I-Bytes Technology Industry

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I-Bytes
Technology
December Edition 2019
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Table of Contents
1. Financial, M & A Updates..................................................................................................................................1
2. Solution Updates................................................................................................................................................10
3. Rewards and Recognition Updates..................................................................................................................66
4. Customer Success Updates...............................................................................................................................85
5. Partnership Ecosystem Updates......................................................................................................................91
6. Miscellaneous Updates....................................................................................................................................115
7. Event Updates..................................................................................................................................................116

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Financial, M & A Updates
Technology Industry

Financial, M&A Updates
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Agilent Technologies (USA) Reports Fourth-Quarter and
Fiscal Year 2019 Financial Results
Fourth-quarter fiscal year 2019
• Revenue of $1.37 billion represents 6% reported growth; and up 4% on a core
basis led by strong results from the Agilent CrossLab Group and the Diagnostics
and Genomics Group
• GAAP net income of $194 million with EPS of 62 cents, up 2% year over year
• Non-GAAP net income of $277 million with EPS of 89 cents, up 10% year
over year
Fiscal year 2019
• Fiscal year 2019 revenue of $5.16 billion delivers 5% reported growth and a
5% increase in core revenue over fiscal year 2018
• Full-year GAAP net income of $1.07 billion with EPS of $3.37, up 247% year
over year
• Non-GAAP net income of $989 million with EPS of $3.11, up 11% year over
year
Outlook
• Fiscal year 2020 revenue expected in the range of $5.50 billion to $5.55
billion, representing core growth of 4% to 5%. Fiscal year 2020 non-GAAP
earnings guidance of $3.38 to $3.43 per share
• Fiscal first-quarter revenue guidance of $1.340 billion to $1.355 billion,
representing core revenue growth of 2.5% to 3.5%. Fiscal first-quarter
non-GAAP earnings guidance of 80 cents to 81 cents per share
Executive Commentary
"Agilent's fourth-quarter results cap off a very solid 2019 and reflect the
broad-based business we've built over the last five years," said Agilent
president and CEO. "Based on what we've been able to achieve in 2019, I'm
convinced we're in an exceptionally strong position for the future."
Description
1

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Analog Devices (USA) Reports Fourth Quarter and Fiscal
2019 Results
• Revenue was $1.44 billion for the fourth quarter and $6 billion for
fiscal 2019
• Operating cash flow was $2.3 billion and free cash flow was $2
billion for fiscal 2019
• Returned over $370 million to shareholders in the fourth quarter,
and nearly $1.4 billion for fiscal 2019 or over 120% of free cash flow
after debt payments
• Diluted earnings per share of $0.74 in Fourth Quarter. Adjusted
Diluted earnings per share of $1.19 in fourth quarter.
• Gross Margin of $942 million in Fourth Quarter and Adjusted
Gross Margin of $987 million in Fourth Quarter.
• Gross margin percentage of 65.3% in Fourth Quarter and Adjusted
Gross Margin percentage of 38.8% in Fourth Quarter.
• The ADI Board of Directors has declared a quarterly cash dividend
of $0.54 per outstanding share of common stock. The dividend will
be paid on December 17, 2019 to all shareholders of record at the
close of business on December 6, 2019.
“ADI delivered solid fourth quarter and full-year results amidst
continued trade and macro uncertainty,” said President and CEO.
“Over the course of the year, we generated revenue of $6 billion
and effectively managed costs, while continuing to prioritize
strategic investments to drive innovation. Our strong margins and
cash flow reflect the resiliency of our business model, which
enabled us to return nearly $1.4 billion to shareholders, or over
120% of free cash flow after debt payments.”
Description
2

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Applied Materials (USA) Announces Fourth Quarter and
Fiscal Year 2019 Results
Fourth Quarter Results
• Applied generated revenue of $3.75 billion. On a GAAP basis, the company
recorded gross margin of 43.5 percent, operating income of $864 million or
23.0 percent of net sales, and earnings per share (EPS) of $0.75.
• On a non-GAAP adjusted basis, the company reported gross margin of 43.8
percent, operating income of $888 million or 23.7 percent of net sales, and
EPS of $0.80.
• The company returned $694 million to shareholders including $500 million
in share repurchases and dividends of $194 million.
Full Year Results
• In fiscal 2019, Applied generated revenue of $14.61 billion. On a GAAP
basis, the company recorded gross margin of 43.7 percent, operating income
of $3.35 billion or 22.9 percent of net sales, and EPS of $2.86
• On a non-GAAP adjusted basis, the company reported gross margin of 44.0
percent, operating income of $3.43 billion or 23.5 percent of net sales, and
EPS of $3.04.
• The company generated $3.25 billion in cash from operations, paid
dividends of $771 million and used $2.40 billion to repurchase 60 million
shares of common stock.
“Applied Materials’ fourth quarter results reflect a healthy uptick in
demand for semiconductor equipment, combined with strong execution
across the company,” said President and CEO. “The semiconductor
industry is increasingly adopting a new playbook for improving chip
performance, power, area and cost, and we are investing in unique
solutions to enable our customers’ success in the AI-Big Data era.”
Description
3

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Autodesk, Inc. (USA) Announces Fiscal 2020 Third Quarter
Results
• Total ARR was $3.22 billion, an increase of 28 percent as reported, and on a constant currency basis. Acquisitions from the
fourth quarter of last year contributed $113 million or 4 percentage points of the growth. On a sequential basis, total ARR
increased 5 percent as reported, and 6 percent on a constant currency basis.
• Subscription plan ARR was $2.86 billion, an increase of 49 percent as reported, and 50 percent on a constant currency basis.
Acquisitions from the fourth quarter of last year contributed $113 million or 6 percentage points of the growth. On a
sequential basis, subscription plan ARR increased 8 percent as reported, and on a constant currency basis. Subscription plan
ARR includes $597 million related to the maintenance-to-subscription (M2S) program.
• Maintenance plan ARR was $365 million, a decrease of 39 percent as reported, and 40 percent on a constant currency basis.
On a sequential basis, maintenance plan ARR decreased 12 percent as reported, and on a constant currency basis.
• Core ARR increased 23 percent to $2.99 billion. On a sequential basis, core ARR increased 5 percent.
• Cloud ARR increased 164 percent to $232 million. Acquisitions from the fourth quarter of last year contributed $113 million
or 128 percentage points of the growth. On a sequential basis, total cloud ARR increased 12 percent.
• Total billings increased 55 percent to $1.01 billion.
• Total revenue was $843 million, an increase of 28 percent as reported, and on a constant currency basis. Acquisitions from
the fourth quarter of last year contributed $29 million or 4 percent of the growth.
• Net revenue retention rate was within the range of 110 to 120 percent.
• Total recurring revenue in the third quarter was 96 percent of total revenue, consistent with the third quarter last year.
• GAAP operating income was $111 million compared to $15 million in the third quarter last year. GAAP operating margin
was 13 percent, up 11 percentage points.
• Total non-GAAP operating income was $225 million compared to $92 million in the third quarter last year. Non-GAAP
operating margin was 27 percent, up 13 percentage points.
• GAAP diluted net income per share was $0.30, compared to GAAP diluted net loss per share of $(0.11) in the third quarter
last year.
• Non-GAAP diluted net income per share was $0.78, compared to non-GAAP diluted net income per share of $0.29 in the
third quarter last year.
• Deferred revenue increased 35 percent to $2.42 billion. Unbilled deferred revenue was $549 million, an increase of $99
million compared to the third quarter of last year. Remaining performance obligations (RPO), or the sum of total billed and
unbilled deferred revenue, totaled $2.97 billion, an increase of 32 percent. Current RPO totaled $2.05 billion, up 23 percent.
• Cash flow from operating activities was $276 million, an increase of $237 million compared to the third quarter last year.
Free cash flow was $267 million, an increase of $240 million compared to the third quarter last year.
"Our strong performance continued in Q3 as revenue, billings, ARR, earnings and free cash flow came in above
expectations," said Autodesk president and CEO. "We continue to demonstrate the cash generating power of our
business model, and this quarter drove a record last twelve months free cash flow of nearly $1 billion. The breadth and
depth of our product portfolio in Construction paved the way for another strong quarter. In Manufacturing, we continue
to displace competitors and grow faster than the overall market."
Description
4

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Motive Partners Acquires Majority Interest in Investment
Services Business of Fiserv (USA)
Motive Partners, a private equity firm focused on technology-enabled companies that
power the financial services industry, and Fiserv, Inc., a leading global provider of
payments and financial services technology solutions, have entered into a definitive
agreement under which Motive Partners-led investors will acquire up to 60% of the
Investment Services business of Fiserv. Retaining a 40% equity interest in the business,
Fiserv will receive approximately $510 million in net after-tax proceeds. The
Investment Services business is a leading technology provider for key segments of the
wealth and asset management industry. Its scalable, integrated platform delivers
mission-critical, end-to-end software solutions for the front, middle and back office. As
a provider of a premier platform for the industry, the Investment Services business
serves a blue-chip customer base in a market with favorable macro trends and the
potential to accelerate growth as a standalone business. Going forward, the business
will benefit from the experience and expertise of Fiserv, Motive Partners and Cannae
Holdings in growing scaled financial technology businesses and will remain committed
to delivering market-leading wealth management capabilities through innovative,
adviser-centric technology solutions. The newly formed joint venture will continue to
be led by Cheryl Nash, President of Investment Services at Fiserv. Upon the closing of
the transaction, Rob Heyvaert, Founder and Managing Partner of Motive Partners, will
serve as Executive Chairman of the joint venture. William P. Foley II, Executive
Chairman of Cannae Holdings, Dun & Bradstreet and Black Knight and Alvi Abuaf,
lead Industry Partner for Motive Partners, will also join the Board.
“We are delighted to be joining forces with Rob and Motive Partners to enhance
and accelerate Investment Services’ leadership position,” said Chairman and Chief
Executive Officer of Fiserv. “The new joint venture will increase our collective
focus on growth and value, while creating more opportunities for clients, associates
and shareholders.”
Description
5

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Lenovo (Hong Kong) Q2 Momentum Powered by 9th Consecutive YOY Quarterly
Revenue Growth, Strong, Positive PTI and Net Income Growth
• Group revenue grew year-on-year for the ninth
consecutive quarter, reaching US$13.5 billion
• Pre-tax Income (PTI) grew 45% year-on-year to US$310
million
• Net income up 20% year-on-year to US$202 million
• Lenovo continues to be the world’s #1 player in the
global PC market with record shipments of 17.3 million
units, including double-digit premium segments growth
• Software and services revenue* up 35% year-on-year to
US$883 million
• Basic earnings per share for the second quarter were 1.69
US cents or 13.23 HK cents. Lenovo’s Board of Directors
declared an interim dividend of 6.3 HK cents per share.
“During the quarter we were pleased to see our growth
momentum deliver continued solid financial
performance amidst a complex and dynamic global
trading environment. This success is a testament to our
commitment to innovation, to our customers across 180
markets around the world, and to how the world
continues to embrace our vision to deliver smarter
technology for all,” said Lenovo Chairman and CEO.
Description
6

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NVIDIA (USA) Announces Financial Results for Third Quarter
Fiscal 2020
• Revenue for the third quarter ended Oct. 27, 2019, of $3.01 billion compared with $3.18 billion a
year earlier and $2.58 billion in the previous quarter.
• GAAP earnings per diluted share for the quarter were $1.45, compared with $1.97 a year ago and
$0.90 in the previous quarter.
• Non-GAAP earnings per diluted share were $1.78, compared with $1.84 a year earlier and $1.24 in
the previous quarter.
NVIDIA’s outlook for the fourth quarter of fiscal 2020 does not include any contribution from the
pending acquisition of Mellanox and is as follows:
• Revenue is expected to be $2.95 billion, plus or minus 2 percent. Strong sequential growth is
expected in Data Center, offset by a seasonal decline in GeForce® notebook GPUs and SoC
modules for gaming platforms.
• GAAP and non-GAAP gross margins are expected to be 64.1 percent and 64.5 percent,
respectively, plus or minus 50 basis points.
• GAAP and non-GAAP operating expenses are expected to be approximately $1.02 billion and
$805 million, respectively.
• GAAP and non-GAAP other income and expense are both expected to be income of approximately
$25 million.
• GAAP and non-GAAP tax rates are both expected to be 9 percent, plus or minus 1 percent,
excluding any discrete items. GAAP discrete items include excess tax benefits or deficiencies
related to stock-based compensation, which are expected to generate variability on a quarter by
quarter basis.
“Our gaming business and demand from hyperscale customers powered Q3’s results,“ said
Founder and CEO of NVIDIA. “The realism of computer graphics is taking a giant leap forward
with NVIDIA RTX. This quarter, we have laid the foundation for where AI will ultimately make
the greatest impact. We extended our reach beyond the cloud, to the edge, where
GPU-accelerated 5G, AI and IoT will revolutionize the world’s largest industries. We see strong
data center growth ahead, driven by the rise of conversational AI and inference.”
Description
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Skyworks (USA) Reports Q4 And Full Year Fy19 Results
• Delivers Q4 Revenue of $827 Million with GAAP Diluted EPS of $1.22; Non-GAAP
Diluted EPS of $1.52
• Posts FY19 Revenue of $3.377 Billion with GAAP Diluted EPS of $4.89; Non-GAAP
Diluted EPS of $6.17
• Drives $1.367 Billion in Annual Operating Cash Flow, Up 8% from FY18
• Returned $932 Million to Shareholders via Dividends and Repurchase of 8.9 Million
Shares in FY19
• Guides to Sequential Revenue and Earnings Growth in Q1 FY20
Fourth Fiscal Quarter Business Highlights
• Accelerated ramp of Sky5® portfolio supporting multiple 5G launches
• Powered Samsung’s suite of 4G mobile devices and their first foldable 5G smartphone
• Enabled LG’s V50ThinQ™ flagship 5G handset featuring an OLED display and dual
screens
• Supported leading infrastructure customers with 5G small cell architectures
• Secured Wi-Fi 6 design wins with Netgear in their Orbi™ and Nighthawk platforms
• Delivered LTE-powered IoT engines across Sierra Wireless industrial gateways and
transportation platforms
• Commenced volume production of high-performance mesh network connectivity modules
for Amazon, Juniper and Ruckus
• Ramped fully integrated LTE solutions with major automotive manufacturers
• Shipped Zigbee® ultra-low power devices for a tier-one home security provider
• Expanded reach at Sonos, enabling their indoor/outdoor portable smart speakers
• Introduced cognitive chipsets for ultra-low latency, next-generation wireless gaming
headsets
“Skyworks delivered solid financial results in the fourth fiscal quarter, closing a year
that saw extraordinary market volatility and change,” said President and chief
executive officer of Skyworks. “Looking ahead, we are well positioned to execute on
our mission of delivering compelling 5G solutions across a growing and diverse suite
of customers and markets. Our systems-level approach, highlighted by our Sky5®
platform, now includes strategic capabilities in BAW, Wi-Fi 6, MIMO and custom
diversity receive. Collectively, these solutions are unleashing the true potential of 5G –
successfully providing a range of options to our customers while increasing the value
and utility of each usage case. We are in the early innings of this substantial technology
inflection, as we translate these dynamics into sustainable growth and profitability.”
Description
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STMicroelectronics (Switzerland) closes acquisition of silicon carbide
wafer specialist Norstel AB
STMicroelectronics, a global semiconductor leader serving
customers across the spectrum of electronics applications,
announced the closing of the full acquisition of Swedish
silicon carbide (SiC) wafer manufacturer Norstel AB
(“Norstel”). ST exercised its option to acquire the remaining
45% stake, following the initial transaction announced in
February 2019. The total consideration for the acquisition of
Norstel was $137.5 million, funded with available cash.
Norstel will be fully integrated into ST’s global R&D and
manufacturing operations. It will continue growing its
activities covering both the production of 150mm bare and
epitaxial silicon carbide wafers and R&D on 200mm
production as well as, more broadly, on wide bandgap
materials.
“At a time of constrained global capacity for silicon
carbide, the full acquisition of Norstel will strengthen our
internal SiC ecosystem: it will boost our flexibility, allow us
to control better the improvement of yield and quality of the
wafers, and support our long-term silicon carbide roadmap
and business,” said President and CEO of
STMicroelectronics. “This acquisition comes in addition to
wafer supply agreements signed with third parties, with the
overall goal to secure the required level of wafers to
manufacture MOSFET and diodes for the automotive and
industrial customer programs that will ramp up over the
next years.”
Description
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Solutions Updates
Technology Industry

Solution Updates
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10
Solution Description
AMD announced the release of the highly anticipated flagship 16-core AMD Ryzen9 3950X processor, available worldwide November
25, 2019. AMD Ryzen 9 3950X processor brings the ultimate processor for gamers with effortless 1080P gaming in select titles1 and up
to 2X more energy efficient processing power compared to the competition2 as the world’s fastest 16-core consumer desktop
processor3. In addition, AMD also announced a significant performance uplift4 coming for mainstream desktop users with the new
AMD Athlon 3000G, arriving November 19, 2019. Offering up to 22% performance increase over previous generations5, the AMD
Ryzen 9 3950X offers faster 1080p gaming in select titles1 and content creation6 than the competition. Built on the industry-leading
“Zen 2” architecture, the AMD Ryzen 9 3950X also excels in power efficiency3 with a TDP7 of 105W. As the fastest 16-core consumer
desktop processor available3, AMD Ryzen 9 3950X processor offers incredible performance best experienced with a liquid cooling
solution. AMD is recommending the use of an AIO solution with a minimum 280mm radiator. A list of AMD recommended coolers can
be found on AMD.com to ensure enthusiasts can maximize the potential of the Ryzen 9 3950X processor. To ensure the best
experiences for all users, this month, AMD released AGESA version 1004 to its motherboard ecosystem. Containing more than 150
updates, AGESA 1004 offers significant improvements for the AM4 platform focused primarily on stability. Key improvements include
AMD X570 stability and compatibility with add-in devices, PCIe® device support and stability, and interoperability of PCIe®, USB,
SATA, and device reset capabilities, alongside performance enhancements with fastest core utilization and further boost frequency
optimizations for the AMD Ryzen™ 9 3900X.

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AMD (USA) Introduces World’s Fastest High-End Desktop Processors With 3rd Gen Ryzen
Threadripper Family: Delivering Unmatched Performance With No Compromises
11
AMD announced the upcoming availability of powerful new additions to its high-end desktop processor family that deliver groundbreaking
performance for creators, developers, and enthusiasts. Built to deliver leadership performance1,3 for the most demanding desktop and
content creation workloads, the 24-core AMD Ryzen Threadripper 3960X and the 32-core AMD Ryzen Threadripper 3970X processors will
be available worldwide November 25, 2019. The 3rd Gen AMD Ryzen Threadripper lineup features two new processors built on
industry-leading 7nm “Zen 2” core architecture, boasting up to 88 PCIe® 4.0 lanes and 144MB cache with extraordinary power efficiency.
Achieving up to 90 percent faster performance over the competition’s top-end HEDT processor1, the new 32-core Ryzen Threadripper
3970X processor offers unsurpassed performance as the most powerful and fastest desktop processor1 in the high-end desktop market.
AMD Ryzen Threadripper 3970X offers significantly better performance than the competition across multiple content creation and
compute-intensive workloads, including:
• Up to 90% faster performance in Cinebench R20 nT1
• Up to 47% more performance in Adobe Premiere4
• Up to 49% more performance in V-Ray4
• Up to 43% more performance in Chromium Release 78 Compile5
• Up to 36% more performance in Unreal Engine5

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AMD (USA) Radeon™ Pro 5000M Series Mobile GPUs Bring High-Performance AMD RDNA
Architecture to Apple’s New 16-inch MacBook Pro
12
AMD announced that the latest Apple MacBook Pro features the new AMD Radeon™ Pro 5500M and 5300M mobile GPUs. AMD Radeon™
Pro 5000M series are the first 7nm discrete mobile GPUs for professional users, leveraging industry-leading process technology and powerful
AMD RDNA architecture to provide groundbreaking levels of graphics performance for video editing, 3D content creation and macOS-based
game development. AMD Radeon™ Pro 5000M series mobile GPUs are built upon the all-new AMD RDNA architecture, designed from the
ground up for superior performance, scalability and power efficiency. The new GPUs include up to 8GB of high-speed GDDR6 memory with up
to 192 GB/s memory bandwidth – double the bandwidth of GDDR5 – and also deliver up to 4.0 TFLOPS of single-precision floating-point
(FP32) performance. The GPUs are optimized for today’s top professional content creation applications and compute-intensive image rendering
workloads, delivering breathtaking, ultra-smooth, high-framerate visuals on the MacBook Pro Retina display. AMD Radeon™ Pro 5000M
products join the AMD Radeon™ RX 5500 series graphics products announced in October 2019. AMD Radeon™ RX 5500M gaming GPUs and
the new AMD Radeon™ RX 5300M gaming GPUs are expected to be available in systems from other notebook manufacturers this quarter. For
50 years AMD has driven innovation in high-performance computing, graphics and visualization technologies ― the building blocks for
gaming, immersive platforms and the datacenter. Hundreds of millions of consumers, leading Fortune 500 businesses and cutting-edge scientific
research facilities around the world rely on AMD technology daily to improve how they live, work and play. AMD employees around the world
are focused on building great products that push the boundaries of what is possible.

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AMD (USA) Delivers Best-in-Class Performance from Supercomputers to HPC
in the Cloud at SC19
13
AMD is extending its performance lead in high-performance computing (HPC) with a range of new customer wins in top research systems worldwide, new platforms supporting AMD EPYC™
processors and Radeon Instinct™ accelerators and the newly announced ROCm 3.0, bringing support for new compilers and HPC applications. Amazon Web Services (AWS) is expanding its use of
AMD EPYC processors, announcing the upcoming launch of two new Amazon Elastic Compute Cloud (Amazon EC2) compute-optimized instances. These instances, C5a and C5ad, will be
powered by custom 2nd Gen AMD EPYC processors, running at frequencies up to 3.3Ghz. C5a and C5ad will come in 8 virtualized sizes with up to 96 vCPUs which will provide additional choices
to help customers optimize both cost and performance for a variety of compute intensive workloads, including batch processing, distributed analytics, and web applications. Both instances will be
available in bare metal variants which will enable customers to run applications that benefit from direct access to the processor and memory resources of the underlying server. These instances will
have 192 logical processors on 96 physical cores, which will be twice the largest instance size offered in the EC2 compute-optimized instance family. The C5a and C5ad bare metal instance will be
able to utilize 100 Gbps network bandwidth and will be compatible with Elastic Fabric Adapter, enabling customers to scale up High Performance Computing and other large compute intensive
workloads. The new instances will be available soon across multiple AWS regions.
The latest customers deploying AMD processors and accelerators include:
• Atos, a global leader in digital transformation, is supplying two BullSequana XH2000 supercomputers based on 2nd Gen EPYC to Météo-France for operational weather forecasting and research
in atmospheric, ocean and climate science.
• Atos and the French national high-performance computing organization, GENCI, announced that the latest extension of its Joliot-Curie supercomputer, located and administered by the CEA teams
at its TGCC (Very Large Computing Centre), and based on Atos’ BullSequana XH2000 solution and 2nd Gen EPYC is now operational.
• The extension of the Joliot-Curie supercomputer joined the 54th edition of the TOP500, making it the first AMD EPYC 7H12 64-core 280W4equipped supercomputer in the global ranking.
• Cray, a Hewlett Packard Enterprise company, recently announced two new supercomputers equipped with the 2nd Gen AMD EPYC processors and based on the Shasta™ supercomputer
architecture, ARCHER2 and Vulcan.
• Dell Technologies is supplying the San Diego Supercomputer Center and its Expanse supercomputer with Dell EMC PowerEdge servers and 2nd Gen EPYC Processors.
• ETH Zurich is using AMD EPYC 7742 processors in its Euler VI system.
• NEC is supplying the German weather forecasting service, Deutscher Wetterdienst, a system using 2nd Gen EPYC processors in conjunction with NEC SX-Aurora TSUBASA vector engines.

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AMD (USA) Launches World’s First 7nm Professional PC Workstation Graphics
Card for 3D Designers, Architects and Engineers
14
AMD announced the AMD Radeon™ Pro W5700, the world’s first 7nm professional PC workstation graphics card. It delivers new levels of performance and advanced features that enable 3D designers, architects and
engineers to visualize, review and interact with their designs in real time, dramatically accelerating decision-making processes and product development cycles. The AMD Radeon™ Pro W5700 workstation graphics
card features the high-performance, energy-efficient AMD RDNA architecture and state-of-the-art GDDR6 memory to handle large models and datasets, and is the first PC workstation graphics card to support
high-bandwidth PCIe® 4.0 technology. It is ideal for professionals who push performance beyond traditional 3D design by generating photorealistic renders of their concepts and reviewing virtual prototypes of their
designs in virtual reality (VR) environments.
Key capabilities and features of the AMD Radeon™ Pro W5700 graphics card include:
• High-Performance AMD RDNAArchitecture – Features a redesigned geometry engine and compute units, delivering up to 25 percent higher performance-per-clock1 and up to 41 percent higher average
performance-per-watt2 than the previous-generation Graphics Core Next (GCN) architecture.
• Exceptional Power Efficiency – AMD Radeon™ Pro Software for Enterprise’s intelligent power optimization, coupled with the power-efficient AMD RDNA architecture and 7nm process technology, enables the
Radeon™ Pro W5700 graphics card to provide up to 18 percent better system efficiency than the competitive product3.
• Accelerated CPU/GPU Multitasking – Provides outstanding multitasking performance even in the most demanding situations, such as continuing to model while rendering a visualization in the background, providing
up to 5.6X the application workflow performance with CPU load than the competition in the SPECviewperf® 13 benchmark4.
• Professional-grade Software – AMD Radeon™ Pro Software for Enterprise delivers professional-grade quality, continuous performance improvements and robust security as well as industry-leading features,
including AMD Remote Workstation5 that allows professionals to work virtually from anywhere with feature and performance parity with the workstation GPU on their desk6.
• Innovative VR Software Features – AMD Radeon™ ReLive for VR enables professionals using AMD Radeon™ Pro W5700 graphics cards to wirelessly visualize their creations with VR-capable applications and
select standalone VR headsets, such as the HTC VIVE Focus™ Plus7.
• High-bandwidth PCIe® 4.0 – The AMD Radeon™ Pro W5700 is the first PC workstation graphics card to support PCIe® 4.0, delivering double the bandwidth of PCIe® 3.0 to enable smooth performance for
GPU-intensive applications.
• Professional Application Certification – Optimized and certified with leading Design and Manufacturing and Architecture, Engineering and Construction applications to deliver the stability and reliability required by
workstation professionals. The list of Radeon™ Pro Software certified ISV applications can be found here.
• High-speed USB-C® – The AMD Radeon™ Pro W5700 is the first PC workstation graphics card to include a USB-C® connector, supporting a growing selection of USB-C® based monitors and head-mounted
displays (HMD).

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Agilent (USA) Announces New ICP-OES Systems with Innovative Instrument
Intelligence
15
Agilent Technologies, Inc. announced a new generation of ICP-OES systems for laboratories serving the environmental,
food, energy, chemicals, and materials markets. The new Agilent 5800 ICP-OES and 5900 ICP-OES systems incorporate
an entirely new layer of smart capabilities that deliver deeper insight into samples, processes, and operational status.
Greater instrument intelligence enables labs to avoid unplanned downtime, and take a more pro-active approach to
reduce the need to remeasure samples. With patent-pending free-form optics, the 5800 and 5900 are the smallest and
fastest ICP-OES systems on the market, providing lab managers with greater confidence in their operations and results.
Agilent Technologies Inc. is a global leader in life sciences, diagnostics, and applied chemical markets. With more than
50 years of insight and innovation, Agilent instruments, software, services, solutions, and people provide trusted
answers to customers' most challenging questions. The company generated revenues of $4.91 billion in fiscal 2018 and
employs 15,500 people worldwide.

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Agilent (USA) Companion Diagnostic Expands CE-IVD mark in Europe to include
Head and Neck Squamous Cell Carcinoma (HNSCC)
16
Agilent Technologies, Inc. announced that its PD-L1 IHC 22C3 pharmDx assay is now labeled for use in HNSCC in the European
Union. The assay is CE-IVD–marked as an aid in identifying HNSCC patients for treatment with KEYTRUDA, an anti-PD-1
therapy manufactured by Merck (known as MSD outside the United States and Canada). KEYTRUDA, as monotherapy or in
combination with platinum and 5-fluorouracil (5-FU) chemotherapy, is indicated for the first-line treatment of metastatic or
unresectable recurrent HNSCC in adults whose tumors express PD-L1 with a CPS ≥ 1. PD-L1 IHC 22C3 pharmDx is the only
clinical trial-proven PD-L1 assay CE-IVD–marked as an aid in identifying HNSCC patients for treatment with KEYTRUDA.
PD-L1 IHC 22C3 pharmDx is now CE-IVD–marked as a companion diagnostic to KEYTRUDA in three tumor indications –
NSCLC, urothelial carcinoma, and HNSCC. HNSCC is the seventh most common cancer worldwide3 and accounts for more than
90% of head and neck cancer cases.4 In Europe, approximately 170,000 new head and neck cancer cases are diagnosed annually.5
Worldwide, the five-year overall survival rate for HNSCC is approximately 40–50%.6 KEYTRUDA is a humanized monoclonal
antibody that increases the ability of the body's immune system to help detect and fight tumor cells. KEYTRUDA blocks the
interaction between PD-1 and its ligands, PD-L1 and PD-L2, thereby activating T lymphocytes, which may affect both tumor cells
and healthy cells. KEYTRUDA and other targeted immunotherapies are revolutionizing cancer treatment, and their therapeutic
value is being demonstrated across a growing list of cancer types.

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Analog Devices (USA) Unveils Robust, Low-Latency PHY Technology for New ADI
Chronous™ Portfolio of Industrial Ethernet Solutions
17
Analog Devices, Inc. (ADI) announces the release of new robust, industrial Ethernet physical layer (PHY) products to help
manufacturers address key Industry 4.0 and smart factory communication challenges surrounding data integration,
synchronization, edge connectivity, and system interoperability. The ADIN1300 is a low-power, single port Ethernet
transceiver with industry leading power and latency specifications primarily designed for time-critical industrial Ethernet
applications up to Gigabit speeds. As industrial automation increases the adoption of Ethernet and pushes the boundaries of
data rates, the ADIN1300 is designed to operate reliably in harsh industrial conditions over extended ambient temperature
ranges. Analog Devices will showcase the ADIN1300 and other industrial Ethernet solutions at the Smart Productions
Solutions (SPS) exhibition November 26 – 28, 2019 in Nuremberg, Germany. ADIN1300 is the latest technology developed
for the ADI Chronous™ Ethernet portfolio, ADI’s newly expanded portfolio of industrial Ethernet solutions. ADI Chronous
Ethernet solutions – which include the ADIN1200, a low-power single port 10/100 robust Ethernet PHY for today’s real
time industrial Ethernet networks – encompass a range of advanced industrial Ethernet technologies from real-time Ethernet
switches, PHY transceivers and protocol processing to complete network interface products.

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Amphenol (USA) Sine Systems' miniBOSS™ M22
18
Amphenol Sine Systems’ miniBOSS™ M22 product line is IP67-rated, and allows for a cost-effective Power and Signal
distribution system compatible with other industry standard mating connectors. Utilizing UL STOOW/CSA Type ST cable, as well
as High Flex TPE jacketed UL Listed TC-ER cable, our miniBOSS™ M22 products are ideal for Automation markets and its many
applications. Proximity Sensors, Limit Switches, Photoelectric Switches, Solenoid & Hydraulic Valves, Foot-Operated Switches,
Power Tools, Cranes, Hoists, Conveyors, Packaging Equipment, Material Handling Equipment, Beverage Processing, Solar Panel
Wiring Systems, Test Equipment, Commerical and Industrial Lighting, and Portable/Mobile Light Towers
Features:
• 500 Mating cycles
• Multiple standard lengths available
• Straight or 90° over-molded connector options
• Simplified wiring and maintenance
• “Plug & Play” design eliminates wiring errors
• Eliminates the need for “pipe and wire” conduit
• Mechanically keyed to eliminate mis-mating
• Customized solutions available

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Amphenol (USA) Sine Systems' miniBOSS™ M22Arrow Electronics (USA) And R3
Offer Ultra-reliable, Low-latency Wireless M2M Communications
19
Arrow Electronics will offer the full range of R3 Communications’ ECHORING wireless networking products in Europe, Middle East and
Africa (EMEA). ECHORING supports ultra-reliable, low-latency wireless machine-to-machine (M2M) communications that deliver similar
performance to current wired systems. Arrow will be present at R3`s SPS booth from 26th-28th of November 2019 in Nuremberg, Germany.
Many companies seeking to deploy industrial Internet of things (IIOT) or Industry 4.0 solutions need wireless networks that can match the
performance and reliability of existing wired control networks. R3’s ECHORING delivers real-time performance levels with latency down to
only 1ms, even in challenging industrial environments. A range of software solutions in combination with hardware modules, devices and
reference designs based on Texas Instruments WiLink 8 Chip with Wi-Fi and Bluetooth connectivity is now available to simplify integration
with existing networks. Industrial communications protocols supported include PROFINET, PROFIsafe, Ethernet, and SafetyNet. For
integration, operation and maintenance, additional tools are available. Industrial automation applications require critical synchronisation of
different devices that, historically, could only be achieved by wired networks. However, Industry 4.0 can place a strain on cabling: machines
need to be reached even when moving, scalability requires a more flexible approach than fixed physical links can deliver, and moving parts are
more susceptible to maintenance issues. ECHORING uses a radio technology, delivering deterministic access, combined with massive
cooperation to support reliability levels up to SIL 3. It can be integrated with existing industrial hardware and software, helping to preserve
previous investments in equipment. The security is powered by Olympus Sky, a company that offers low cost, low complexity military grade
security. As part of the agreement, Arrow will be offering a starter kit that allows users to test ECHORING’s performance in their own
production environment by substituting the kit’s wireless stations for existing Ethernet connections.

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Autodesk (USA) Ushers in New Era of Connected Construction with Autodesk
Construction Cloud
20
Autodesk, Inc. unveiled Autodesk Construction Cloud™, which combines advanced technology, a unique builders network and predictive
insights to connect people and data across the entire building lifecycle, from design through operations. At the center of Autodesk
Construction Cloud are best-of-breed construction solutions Assemble, BuildingConnected, BIM 360 and PlanGrid. Autodesk Construction
Cloud brings these solutions together, and with Autodesk’s established design authoring tools, connects headquarters, office and field teams
to increase collaboration and productivity. Autodesk Construction Cloud includes more than 50 new product enhancements, as well as
deeper integrations between each product to allow data to flow across all stages of construction. It also includes powerful new artificial
intelligence functionality that helps construction teams identify and mitigate design risks before problems occur — reducing delays, rework
and costs.
Autodesk Construction Cloud includes three core elements that give construction companies a competitive advantage in the industry:
• Advanced Technology: Best-in-class software solutions built for simplicity and power — uniting headquarters, office and field teams from
design through construction and operations.
• Builders Network: The industry’s largest network of owners, designers, builders and trades, enabling each to connect with the right
partners and projects.
• Predictive Insights: AI-driven analysis of previously siloed project data provides builders with powerful insights to predict outcomes and
reduce risk.

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Apple (USA) introduces 16-inch MacBook Pro, the world’s best pro notebook
21
Apple unveiled an all-new 16-inch MacBook Pro — the world’s best pro notebook — designed for developers,
photographers, filmmakers, scientists, music producers and anyone who relies on a Mac to create their life’s best work. The
all-new MacBook Pro features a brilliant 16-inch Retina Display, the latest 8-core processors, up to 64GB of memory,
next-generation graphics with up to 8GB of VRAM and a new advanced thermal design, making it the most powerful
MacBook Pro ever. Featuring a new Magic Keyboard with a redesigned scissor mechanism and 1mm travel for a more
satisfying key feel, the 16-inch MacBook Pro delivers the best typing experience ever in a Mac notebook. The 16-inch
MacBook Pro also includes a six-speaker sound system, longer battery life, Touch Bar, Touch ID, the Force Touch trackpad
and the Apple T2 Security Chip. Pros love the brilliant 500 nit, P3 wide colour gamut Retina display on MacBook Pro, and
at 16 inches, it’s the largest Retina notebook display ever. Featuring a resolution of 3072x1920 and a higher pixel density of
226 ppi, the 16-inch Retina display delivers nearly 6 million pixels and an even more immersive front-of-screen experience.
Each display is individually calibrated in the factory for accurate gamma, white point and primary colours.

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Broadcom (USA) Introduces Industry’s First Enterprise-Grade Support for
Eclipse Che4z and VS Code4z
22
Broadcom Inc. announced the introduction of the industry’s first enterprise-grade support for new extensions of Eclipse Che 7— the first
Kubernetes-native, integrated development environment (IDE) for developer teams leveraging the mainframe platform. As the first-ever
open-source based set of IDE extensions for mainframe application development, developers can now use their existing tools to easily build
innovative apps leveraging the data and processes residing on the mainframe. This innovative new offering, combined with Broadcom’s CA
Brightside support of the Open Mainframe Project Zowe framework, provides enterprises with the confidence they need to introduce true,
modern DevOps tools within their mainframe environment. With enterprise-grade support, IT organizations are now in a position to
accelerate their digital transformation initiatives. Developers spend the bulk of their day immersed in IDE and software configuration
management (SCM). While career mainframe programmers can continue to use existing tools, the real future of mainframe DevOps focuses
on millennial and off-platform developers who prefer to use familiar tools. The Eclipse Che4z and VS Code4z extensions, previously
contributed by Broadcom to the open-source community, will now be fully-supported. Broadcom’s customers using CA Endevor as their
SCM, with the Git option, will benefit from these tools as well. Broadcom Inc. (NASDAQ: AVGO) is a global technology leader that
designs, develops and supplies a broad range of semiconductor and infrastructure software solutions. Broadcom’s category-leading product
portfolio serves critical markets including data center, networking, enterprise software, broadband, wireless, storage and industrial. Our
solutions include data center networking and storage, enterprise, mainframe and cyber security software focused on automation, monitoring
and security, smartphone components, telecoms and factory automation.

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Fujifilm (Japan) launches “FUJINON UA125×8BESM”
23
FUJIFILM Corporation is pleased to announce the launch of the FUJINON UA125×8BESM (UA125×8), a 4K-compatible
broadcast lens with the world's highest* zoom of 125×, in February 2020. The UA125×8 is a box-type broadcast lens that covers
focal length ranges from a best-in-class wide-angle** of 8mm to a super-telephoto of 1000mm. It uses the company's proprietary
optical technologies to achieve vivid color reproduction and high contrast, producing video with rich gradation using HDR (high
dynamic range), which makes it a perfect choice for live coverage of sporting and music events. The penetration of 4K-compatible
large-screen television in recent years has increased opportunities for enjoying high-definition 4K video. Amidst accelerated
introduction of 4K-compatible video-recording equipment, there is a growing need at the video production frontline for
high-magnification zoom lens capable of capturing dynamic close-up video of a distant subject in 4K quality. The UA125×8 can
record powerful high-quality video thanks to its world’s highest 125× magnification zoom and optical performance that supports
4K video. The lens has the focal lengths of up to 1000mm on the telephoto end to capture a decisive moment of athletes far away or
facial expressions and gestures of artists on stage in live concert. Having the world’s highest wide-angle focal lengths of up to 8mm
means the lens can also record video showing an entire sporting or live music venue. The proprietary optical technologies make
vivid color reproduction and high contrast as well as rich gradation using the HDR. The integration of high-performance optical
image stabilization mechanism keeps camera steady.

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Fujifilm (Japan) launches “FUJINON UA107×8.4BESM AF”
24
FUJIFILM Corporation is pleased to announce the launch of the “FUJINON UA107×8.4BESM AF”, the world's first* 4K-compatible broadcast
lens that incorporates the AF function, in March 2020. The UA107×8.4 AF is a box-type broadcast lens that delivers outstanding capability for
tracking a moving subject and a fast and accurate auto-focus with AF speed as fast as 0.5 seconds. The lens's ultra-high 107× zoom ratio
covering focal lengths from 8.4mm to 900mm and the use of a unique optical image stabilization mechanism allow users to accurately capture a
distant moving subject and produce premium-quality video with minimal camera shake in live coverage of sporting or music events. The
UA107×8.4 AF is an epoch-making product that brings innovation to video production with its capability to record high-quality 4K video with
ease of use and comfort. 4K video is primarily produced through manual focusing, which requires advanced skills on the part of camera
operators. Amidst this situation, Fujifilm has gone a step ahead of the rest of the world in developing a revolutionary 4K-compatible broadcast
lens, “UA107×8.4 AF” with AF function for easy autofocusing. The announcement of its development was well received in the industry.
FUJINON lenses developed by Fujifilm are known for high-quality images and have been used on various production sites including TV
programs, movies and TV commercials around the world, contributing to the evolution of the cutting-edge field of video expression. The
company will continue to tap into its optical, high-precision forming and assembling technologies that have been nurtured over many years to
develop and supply leading-edge products, thereby addressing the diversifying needs at the forefront of video production.

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Hikvision (China) Introduces Video & Audio Convergence Solution Featuring
Real-time Deterrent
25
Hikvision, the world’s leading provider of innovative security products and solutions, has introduced its Video & Audio Convergence
Solution to the market, featuring an innovative real-time intrusion deterrent feature. With Hikvision’s new Video & Audio Convergence
Solution, IP speakers now can be linked with cameras, access control systems, and alarm devices. When the CCTV system automatically
detects an intrusion or if the alarm system is activated, IP speakers can immediately play programmed audio warnings to drive away
would-be intruders. The audio message acts as a deterrent to possible intrusion actions as they happen. Loss and damage can be prevented,
and footage of the event gets recorded for investigation and evidence collection. Along with imported audio warnings, operators can also
speak via the IP speakers to give live warnings when notified of an intrusion. Efficient security operations and digital transformation are
further supported by alarm video which can pop up automatically. Scheduled audio messaging and public information broadcasting are two
more practical functions made possible by Hikvision’s Video & Audio Convergence Solution. IP speakers can play recorded audio
recordings according to a schedule, and operators can use the audio system to broadcast public information as needed to audiences as well.
With its valuable functionality, Hikvision Video & Audio Convergence can be applied across a wide range of scenarios and applications –
including perimeter security, petrol stations, metro and railway stations, office buildings, and much more. Continue reading for more details
on various applications.

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Intuit (USA): QuickBooks Online Advanced Continues Innovating for High-Growth
Mid-Market Businesses with AI-Enabled Capabilities
26
Intuit Inc. announced five new capabilities to QuickBooks Online Advanced, Intuit’s cloud-based offering specifically designed for high-growth, mid-market small businesses that leverages AI,
automation and data insights to deliver more ways for them to grow and scale. Intuit unveiled the new QuickBooks Online Advanced capabilities at Dreamforce 2019 this month in San Francisco.
Five New Capabilities Available Today in QuickBooks Online Advanced. Intuit is committed to delivering an online accounting solution that helps mid-market small businesses be more productive,
collaborate and grow as they scale rapidly. QuickBooks Online Advanced supports these types of businesses with several capabilities already in place, including all the capabilities within
QuickBooks Online Plus as well as smart reporting powered by Fathom, accelerated invoicing, custom user permissions and membership in Priority Circle, a premier priority care and training
program. The new capabilities launched today further meet the unique needs of these high-growth businesses by delivering even deeper insights through added reporting and business management
tools as well as identifying potential cash flow issues through the display of sales patterns and seasonality trends. The five new capabilities introduced to QuickBooks Online Advanced are:
• Revenue Streams Dashboard Card - A new revenue streams report allows businesses to know what is contributing to topline revenue numbers. The dashboard displays both revenue streams as well
as trendlines, so that businesses can better identify seasonality trends and patterns in sales. This is also available from the QuickBooks Online mobile app so businesses can stay informed on the go.
• Workflow Management - Manual workflows are often difficult for small businesses to manage and scale. The new Workflows tool leverages automation to allow business owners to take the work
out of workflow management, allowing them to configure reminders, approvals and triggers based on a small businesses’ own defined rules. Workflow automation within QuickBooks Online
Advanced includes the ability to automatically send invoices and past due reminders and easily track when invoices have been paid.
• Batch Invoices and Expenses - Mid-market small businesses can save time and effort by batching multiple invoices, expenses and checks at once and fast tracking transactions by duplicating them
for multiple customers. This allows businesses to create invoices faster, ensuring they can manage expenses and payments more efficiently.
• Custom Fields - QuickBooks Online Advanced now includes custom fields, which allows businesses to create more detailed reports with multiple field types, with up to 10 custom fields available
so that businesses can better search, sort and filter the data they need, faster.
• Third-Party Integrations - In addition to the new features and tools added to QuickBooks Online Advanced, Intuit continues to add third-party integrations from the companies that small businesses
use most. From spreadsheet programs to customer relationship management, QuickBooks Online Advanced integrates with more than 700 third-party apps to help businesses grow.

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KYOCERA's (Japan) New Temperature-Compensated Crystal Oscillator Offers Industry's
Lowest Phase Noise for 5G, Wi-Fi
27
Kyocera Corporation unveiled a compact temperature-compensated crystal oscillator (TCXO) offering the industry's lowest phase noise*.
Samples of Kyocera's KT1612 Series and KT2016 Series TCXOs are now available worldwide, with mass production planned to start in
March 2020. Increased communication speeds and data capacities required for new 5G and Wi-Fi technologies have brought about a shift
toward multilevel modulation systems that send multiple signals to a single section of a single wavelength. However, since noise and
frequency fluctuations can produce data errors, circuit designers seek compact TCXOs that can provide higher frequency stability with less
degradation. In these applications, a TCXO has two important performance indices:
1. Phase noise: Amplitude and phase fluctuations due to inherent noise in the device; and
2. Phase jitter: Shifts and fluctuations in the time domain of the waveform
Kyocera's compact TCXO delivers an industry-leading, ultra-low phase noise of -168 dBc/Hz at 100kHz offset. In addition, it reduces phase
jitter to 68 fs from 12kHz to 5MHz, resulting in greatly improved communication quality. These new benchmark performance levels were
achieved using high-Q-value, high-quality, synthetic crystals grown at Kyocera's Yamagata Higashine Plant, combined with a crystal
oscillator optimized by plasma chemical vaporization machining (CVM), an ultra-high-precision processing technology, and an oscillator
circuit that suppresses noise.

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Lam Research (USA) Offers New Capabilities In Its Edge Yield Product Portfolio
28
Lam Research Corp. is offering new capabilities in its semiconductor manufacturing systems portfolio to further improve device yield at the edge of the wafer,
which is essential to delivering greater productivity for customers. During the semiconductor production process, device manufacturers want to build integrated
circuits on the entire surface of the wafer. On the edge of the wafer, where chemical, physical and thermal discontinuities are harder to control, the risk of yield
loss increases. Controlling etch non-uniformity and preventing defects at the wafer’s edge is key to semiconductor device manufacturing cost reduction. Lam
offers edge yield solutions for high volume manufacturing with the Corvus® etch and Coronus® plasma bevel clean systems. These solutions can be found in
leading-edge node manufacturing facilities around the world and are extensively used by advanced foundry, logic, DRAM, and NAND customers. Corvus
enhances edge yield on the Kiyo® and Versys® Metal systems by smoothing out extreme edge discontinuities. With Corvus, every die on the wafer sees the
same conditions for optimal yield, reducing previously seen systematic die-to-die variability. Lam’s Corvus technology also minimizes deviation at the edge
using its tunability features. Coronus improves device yield by removing defect sources from the bevel region or depositing encapsulating layers for bevel
protection. Coronus’ versatility manages bevel challenges such as eliminating defects from film/polymer residues and roughened surfaces, as well as depositing
layers for bevel protection during long otherwise damaging etch processes. The Coronus product family demonstrates excellent repeatability enabled by
proprietary wafer placement and plasma confinement technologies. Lam Research Corporation is a global supplier of innovative wafer fabrication equipment
and services to the semiconductor industry. As a trusted, collaborative partner to the world’s leading semiconductor companies, we combine superior systems
engineering capability, technology leadership, and unwavering commitment to customer success to accelerate innovation through enhanced device performance.
In fact, today, nearly every advanced chip is built with Lam technology. Lam Research (Nasdaq: LRCX) is a FORTUNE 500® company headquartered in
Fremont, Calif., with operations around the globe.

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LG (South Korea) Introduces Powerful Portable Air Purifier For Enhanced
Peace Of Mind
29
LG Electronics (LG) announces the world’s first filter-type portable air purifier designed for use on-the-go. With an innovate PM1.0
Sensor, the compact and cord-free LG PuriCareTM Mini helps deliver safe, clean air in the car, a baby’s nursery or even one’s office.
With LG’s 4-Step Air Filtration System, LG PuriCare Mini can detect and remove 99 percent particulates as small as 0.3 μm.* The first
step involves the PM1.0 Sensor which quickly and accurately detects the quality of the air before the Dual Inverter Motor forcibly
draws in the air at 5,000rpm in the second step. In step three, the high-efficiency Total Allergen Removal filter removes particulates in
the air and in the final step, the powerful Twin Tornado Dual Fan disperses the clean air far and wide. The LG PuriCare Mini is not only
highly efficient, it’s also fast, cleaning 50 percent of the air inside a car in 10 minutes. LG PuriCare Mini can go anywhere the user goes
thanks to its small size and light weight, which make it ideal for use on the go where plug-in models can’t go. Similar in size and
weight as a 500 milliliter bottle of water, the wireless portable air purifier freshens the air for up to 8 hours at low speed or 2 hours at
the highest setting on battery power alone. And its quiet operation – only 30dB in low setting – allows the LG PuriCare Mini to be used
in an enclosed stroller without waking a peacefully sleeping baby. PuriCare Mini utlizes a durable filter which lasts up to 2,000 hours or
six months if used 12 hours a day. The free LG ThinQ app for both Android and iOS devices allows users to monitor the condition of
the filter, check the battery status and control their LG PuriCare Mini via Bluetooth with a smartphone or tablet.

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Maxim (USA) Unveils Cuffless Blood-Pressure Measurement Solution Meeting
Class-II Regulatory Accuracy Limits
30
Until now, accurate blood-pressure monitoring could only be achieved with bulky and mechanical cuff-based medical devices. Now, Maxim
Integrated Products, Inc. has introduced a solid-state blood-pressure monitoring solution to more conveniently track this critical health
indicator. Design engineers can develop blood-pressure trending solutions with the MAXREFDES220# reference design from Maxim.
Comprised of a complete integrated optical sensor module, a microcontroller sensor hub and a sensing algorithm, the MAXREFDES220#
optical blood-pressure trending solution can be embedded into smartphones or wearables. It enables users to place their finger on a device
for 30-45 seconds while resting to measure blood pressure anywhere and anytime. The reference design includes the MAX30101 or
MAX30102 high-sensitivity optical sensor, as well as the MAX32664D sensor hub IC with built-in algorithms. The MAX30101 (using
three LEDs) and MAX30102 (using two LEDs) pulse-oximeter and heart-rate optical sensor modules combine photodetectors, LEDs and
analog front-end (AFE) electronics with an integrated cover glass. This integrated optical design and lenses-on-top approach enables
optimal signal-to-noise ratio (SNR) for a small, lower cost and power-efficient module. It comes in a tiny 5.6mm x 3.3mm 14-pin optical
package with an I2C interface to the sensor hub IC. The MAX32664D sensor hub IC includes firmware which controls the sensor and
executes the algorithms which measure cuffless blood pressure, heart rate and blood-oxygen levels. Its ultra-small size (1.6mm x 1.6mm)
can easily fit into small devices to seamlessly and effortlessly connect to a device’s host microcontroller.

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Microchip (USA) Smart Storage Adapters Now Interoperate Seamlessly with MegaRAC®
SP-X Management Firmware from AMI for At-Scale Secure Storage Management
32
Data center administrators and IT managers want the ability to securely manage and trouble-shoot platforms and devices remotely,
which requires that additional software, hardware and firmware be interfaced with storage adapters and other server components.
Microchip Technology Inc. (Nasdaq: MCHP) today announced it has added this capability to its Adaptec Smart Storage adapters, which
now seamlessly interoperate with MegaRAC® SP-X remote monitoring and diagnostics firmware from American Megatrends (AMI)
and are supported in its MegaRAC solution development framework. Interoperability between Adaptec Smart Storage adapters and
MegaRAC SP-X manageability firmware powering embedded base management controllers (BMCs) reduces data center operational
costs by enabling remote management capabilities including platform status monitoring and problem notifications, diagnosis and
recovery. Out-of-band management enables the adapters to be reached directly over a network connection if the server is powered off or
unresponsive and improves security by eliminating the need for proprietary software or host tools on either the server or storage
system. AMI has leveraged a combination of the widely adopted management component transport protocol (MCTP) protocol and
Microchip’s StorageCore application programming interface (API) to add basic support for the Adaptec Smart Storage adapters in its
MegaRAC development framework’s Storage Adapter management tool.

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Reduce Memory Costs and Retain Data at Power Loss with Microchip’s EERAM
Memory Solutions
33
Microchip Technology Inc. announced a new family of Serial Peripheral Interface (SPI) EERAM memory products that offer system
designers up to 25 percent cost savings over the current serial NVRAM alternatives. The family introduces four reliable SPI densities to
Microchip’s EERAM portfolio, ranging from 64 Kb up to 1 Mb. EERAM is a standalone nonvolatile RAM memory that uses the same
SPI and I2C protocols as serial SRAM, enabling devices to retain SRAM content during power loss without using an external battery.
All nonvolatile aspects of the part are essentially invisible to the user. When the device detects power going away, it automatically
transfers the SRAM data to nonvolatile storage and moves it back to the SRAM once power returns to the part. In manufacturing lines,
for example, stations handle up to millions of tasks over their lifetimes, and lost data during a task can require overhauling or
discarding items. EERAMs automatically store SRAM content in these settings, allowing the manufacturing line to resume where the
task was disrupted. The primary reason EERAM is available at a lower price point is the use of standard Complementary
Metal-oxide-semiconductor (CMOS) and Flash processes. Because these are the highest volume and most widely used processes, they
offer the best reliability and lowest cost in the industry. Alternative solutions such as Ferroelectric RAM (FRAM) use a specialty
process, resulting in much higher costs and unstable long-term supply. The new EERAM family comes with Microchip’s
customer-driven obsolescence practice, which helps ensure availability to customers for as long as needed.

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Micron (USA) Eliminates Need for Network Video Recorders With Launch of World’s First
1TB Industrial-Grade microSD Card for Cloud-Managed Video Surveillance
34
Micron Technology, Inc. unveiled the world’s highest-capacity industrial microSD card — Micron® i300 1TB3 microSDXC UHS-I — to
address the edge storage needs of the video surveillance market and other industrial applications. The new Micron® i300 1TB microSD card is
based on Micron’s advanced 96-layer 3D quad-level cell (QLC) NAND technology, now making it cheaper for small- to medium-sized
deployments to have primary storage in the camera compared to a centralized storage architecture. The i300 microSD card enables users of
video surveillance systems to capture and store more than three months of high-quality video footage on-device and at the edge. VSaaS systems
are increasingly integrating artificial intelligence-based and higher-resolution cameras that require more storage at the edge. The Micron i300
1TB microSDXC card allows 24/7 continuous capture and storage of up to 1TB of high-quality video in the camera. Users of video surveillance
systems can now store large amounts of video footage on-device, opening a broader set of uses for cloud-managed solutions. The VSaaS market
is projected to reach $6 billion in 2022, corresponding to a growth of 22% compound annual growth rate between 2017 and 2022.4 The rising
adoption of VSaaS by small to medium businesses and enterprises is attributed to lower overhead costs achieved through ease of installation and
elimination of the need for on-site NVRs and DVRs. The ability to store large video footage files in the camera and at the edge reduces the
demand for network bandwidth and expenditure associated with continuous cloud storage. These savings contribute to lowering the overall cost
of ownership for businesses while bringing flexibility and scalability associated with cloud-based implementation models.

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Murata (Japan) Develops the World's First Multilayer Ceramic Capacitor
35
Murata Manufacturing Co., Ltd. has developed the GRM011R60J104M, the world’s first multi-layer ceramic capacitor*1 to feature a
maximum capacitance of 0.1µF in 008004 inch size (0.25×0.125mm). Mass production of this new product is scheduled to begin in 2020.
As smartphones supporting 5G become more widespread and devices such as wearable devices become increasingly multifunctional and
more compact, the demand for smaller and higher density electronic circuitry is growing. Among the components employed in this circuitry,
multi-layer ceramic capacitors are essential for electronic devices and are used for a wide range of applications such as in smartphones and
wearable devices. As the high end smartphones are equipped with around 800 to 1,000 capacitors, there is a considerable need for such
components to be made even more compact. By using our original ceramic and electrode material atomization and homogenization
technology, Murata has achieved a mounting surface area approximately 50% smaller and a volume approximately 80% smaller than that of
our conventional product (01005 inch size)*2 with a capacitance of 0.1µF. Moreover, the new product has a capacity of around 10 times
that of the same-sized product (008004 inch size)*3 initially mass-produced by the Company. In future, Murata will continue to conduct
research and development into ceramics and high-precision, microscopic layering technology for electrode materials, expand our lineup to
meet the needs of the market, and contribute to the further miniaturization and greater functionality of electronic devices.

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NRI (Japan) reveals Shingan AD, alternative data insights for global institutional
investors
36
Nomura Research Institute, Ltd. (NRI), a leading provider of consulting services and system solutions, announced they will launch
Shingan AD, a new service providing institutional investors with Japanese alternative data and data analysis on December 1st,
2019. The use of alternative data in investment decision-making is growing rapidly. Sourcing, cleansing, and preparing large
amount of data for analysis presents a big challenge for institutional investors who are looking for untapped alpha. NRI’s new
offering, Shingan AD, allows institutional investors to easily access Japanese alternative data. A wide range of alternative data
collected from Japanese companies and data vendors is available, as well as data processing and analysis services. Shingan AD
covers a wide range of data from various industries such as Consumer Transaction, PoS (Point of Sales), Mobile App, Healthcare
and Sentiment Score data. Data presentation is customizable to the clients desired format, including raw, processed and/or in
combination. Shingan AD provides a service for institutional investors and asset managers to gather the most up to date alternative
market data from Japan to identify untapped alpha and support data-driven investment decisions. Shingan AD offers a unified
source for the latest data from Japanese corporations and data vendors, as well as data processing and analysis services, data
matching and contract executions. Shingan AD is available to asset managers across the global marketplace.

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NRI (Japan) Secure Launches Japan's First IT Security Assessment Service for
Container Orchestration
37
NRI SecureTechnologies, Ltd. (NRI Secure) launched Japan's first1 IT security assessment service for systems with container
orchestration2, that uses the leading container orchestration tool "Kubernetes." This service provides IT security assessment for a
system using container orchestration technology from the viewpoints of both "static analysis" by interpreting configuration files,
and "dynamic analysis" by attempting simulated attacks. The assessment consists of manual inspection by engineers of NRI Secure
who have expert knowledge of container orchestration as well as several tests using auxiliary inspection tools. This service detects
security issues by checking the validity of the information on the configuration file, and the architecture configuration generated by
container orchestration. In addition to the independent inspection of each configuration file, a comprehensive and highly accurate
assessment is performed to check whether the configuration state is appropriate or not by looking at the entire architecture. This
enables us to detect security issues at the design phase that are often overlooked by the inspection tool alone. Followed by
Kubernetes, NRI Secure plan to add more container orchestration tools to the scope of this IT security assessment service. In recent
years, as DX (digital transformation) has become more widespread, the need for greater flexibility and speed in system
development has increased, and the design concepts and infrastructure technologies that support these requirements have been
rapidly evolving. In particular, microservice4, which develops applications by splitting them into services and functions, and other
system development that presuppose deployment of cloud-native5 and serverless6 architectures are becoming more common.

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NVIDIA (USA) Announces Scalable GPU-Accelerated Supercomputer in the Microsoft
Azure Cloud
38
NVIDIA announced the availability of a new kind of GPU-accelerated supercomputer in the cloud on Microsoft Azure. Built to handle
the most demanding AI and high-performance computing applications, the largest deployments of Azure’s new NDv2 instance rank
among the world’s fastest supercomputers, offering up to 800 NVIDIA V100 Tensor Core GPUs interconnected on a single Mellanox
InfiniBand backend network. It enables customers for the first time to rent an entire AI supercomputer on demand from their desk, and
match the capabilities of large-scale, on-premises supercomputers that can take months to deploy. The new offering — which is ideal
for complex AI, machine learning and HPC workloads — can provide dramatic performance and cost advantages over traditional
CPU-based computing. AI researchers needing fast solutions can quickly spin up multiple NDv2 instances and train complex
conversational AI models in just hours. Microsoft and NVIDIA engineers used 64 NDv2 instances on a pre-release version of the
cluster to train BERT, a popular conversational AI model, in roughly three hours. This was achieved in part by taking advantage of
multi-GPU optimizations provided by NCCL, an NVIDIA CUDA X™ library and high-speed Mellanox interconnects. Customers can
also see benefits from using multiple NDv2 instances to run complex HPC workloads, such as LAMMPS, a popular molecular
dynamics application used to simulate materials down to the atomic scale in such areas as drug development and discovery. A single
NDv2 instance can deliver an order of magnitude faster results than a traditional HPC node without GPU acceleration for specific types
of applications, such as deep learning. This performance can scale linearly to a hundred instances for large-scale simulations.

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NVIDIA (USA) and Tech Leaders Team to Build GPU-Accelerated Arm Servers for New
Era of Diverse HPC Architectures
39
NVIDIA introduced a reference design platform that enables companies to quickly build GPU-accelerated Arm®-based servers, driving
a new era of high performance computing for a growing range of applications in science and industry. Announced by NVIDIA founder
and CEO at the SC19 supercomputing conference, the reference design platform — consisting of hardware and software building
blocks — responds to growing demand in the HPC community to harness a broader range of CPU architectures. It allows
supercomputing centers, hyperscale-cloud operators and enterprises to combine the advantage of NVIDIA’s accelerated computing
platform with the latest Arm-based server platforms. To build the reference platform, NVIDIA is teaming with Arm and its ecosystem
partners — including Ampere, Fujitsu and Marvell — to ensure NVIDIA GPUs can work seamlessly with Arm-based processors. The
reference platform also benefits from strong collaboration with Cray, a Hewlett Packard Enterprise company, and HPE, two early
providers of Arm-based servers. Additionally, a wide range of HPC software companies have used NVIDIA CUDA-X™ libraries to
build GPU-enabled management and monitoring tools that run on Arm-based servers. In addition to making its own software
compatible with Arm, NVIDIA is working closely with its broad ecosystem of developers to bring GPU acceleration to Arm for HPC
applications such as GROMACS, LAMMPS, MILC, NAMD, Quantum Espresso and Relion. NVIDIA and its HPC-application
ecosystem partners have compiled extensive code to bring GPU acceleration to their applications on the Arm platform.

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NVIDIA (USA) Launches Magnum IO Software Suite to Help Eliminate Data Bottlenecks for
Data Scientists and AI, HPC Researchers
40
NVIDIA introduced NVIDIA Magnum IO, a suite of software to help data scientists and AI and high performance computing
researchers process massive amounts of data in minutes, rather than hours. Optimized to eliminate storage and input/output
bottlenecks, Magnum IO delivers up to 20x faster data processing for multi-server, multi-GPU computing nodes when working
with massive datasets to carry out complex financial analysis, climate modeling and other HPC workloads. NVIDIA has
developed Magnum IO in close collaboration with industry leaders in networking and storage, including DataDirect Networks,
Excelero, IBM, Mellanox and WekaIO. At the heart of Magnum IO is GPUDirect, which provides a path for data to bypass
CPUs and travel on “open highways” offered by GPUs, storage and networking devices. Compatible with a wide range of
communications interconnects and APIs — including NVIDIA NVLink™ and NCCL, as well as OpenMPI and UCX —
GPUDirect is composed of peer-to-peer and RDMA elements. Its newest element is GPUDirect Storage, which enables
researchers to bypass CPUs when accessing storage and quickly access data files for simulation, analysis or visualization.
NVIDIA Magnum IO software is available now, with the exception of GPUDirect Storage, which is currently available to select
early-access customers. Broader release of GPUDirect Storage is planned for the first half of 2020.

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OMRON (Japan) Develops Industry's Fastest 3D Vision Sensing Technology for
Robot Hands
41
OMRON Corporation has developed the industry's fastest*1 3D vision sensing technology for compact vision sensors to three-dimensionally recognize the
position and orientation of target objects. Incorporating this technology with robots will enable fast and accurate assembly of bulk parts by automating the
conventional human-intensive process. The commercialization of a compact 3D vision sensor based on this technology is slated for 2020. The automation
of processes such as assembly, inspection and transportation that very much rely on people's experience and senses is imperative amid deepening labor
shortage and increasing labor costs of recent years. However, to automate the picking of bulk parts performed by humans in an assembly process, robots
need to be equipped with "eyes", and that requires high-speed 3D vision sensing technology capable of instantly recognizing the position and orientation of
parts. To this end, both of the two component technologies of 3D measurement to generate 3D images of a shape, and 3D recognition to recognize the
position and orientation of the target object need to be faster. To address this need, OMRON developed a 3D vision sensing technology. This new
technology enables high-speed, high-accuracy three-dimensional object recognition and provides a compact and lightweight vision sensor that can be
mounted onto robot hands. Whereas measurement by conventional 3D measurement technology using the phase-shifting method*2 requires time since 10
or more images need to be captured, OMRON developed a 3D measurement technology capable of generating a 3D image of a target object in a single
shot using a proprietary pattern illumination. In addition, by extending the high-speed 2D search technology*3 it accumulated in the image processing field
to 3D, OMRON developed a high-speed object position and orientation recognition algorithm for the 3D recognition technology. These technologies allow
for high-speed part recognition for fluid part picking in approximately 0.5 seconds*4. Furthermore, mounting cameras onto compact robot hands became
possible as OMRON's proprietary pattern illumination reduced the camera size and weight to approximately 500g. The 3D vision sensor's visual point can
be moved in accordance with the part setup, allowing for flexible picking of parts in various positions and orientations.

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OMRON (Japan) Globally Launches LD-250 Mobile Robot to Move Payloads
Up to 250kg
42
OMRON Corporation announced that it will globally start selling a new mobile robot called the LD-250 on November 15,
2019. With a payload capacity of 250kg, the LD-250 is the strongest and newest addition to the company's LD series of
mobile robots. Together with the Fleet Manager, which for the first time in the industry enables the control of multiple
mobile robots with different payloads through one system, it will contribute to realizing a more flexible and optimized
autonomous material transport system. Factories worldwide are facing challenges in increasing the productivity and
profitability of high-mix production with the decreasing workforce in industrialized nations and rising labor costs in
emerging countries. The mobile robot LD series can autonomously avoid people and obstacles while automatically
calculating the best routes to transport material. The new LD-250 mobile robot has a 250kg payload capacity and almost
double the surface area, so it can be used to transport large automobile components such as transmission blocks and
voluminous packaging materials - things that would traditionally be moved by human workers using carts. To optimize the
autonomous material transport system, customers will use OMRON's industry-first Fleet Manager, which can control a
diverse fleet of up to 100 of OMRON's mobile robots that can consist of different payloads and capabilities, by conducting
traffic management, battery management, and navigation of vehicles.

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OMRON (Japan) Releases World's First MOS FET Relay Module G3VM-21MT with
Solid State Relay in "T-type Circuit Structure"
43
OMRON Corporation will globally release its new MOS FET*1 relay module "G3VM-21MT" on December 2, 2019. The product will be the first
electronic component in the world*2 to adopt a "T-type circuit structure"*3. With T-type circuit structure consisting of compact size and longer
lifecycle solid state relays that output signals using no physical contact, the relay module minimizes the leakage current*4 which has long been a
problem with semiconductor test equipment. G3VM-21MT allows high-precision measurement and improves productivity of electronic components.
G3VM-21MT enables switching measurement signals in the test equipment mainly used to perform electrical tests for semiconductor devices. In
addition to the MOS FET relay features of compact size and longer lifecycle, G3VM-21MT is the world's first MOS FET relay Module with "T-type
circuit structure" which consists of three MOS FET relays that help reduce the leakage current to a minimal level without affecting the test
equipment's inspection accuracy while allowing high-precision measurement and decreasing maintenance frequency of the test equipment. Amid the
digital age where functions of electronic components are getting diversified and production volume increasing, there is a growing need for higher
performance of semiconductor test equipment. Mechanical reed relays*5, which have been used for a part that performs high-precision measurement
in semiconductor test equipment, have extremely low leakage current but they require replacement on a regular basis, maybe several times for every
single month due to wear and abrasion of the contacts that lead to affecting the measurement accuracy. Such maintenance work may substantially
affect the production efficiency so adoption of solid state relays has been long desired as its longer lifecycle. So far, MOS FET relays are considered
not suitable for precise electrical tests due to technological difficulty to reduce the leakage current in relation with its feature, and were not used in
test equipment which requires high reliability.

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Ericsson, Swisscom and Qualcomm (USA) make huge step towards nationwide 5G
coverage in Switzerland
44
Ericsson, Swisscom and Qualcomm Technologies achieve 5G data call over-the-air using spectrum sharing. The data call on commercial platforms in
Swisscom lab is the first part of a large-scale 5G rollout across Switzerland, making it a 5G leader in Europe. Spectrum Sharing technology allows
for a smooth transition from 4G to 5G with a software upgrade in the commercial network An industry leading step in 5G has taken place in
Switzerland on October 31 when the first over-the-air, Dynamic Spectrum Sharing (DSS) 5G data call was successfully carried out by Ericsson
(NASDAQ: ERIC), Swisscom, and Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated. This latest 5G milestone marks the first
time an over-the-air, 5G data call using dynamic spectrum sharing has been conducted with a service provider in Switzerland. In September, Ericsson
and Qualcomm Technologies achieved the world’s first 5G data call using Ericsson Spectrum Sharing on a 3GPP Frequency Division Duplex (FDD)
low band. Together with Swisscom, the ecosystem partners have once again demonstrated leadership in 5G by continuing collaborative efforts to
deploy 5G services on a broader scale in Switzerland. Swisscom was the first service provider in Europe to launch 5G services commercially last
April, using the 3.6 GHz band, and is now taking the next step toward realizing its goal of reaching 5G coverage of 90 percent population by end of
this year. Ericsson Spectrum Sharing, which is embedded in Ericsson Radio System, enables a cost-effective and smooth transition from 4G to 5G
nationwide coverage through a network software upgrade. The solution will dynamically share spectrum between 4G and 5G carriers based on traffic
demand. The switch between carriers happens within milliseconds, which minimizes spectrum wastage and allows for best end-user performance. It
is compatible with all 5G FDD capable smartphones and other devices based on the Qualcomm® Snapdragon™ 5G Mobile Platform, supporting the
standardized spectrum sharing functionality.

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Qualcomm Technologies (USA): AT&T Validates Qualcomm 9205 LTE Modem on
Carrier’s Low-Power Wide-Area Networks
45
Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated, announced that AT&T has validated its Qualcomm® 9205 LTE
multimode modem’s capabilities for the carrier’s LTE-M and NB-IoT networks. AT&T is the first carrier to complete the verification of the
industry-leading Qualcomm 9205 LTE modem designed for Internet of Things applications. Compared to its predecessor, the modem is
engineered to reduce power consumption by up to 70% in idle mode, a critical consideration for battery-powered IoT devices that need to
operate for 10 years or longer in the field. The Qualcomm 9205 LTE modem is also 50% smaller and 40% more cost-effective than its
predecessor – making it ideal for IoT applications requiring low-power, wide-area connectivity in a small form factor device. The Qualcomm
9205 LTE modem is also software-compatible with our prior LPWA LTE IoT solutions which allows module manufacturers to reuse software
investments to develop new module solutions. Qualcomm invents breakthrough technologies that transform how the world connects, computes
and communicates. When we connected the phone to the Internet, the mobile revolution was born. Today, our inventions are the foundation for
life-changing products, experiences, and industries. As we lead the world to 5G, we envision this next big change in cellular technology
spurring a new era of intelligent, connected devices and enabling new opportunities in connected cars, remote delivery of health care services,
and the IoT - including smart cities, smart homes and wearables. Qualcomm Incorporated includes our licensing business, QTL, and the vast
majority of our patent portfolio. Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated, operates, along with its subsidiaries,
substantially all of our engineering, research and development functions, and substantially all of our products and services businesses, including
our QCT semiconductor business.

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Qualcomm (USA) Introduces the World’s Most Advanced 5G Mobile Platform
46
Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated, introduced the Qualcomm® Snapdragon™ 865 5G Mobile Platform, which
combines the world’s most advanced 5G Modem-RF System with the world’s most advanced mobile platform designed to deliver the unmatched
connectivity and performance required for the next generation of flagship devices. The platform’s best-in-class Qualcomm® Snapdragon™ X55 5G
Modem-RF System provides peak speeds of up to 7.5 Gbps, surpassing most wired connections and transforming the mobile experience. The leading 5th
generation Qualcomm® AI Engine and new Qualcomm® Sensing Hub provides more intelligence and personalization than ever before. Snapdragon 865
includes the blazing fast Qualcomm Spectra™ 480 Image Signal Processor (ISP), which brings new features to mobile photography and videography
thanks to gigapixel speeds – up to 2 gigapixels per second. Gamers can use Snapdragon to compete at the highest levels with an array of brand-new
Qualcomm® Snapdragon Elite Gaming™ features for desktop-quality gaming and ultra-realistic graphics. Our next generation Qualcomm® Kryo™ 585
CPU delivers up to 25% performance improvement, and the new Qualcomm® Adreno™ 650 GPU offers up to 25% overall performance boost compared
to the previous generations[1], ensuring superior processing power for the next generation of flagship devices. The Snapdragon 865 empowers you to
game, capture, cross-task and connect like never before. Qualcomm invents breakthrough technologies that transform how the world connects, computes
and communicates. When we connected the phone to the Internet, the mobile revolution was born. Today, our inventions are the foundation for
life-changing products, experiences, and industries. As we lead the world to 5G, we envision this next big change in cellular technology spurring a new era
of intelligent, connected devices and enabling new opportunities in connected cars, remote delivery of health care services, and the IoT - including smart
cities, smart homes and wearables. Qualcomm Incorporated includes our licensing business, QTL, and the vast majority of our patent portfolio. Qualcomm
Technologies, Inc., a subsidiary of Qualcomm Incorporated, operates, along with its subsidiaries, substantially all of our engineering, research and
development functions, and substantially all of our products and services businesses, including our QCT semiconductor business.

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Qualcomm Technologies (USA) Announces the World’s First 5G XR Platform
47
The Qualcomm® Snapdragon™ XR2 Platform is the world’s first 5G-supported extended reality (XR) platform. It unites Qualcomm
Technologies, Inc.’s 5G and AI innovations with our industry leading XR technology to usher in a new era of mobile computing. This
premium-quality platform unveils custom features and boasts multiple firsts that can be scaled across augmented reality (AR), virtual reality
(VR) and mixed reality (MR). The Snapdragon XR2 Platform is packed with significant performance improvements compared to our
current widely adopted premium-tier XR platform[1] to deliver 2x the CPU and GPU performance, 4x more video bandwidth, 6x higher
resolution and 11x AI improvement. The Snapdragon XR2 Platform is the world’s first XR platform to support seven (7) concurrent
cameras and a dedicated computer vision processor. Additionally, this is the first XR platform to enable low latency camera pass-through to
unlock true MR, which allow users to see, interact and create a hybrid of the virtual and real world while wearing a VR device. To meet the
demands of truly immersive XR, the platform has customized visuals, interactivity and audio technologies, all of which utilize the
foundational technology of AI and option of 5G connectivity. The Snapdragon XR2 Platform delivers innovation that the new digital era
requires. Multiple OEMs are committed to commercializing devices with the Snapdragon XR2 Platform and other customers are in various
stages of prototyping and evaluation. Today marks a significant milestone for the entire XR industry and we are excited to continue our
efforts to transform how the world connects and communicates using XR.

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