
Proc.
SPIE
Astro.,
Edinburgh,
2016.
15980
µm
15980
µm
IC
available
from
stock
23. RADEM
ASIC
IDE3466
-‐
Trigger
and
Shaped
Pulse
2016-‐11-‐02
dirk.meier@ideas.no,
h8p://www.ideas.no
23
Response
to
8pC
test
charge
24. RADEM
ASIC
IDE3466
-‐
Coincidence
Pa8ern
Units
and
Counters
2016-‐11-‐02
dirk.meier@ideas.no,
h8p://www.ideas.no
24
68-‐bit
Input
pa8ern
Qi
Coincidence
Fme
EvaluaFon
Programmed
68-‐bit
pairs
Mi,
Vi
masks
Mi,
and
veto
bits
Vi
22-‐bit
Gray
counters
incremenFng,
Log2
(4194304)
=
22
Input
charge
rate
capability
25. 2016-‐11-‐02
dirk.meier@ideas.no,
h8p://www.ideas.no
25
NIRCA
–
V2
FPA
Controller
Programmable
sequencer
ECC
RAM
16
x
14-‐bit,
20Msps
ADCs
Programmable
gain/offset
Programmable
bias
&
supplies
for
FPA
ROIC
Radhard
by
design
and
process
IC
engineering
samples
in
stock
26. Silicon
Tracker
Readout
2016-‐11-‐02
dirk.meier@ideas.no,
h8p://www.ideas.no
26
DAMPE
launched
2015-‐12-‐17
IDEAS
designed
FM
STK
readout
STK
has
1152
chips
of
IDE1140
IDEAS
also
designed
FM
readout
27. CZT
Sampling
Readout
2016-‐11-‐02
dirk.meier@ideas.no,
h8p://www.ideas.no
27
Cd109
Cd109
Am247
Co57
R09-‐2
–
Noise
reducFon
...
using
VAD_UM
V2.2
digiFzer
ASIC
by
Zhong
He
and
Yuefeng
Zhu
R10-‐6
-‐
SpaFally
Resolved
InvesFgaFon
of
Large
CdZnTe
Detectors
with
a
Coplanar
Quad-‐Grid
by
R.
Temminghoff
for
COBRA
28. Quality
Assurance
2016-‐11-‐02
dirk.meier@ideas.no,
h8p://www.ideas.no
28
Design
&
Development
• Full-‐custom
mixed
mode,
analogue
and
digital
IC
design
• SchemaFc
capture,
circuit
simulaFon,
process
corners
(PVT),
layout,
physical
verificaFon
(LVS,
DRC),
VHDL/Verilog,
behavior
simulaFon,
synthesis,
scan
inserFon,
P&R,
extracFon,
verificaFon
• ECSS-‐Q-‐ST-‐60-‐02
ASIC/FPGA
development,
ECSS-‐M-‐ST-‐10
Project
planning
and
implementaFon,
IEC
60601
Medical
electrical
safety
and
performance
Valida3on
&
Qualifica3on
• Prototype
system
design,
verificaFon
of
the
ASIC
funcFonal
and
performance
requirements,
if
needed
with
ionizing
radiaFon,
physical
and
environmental
requirements
specificaFons
• MIL-‐STD
883
Test
method
standard
for
microcircuits,
radiaFon
effects
characterizaFon
(SEE,
TID)
Manufacture
• Wafer
foundry
AMS,
XFAB,
Tower,
TSMC,
including
engineering
services,
if
needed
(process
opFons,
dicing,
thinning)
• Lot
acceptance
tests
(LAT),
wafer
level
probe
tesFng,
packaging
services
• AMS
design
and
producFon
is
ISO/TS
16949:2009
and
ISO
14001:2004/Cor
1:2009
29. • CMOS
DSM
• 10
Mrad
TID
–
Total
Ionizing
Dose
Latch-‐up
immune
SEL
–
Single
Event
Latch-‐up
• LETth
at
50
MeVcm2/
mg
• Triple
Redundancy
• Parity
SEU
–
Single
Event
Upset
• Filters
• Digital
gate
I/O
sensiFvity
SET
–
Single
Event
Transient
• Design
for
calibraFon
over
wide
temperature
range
• Temperature
stable
bias
reference
Cryogenic
OperaFon
IC
Design
for
Extreme
RadiaFon
&
Temperatures
2016-‐11-‐02
dirk.meier@ideas.no,
h8p://www.ideas.no
29
30. ASIC
IP
Library
2016-‐11-‐02
dirk.meier@ideas.no,
h8p://www.ideas.no
30
Analogue
processing
Converters
&
Power
Charge
SensiFve
Amplifiers
(CSA)
Shaping
Amplifiers
Pre-‐Amplifiers
Current
Conveyor
Fast
Trigger
Generators
Analogue-‐to-‐Digital
Converters
(ADC)
Digital-‐to-‐Analogue
Converters
(DAC)
Sampling
Pipeline
Time-‐to-‐Digital
Converters
(TDC)
Trigger
Processing
StaFc
RAM
(SRAM)
with
EDAC
Custom
Microcontroller
(μC)
Buffer
Amplifiers
Programmable
Trigger
Coincidence
Logic
External
Control
Interfaces
(SPI,
etc.)
Custom
High-‐Speed
Serial
Data
Links
Data
Encoders
(8b/10b
etc.)
Digital
Fast
Mono-‐Stable
MulFvibrators
Reference
and
Bias
Generators
Low-‐Dropout
Regulators
(LDO)
Full-‐Custom
Digital
Rad-‐Hard
Triple-‐Redundant
Parity
Check
Rad-‐Hard
by
Design
SEL
immune
SEU
tolerant
Rad-‐Hard
by
Process
TID
tolerant
Extended
Temp
Range
Cryogenic
31. ASIC
Design
and
Development
ECSS-‐Q-‐ST-‐60-‐02
ASIC/FPGA
development
standard
2016-‐11-‐02
dirk.meier@ideas.no,
h8p://www.ideas.no
31
KO
–
Project
Kick-‐Off
• Contract
• Statement
of
Work
ARS
–
ASIC
Requirements
SpecificaFon
• ASIC
Development
Plan
• ASIC
Requirements
SpecificaFon
• Feasibility
and
Risk
Analysis
PDR
–
Preliminary
Design
Review
• ASIC
Preliminary
Datasheet
• ASIC
VerificaFon
Plan
CDR
–
CriFcal
Design
Review
• ASIC
Design
ValidaFon
Plan
• ASIC
Updated
Datasheet
TRR
–
ASIC
Test
Readiness
Review
• ASIC
engineering
samples
• ASIC
test
system
hardware
QR/AR
–
Quality
and
Acceptance
Review
• ASIC
Design
ValidaFon
Report
• ASIC
Final
Datasheet
32. Summary
2016-‐11-‐02
dirk.meier@ideas.no,
h8p://www.ideas.no
32
IDEAS designs application specific integrated circuits and subsystem for radiation
detection and imaging, with emphasis on sensor and detector readout.
IDEAS has created IP and libraries for radiation hardened and extended
temperature range ASICS and ICs for harsh environment.
We
would
be
happy
to
work
with
YOU
on
your
innovaFons
in
radiaFon
and
imaging
technology.
Thank
you