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Spoiler	
  
2016-­‐11-­‐02	
   dirk.meier@ideas.no,	
  h8p://www.ideas.no	
   1	
  
...now	
  everybody	
  
can	
  build	
  their	
  
spectrometer.	
  
Technology	
  for	
  	
  
RadiaFon	
  DetecFon	
  and	
  Imaging	
  
IDEAS	
  –	
  Integrated	
  Detector	
  Electronics	
  AS	
  
	
  
dirk.meier@ideas.no	
  on	
  behalf	
  of	
  the	
  IDEAS	
  development	
  team	
  
	
  
InformaFon	
  about	
  IDEAS	
  company	
  	
  
h8p://www.ideas.no	
  
	
  
2016-­‐11-­‐02	
   dirk.meier@ideas.no,	
  h8p://www.ideas.no	
   2	
  
IDEAS	
  since	
  1992	
  	
  
2016-­‐11-­‐02	
   dirk.meier@ideas.no,	
  h8p://www.ideas.no	
   3	
  
HQ	
  in	
  Oslo	
  Norway	
  and	
  Resellers	
  in	
  China	
  and	
  Korea	
  
IDEAS	
  Products	
  
2016-­‐11-­‐02	
   dirk.meier@ideas.no,	
  h8p://www.ideas.no	
   4	
  
SoluFons	
  for	
  radiaFon	
  detecFon	
  and	
  imaging	
  
Readout	
  ICs	
  	
  
and	
  ASICs	
  
RadiaFon	
  	
  
Detector	
  Modules	
  
X-­‐ray	
  and	
  Gamma	
  	
  
Cameras	
  
Further	
  informaFon	
  at	
  h8p://www.ideas.no	
  -­‐>	
  Products	
  	
  
ApplicaFons	
  
2016-­‐11-­‐02	
   dirk.meier@ideas.no,	
  h8p://www.ideas.no	
   5	
  
• Hot	
  Spot	
  Locator	
  
• RadiaFon	
  Awareness	
  
Environment	
  
• Nuclear	
  Medicine	
  
• Radiology	
  with	
  x-­‐rays	
  
• Dosimetry	
  in	
  
Radiotherapy	
  
Healthcare	
  
• Nuclear	
  and	
  parFcle	
  
physics	
  
• Neutron	
  faciliFes	
  
Science	
  
• Screening	
  and	
  portal	
  
imaging	
  
• Nuclear	
  proliferaFon	
  
miFgaFon	
  
Security	
  
• RadiaFon	
  Monitoring	
  
• Fundamental	
  physics	
  
• Imaging	
  for	
  science	
  and	
  
Earth	
  observaFon	
  
Space	
  
• Process	
  and	
  flow	
  
tomography	
  
• Food	
  processing	
  for	
  
safety	
  and	
  quality	
  
assurance	
  
Industry	
  
Gamma	
  Camera	
  
2016-­‐11-­‐02	
   dirk.meier@ideas.no,	
  h8p://www.ideas.no	
   6	
  
Detector	
   CZT	
  
FOV	
   12.7	
  cm	
  x	
  12.7	
  cm	
  	
  
Power	
   9	
  W	
  
Weight	
   2	
  kg	
  	
  
Energy	
   18	
  keV	
  to	
  490	
  keV	
  
Energy	
  resoluFon	
   6	
  keV	
  FWHM	
  
Input	
  rate	
  max	
   50	
  kcps	
  per	
  FOV	
  
Output	
  rate	
  max	
   50	
  kcps	
  list	
  mode	
  
Interface	
   Ethernet,	
  API	
  
<	
  3	
  months	
  lead	
  Fme	
  
Configure	
  number	
  and	
  placement	
  of	
  modules	
  
Gamma	
  Camera	
  
2016-­‐11-­‐02	
   dirk.meier@ideas.no,	
  h8p://www.ideas.no	
   7	
  
Gamma	
  Camera	
  
2016-­‐11-­‐02	
   dirk.meier@ideas.no,	
  h8p://www.ideas.no	
   8	
  
XCS	
  –	
  Xray	
  CounFng	
  System	
  
2016-­‐11-­‐02	
   dirk.meier@ideas.no,	
  h8p://www.ideas.no	
   9	
  
Detector	
   CZT	
  	
  
FOV	
   18.2	
  cm	
  x	
  1.28	
  cm	
  	
  
Power	
   12	
  W	
  
Weight	
   3	
  kg	
  	
  
Energy	
   30	
  keV	
  to	
  130	
  keV	
  
Erg.	
  Res.	
   6keV	
  FWHM	
  
Input	
  rate	
   500	
  kcps	
  per	
  pixel	
  
Output	
  rate	
   <1000	
  Hz	
  frames	
  
I/F	
   Ethernet,	
  API	
   OpFonal:	
  3	
  or	
  6	
  	
  energy	
  bins	
  
<	
  3	
  months	
  lead	
  Fme	
  
XCS	
  in	
  Flow	
  Tomograph	
  
2016-­‐11-­‐02	
   dirk.meier@ideas.no,	
  h8p://www.ideas.no	
   10	
  
5	
  XCS	
  units	
  assembled	
  in	
  the	
  flow	
  tomograph	
   Image	
  from	
  phantom	
  
h8p://prototech.no/projects/10503/gamma-­‐ray-­‐tomographer/	
  
LaBr/SiPM/IDE3380	
  
2016-­‐11-­‐02	
   dirk.meier@ideas.no,	
  h8p://www.ideas.no	
   11	
  
Monolithic	
  LaBr/SiPM	
  
Image	
  Univ.	
  College	
  Dublin,	
  
SensL	
  SiPM	
  array	
  16	
  SiPMs	
  
SiPM	
  Readout	
  with	
  IDE3380	
  and	
  Zync	
  ARM	
  
LaBr/SiPM/IDE3380	
  
2016-­‐11-­‐02	
   dirk.meier@ideas.no,	
  h8p://www.ideas.no	
   12	
  
LaBr/SiPM	
  housing	
  
LaBr	
  crystal	
  
SiPM	
  carrier	
  
board	
  
connectors	
  
IDE3380	
  ASIC	
  
Na-­‐22	
  
4%	
  FWHM	
  
511	
  keV	
  
SoNDe	
  SKADI	
  Neutron	
  at	
  ESS	
  
2016-­‐11-­‐02	
   dirk.meier@ideas.no,	
  h8p://www.ideas.no	
   13	
  
Detector	
   Li-­‐Glass	
  scin3llator/H8500	
  
FOV	
  module	
   5	
  x	
  5	
  cm2	
  
Power	
   3W	
  per	
  module	
  
Weight	
   100g	
  w/o	
  detector	
  
Input	
  charge	
   80	
  pC	
  max.	
  
Erg.	
  Res.	
   6keV	
  FWHM	
  
Input	
  rate	
  	
   100kcps	
  per	
  pixel	
  
Output	
  rate	
   1000Hz	
  frames	
  or	
  
50kps	
  list	
  mode	
  
I/F	
   Ethernet,	
  API	
  
h8ps://europeanspallaFonsource.se/arFcle/skadi-­‐diffractometer-­‐enlarging-­‐field-­‐small-­‐angle-­‐neutron-­‐sca8ering	
  
DOI:	
  10.1016/j.nima.2014.04.024	
   RO	
  modules	
  <	
  3	
  month	
  lead	
  Fme	
  
Development	
  System	
  with	
  SiPM/LaBr	
  
2016-­‐11-­‐02	
   dirk.meier@ideas.no,	
  h8p://www.ideas.no	
   14	
  
Readout	
  <	
  1	
  month	
  lead	
  Fme	
  
ASIC	
  Development	
  System	
  
Available	
  for	
  
•  IDE3380	
  (SiPM	
  R/O)	
  
•  VATA64HDR16	
  
•  IDE1163	
  (wire	
  chamber	
  R/O)	
  
•  Other	
  ROICs	
  
2016-­‐11-­‐02	
   dirk.meier@ideas.no,	
  h8p://www.ideas.no	
   15	
  
Stock	
  item	
  
NGRM	
  Space	
  RadiaFon	
  Monitor	
  
2016-­‐11-­‐02	
   dirk.meier@ideas.no,	
  h8p://www.ideas.no	
   16	
  
h8ps://www.ruag.com/fileadmin/ruag/Divisions/Space/Products/Satellite_Instruments/RadiaFon_Monitors/PDF/NGRM_datasheet.pdf	
  
RADEM	
  Space	
  RadiaFon	
  Monitor	
  
2016-­‐11-­‐02	
   dirk.meier@ideas.no,	
  h8p://www.ideas.no	
   17	
  
IC	
  Overview	
  Stock	
  Items	
  
2016-­‐11-­‐02	
   dirk.meier@ideas.no,	
  h8p://www.ideas.no	
   18	
  
Pre-­‐amplifiers	
  and	
  
shapers	
  
VA	
  –	
  Viking	
  ASICs	
  
Pre-­‐amplifiers,	
  shapers,	
  
comparators,	
  counters	
  
VATA	
  and	
  CA	
  –	
  
Triggers	
  and	
  Counters	
  
LNA,	
  ADC,	
  Micro-­‐
controller	
  
IR	
  –	
  Infrared	
  ASICs	
  
Further	
  informaFon	
  at	
  h8p://www.ideas.no/product-­‐category/readout-­‐ics/	
  
SIPHRA	
  IDE3380	
  SiPM	
  ROIC	
  
2016-­‐11-­‐02	
   dirk.meier@ideas.no,	
  h8p://www.ideas.no	
   19	
  
Chip	
  acFve	
  area:	
  7.6	
  mm×6.8	
  mm	
  
Planned	
  Packaging	
  OpFons:	
  PlasFc	
  PQFP120,	
  Bare-­‐Die	
  
DOI:	
  10.13140/RG.2.1.1460.8882	
  
Available	
  from	
  stock	
  
SIPHRA	
  Features	
  and	
  Block	
  Diagram	
  
2016-­‐11-­‐02	
   dirk.meier@ideas.no,	
  h8p://www.ideas.no	
   20	
  
IDE3380	
  (SIPHRA)	
  Features	
  
-­‐	
  16	
  readout	
  channels	
  
16	
  current	
  sensiFve	
  inputs	
  (≤	
  16	
  nC)	

1	
  summing	
  channel	

-­‐	
  Programmable	
  aKenua3on	
  to	
  handle	
  charge	
  up	
  to	
  
-­‐16	
  nC,	
  -­‐8	
  nC,	
  -­‐4	
  nC,	
  -­‐400	
  pC	
  at	
  AIN	
  inputs,	
  or	

+40	
  pC,	
  +4	
  pC,	
  +0.4	
  pC	
  at	
  FIN	
  inputs	

-­‐	
  Programmable	
  shaping	
  3me	
  
200	
  ns,	
  400	
  ns,	
  800	
  ns,	
  1600	
  ns	

-­‐	
  16	
  inputs	
  (AIN)	
  with	
  programmable	
  offset	
  voltage	

-­‐	
  Pulse	
  height	
  spectroscopy	

	
  16	
  shapers	
  followed	
  by	
  track-­‐and-­‐hold	
  
Programmable	
  hold	
  Fming	

	
  Analog	
  and/or	
  12-­‐bit	
  digital	
  readout	
  
3	
  ksps/channel	
  max.	

-­‐	
  Trigger	
  genera3on	

	
  Internal	
  from	
  charge	
  discriminator	
  via	
  	

programmable	
  threshold	
  in	
  every	
  channel	
  
External	
  (trigger	
  on	
  input,	
  trigger	
  on	
  sum)	

-­‐	
  Power	

15	
  mW	
  without	
  CMIS,	
  30	
  mW	
  with	
  CMIS	
  acFve	

	
  Flexible	
  power	
  down	
  scheme	
  of	
  channels	
  or	
  funcFons	

-­‐	
  SEL/SEU	
  radia3on	
  hardened	

-­‐	
  SPI	
  Interface	
  
h8p://www.ideas.no/products/ide3380/	
  
	
  
SIPHRA	
  LaBr/SiPM	
  
2016-­‐11-­‐02	
   dirk.meier@ideas.no,	
  h8p://www.ideas.no	
   21	
  
0	
  
500	
  
1000	
  
1500	
  
2000	
  
2500	
  
3000	
  
3500	
  
4000	
  
0	
  
2000	
  
4000	
  
6000	
  
8000	
  
10000	
  
12000	
  
14000	
  
16000	
  
18000	
  
20000	
  
22000	
  
24000	
  
26000	
  
28000	
  
ADC	
  value	
  
Input	
  charge	
  [pC]	
  (negaFve)	
  
CMIS	
  gain	
  
1/10	
  
CMIS	
  gain	
  
1/100	
  
Na-­‐22	
  
4%	
  FWHM	
  
511	
  keV	
  
RADEM	
  ASIC	
  IDE3466	
  for	
  ESA	
  JUICE	
  
Mission	
  to	
  Jupiter	
  
2016-­‐11-­‐02	
   dirk.meier@ideas.no,	
  h8p://www.ideas.no	
   22	
  
IC	
  front-­‐end	
  readout	
  of	
  array	
  and	
  stacked	
  silicon	
  diodes.	
  
T.A.	
  Stein	
  et	
  al.,	
  IDEAS	
  IDE3466	
  ASIC	
  for	
  RADEM,	
  Proc.	
  SPIE	
  Astro.,	
  Edinburgh,	
  2016.	
  
15980	
  µm	
  
15980	
  µm	
  
IC	
  available	
  from	
  stock	
  
RADEM	
  ASIC	
  IDE3466	
  -­‐	
  Trigger	
  and	
  Shaped	
  Pulse	
  
2016-­‐11-­‐02	
   dirk.meier@ideas.no,	
  h8p://www.ideas.no	
  
23	
  
Response	
  to	
  8pC	
  test	
  charge	
  
RADEM	
  ASIC	
  IDE3466	
  -­‐	
  Coincidence	
  
Pa8ern	
  Units	
  and	
  Counters	
  
2016-­‐11-­‐02	
   dirk.meier@ideas.no,	
  h8p://www.ideas.no	
   24	
  
68-­‐bit	
  	
  
Input	
  
pa8ern	
  Qi	
  
Coincidence	
  Fme	
   EvaluaFon	
  
Programmed	
  68-­‐bit	
  pairs	
  Mi,	
  Vi	
  
masks	
  Mi,	
  and	
  veto	
  bits	
  Vi	
  
22-­‐bit	
  Gray	
  counters	
  
incremenFng,	
  
Log2	
  (4194304)	
  =	
  22	
  
Input	
  charge	
  rate	
  
capability	
  
2016-­‐11-­‐02	
   dirk.meier@ideas.no,	
  h8p://www.ideas.no	
   25	
  
NIRCA	
  –	
  V2	
  
FPA	
  Controller	
  	
  
Programmable	
  sequencer	
  
ECC	
  RAM	
  
16	
  x	
  14-­‐bit,	
  20Msps	
  ADCs	
  
Programmable	
  gain/offset	
  
Programmable	
  bias	
  &	
  
supplies	
  for	
  FPA	
  ROIC	
  
Radhard	
  by	
  design	
  and	
  
process	
  
IC	
  engineering	
  	
  
samples	
  	
  
in	
  stock	
  
Silicon	
  Tracker	
  Readout	
  
2016-­‐11-­‐02	
   dirk.meier@ideas.no,	
  h8p://www.ideas.no	
   26	
  
DAMPE	
  
launched	
  2015-­‐12-­‐17	
  
IDEAS	
  designed	
  FM	
  STK	
  readout	
  	
  
STK	
  has	
  1152	
  chips	
  of	
  IDE1140	
  
	
  
IDEAS	
  also	
  designed	
  FM	
  readout	
  
CZT	
  Sampling	
  Readout	
  
2016-­‐11-­‐02	
   dirk.meier@ideas.no,	
  h8p://www.ideas.no	
   27	
  
Cd109
Cd109
Am247
Co57
R09-­‐2	
  –	
  Noise	
  reducFon	
  ...	
  using	
  VAD_UM	
  V2.2	
  digiFzer	
  ASIC	
  by	
  
Zhong	
  He	
  and	
  Yuefeng	
  Zhu	
  
R10-­‐6	
  -­‐	
  SpaFally	
  Resolved	
  InvesFgaFon	
  of	
  Large	
  CdZnTe	
  Detectors	
  
with	
  a	
  Coplanar	
  Quad-­‐Grid	
  by	
  R.	
  Temminghoff	
  for	
  COBRA	
  
Quality	
  Assurance	
  
2016-­‐11-­‐02	
   dirk.meier@ideas.no,	
  h8p://www.ideas.no	
   28	
  
Design	
  &	
  Development	
  
• Full-­‐custom	
  mixed	
  mode,	
  	
  analogue	
  
and	
  digital	
  IC	
  design	
  
• SchemaFc	
  	
  capture,	
  	
  circuit	
  simulaFon,	
  
process	
  corners	
  (PVT),	
  layout,	
  physical	
  
verificaFon	
  (LVS,	
  DRC),	
  VHDL/Verilog,	
  	
  
behavior	
  simulaFon,	
  synthesis,	
  scan	
  
inserFon,	
  P&R,	
  extracFon,	
  verificaFon	
  
• ECSS-­‐Q-­‐ST-­‐60-­‐02	
  ASIC/FPGA	
  
development,	
  ECSS-­‐M-­‐ST-­‐10	
  Project	
  
planning	
  and	
  implementaFon,	
  IEC	
  
60601	
  Medical	
  electrical	
  safety	
  and	
  
performance	
  
Valida3on	
  &	
  Qualifica3on	
  
• Prototype	
  system	
  design,	
  
verificaFon	
  of	
  the	
  ASIC	
  funcFonal	
  
and	
  performance	
  requirements,	
  if	
  
needed	
  with	
  ionizing	
  radiaFon,	
  
physical	
  and	
  environmental	
  
requirements	
  specificaFons	
  
• MIL-­‐STD	
  883	
  Test	
  method	
  
standard	
  for	
  microcircuits,	
  
radiaFon	
  effects	
  characterizaFon	
  
(SEE,	
  TID)	
  
Manufacture	
  
• Wafer	
  foundry	
  AMS,	
  XFAB,	
  Tower,	
  
TSMC,	
  including	
  engineering	
  services,	
  
if	
  needed	
  (process	
  opFons,	
  dicing,	
  
thinning)	
  
• Lot	
  acceptance	
  tests	
  (LAT),	
  wafer	
  level	
  
probe	
  tesFng,	
  packaging	
  services	
  
• AMS	
  design	
  and	
  producFon	
  is	
  ISO/TS	
  
16949:2009	
  and	
  ISO	
  14001:2004/Cor	
  
1:2009	
  
• CMOS	
  DSM	
  
• 10	
  Mrad	
  
TID	
  –	
  Total	
  Ionizing	
  Dose	
  
Latch-­‐up	
  immune	
  
SEL	
  –	
  Single	
  Event	
  Latch-­‐up	
  
• LETth	
  at	
  50	
  MeVcm2/
mg	
  
• Triple	
  Redundancy	
  
• Parity	
  
SEU	
  –	
  Single	
  Event	
  Upset	
  
• Filters	
  
• Digital	
  gate	
  I/O	
  
sensiFvity	
  
SET	
  –	
  Single	
  Event	
  Transient	
  
• Design	
  for	
  calibraFon	
  
over	
  wide	
  
temperature	
  range	
  
• Temperature	
  stable	
  
bias	
  reference	
  
Cryogenic	
  OperaFon	
  
IC	
  Design	
  for	
  Extreme	
  RadiaFon	
  &	
  Temperatures	
  
2016-­‐11-­‐02	
   dirk.meier@ideas.no,	
  h8p://www.ideas.no	
   29	
  
ASIC	
  IP	
  Library	
  
2016-­‐11-­‐02	
   dirk.meier@ideas.no,	
  h8p://www.ideas.no	
   30	
  
Analogue	
  processing	
   Converters	
  &	
  Power	
  
Charge	
  SensiFve	
  
Amplifiers	
  (CSA)	
  
Shaping	
  Amplifiers	
  
Pre-­‐Amplifiers	
  
Current	
  Conveyor	
  
Fast	
  Trigger	
  Generators	
  
Analogue-­‐to-­‐Digital	
  
Converters	
  (ADC)	
  
Digital-­‐to-­‐Analogue	
  
Converters	
  (DAC)	
  
Sampling	
  Pipeline	
  
Time-­‐to-­‐Digital	
  Converters	
  
(TDC)	
  
Trigger	
  Processing	
  
StaFc	
  RAM	
  (SRAM)	
  with	
  
EDAC	
  
Custom	
  Microcontroller	
  
(μC)	
  
Buffer	
  Amplifiers	
  
Programmable	
  Trigger	
  
Coincidence	
  Logic	
  
External	
  Control	
  
Interfaces	
  (SPI,	
  etc.)	
  
Custom	
  High-­‐Speed	
  Serial	
  
Data	
  Links	
  
Data	
  Encoders	
  	
  
(8b/10b	
  etc.)	
  
Digital	
  
Fast	
  Mono-­‐Stable	
  
MulFvibrators	
  
Reference	
  and	
  Bias	
  
Generators	
  
Low-­‐Dropout	
  Regulators	
  
(LDO)	
  
Full-­‐Custom	
  Digital	
  
Rad-­‐Hard	
  
Triple-­‐Redundant	
  
Parity	
  Check	
  
	
  
Rad-­‐Hard	
  by	
  Design	
  
SEL	
  immune	
  
SEU	
  tolerant	
  
	
  
Rad-­‐Hard	
  by	
  Process	
  
TID	
  tolerant	
  
	
  
Extended	
  Temp	
  Range	
  
Cryogenic	
  
ASIC	
  Design	
  and	
  Development	
  
ECSS-­‐Q-­‐ST-­‐60-­‐02	
  ASIC/FPGA	
  development	
  standard	
  
2016-­‐11-­‐02	
   dirk.meier@ideas.no,	
  h8p://www.ideas.no	
   31	
  
KO	
  –	
  Project	
  Kick-­‐Off	
  
• Contract	
  
• Statement	
  of	
  Work	
  
ARS	
  –	
  ASIC	
  Requirements	
  
SpecificaFon	
  
• ASIC	
  Development	
  Plan	
  
• ASIC	
  Requirements	
  
SpecificaFon	
  
• Feasibility	
  and	
  Risk	
  
Analysis	
  
PDR	
  –	
  Preliminary	
  
Design	
  Review	
  
• ASIC	
  Preliminary	
  
Datasheet	
  
• ASIC	
  VerificaFon	
  
Plan	
  
CDR	
  –	
  CriFcal	
  
Design	
  Review	
  
• ASIC	
  Design	
  
ValidaFon	
  Plan	
  
• ASIC	
  Updated	
  
Datasheet	
  
TRR	
  –	
  ASIC	
  Test	
  
Readiness	
  Review	
  
• ASIC	
  engineering	
  
samples	
  
• ASIC	
  test	
  system	
  
hardware	
  
QR/AR	
  –	
  Quality	
  
and	
  Acceptance	
  
Review	
  
• ASIC	
  Design	
  
ValidaFon	
  Report	
  
• ASIC	
  Final	
  
Datasheet	
  
Summary	
  
2016-­‐11-­‐02	
   dirk.meier@ideas.no,	
  h8p://www.ideas.no	
   32	
  
IDEAS designs application specific integrated circuits and subsystem for radiation
detection and imaging, with emphasis on sensor and detector readout.

IDEAS has created IP and libraries for radiation hardened and extended
temperature range ASICS and ICs for harsh environment.
	
  
We	
  would	
  be	
  happy	
  to	
  work	
  with	
  YOU	
  on	
  your	
  innovaFons	
  	
  
in	
  radiaFon	
  and	
  imaging	
  technology.	
  
Thank	
  you	
  

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IDEAS Technology for Radiation Detection and Imaging, Year 2016

  • 1. Spoiler   2016-­‐11-­‐02   dirk.meier@ideas.no,  h8p://www.ideas.no   1   ...now  everybody   can  build  their   spectrometer.  
  • 2. Technology  for     RadiaFon  DetecFon  and  Imaging   IDEAS  –  Integrated  Detector  Electronics  AS     dirk.meier@ideas.no  on  behalf  of  the  IDEAS  development  team     InformaFon  about  IDEAS  company     h8p://www.ideas.no     2016-­‐11-­‐02   dirk.meier@ideas.no,  h8p://www.ideas.no   2  
  • 3. IDEAS  since  1992     2016-­‐11-­‐02   dirk.meier@ideas.no,  h8p://www.ideas.no   3   HQ  in  Oslo  Norway  and  Resellers  in  China  and  Korea  
  • 4. IDEAS  Products   2016-­‐11-­‐02   dirk.meier@ideas.no,  h8p://www.ideas.no   4   SoluFons  for  radiaFon  detecFon  and  imaging   Readout  ICs     and  ASICs   RadiaFon     Detector  Modules   X-­‐ray  and  Gamma     Cameras   Further  informaFon  at  h8p://www.ideas.no  -­‐>  Products    
  • 5. ApplicaFons   2016-­‐11-­‐02   dirk.meier@ideas.no,  h8p://www.ideas.no   5   • Hot  Spot  Locator   • RadiaFon  Awareness   Environment   • Nuclear  Medicine   • Radiology  with  x-­‐rays   • Dosimetry  in   Radiotherapy   Healthcare   • Nuclear  and  parFcle   physics   • Neutron  faciliFes   Science   • Screening  and  portal   imaging   • Nuclear  proliferaFon   miFgaFon   Security   • RadiaFon  Monitoring   • Fundamental  physics   • Imaging  for  science  and   Earth  observaFon   Space   • Process  and  flow   tomography   • Food  processing  for   safety  and  quality   assurance   Industry  
  • 6. Gamma  Camera   2016-­‐11-­‐02   dirk.meier@ideas.no,  h8p://www.ideas.no   6   Detector   CZT   FOV   12.7  cm  x  12.7  cm     Power   9  W   Weight   2  kg     Energy   18  keV  to  490  keV   Energy  resoluFon   6  keV  FWHM   Input  rate  max   50  kcps  per  FOV   Output  rate  max   50  kcps  list  mode   Interface   Ethernet,  API   <  3  months  lead  Fme   Configure  number  and  placement  of  modules  
  • 7. Gamma  Camera   2016-­‐11-­‐02   dirk.meier@ideas.no,  h8p://www.ideas.no   7  
  • 8. Gamma  Camera   2016-­‐11-­‐02   dirk.meier@ideas.no,  h8p://www.ideas.no   8  
  • 9. XCS  –  Xray  CounFng  System   2016-­‐11-­‐02   dirk.meier@ideas.no,  h8p://www.ideas.no   9   Detector   CZT     FOV   18.2  cm  x  1.28  cm     Power   12  W   Weight   3  kg     Energy   30  keV  to  130  keV   Erg.  Res.   6keV  FWHM   Input  rate   500  kcps  per  pixel   Output  rate   <1000  Hz  frames   I/F   Ethernet,  API   OpFonal:  3  or  6    energy  bins   <  3  months  lead  Fme  
  • 10. XCS  in  Flow  Tomograph   2016-­‐11-­‐02   dirk.meier@ideas.no,  h8p://www.ideas.no   10   5  XCS  units  assembled  in  the  flow  tomograph   Image  from  phantom   h8p://prototech.no/projects/10503/gamma-­‐ray-­‐tomographer/  
  • 11. LaBr/SiPM/IDE3380   2016-­‐11-­‐02   dirk.meier@ideas.no,  h8p://www.ideas.no   11   Monolithic  LaBr/SiPM   Image  Univ.  College  Dublin,   SensL  SiPM  array  16  SiPMs   SiPM  Readout  with  IDE3380  and  Zync  ARM  
  • 12. LaBr/SiPM/IDE3380   2016-­‐11-­‐02   dirk.meier@ideas.no,  h8p://www.ideas.no   12   LaBr/SiPM  housing   LaBr  crystal   SiPM  carrier   board   connectors   IDE3380  ASIC   Na-­‐22   4%  FWHM   511  keV  
  • 13. SoNDe  SKADI  Neutron  at  ESS   2016-­‐11-­‐02   dirk.meier@ideas.no,  h8p://www.ideas.no   13   Detector   Li-­‐Glass  scin3llator/H8500   FOV  module   5  x  5  cm2   Power   3W  per  module   Weight   100g  w/o  detector   Input  charge   80  pC  max.   Erg.  Res.   6keV  FWHM   Input  rate     100kcps  per  pixel   Output  rate   1000Hz  frames  or   50kps  list  mode   I/F   Ethernet,  API   h8ps://europeanspallaFonsource.se/arFcle/skadi-­‐diffractometer-­‐enlarging-­‐field-­‐small-­‐angle-­‐neutron-­‐sca8ering   DOI:  10.1016/j.nima.2014.04.024   RO  modules  <  3  month  lead  Fme  
  • 14. Development  System  with  SiPM/LaBr   2016-­‐11-­‐02   dirk.meier@ideas.no,  h8p://www.ideas.no   14   Readout  <  1  month  lead  Fme  
  • 15. ASIC  Development  System   Available  for   •  IDE3380  (SiPM  R/O)   •  VATA64HDR16   •  IDE1163  (wire  chamber  R/O)   •  Other  ROICs   2016-­‐11-­‐02   dirk.meier@ideas.no,  h8p://www.ideas.no   15   Stock  item  
  • 16. NGRM  Space  RadiaFon  Monitor   2016-­‐11-­‐02   dirk.meier@ideas.no,  h8p://www.ideas.no   16   h8ps://www.ruag.com/fileadmin/ruag/Divisions/Space/Products/Satellite_Instruments/RadiaFon_Monitors/PDF/NGRM_datasheet.pdf  
  • 17. RADEM  Space  RadiaFon  Monitor   2016-­‐11-­‐02   dirk.meier@ideas.no,  h8p://www.ideas.no   17  
  • 18. IC  Overview  Stock  Items   2016-­‐11-­‐02   dirk.meier@ideas.no,  h8p://www.ideas.no   18   Pre-­‐amplifiers  and   shapers   VA  –  Viking  ASICs   Pre-­‐amplifiers,  shapers,   comparators,  counters   VATA  and  CA  –   Triggers  and  Counters   LNA,  ADC,  Micro-­‐ controller   IR  –  Infrared  ASICs   Further  informaFon  at  h8p://www.ideas.no/product-­‐category/readout-­‐ics/  
  • 19. SIPHRA  IDE3380  SiPM  ROIC   2016-­‐11-­‐02   dirk.meier@ideas.no,  h8p://www.ideas.no   19   Chip  acFve  area:  7.6  mm×6.8  mm   Planned  Packaging  OpFons:  PlasFc  PQFP120,  Bare-­‐Die   DOI:  10.13140/RG.2.1.1460.8882   Available  from  stock  
  • 20. SIPHRA  Features  and  Block  Diagram   2016-­‐11-­‐02   dirk.meier@ideas.no,  h8p://www.ideas.no   20   IDE3380  (SIPHRA)  Features   -­‐  16  readout  channels   16  current  sensiFve  inputs  (≤  16  nC) 1  summing  channel -­‐  Programmable  aKenua3on  to  handle  charge  up  to   -­‐16  nC,  -­‐8  nC,  -­‐4  nC,  -­‐400  pC  at  AIN  inputs,  or +40  pC,  +4  pC,  +0.4  pC  at  FIN  inputs -­‐  Programmable  shaping  3me   200  ns,  400  ns,  800  ns,  1600  ns -­‐  16  inputs  (AIN)  with  programmable  offset  voltage -­‐  Pulse  height  spectroscopy  16  shapers  followed  by  track-­‐and-­‐hold   Programmable  hold  Fming  Analog  and/or  12-­‐bit  digital  readout   3  ksps/channel  max. -­‐  Trigger  genera3on  Internal  from  charge  discriminator  via   programmable  threshold  in  every  channel   External  (trigger  on  input,  trigger  on  sum) -­‐  Power 15  mW  without  CMIS,  30  mW  with  CMIS  acFve  Flexible  power  down  scheme  of  channels  or  funcFons -­‐  SEL/SEU  radia3on  hardened -­‐  SPI  Interface   h8p://www.ideas.no/products/ide3380/    
  • 21. SIPHRA  LaBr/SiPM   2016-­‐11-­‐02   dirk.meier@ideas.no,  h8p://www.ideas.no   21   0   500   1000   1500   2000   2500   3000   3500   4000   0   2000   4000   6000   8000   10000   12000   14000   16000   18000   20000   22000   24000   26000   28000   ADC  value   Input  charge  [pC]  (negaFve)   CMIS  gain   1/10   CMIS  gain   1/100   Na-­‐22   4%  FWHM   511  keV  
  • 22. RADEM  ASIC  IDE3466  for  ESA  JUICE   Mission  to  Jupiter   2016-­‐11-­‐02   dirk.meier@ideas.no,  h8p://www.ideas.no   22   IC  front-­‐end  readout  of  array  and  stacked  silicon  diodes.   T.A.  Stein  et  al.,  IDEAS  IDE3466  ASIC  for  RADEM,  Proc.  SPIE  Astro.,  Edinburgh,  2016.   15980  µm   15980  µm   IC  available  from  stock  
  • 23. RADEM  ASIC  IDE3466  -­‐  Trigger  and  Shaped  Pulse   2016-­‐11-­‐02   dirk.meier@ideas.no,  h8p://www.ideas.no   23   Response  to  8pC  test  charge  
  • 24. RADEM  ASIC  IDE3466  -­‐  Coincidence   Pa8ern  Units  and  Counters   2016-­‐11-­‐02   dirk.meier@ideas.no,  h8p://www.ideas.no   24   68-­‐bit     Input   pa8ern  Qi   Coincidence  Fme   EvaluaFon   Programmed  68-­‐bit  pairs  Mi,  Vi   masks  Mi,  and  veto  bits  Vi   22-­‐bit  Gray  counters   incremenFng,   Log2  (4194304)  =  22   Input  charge  rate   capability  
  • 25. 2016-­‐11-­‐02   dirk.meier@ideas.no,  h8p://www.ideas.no   25   NIRCA  –  V2   FPA  Controller     Programmable  sequencer   ECC  RAM   16  x  14-­‐bit,  20Msps  ADCs   Programmable  gain/offset   Programmable  bias  &   supplies  for  FPA  ROIC   Radhard  by  design  and   process   IC  engineering     samples     in  stock  
  • 26. Silicon  Tracker  Readout   2016-­‐11-­‐02   dirk.meier@ideas.no,  h8p://www.ideas.no   26   DAMPE   launched  2015-­‐12-­‐17   IDEAS  designed  FM  STK  readout     STK  has  1152  chips  of  IDE1140     IDEAS  also  designed  FM  readout  
  • 27. CZT  Sampling  Readout   2016-­‐11-­‐02   dirk.meier@ideas.no,  h8p://www.ideas.no   27   Cd109 Cd109 Am247 Co57 R09-­‐2  –  Noise  reducFon  ...  using  VAD_UM  V2.2  digiFzer  ASIC  by   Zhong  He  and  Yuefeng  Zhu   R10-­‐6  -­‐  SpaFally  Resolved  InvesFgaFon  of  Large  CdZnTe  Detectors   with  a  Coplanar  Quad-­‐Grid  by  R.  Temminghoff  for  COBRA  
  • 28. Quality  Assurance   2016-­‐11-­‐02   dirk.meier@ideas.no,  h8p://www.ideas.no   28   Design  &  Development   • Full-­‐custom  mixed  mode,    analogue   and  digital  IC  design   • SchemaFc    capture,    circuit  simulaFon,   process  corners  (PVT),  layout,  physical   verificaFon  (LVS,  DRC),  VHDL/Verilog,     behavior  simulaFon,  synthesis,  scan   inserFon,  P&R,  extracFon,  verificaFon   • ECSS-­‐Q-­‐ST-­‐60-­‐02  ASIC/FPGA   development,  ECSS-­‐M-­‐ST-­‐10  Project   planning  and  implementaFon,  IEC   60601  Medical  electrical  safety  and   performance   Valida3on  &  Qualifica3on   • Prototype  system  design,   verificaFon  of  the  ASIC  funcFonal   and  performance  requirements,  if   needed  with  ionizing  radiaFon,   physical  and  environmental   requirements  specificaFons   • MIL-­‐STD  883  Test  method   standard  for  microcircuits,   radiaFon  effects  characterizaFon   (SEE,  TID)   Manufacture   • Wafer  foundry  AMS,  XFAB,  Tower,   TSMC,  including  engineering  services,   if  needed  (process  opFons,  dicing,   thinning)   • Lot  acceptance  tests  (LAT),  wafer  level   probe  tesFng,  packaging  services   • AMS  design  and  producFon  is  ISO/TS   16949:2009  and  ISO  14001:2004/Cor   1:2009  
  • 29. • CMOS  DSM   • 10  Mrad   TID  –  Total  Ionizing  Dose   Latch-­‐up  immune   SEL  –  Single  Event  Latch-­‐up   • LETth  at  50  MeVcm2/ mg   • Triple  Redundancy   • Parity   SEU  –  Single  Event  Upset   • Filters   • Digital  gate  I/O   sensiFvity   SET  –  Single  Event  Transient   • Design  for  calibraFon   over  wide   temperature  range   • Temperature  stable   bias  reference   Cryogenic  OperaFon   IC  Design  for  Extreme  RadiaFon  &  Temperatures   2016-­‐11-­‐02   dirk.meier@ideas.no,  h8p://www.ideas.no   29  
  • 30. ASIC  IP  Library   2016-­‐11-­‐02   dirk.meier@ideas.no,  h8p://www.ideas.no   30   Analogue  processing   Converters  &  Power   Charge  SensiFve   Amplifiers  (CSA)   Shaping  Amplifiers   Pre-­‐Amplifiers   Current  Conveyor   Fast  Trigger  Generators   Analogue-­‐to-­‐Digital   Converters  (ADC)   Digital-­‐to-­‐Analogue   Converters  (DAC)   Sampling  Pipeline   Time-­‐to-­‐Digital  Converters   (TDC)   Trigger  Processing   StaFc  RAM  (SRAM)  with   EDAC   Custom  Microcontroller   (μC)   Buffer  Amplifiers   Programmable  Trigger   Coincidence  Logic   External  Control   Interfaces  (SPI,  etc.)   Custom  High-­‐Speed  Serial   Data  Links   Data  Encoders     (8b/10b  etc.)   Digital   Fast  Mono-­‐Stable   MulFvibrators   Reference  and  Bias   Generators   Low-­‐Dropout  Regulators   (LDO)   Full-­‐Custom  Digital   Rad-­‐Hard   Triple-­‐Redundant   Parity  Check     Rad-­‐Hard  by  Design   SEL  immune   SEU  tolerant     Rad-­‐Hard  by  Process   TID  tolerant     Extended  Temp  Range   Cryogenic  
  • 31. ASIC  Design  and  Development   ECSS-­‐Q-­‐ST-­‐60-­‐02  ASIC/FPGA  development  standard   2016-­‐11-­‐02   dirk.meier@ideas.no,  h8p://www.ideas.no   31   KO  –  Project  Kick-­‐Off   • Contract   • Statement  of  Work   ARS  –  ASIC  Requirements   SpecificaFon   • ASIC  Development  Plan   • ASIC  Requirements   SpecificaFon   • Feasibility  and  Risk   Analysis   PDR  –  Preliminary   Design  Review   • ASIC  Preliminary   Datasheet   • ASIC  VerificaFon   Plan   CDR  –  CriFcal   Design  Review   • ASIC  Design   ValidaFon  Plan   • ASIC  Updated   Datasheet   TRR  –  ASIC  Test   Readiness  Review   • ASIC  engineering   samples   • ASIC  test  system   hardware   QR/AR  –  Quality   and  Acceptance   Review   • ASIC  Design   ValidaFon  Report   • ASIC  Final   Datasheet  
  • 32. Summary   2016-­‐11-­‐02   dirk.meier@ideas.no,  h8p://www.ideas.no   32   IDEAS designs application specific integrated circuits and subsystem for radiation detection and imaging, with emphasis on sensor and detector readout. IDEAS has created IP and libraries for radiation hardened and extended temperature range ASICS and ICs for harsh environment.   We  would  be  happy  to  work  with  YOU  on  your  innovaFons     in  radiaFon  and  imaging  technology.   Thank  you