I-Bytes Technology Industry

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I-Bytes
Technology
December Edition 2019
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Table of Contents
1. Financial, M & A Updates..................................................................................................................................1
2. Solution Updates................................................................................................................................................10
3. Rewards and Recognition Updates..................................................................................................................66
4. Customer Success Updates...............................................................................................................................85
5. Partnership Ecosystem Updates......................................................................................................................91
6. Miscellaneous Updates....................................................................................................................................115
7. Event Updates..................................................................................................................................................116

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Financial, M & A Updates
Technology Industry

Financial, M&A Updates
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Agilent Technologies (USA) Reports Fourth-Quarter and
Fiscal Year 2019 Financial Results
Fourth-quarter fiscal year 2019
• Revenue of $1.37 billion represents 6% reported growth; and up 4% on a core
basis led by strong results from the Agilent CrossLab Group and the Diagnostics
and Genomics Group
• GAAP net income of $194 million with EPS of 62 cents, up 2% year over year
• Non-GAAP net income of $277 million with EPS of 89 cents, up 10% year
over year
Fiscal year 2019
• Fiscal year 2019 revenue of $5.16 billion delivers 5% reported growth and a
5% increase in core revenue over fiscal year 2018
• Full-year GAAP net income of $1.07 billion with EPS of $3.37, up 247% year
over year
• Non-GAAP net income of $989 million with EPS of $3.11, up 11% year over
year
Outlook
• Fiscal year 2020 revenue expected in the range of $5.50 billion to $5.55
billion, representing core growth of 4% to 5%. Fiscal year 2020 non-GAAP
earnings guidance of $3.38 to $3.43 per share
• Fiscal first-quarter revenue guidance of $1.340 billion to $1.355 billion,
representing core revenue growth of 2.5% to 3.5%. Fiscal first-quarter
non-GAAP earnings guidance of 80 cents to 81 cents per share
Executive Commentary
"Agilent's fourth-quarter results cap off a very solid 2019 and reflect the
broad-based business we've built over the last five years," said Agilent
president and CEO. "Based on what we've been able to achieve in 2019, I'm
convinced we're in an exceptionally strong position for the future."
Description
1

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Analog Devices (USA) Reports Fourth Quarter and Fiscal
2019 Results
• Revenue was $1.44 billion for the fourth quarter and $6 billion for
fiscal 2019
• Operating cash flow was $2.3 billion and free cash flow was $2
billion for fiscal 2019
• Returned over $370 million to shareholders in the fourth quarter,
and nearly $1.4 billion for fiscal 2019 or over 120% of free cash flow
after debt payments
• Diluted earnings per share of $0.74 in Fourth Quarter. Adjusted
Diluted earnings per share of $1.19 in fourth quarter.
• Gross Margin of $942 million in Fourth Quarter and Adjusted
Gross Margin of $987 million in Fourth Quarter.
• Gross margin percentage of 65.3% in Fourth Quarter and Adjusted
Gross Margin percentage of 38.8% in Fourth Quarter.
• The ADI Board of Directors has declared a quarterly cash dividend
of $0.54 per outstanding share of common stock. The dividend will
be paid on December 17, 2019 to all shareholders of record at the
close of business on December 6, 2019.
“ADI delivered solid fourth quarter and full-year results amidst
continued trade and macro uncertainty,” said President and CEO.
“Over the course of the year, we generated revenue of $6 billion
and effectively managed costs, while continuing to prioritize
strategic investments to drive innovation. Our strong margins and
cash flow reflect the resiliency of our business model, which
enabled us to return nearly $1.4 billion to shareholders, or over
120% of free cash flow after debt payments.”
Description
2

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Applied Materials (USA) Announces Fourth Quarter and
Fiscal Year 2019 Results
Fourth Quarter Results
• Applied generated revenue of $3.75 billion. On a GAAP basis, the company
recorded gross margin of 43.5 percent, operating income of $864 million or
23.0 percent of net sales, and earnings per share (EPS) of $0.75.
• On a non-GAAP adjusted basis, the company reported gross margin of 43.8
percent, operating income of $888 million or 23.7 percent of net sales, and
EPS of $0.80.
• The company returned $694 million to shareholders including $500 million
in share repurchases and dividends of $194 million.
Full Year Results
• In fiscal 2019, Applied generated revenue of $14.61 billion. On a GAAP
basis, the company recorded gross margin of 43.7 percent, operating income
of $3.35 billion or 22.9 percent of net sales, and EPS of $2.86
• On a non-GAAP adjusted basis, the company reported gross margin of 44.0
percent, operating income of $3.43 billion or 23.5 percent of net sales, and
EPS of $3.04.
• The company generated $3.25 billion in cash from operations, paid
dividends of $771 million and used $2.40 billion to repurchase 60 million
shares of common stock.
“Applied Materials’ fourth quarter results reflect a healthy uptick in
demand for semiconductor equipment, combined with strong execution
across the company,” said President and CEO. “The semiconductor
industry is increasingly adopting a new playbook for improving chip
performance, power, area and cost, and we are investing in unique
solutions to enable our customers’ success in the AI-Big Data era.”
Description
3

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Autodesk, Inc. (USA) Announces Fiscal 2020 Third Quarter
Results
• Total ARR was $3.22 billion, an increase of 28 percent as reported, and on a constant currency basis. Acquisitions from the
fourth quarter of last year contributed $113 million or 4 percentage points of the growth. On a sequential basis, total ARR
increased 5 percent as reported, and 6 percent on a constant currency basis.
• Subscription plan ARR was $2.86 billion, an increase of 49 percent as reported, and 50 percent on a constant currency basis.
Acquisitions from the fourth quarter of last year contributed $113 million or 6 percentage points of the growth. On a
sequential basis, subscription plan ARR increased 8 percent as reported, and on a constant currency basis. Subscription plan
ARR includes $597 million related to the maintenance-to-subscription (M2S) program.
• Maintenance plan ARR was $365 million, a decrease of 39 percent as reported, and 40 percent on a constant currency basis.
On a sequential basis, maintenance plan ARR decreased 12 percent as reported, and on a constant currency basis.
• Core ARR increased 23 percent to $2.99 billion. On a sequential basis, core ARR increased 5 percent.
• Cloud ARR increased 164 percent to $232 million. Acquisitions from the fourth quarter of last year contributed $113 million
or 128 percentage points of the growth. On a sequential basis, total cloud ARR increased 12 percent.
• Total billings increased 55 percent to $1.01 billion.
• Total revenue was $843 million, an increase of 28 percent as reported, and on a constant currency basis. Acquisitions from
the fourth quarter of last year contributed $29 million or 4 percent of the growth.
• Net revenue retention rate was within the range of 110 to 120 percent.
• Total recurring revenue in the third quarter was 96 percent of total revenue, consistent with the third quarter last year.
• GAAP operating income was $111 million compared to $15 million in the third quarter last year. GAAP operating margin
was 13 percent, up 11 percentage points.
• Total non-GAAP operating income was $225 million compared to $92 million in the third quarter last year. Non-GAAP
operating margin was 27 percent, up 13 percentage points.
• GAAP diluted net income per share was $0.30, compared to GAAP diluted net loss per share of $(0.11) in the third quarter
last year.
• Non-GAAP diluted net income per share was $0.78, compared to non-GAAP diluted net income per share of $0.29 in the
third quarter last year.
• Deferred revenue increased 35 percent to $2.42 billion. Unbilled deferred revenue was $549 million, an increase of $99
million compared to the third quarter of last year. Remaining performance obligations (RPO), or the sum of total billed and
unbilled deferred revenue, totaled $2.97 billion, an increase of 32 percent. Current RPO totaled $2.05 billion, up 23 percent.
• Cash flow from operating activities was $276 million, an increase of $237 million compared to the third quarter last year.
Free cash flow was $267 million, an increase of $240 million compared to the third quarter last year.
"Our strong performance continued in Q3 as revenue, billings, ARR, earnings and free cash flow came in above
expectations," said Autodesk president and CEO. "We continue to demonstrate the cash generating power of our
business model, and this quarter drove a record last twelve months free cash flow of nearly $1 billion. The breadth and
depth of our product portfolio in Construction paved the way for another strong quarter. In Manufacturing, we continue
to displace competitors and grow faster than the overall market."
Description
4

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Motive Partners Acquires Majority Interest in Investment
Services Business of Fiserv (USA)
Motive Partners, a private equity firm focused on technology-enabled companies that
power the financial services industry, and Fiserv, Inc., a leading global provider of
payments and financial services technology solutions, have entered into a definitive
agreement under which Motive Partners-led investors will acquire up to 60% of the
Investment Services business of Fiserv. Retaining a 40% equity interest in the business,
Fiserv will receive approximately $510 million in net after-tax proceeds. The
Investment Services business is a leading technology provider for key segments of the
wealth and asset management industry. Its scalable, integrated platform delivers
mission-critical, end-to-end software solutions for the front, middle and back office. As
a provider of a premier platform for the industry, the Investment Services business
serves a blue-chip customer base in a market with favorable macro trends and the
potential to accelerate growth as a standalone business. Going forward, the business
will benefit from the experience and expertise of Fiserv, Motive Partners and Cannae
Holdings in growing scaled financial technology businesses and will remain committed
to delivering market-leading wealth management capabilities through innovative,
adviser-centric technology solutions. The newly formed joint venture will continue to
be led by Cheryl Nash, President of Investment Services at Fiserv. Upon the closing of
the transaction, Rob Heyvaert, Founder and Managing Partner of Motive Partners, will
serve as Executive Chairman of the joint venture. William P. Foley II, Executive
Chairman of Cannae Holdings, Dun & Bradstreet and Black Knight and Alvi Abuaf,
lead Industry Partner for Motive Partners, will also join the Board.
“We are delighted to be joining forces with Rob and Motive Partners to enhance
and accelerate Investment Services’ leadership position,” said Chairman and Chief
Executive Officer of Fiserv. “The new joint venture will increase our collective
focus on growth and value, while creating more opportunities for clients, associates
and shareholders.”
Description
5

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Lenovo (Hong Kong) Q2 Momentum Powered by 9th Consecutive YOY Quarterly
Revenue Growth, Strong, Positive PTI and Net Income Growth
• Group revenue grew year-on-year for the ninth
consecutive quarter, reaching US$13.5 billion
• Pre-tax Income (PTI) grew 45% year-on-year to US$310
million
• Net income up 20% year-on-year to US$202 million
• Lenovo continues to be the world’s #1 player in the
global PC market with record shipments of 17.3 million
units, including double-digit premium segments growth
• Software and services revenue* up 35% year-on-year to
US$883 million
• Basic earnings per share for the second quarter were 1.69
US cents or 13.23 HK cents. Lenovo’s Board of Directors
declared an interim dividend of 6.3 HK cents per share.
“During the quarter we were pleased to see our growth
momentum deliver continued solid financial
performance amidst a complex and dynamic global
trading environment. This success is a testament to our
commitment to innovation, to our customers across 180
markets around the world, and to how the world
continues to embrace our vision to deliver smarter
technology for all,” said Lenovo Chairman and CEO.
Description
6

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NVIDIA (USA) Announces Financial Results for Third Quarter
Fiscal 2020
• Revenue for the third quarter ended Oct. 27, 2019, of $3.01 billion compared with $3.18 billion a
year earlier and $2.58 billion in the previous quarter.
• GAAP earnings per diluted share for the quarter were $1.45, compared with $1.97 a year ago and
$0.90 in the previous quarter.
• Non-GAAP earnings per diluted share were $1.78, compared with $1.84 a year earlier and $1.24 in
the previous quarter.
NVIDIA’s outlook for the fourth quarter of fiscal 2020 does not include any contribution from the
pending acquisition of Mellanox and is as follows:
• Revenue is expected to be $2.95 billion, plus or minus 2 percent. Strong sequential growth is
expected in Data Center, offset by a seasonal decline in GeForce® notebook GPUs and SoC
modules for gaming platforms.
• GAAP and non-GAAP gross margins are expected to be 64.1 percent and 64.5 percent,
respectively, plus or minus 50 basis points.
• GAAP and non-GAAP operating expenses are expected to be approximately $1.02 billion and
$805 million, respectively.
• GAAP and non-GAAP other income and expense are both expected to be income of approximately
$25 million.
• GAAP and non-GAAP tax rates are both expected to be 9 percent, plus or minus 1 percent,
excluding any discrete items. GAAP discrete items include excess tax benefits or deficiencies
related to stock-based compensation, which are expected to generate variability on a quarter by
quarter basis.
“Our gaming business and demand from hyperscale customers powered Q3’s results,“ said
Founder and CEO of NVIDIA. “The realism of computer graphics is taking a giant leap forward
with NVIDIA RTX. This quarter, we have laid the foundation for where AI will ultimately make
the greatest impact. We extended our reach beyond the cloud, to the edge, where
GPU-accelerated 5G, AI and IoT will revolutionize the world’s largest industries. We see strong
data center growth ahead, driven by the rise of conversational AI and inference.”
Description
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Skyworks (USA) Reports Q4 And Full Year Fy19 Results
• Delivers Q4 Revenue of $827 Million with GAAP Diluted EPS of $1.22; Non-GAAP
Diluted EPS of $1.52
• Posts FY19 Revenue of $3.377 Billion with GAAP Diluted EPS of $4.89; Non-GAAP
Diluted EPS of $6.17
• Drives $1.367 Billion in Annual Operating Cash Flow, Up 8% from FY18
• Returned $932 Million to Shareholders via Dividends and Repurchase of 8.9 Million
Shares in FY19
• Guides to Sequential Revenue and Earnings Growth in Q1 FY20
Fourth Fiscal Quarter Business Highlights
• Accelerated ramp of Sky5® portfolio supporting multiple 5G launches
• Powered Samsung’s suite of 4G mobile devices and their first foldable 5G smartphone
• Enabled LG’s V50ThinQ™ flagship 5G handset featuring an OLED display and dual
screens
• Supported leading infrastructure customers with 5G small cell architectures
• Secured Wi-Fi 6 design wins with Netgear in their Orbi™ and Nighthawk platforms
• Delivered LTE-powered IoT engines across Sierra Wireless industrial gateways and
transportation platforms
• Commenced volume production of high-performance mesh network connectivity modules
for Amazon, Juniper and Ruckus
• Ramped fully integrated LTE solutions with major automotive manufacturers
• Shipped Zigbee® ultra-low power devices for a tier-one home security provider
• Expanded reach at Sonos, enabling their indoor/outdoor portable smart speakers
• Introduced cognitive chipsets for ultra-low latency, next-generation wireless gaming
headsets
“Skyworks delivered solid financial results in the fourth fiscal quarter, closing a year
that saw extraordinary market volatility and change,” said President and chief
executive officer of Skyworks. “Looking ahead, we are well positioned to execute on
our mission of delivering compelling 5G solutions across a growing and diverse suite
of customers and markets. Our systems-level approach, highlighted by our Sky5®
platform, now includes strategic capabilities in BAW, Wi-Fi 6, MIMO and custom
diversity receive. Collectively, these solutions are unleashing the true potential of 5G –
successfully providing a range of options to our customers while increasing the value
and utility of each usage case. We are in the early innings of this substantial technology
inflection, as we translate these dynamics into sustainable growth and profitability.”
Description
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STMicroelectronics (Switzerland) closes acquisition of silicon carbide
wafer specialist Norstel AB
STMicroelectronics, a global semiconductor leader serving
customers across the spectrum of electronics applications,
announced the closing of the full acquisition of Swedish
silicon carbide (SiC) wafer manufacturer Norstel AB
(“Norstel”). ST exercised its option to acquire the remaining
45% stake, following the initial transaction announced in
February 2019. The total consideration for the acquisition of
Norstel was $137.5 million, funded with available cash.
Norstel will be fully integrated into ST’s global R&D and
manufacturing operations. It will continue growing its
activities covering both the production of 150mm bare and
epitaxial silicon carbide wafers and R&D on 200mm
production as well as, more broadly, on wide bandgap
materials.
“At a time of constrained global capacity for silicon
carbide, the full acquisition of Norstel will strengthen our
internal SiC ecosystem: it will boost our flexibility, allow us
to control better the improvement of yield and quality of the
wafers, and support our long-term silicon carbide roadmap
and business,” said President and CEO of
STMicroelectronics. “This acquisition comes in addition to
wafer supply agreements signed with third parties, with the
overall goal to secure the required level of wafers to
manufacture MOSFET and diodes for the automotive and
industrial customer programs that will ramp up over the
next years.”
Description
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Solutions Updates
Technology Industry

Solution Updates
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10
Solution Description
AMD announced the release of the highly anticipated flagship 16-core AMD Ryzen9 3950X processor, available worldwide November
25, 2019. AMD Ryzen 9 3950X processor brings the ultimate processor for gamers with effortless 1080P gaming in select titles1 and up
to 2X more energy efficient processing power compared to the competition2 as the world’s fastest 16-core consumer desktop
processor3. In addition, AMD also announced a significant performance uplift4 coming for mainstream desktop users with the new
AMD Athlon 3000G, arriving November 19, 2019. Offering up to 22% performance increase over previous generations5, the AMD
Ryzen 9 3950X offers faster 1080p gaming in select titles1 and content creation6 than the competition. Built on the industry-leading
“Zen 2” architecture, the AMD Ryzen 9 3950X also excels in power efficiency3 with a TDP7 of 105W. As the fastest 16-core consumer
desktop processor available3, AMD Ryzen 9 3950X processor offers incredible performance best experienced with a liquid cooling
solution. AMD is recommending the use of an AIO solution with a minimum 280mm radiator. A list of AMD recommended coolers can
be found on AMD.com to ensure enthusiasts can maximize the potential of the Ryzen 9 3950X processor. To ensure the best
experiences for all users, this month, AMD released AGESA version 1004 to its motherboard ecosystem. Containing more than 150
updates, AGESA 1004 offers significant improvements for the AM4 platform focused primarily on stability. Key improvements include
AMD X570 stability and compatibility with add-in devices, PCIe® device support and stability, and interoperability of PCIe®, USB,
SATA, and device reset capabilities, alongside performance enhancements with fastest core utilization and further boost frequency
optimizations for the AMD Ryzen™ 9 3900X.

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AMD (USA) Introduces World’s Fastest High-End Desktop Processors With 3rd Gen Ryzen
Threadripper Family: Delivering Unmatched Performance With No Compromises
11
AMD announced the upcoming availability of powerful new additions to its high-end desktop processor family that deliver groundbreaking
performance for creators, developers, and enthusiasts. Built to deliver leadership performance1,3 for the most demanding desktop and
content creation workloads, the 24-core AMD Ryzen Threadripper 3960X and the 32-core AMD Ryzen Threadripper 3970X processors will
be available worldwide November 25, 2019. The 3rd Gen AMD Ryzen Threadripper lineup features two new processors built on
industry-leading 7nm “Zen 2” core architecture, boasting up to 88 PCIe® 4.0 lanes and 144MB cache with extraordinary power efficiency.
Achieving up to 90 percent faster performance over the competition’s top-end HEDT processor1, the new 32-core Ryzen Threadripper
3970X processor offers unsurpassed performance as the most powerful and fastest desktop processor1 in the high-end desktop market.
AMD Ryzen Threadripper 3970X offers significantly better performance than the competition across multiple content creation and
compute-intensive workloads, including:
• Up to 90% faster performance in Cinebench R20 nT1
• Up to 47% more performance in Adobe Premiere4
• Up to 49% more performance in V-Ray4
• Up to 43% more performance in Chromium Release 78 Compile5
• Up to 36% more performance in Unreal Engine5

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AMD (USA) Radeon™ Pro 5000M Series Mobile GPUs Bring High-Performance AMD RDNA
Architecture to Apple’s New 16-inch MacBook Pro
12
AMD announced that the latest Apple MacBook Pro features the new AMD Radeon™ Pro 5500M and 5300M mobile GPUs. AMD Radeon™
Pro 5000M series are the first 7nm discrete mobile GPUs for professional users, leveraging industry-leading process technology and powerful
AMD RDNA architecture to provide groundbreaking levels of graphics performance for video editing, 3D content creation and macOS-based
game development. AMD Radeon™ Pro 5000M series mobile GPUs are built upon the all-new AMD RDNA architecture, designed from the
ground up for superior performance, scalability and power efficiency. The new GPUs include up to 8GB of high-speed GDDR6 memory with up
to 192 GB/s memory bandwidth – double the bandwidth of GDDR5 – and also deliver up to 4.0 TFLOPS of single-precision floating-point
(FP32) performance. The GPUs are optimized for today’s top professional content creation applications and compute-intensive image rendering
workloads, delivering breathtaking, ultra-smooth, high-framerate visuals on the MacBook Pro Retina display. AMD Radeon™ Pro 5000M
products join the AMD Radeon™ RX 5500 series graphics products announced in October 2019. AMD Radeon™ RX 5500M gaming GPUs and
the new AMD Radeon™ RX 5300M gaming GPUs are expected to be available in systems from other notebook manufacturers this quarter. For
50 years AMD has driven innovation in high-performance computing, graphics and visualization technologies ― the building blocks for
gaming, immersive platforms and the datacenter. Hundreds of millions of consumers, leading Fortune 500 businesses and cutting-edge scientific
research facilities around the world rely on AMD technology daily to improve how they live, work and play. AMD employees around the world
are focused on building great products that push the boundaries of what is possible.

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AMD (USA) Delivers Best-in-Class Performance from Supercomputers to HPC
in the Cloud at SC19
13
AMD is extending its performance lead in high-performance computing (HPC) with a range of new customer wins in top research systems worldwide, new platforms supporting AMD EPYC™
processors and Radeon Instinct™ accelerators and the newly announced ROCm 3.0, bringing support for new compilers and HPC applications. Amazon Web Services (AWS) is expanding its use of
AMD EPYC processors, announcing the upcoming launch of two new Amazon Elastic Compute Cloud (Amazon EC2) compute-optimized instances. These instances, C5a and C5ad, will be
powered by custom 2nd Gen AMD EPYC processors, running at frequencies up to 3.3Ghz. C5a and C5ad will come in 8 virtualized sizes with up to 96 vCPUs which will provide additional choices
to help customers optimize both cost and performance for a variety of compute intensive workloads, including batch processing, distributed analytics, and web applications. Both instances will be
available in bare metal variants which will enable customers to run applications that benefit from direct access to the processor and memory resources of the underlying server. These instances will
have 192 logical processors on 96 physical cores, which will be twice the largest instance size offered in the EC2 compute-optimized instance family. The C5a and C5ad bare metal instance will be
able to utilize 100 Gbps network bandwidth and will be compatible with Elastic Fabric Adapter, enabling customers to scale up High Performance Computing and other large compute intensive
workloads. The new instances will be available soon across multiple AWS regions.
The latest customers deploying AMD processors and accelerators include:
• Atos, a global leader in digital transformation, is supplying two BullSequana XH2000 supercomputers based on 2nd Gen EPYC to Météo-France for operational weather forecasting and research
in atmospheric, ocean and climate science.
• Atos and the French national high-performance computing organization, GENCI, announced that the latest extension of its Joliot-Curie supercomputer, located and administered by the CEA teams
at its TGCC (Very Large Computing Centre), and based on Atos’ BullSequana XH2000 solution and 2nd Gen EPYC is now operational.
• The extension of the Joliot-Curie supercomputer joined the 54th edition of the TOP500, making it the first AMD EPYC 7H12 64-core 280W4equipped supercomputer in the global ranking.
• Cray, a Hewlett Packard Enterprise company, recently announced two new supercomputers equipped with the 2nd Gen AMD EPYC processors and based on the Shasta™ supercomputer
architecture, ARCHER2 and Vulcan.
• Dell Technologies is supplying the San Diego Supercomputer Center and its Expanse supercomputer with Dell EMC PowerEdge servers and 2nd Gen EPYC Processors.
• ETH Zurich is using AMD EPYC 7742 processors in its Euler VI system.
• NEC is supplying the German weather forecasting service, Deutscher Wetterdienst, a system using 2nd Gen EPYC processors in conjunction with NEC SX-Aurora TSUBASA vector engines.

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AMD (USA) Launches World’s First 7nm Professional PC Workstation Graphics
Card for 3D Designers, Architects and Engineers
14
AMD announced the AMD Radeon™ Pro W5700, the world’s first 7nm professional PC workstation graphics card. It delivers new levels of performance and advanced features that enable 3D designers, architects and
engineers to visualize, review and interact with their designs in real time, dramatically accelerating decision-making processes and product development cycles. The AMD Radeon™ Pro W5700 workstation graphics
card features the high-performance, energy-efficient AMD RDNA architecture and state-of-the-art GDDR6 memory to handle large models and datasets, and is the first PC workstation graphics card to support
high-bandwidth PCIe® 4.0 technology. It is ideal for professionals who push performance beyond traditional 3D design by generating photorealistic renders of their concepts and reviewing virtual prototypes of their
designs in virtual reality (VR) environments.
Key capabilities and features of the AMD Radeon™ Pro W5700 graphics card include:
• High-Performance AMD RDNAArchitecture – Features a redesigned geometry engine and compute units, delivering up to 25 percent higher performance-per-clock1 and up to 41 percent higher average
performance-per-watt2 than the previous-generation Graphics Core Next (GCN) architecture.
• Exceptional Power Efficiency – AMD Radeon™ Pro Software for Enterprise’s intelligent power optimization, coupled with the power-efficient AMD RDNA architecture and 7nm process technology, enables the
Radeon™ Pro W5700 graphics card to provide up to 18 percent better system efficiency than the competitive product3.
• Accelerated CPU/GPU Multitasking – Provides outstanding multitasking performance even in the most demanding situations, such as continuing to model while rendering a visualization in the background, providing
up to 5.6X the application workflow performance with CPU load than the competition in the SPECviewperf® 13 benchmark4.
• Professional-grade Software – AMD Radeon™ Pro Software for Enterprise delivers professional-grade quality, continuous performance improvements and robust security as well as industry-leading features,
including AMD Remote Workstation5 that allows professionals to work virtually from anywhere with feature and performance parity with the workstation GPU on their desk6.
• Innovative VR Software Features – AMD Radeon™ ReLive for VR enables professionals using AMD Radeon™ Pro W5700 graphics cards to wirelessly visualize their creations with VR-capable applications and
select standalone VR headsets, such as the HTC VIVE Focus™ Plus7.
• High-bandwidth PCIe® 4.0 – The AMD Radeon™ Pro W5700 is the first PC workstation graphics card to support PCIe® 4.0, delivering double the bandwidth of PCIe® 3.0 to enable smooth performance for
GPU-intensive applications.
• Professional Application Certification – Optimized and certified with leading Design and Manufacturing and Architecture, Engineering and Construction applications to deliver the stability and reliability required by
workstation professionals. The list of Radeon™ Pro Software certified ISV applications can be found here.
• High-speed USB-C® – The AMD Radeon™ Pro W5700 is the first PC workstation graphics card to include a USB-C® connector, supporting a growing selection of USB-C® based monitors and head-mounted
displays (HMD).

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Agilent (USA) Announces New ICP-OES Systems with Innovative Instrument
Intelligence
15
Agilent Technologies, Inc. announced a new generation of ICP-OES systems for laboratories serving the environmental,
food, energy, chemicals, and materials markets. The new Agilent 5800 ICP-OES and 5900 ICP-OES systems incorporate
an entirely new layer of smart capabilities that deliver deeper insight into samples, processes, and operational status.
Greater instrument intelligence enables labs to avoid unplanned downtime, and take a more pro-active approach to
reduce the need to remeasure samples. With patent-pending free-form optics, the 5800 and 5900 are the smallest and
fastest ICP-OES systems on the market, providing lab managers with greater confidence in their operations and results.
Agilent Technologies Inc. is a global leader in life sciences, diagnostics, and applied chemical markets. With more than
50 years of insight and innovation, Agilent instruments, software, services, solutions, and people provide trusted
answers to customers' most challenging questions. The company generated revenues of $4.91 billion in fiscal 2018 and
employs 15,500 people worldwide.

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Agilent (USA) Companion Diagnostic Expands CE-IVD mark in Europe to include
Head and Neck Squamous Cell Carcinoma (HNSCC)
16
Agilent Technologies, Inc. announced that its PD-L1 IHC 22C3 pharmDx assay is now labeled for use in HNSCC in the European
Union. The assay is CE-IVD–marked as an aid in identifying HNSCC patients for treatment with KEYTRUDA, an anti-PD-1
therapy manufactured by Merck (known as MSD outside the United States and Canada). KEYTRUDA, as monotherapy or in
combination with platinum and 5-fluorouracil (5-FU) chemotherapy, is indicated for the first-line treatment of metastatic or
unresectable recurrent HNSCC in adults whose tumors express PD-L1 with a CPS ≥ 1. PD-L1 IHC 22C3 pharmDx is the only
clinical trial-proven PD-L1 assay CE-IVD–marked as an aid in identifying HNSCC patients for treatment with KEYTRUDA.
PD-L1 IHC 22C3 pharmDx is now CE-IVD–marked as a companion diagnostic to KEYTRUDA in three tumor indications –
NSCLC, urothelial carcinoma, and HNSCC. HNSCC is the seventh most common cancer worldwide3 and accounts for more than
90% of head and neck cancer cases.4 In Europe, approximately 170,000 new head and neck cancer cases are diagnosed annually.5
Worldwide, the five-year overall survival rate for HNSCC is approximately 40–50%.6 KEYTRUDA is a humanized monoclonal
antibody that increases the ability of the body's immune system to help detect and fight tumor cells. KEYTRUDA blocks the
interaction between PD-1 and its ligands, PD-L1 and PD-L2, thereby activating T lymphocytes, which may affect both tumor cells
and healthy cells. KEYTRUDA and other targeted immunotherapies are revolutionizing cancer treatment, and their therapeutic
value is being demonstrated across a growing list of cancer types.

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Analog Devices (USA) Unveils Robust, Low-Latency PHY Technology for New ADI
Chronous™ Portfolio of Industrial Ethernet Solutions
17
Analog Devices, Inc. (ADI) announces the release of new robust, industrial Ethernet physical layer (PHY) products to help
manufacturers address key Industry 4.0 and smart factory communication challenges surrounding data integration,
synchronization, edge connectivity, and system interoperability. The ADIN1300 is a low-power, single port Ethernet
transceiver with industry leading power and latency specifications primarily designed for time-critical industrial Ethernet
applications up to Gigabit speeds. As industrial automation increases the adoption of Ethernet and pushes the boundaries of
data rates, the ADIN1300 is designed to operate reliably in harsh industrial conditions over extended ambient temperature
ranges. Analog Devices will showcase the ADIN1300 and other industrial Ethernet solutions at the Smart Productions
Solutions (SPS) exhibition November 26 – 28, 2019 in Nuremberg, Germany. ADIN1300 is the latest technology developed
for the ADI Chronous™ Ethernet portfolio, ADI’s newly expanded portfolio of industrial Ethernet solutions. ADI Chronous
Ethernet solutions – which include the ADIN1200, a low-power single port 10/100 robust Ethernet PHY for today’s real
time industrial Ethernet networks – encompass a range of advanced industrial Ethernet technologies from real-time Ethernet
switches, PHY transceivers and protocol processing to complete network interface products.

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Amphenol (USA) Sine Systems' miniBOSS™ M22
18
Amphenol Sine Systems’ miniBOSS™ M22 product line is IP67-rated, and allows for a cost-effective Power and Signal
distribution system compatible with other industry standard mating connectors. Utilizing UL STOOW/CSA Type ST cable, as well
as High Flex TPE jacketed UL Listed TC-ER cable, our miniBOSS™ M22 products are ideal for Automation markets and its many
applications. Proximity Sensors, Limit Switches, Photoelectric Switches, Solenoid & Hydraulic Valves, Foot-Operated Switches,
Power Tools, Cranes, Hoists, Conveyors, Packaging Equipment, Material Handling Equipment, Beverage Processing, Solar Panel
Wiring Systems, Test Equipment, Commerical and Industrial Lighting, and Portable/Mobile Light Towers
Features:
• 500 Mating cycles
• Multiple standard lengths available
• Straight or 90° over-molded connector options
• Simplified wiring and maintenance
• “Plug & Play” design eliminates wiring errors
• Eliminates the need for “pipe and wire” conduit
• Mechanically keyed to eliminate mis-mating
• Customized solutions available

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Amphenol (USA) Sine Systems' miniBOSS™ M22Arrow Electronics (USA) And R3
Offer Ultra-reliable, Low-latency Wireless M2M Communications
19
Arrow Electronics will offer the full range of R3 Communications’ ECHORING wireless networking products in Europe, Middle East and
Africa (EMEA). ECHORING supports ultra-reliable, low-latency wireless machine-to-machine (M2M) communications that deliver similar
performance to current wired systems. Arrow will be present at R3`s SPS booth from 26th-28th of November 2019 in Nuremberg, Germany.
Many companies seeking to deploy industrial Internet of things (IIOT) or Industry 4.0 solutions need wireless networks that can match the
performance and reliability of existing wired control networks. R3’s ECHORING delivers real-time performance levels with latency down to
only 1ms, even in challenging industrial environments. A range of software solutions in combination with hardware modules, devices and
reference designs based on Texas Instruments WiLink 8 Chip with Wi-Fi and Bluetooth connectivity is now available to simplify integration
with existing networks. Industrial communications protocols supported include PROFINET, PROFIsafe, Ethernet, and SafetyNet. For
integration, operation and maintenance, additional tools are available. Industrial automation applications require critical synchronisation of
different devices that, historically, could only be achieved by wired networks. However, Industry 4.0 can place a strain on cabling: machines
need to be reached even when moving, scalability requires a more flexible approach than fixed physical links can deliver, and moving parts are
more susceptible to maintenance issues. ECHORING uses a radio technology, delivering deterministic access, combined with massive
cooperation to support reliability levels up to SIL 3. It can be integrated with existing industrial hardware and software, helping to preserve
previous investments in equipment. The security is powered by Olympus Sky, a company that offers low cost, low complexity military grade
security. As part of the agreement, Arrow will be offering a starter kit that allows users to test ECHORING’s performance in their own
production environment by substituting the kit’s wireless stations for existing Ethernet connections.

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Autodesk (USA) Ushers in New Era of Connected Construction with Autodesk
Construction Cloud
20
Autodesk, Inc. unveiled Autodesk Construction Cloud™, which combines advanced technology, a unique builders network and predictive
insights to connect people and data across the entire building lifecycle, from design through operations. At the center of Autodesk
Construction Cloud are best-of-breed construction solutions Assemble, BuildingConnected, BIM 360 and PlanGrid. Autodesk Construction
Cloud brings these solutions together, and with Autodesk’s established design authoring tools, connects headquarters, office and field teams
to increase collaboration and productivity. Autodesk Construction Cloud includes more than 50 new product enhancements, as well as
deeper integrations between each product to allow data to flow across all stages of construction. It also includes powerful new artificial
intelligence functionality that helps construction teams identify and mitigate design risks before problems occur — reducing delays, rework
and costs.
Autodesk Construction Cloud includes three core elements that give construction companies a competitive advantage in the industry:
• Advanced Technology: Best-in-class software solutions built for simplicity and power — uniting headquarters, office and field teams from
design through construction and operations.
• Builders Network: The industry’s largest network of owners, designers, builders and trades, enabling each to connect with the right
partners and projects.
• Predictive Insights: AI-driven analysis of previously siloed project data provides builders with powerful insights to predict outcomes and
reduce risk.

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Apple (USA) introduces 16-inch MacBook Pro, the world’s best pro notebook
21
Apple unveiled an all-new 16-inch MacBook Pro — the world’s best pro notebook — designed for developers,
photographers, filmmakers, scientists, music producers and anyone who relies on a Mac to create their life’s best work. The
all-new MacBook Pro features a brilliant 16-inch Retina Display, the latest 8-core processors, up to 64GB of memory,
next-generation graphics with up to 8GB of VRAM and a new advanced thermal design, making it the most powerful
MacBook Pro ever. Featuring a new Magic Keyboard with a redesigned scissor mechanism and 1mm travel for a more
satisfying key feel, the 16-inch MacBook Pro delivers the best typing experience ever in a Mac notebook. The 16-inch
MacBook Pro also includes a six-speaker sound system, longer battery life, Touch Bar, Touch ID, the Force Touch trackpad
and the Apple T2 Security Chip. Pros love the brilliant 500 nit, P3 wide colour gamut Retina display on MacBook Pro, and
at 16 inches, it’s the largest Retina notebook display ever. Featuring a resolution of 3072x1920 and a higher pixel density of
226 ppi, the 16-inch Retina display delivers nearly 6 million pixels and an even more immersive front-of-screen experience.
Each display is individually calibrated in the factory for accurate gamma, white point and primary colours.

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Broadcom (USA) Introduces Industry’s First Enterprise-Grade Support for
Eclipse Che4z and VS Code4z
22
Broadcom Inc. announced the introduction of the industry’s first enterprise-grade support for new extensions of Eclipse Che 7— the first
Kubernetes-native, integrated development environment (IDE) for developer teams leveraging the mainframe platform. As the first-ever
open-source based set of IDE extensions for mainframe application development, developers can now use their existing tools to easily build
innovative apps leveraging the data and processes residing on the mainframe. This innovative new offering, combined with Broadcom’s CA
Brightside support of the Open Mainframe Project Zowe framework, provides enterprises with the confidence they need to introduce true,
modern DevOps tools within their mainframe environment. With enterprise-grade support, IT organizations are now in a position to
accelerate their digital transformation initiatives. Developers spend the bulk of their day immersed in IDE and software configuration
management (SCM). While career mainframe programmers can continue to use existing tools, the real future of mainframe DevOps focuses
on millennial and off-platform developers who prefer to use familiar tools. The Eclipse Che4z and VS Code4z extensions, previously
contributed by Broadcom to the open-source community, will now be fully-supported. Broadcom’s customers using CA Endevor as their
SCM, with the Git option, will benefit from these tools as well. Broadcom Inc. (NASDAQ: AVGO) is a global technology leader that
designs, develops and supplies a broad range of semiconductor and infrastructure software solutions. Broadcom’s category-leading product
portfolio serves critical markets including data center, networking, enterprise software, broadband, wireless, storage and industrial. Our
solutions include data center networking and storage, enterprise, mainframe and cyber security software focused on automation, monitoring
and security, smartphone components, telecoms and factory automation.

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Fujifilm (Japan) launches “FUJINON UA125×8BESM”
23
FUJIFILM Corporation is pleased to announce the launch of the FUJINON UA125×8BESM (UA125×8), a 4K-compatible
broadcast lens with the world's highest* zoom of 125×, in February 2020. The UA125×8 is a box-type broadcast lens that covers
focal length ranges from a best-in-class wide-angle** of 8mm to a super-telephoto of 1000mm. It uses the company's proprietary
optical technologies to achieve vivid color reproduction and high contrast, producing video with rich gradation using HDR (high
dynamic range), which makes it a perfect choice for live coverage of sporting and music events. The penetration of 4K-compatible
large-screen television in recent years has increased opportunities for enjoying high-definition 4K video. Amidst accelerated
introduction of 4K-compatible video-recording equipment, there is a growing need at the video production frontline for
high-magnification zoom lens capable of capturing dynamic close-up video of a distant subject in 4K quality. The UA125×8 can
record powerful high-quality video thanks to its world’s highest 125× magnification zoom and optical performance that supports
4K video. The lens has the focal lengths of up to 1000mm on the telephoto end to capture a decisive moment of athletes far away or
facial expressions and gestures of artists on stage in live concert. Having the world’s highest wide-angle focal lengths of up to 8mm
means the lens can also record video showing an entire sporting or live music venue. The proprietary optical technologies make
vivid color reproduction and high contrast as well as rich gradation using the HDR. The integration of high-performance optical
image stabilization mechanism keeps camera steady.

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Fujifilm (Japan) launches “FUJINON UA107×8.4BESM AF”
24
FUJIFILM Corporation is pleased to announce the launch of the “FUJINON UA107×8.4BESM AF”, the world's first* 4K-compatible broadcast
lens that incorporates the AF function, in March 2020. The UA107×8.4 AF is a box-type broadcast lens that delivers outstanding capability for
tracking a moving subject and a fast and accurate auto-focus with AF speed as fast as 0.5 seconds. The lens's ultra-high 107× zoom ratio
covering focal lengths from 8.4mm to 900mm and the use of a unique optical image stabilization mechanism allow users to accurately capture a
distant moving subject and produce premium-quality video with minimal camera shake in live coverage of sporting or music events. The
UA107×8.4 AF is an epoch-making product that brings innovation to video production with its capability to record high-quality 4K video with
ease of use and comfort. 4K video is primarily produced through manual focusing, which requires advanced skills on the part of camera
operators. Amidst this situation, Fujifilm has gone a step ahead of the rest of the world in developing a revolutionary 4K-compatible broadcast
lens, “UA107×8.4 AF” with AF function for easy autofocusing. The announcement of its development was well received in the industry.
FUJINON lenses developed by Fujifilm are known for high-quality images and have been used on various production sites including TV
programs, movies and TV commercials around the world, contributing to the evolution of the cutting-edge field of video expression. The
company will continue to tap into its optical, high-precision forming and assembling technologies that have been nurtured over many years to
develop and supply leading-edge products, thereby addressing the diversifying needs at the forefront of video production.

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Hikvision (China) Introduces Video & Audio Convergence Solution Featuring
Real-time Deterrent
25
Hikvision, the world’s leading provider of innovative security products and solutions, has introduced its Video & Audio Convergence
Solution to the market, featuring an innovative real-time intrusion deterrent feature. With Hikvision’s new Video & Audio Convergence
Solution, IP speakers now can be linked with cameras, access control systems, and alarm devices. When the CCTV system automatically
detects an intrusion or if the alarm system is activated, IP speakers can immediately play programmed audio warnings to drive away
would-be intruders. The audio message acts as a deterrent to possible intrusion actions as they happen. Loss and damage can be prevented,
and footage of the event gets recorded for investigation and evidence collection. Along with imported audio warnings, operators can also
speak via the IP speakers to give live warnings when notified of an intrusion. Efficient security operations and digital transformation are
further supported by alarm video which can pop up automatically. Scheduled audio messaging and public information broadcasting are two
more practical functions made possible by Hikvision’s Video & Audio Convergence Solution. IP speakers can play recorded audio
recordings according to a schedule, and operators can use the audio system to broadcast public information as needed to audiences as well.
With its valuable functionality, Hikvision Video & Audio Convergence can be applied across a wide range of scenarios and applications –
including perimeter security, petrol stations, metro and railway stations, office buildings, and much more. Continue reading for more details
on various applications.

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Intuit (USA): QuickBooks Online Advanced Continues Innovating for High-Growth
Mid-Market Businesses with AI-Enabled Capabilities
26
Intuit Inc. announced five new capabilities to QuickBooks Online Advanced, Intuit’s cloud-based offering specifically designed for high-growth, mid-market small businesses that leverages AI,
automation and data insights to deliver more ways for them to grow and scale. Intuit unveiled the new QuickBooks Online Advanced capabilities at Dreamforce 2019 this month in San Francisco.
Five New Capabilities Available Today in QuickBooks Online Advanced. Intuit is committed to delivering an online accounting solution that helps mid-market small businesses be more productive,
collaborate and grow as they scale rapidly. QuickBooks Online Advanced supports these types of businesses with several capabilities already in place, including all the capabilities within
QuickBooks Online Plus as well as smart reporting powered by Fathom, accelerated invoicing, custom user permissions and membership in Priority Circle, a premier priority care and training
program. The new capabilities launched today further meet the unique needs of these high-growth businesses by delivering even deeper insights through added reporting and business management
tools as well as identifying potential cash flow issues through the display of sales patterns and seasonality trends. The five new capabilities introduced to QuickBooks Online Advanced are:
• Revenue Streams Dashboard Card - A new revenue streams report allows businesses to know what is contributing to topline revenue numbers. The dashboard displays both revenue streams as well
as trendlines, so that businesses can better identify seasonality trends and patterns in sales. This is also available from the QuickBooks Online mobile app so businesses can stay informed on the go.
• Workflow Management - Manual workflows are often difficult for small businesses to manage and scale. The new Workflows tool leverages automation to allow business owners to take the work
out of workflow management, allowing them to configure reminders, approvals and triggers based on a small businesses’ own defined rules. Workflow automation within QuickBooks Online
Advanced includes the ability to automatically send invoices and past due reminders and easily track when invoices have been paid.
• Batch Invoices and Expenses - Mid-market small businesses can save time and effort by batching multiple invoices, expenses and checks at once and fast tracking transactions by duplicating them
for multiple customers. This allows businesses to create invoices faster, ensuring they can manage expenses and payments more efficiently.
• Custom Fields - QuickBooks Online Advanced now includes custom fields, which allows businesses to create more detailed reports with multiple field types, with up to 10 custom fields available
so that businesses can better search, sort and filter the data they need, faster.
• Third-Party Integrations - In addition to the new features and tools added to QuickBooks Online Advanced, Intuit continues to add third-party integrations from the companies that small businesses
use most. From spreadsheet programs to customer relationship management, QuickBooks Online Advanced integrates with more than 700 third-party apps to help businesses grow.

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KYOCERA's (Japan) New Temperature-Compensated Crystal Oscillator Offers Industry's
Lowest Phase Noise for 5G, Wi-Fi
27
Kyocera Corporation unveiled a compact temperature-compensated crystal oscillator (TCXO) offering the industry's lowest phase noise*.
Samples of Kyocera's KT1612 Series and KT2016 Series TCXOs are now available worldwide, with mass production planned to start in
March 2020. Increased communication speeds and data capacities required for new 5G and Wi-Fi technologies have brought about a shift
toward multilevel modulation systems that send multiple signals to a single section of a single wavelength. However, since noise and
frequency fluctuations can produce data errors, circuit designers seek compact TCXOs that can provide higher frequency stability with less
degradation. In these applications, a TCXO has two important performance indices:
1. Phase noise: Amplitude and phase fluctuations due to inherent noise in the device; and
2. Phase jitter: Shifts and fluctuations in the time domain of the waveform
Kyocera's compact TCXO delivers an industry-leading, ultra-low phase noise of -168 dBc/Hz at 100kHz offset. In addition, it reduces phase
jitter to 68 fs from 12kHz to 5MHz, resulting in greatly improved communication quality. These new benchmark performance levels were
achieved using high-Q-value, high-quality, synthetic crystals grown at Kyocera's Yamagata Higashine Plant, combined with a crystal
oscillator optimized by plasma chemical vaporization machining (CVM), an ultra-high-precision processing technology, and an oscillator
circuit that suppresses noise.

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Lam Research (USA) Offers New Capabilities In Its Edge Yield Product Portfolio
28
Lam Research Corp. is offering new capabilities in its semiconductor manufacturing systems portfolio to further improve device yield at the edge of the wafer,
which is essential to delivering greater productivity for customers. During the semiconductor production process, device manufacturers want to build integrated
circuits on the entire surface of the wafer. On the edge of the wafer, where chemical, physical and thermal discontinuities are harder to control, the risk of yield
loss increases. Controlling etch non-uniformity and preventing defects at the wafer’s edge is key to semiconductor device manufacturing cost reduction. Lam
offers edge yield solutions for high volume manufacturing with the Corvus® etch and Coronus® plasma bevel clean systems. These solutions can be found in
leading-edge node manufacturing facilities around the world and are extensively used by advanced foundry, logic, DRAM, and NAND customers. Corvus
enhances edge yield on the Kiyo® and Versys® Metal systems by smoothing out extreme edge discontinuities. With Corvus, every die on the wafer sees the
same conditions for optimal yield, reducing previously seen systematic die-to-die variability. Lam’s Corvus technology also minimizes deviation at the edge
using its tunability features. Coronus improves device yield by removing defect sources from the bevel region or depositing encapsulating layers for bevel
protection. Coronus’ versatility manages bevel challenges such as eliminating defects from film/polymer residues and roughened surfaces, as well as depositing
layers for bevel protection during long otherwise damaging etch processes. The Coronus product family demonstrates excellent repeatability enabled by
proprietary wafer placement and plasma confinement technologies. Lam Research Corporation is a global supplier of innovative wafer fabrication equipment
and services to the semiconductor industry. As a trusted, collaborative partner to the world’s leading semiconductor companies, we combine superior systems
engineering capability, technology leadership, and unwavering commitment to customer success to accelerate innovation through enhanced device performance.
In fact, today, nearly every advanced chip is built with Lam technology. Lam Research (Nasdaq: LRCX) is a FORTUNE 500® company headquartered in
Fremont, Calif., with operations around the globe.

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LG (South Korea) Introduces Powerful Portable Air Purifier For Enhanced
Peace Of Mind
29
LG Electronics (LG) announces the world’s first filter-type portable air purifier designed for use on-the-go. With an innovate PM1.0
Sensor, the compact and cord-free LG PuriCareTM Mini helps deliver safe, clean air in the car, a baby’s nursery or even one’s office.
With LG’s 4-Step Air Filtration System, LG PuriCare Mini can detect and remove 99 percent particulates as small as 0.3 μm.* The first
step involves the PM1.0 Sensor which quickly and accurately detects the quality of the air before the Dual Inverter Motor forcibly
draws in the air at 5,000rpm in the second step. In step three, the high-efficiency Total Allergen Removal filter removes particulates in
the air and in the final step, the powerful Twin Tornado Dual Fan disperses the clean air far and wide. The LG PuriCare Mini is not only
highly efficient, it’s also fast, cleaning 50 percent of the air inside a car in 10 minutes. LG PuriCare Mini can go anywhere the user goes
thanks to its small size and light weight, which make it ideal for use on the go where plug-in models can’t go. Similar in size and
weight as a 500 milliliter bottle of water, the wireless portable air purifier freshens the air for up to 8 hours at low speed or 2 hours at
the highest setting on battery power alone. And its quiet operation – only 30dB in low setting – allows the LG PuriCare Mini to be used
in an enclosed stroller without waking a peacefully sleeping baby. PuriCare Mini utlizes a durable filter which lasts up to 2,000 hours or
six months if used 12 hours a day. The free LG ThinQ app for both Android and iOS devices allows users to monitor the condition of
the filter, check the battery status and control their LG PuriCare Mini via Bluetooth with a smartphone or tablet.

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Maxim (USA) Unveils Cuffless Blood-Pressure Measurement Solution Meeting
Class-II Regulatory Accuracy Limits
30
Until now, accurate blood-pressure monitoring could only be achieved with bulky and mechanical cuff-based medical devices. Now, Maxim
Integrated Products, Inc. has introduced a solid-state blood-pressure monitoring solution to more conveniently track this critical health
indicator. Design engineers can develop blood-pressure trending solutions with the MAXREFDES220# reference design from Maxim.
Comprised of a complete integrated optical sensor module, a microcontroller sensor hub and a sensing algorithm, the MAXREFDES220#
optical blood-pressure trending solution can be embedded into smartphones or wearables. It enables users to place their finger on a device
for 30-45 seconds while resting to measure blood pressure anywhere and anytime. The reference design includes the MAX30101 or
MAX30102 high-sensitivity optical sensor, as well as the MAX32664D sensor hub IC with built-in algorithms. The MAX30101 (using
three LEDs) and MAX30102 (using two LEDs) pulse-oximeter and heart-rate optical sensor modules combine photodetectors, LEDs and
analog front-end (AFE) electronics with an integrated cover glass. This integrated optical design and lenses-on-top approach enables
optimal signal-to-noise ratio (SNR) for a small, lower cost and power-efficient module. It comes in a tiny 5.6mm x 3.3mm 14-pin optical
package with an I2C interface to the sensor hub IC. The MAX32664D sensor hub IC includes firmware which controls the sensor and
executes the algorithms which measure cuffless blood pressure, heart rate and blood-oxygen levels. Its ultra-small size (1.6mm x 1.6mm)
can easily fit into small devices to seamlessly and effortlessly connect to a device’s host microcontroller.

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Microchip (USA) Smart Storage Adapters Now Interoperate Seamlessly with MegaRAC®
SP-X Management Firmware from AMI for At-Scale Secure Storage Management
32
Data center administrators and IT managers want the ability to securely manage and trouble-shoot platforms and devices remotely,
which requires that additional software, hardware and firmware be interfaced with storage adapters and other server components.
Microchip Technology Inc. (Nasdaq: MCHP) today announced it has added this capability to its Adaptec Smart Storage adapters, which
now seamlessly interoperate with MegaRAC® SP-X remote monitoring and diagnostics firmware from American Megatrends (AMI)
and are supported in its MegaRAC solution development framework. Interoperability between Adaptec Smart Storage adapters and
MegaRAC SP-X manageability firmware powering embedded base management controllers (BMCs) reduces data center operational
costs by enabling remote management capabilities including platform status monitoring and problem notifications, diagnosis and
recovery. Out-of-band management enables the adapters to be reached directly over a network connection if the server is powered off or
unresponsive and improves security by eliminating the need for proprietary software or host tools on either the server or storage
system. AMI has leveraged a combination of the widely adopted management component transport protocol (MCTP) protocol and
Microchip’s StorageCore application programming interface (API) to add basic support for the Adaptec Smart Storage adapters in its
MegaRAC development framework’s Storage Adapter management tool.

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Reduce Memory Costs and Retain Data at Power Loss with Microchip’s EERAM
Memory Solutions
33
Microchip Technology Inc. announced a new family of Serial Peripheral Interface (SPI) EERAM memory products that offer system
designers up to 25 percent cost savings over the current serial NVRAM alternatives. The family introduces four reliable SPI densities to
Microchip’s EERAM portfolio, ranging from 64 Kb up to 1 Mb. EERAM is a standalone nonvolatile RAM memory that uses the same
SPI and I2C protocols as serial SRAM, enabling devices to retain SRAM content during power loss without using an external battery.
All nonvolatile aspects of the part are essentially invisible to the user. When the device detects power going away, it automatically
transfers the SRAM data to nonvolatile storage and moves it back to the SRAM once power returns to the part. In manufacturing lines,
for example, stations handle up to millions of tasks over their lifetimes, and lost data during a task can require overhauling or
discarding items. EERAMs automatically store SRAM content in these settings, allowing the manufacturing line to resume where the
task was disrupted. The primary reason EERAM is available at a lower price point is the use of standard Complementary
Metal-oxide-semiconductor (CMOS) and Flash processes. Because these are the highest volume and most widely used processes, they
offer the best reliability and lowest cost in the industry. Alternative solutions such as Ferroelectric RAM (FRAM) use a specialty
process, resulting in much higher costs and unstable long-term supply. The new EERAM family comes with Microchip’s
customer-driven obsolescence practice, which helps ensure availability to customers for as long as needed.

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Micron (USA) Eliminates Need for Network Video Recorders With Launch of World’s First
1TB Industrial-Grade microSD Card for Cloud-Managed Video Surveillance
34
Micron Technology, Inc. unveiled the world’s highest-capacity industrial microSD card — Micron® i300 1TB3 microSDXC UHS-I — to
address the edge storage needs of the video surveillance market and other industrial applications. The new Micron® i300 1TB microSD card is
based on Micron’s advanced 96-layer 3D quad-level cell (QLC) NAND technology, now making it cheaper for small- to medium-sized
deployments to have primary storage in the camera compared to a centralized storage architecture. The i300 microSD card enables users of
video surveillance systems to capture and store more than three months of high-quality video footage on-device and at the edge. VSaaS systems
are increasingly integrating artificial intelligence-based and higher-resolution cameras that require more storage at the edge. The Micron i300
1TB microSDXC card allows 24/7 continuous capture and storage of up to 1TB of high-quality video in the camera. Users of video surveillance
systems can now store large amounts of video footage on-device, opening a broader set of uses for cloud-managed solutions. The VSaaS market
is projected to reach $6 billion in 2022, corresponding to a growth of 22% compound annual growth rate between 2017 and 2022.4 The rising
adoption of VSaaS by small to medium businesses and enterprises is attributed to lower overhead costs achieved through ease of installation and
elimination of the need for on-site NVRs and DVRs. The ability to store large video footage files in the camera and at the edge reduces the
demand for network bandwidth and expenditure associated with continuous cloud storage. These savings contribute to lowering the overall cost
of ownership for businesses while bringing flexibility and scalability associated with cloud-based implementation models.

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Murata (Japan) Develops the World's First Multilayer Ceramic Capacitor
35
Murata Manufacturing Co., Ltd. has developed the GRM011R60J104M, the world’s first multi-layer ceramic capacitor*1 to feature a
maximum capacitance of 0.1µF in 008004 inch size (0.25×0.125mm). Mass production of this new product is scheduled to begin in 2020.
As smartphones supporting 5G become more widespread and devices such as wearable devices become increasingly multifunctional and
more compact, the demand for smaller and higher density electronic circuitry is growing. Among the components employed in this circuitry,
multi-layer ceramic capacitors are essential for electronic devices and are used for a wide range of applications such as in smartphones and
wearable devices. As the high end smartphones are equipped with around 800 to 1,000 capacitors, there is a considerable need for such
components to be made even more compact. By using our original ceramic and electrode material atomization and homogenization
technology, Murata has achieved a mounting surface area approximately 50% smaller and a volume approximately 80% smaller than that of
our conventional product (01005 inch size)*2 with a capacitance of 0.1µF. Moreover, the new product has a capacity of around 10 times
that of the same-sized product (008004 inch size)*3 initially mass-produced by the Company. In future, Murata will continue to conduct
research and development into ceramics and high-precision, microscopic layering technology for electrode materials, expand our lineup to
meet the needs of the market, and contribute to the further miniaturization and greater functionality of electronic devices.

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NRI (Japan) reveals Shingan AD, alternative data insights for global institutional
investors
36
Nomura Research Institute, Ltd. (NRI), a leading provider of consulting services and system solutions, announced they will launch
Shingan AD, a new service providing institutional investors with Japanese alternative data and data analysis on December 1st,
2019. The use of alternative data in investment decision-making is growing rapidly. Sourcing, cleansing, and preparing large
amount of data for analysis presents a big challenge for institutional investors who are looking for untapped alpha. NRI’s new
offering, Shingan AD, allows institutional investors to easily access Japanese alternative data. A wide range of alternative data
collected from Japanese companies and data vendors is available, as well as data processing and analysis services. Shingan AD
covers a wide range of data from various industries such as Consumer Transaction, PoS (Point of Sales), Mobile App, Healthcare
and Sentiment Score data. Data presentation is customizable to the clients desired format, including raw, processed and/or in
combination. Shingan AD provides a service for institutional investors and asset managers to gather the most up to date alternative
market data from Japan to identify untapped alpha and support data-driven investment decisions. Shingan AD offers a unified
source for the latest data from Japanese corporations and data vendors, as well as data processing and analysis services, data
matching and contract executions. Shingan AD is available to asset managers across the global marketplace.

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NRI (Japan) Secure Launches Japan's First IT Security Assessment Service for
Container Orchestration
37
NRI SecureTechnologies, Ltd. (NRI Secure) launched Japan's first1 IT security assessment service for systems with container
orchestration2, that uses the leading container orchestration tool "Kubernetes." This service provides IT security assessment for a
system using container orchestration technology from the viewpoints of both "static analysis" by interpreting configuration files,
and "dynamic analysis" by attempting simulated attacks. The assessment consists of manual inspection by engineers of NRI Secure
who have expert knowledge of container orchestration as well as several tests using auxiliary inspection tools. This service detects
security issues by checking the validity of the information on the configuration file, and the architecture configuration generated by
container orchestration. In addition to the independent inspection of each configuration file, a comprehensive and highly accurate
assessment is performed to check whether the configuration state is appropriate or not by looking at the entire architecture. This
enables us to detect security issues at the design phase that are often overlooked by the inspection tool alone. Followed by
Kubernetes, NRI Secure plan to add more container orchestration tools to the scope of this IT security assessment service. In recent
years, as DX (digital transformation) has become more widespread, the need for greater flexibility and speed in system
development has increased, and the design concepts and infrastructure technologies that support these requirements have been
rapidly evolving. In particular, microservice4, which develops applications by splitting them into services and functions, and other
system development that presuppose deployment of cloud-native5 and serverless6 architectures are becoming more common.

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NVIDIA (USA) Announces Scalable GPU-Accelerated Supercomputer in the Microsoft
Azure Cloud
38
NVIDIA announced the availability of a new kind of GPU-accelerated supercomputer in the cloud on Microsoft Azure. Built to handle
the most demanding AI and high-performance computing applications, the largest deployments of Azure’s new NDv2 instance rank
among the world’s fastest supercomputers, offering up to 800 NVIDIA V100 Tensor Core GPUs interconnected on a single Mellanox
InfiniBand backend network. It enables customers for the first time to rent an entire AI supercomputer on demand from their desk, and
match the capabilities of large-scale, on-premises supercomputers that can take months to deploy. The new offering — which is ideal
for complex AI, machine learning and HPC workloads — can provide dramatic performance and cost advantages over traditional
CPU-based computing. AI researchers needing fast solutions can quickly spin up multiple NDv2 instances and train complex
conversational AI models in just hours. Microsoft and NVIDIA engineers used 64 NDv2 instances on a pre-release version of the
cluster to train BERT, a popular conversational AI model, in roughly three hours. This was achieved in part by taking advantage of
multi-GPU optimizations provided by NCCL, an NVIDIA CUDA X™ library and high-speed Mellanox interconnects. Customers can
also see benefits from using multiple NDv2 instances to run complex HPC workloads, such as LAMMPS, a popular molecular
dynamics application used to simulate materials down to the atomic scale in such areas as drug development and discovery. A single
NDv2 instance can deliver an order of magnitude faster results than a traditional HPC node without GPU acceleration for specific types
of applications, such as deep learning. This performance can scale linearly to a hundred instances for large-scale simulations.

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NVIDIA (USA) and Tech Leaders Team to Build GPU-Accelerated Arm Servers for New
Era of Diverse HPC Architectures
39
NVIDIA introduced a reference design platform that enables companies to quickly build GPU-accelerated Arm®-based servers, driving
a new era of high performance computing for a growing range of applications in science and industry. Announced by NVIDIA founder
and CEO at the SC19 supercomputing conference, the reference design platform — consisting of hardware and software building
blocks — responds to growing demand in the HPC community to harness a broader range of CPU architectures. It allows
supercomputing centers, hyperscale-cloud operators and enterprises to combine the advantage of NVIDIA’s accelerated computing
platform with the latest Arm-based server platforms. To build the reference platform, NVIDIA is teaming with Arm and its ecosystem
partners — including Ampere, Fujitsu and Marvell — to ensure NVIDIA GPUs can work seamlessly with Arm-based processors. The
reference platform also benefits from strong collaboration with Cray, a Hewlett Packard Enterprise company, and HPE, two early
providers of Arm-based servers. Additionally, a wide range of HPC software companies have used NVIDIA CUDA-X™ libraries to
build GPU-enabled management and monitoring tools that run on Arm-based servers. In addition to making its own software
compatible with Arm, NVIDIA is working closely with its broad ecosystem of developers to bring GPU acceleration to Arm for HPC
applications such as GROMACS, LAMMPS, MILC, NAMD, Quantum Espresso and Relion. NVIDIA and its HPC-application
ecosystem partners have compiled extensive code to bring GPU acceleration to their applications on the Arm platform.

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NVIDIA (USA) Launches Magnum IO Software Suite to Help Eliminate Data Bottlenecks for
Data Scientists and AI, HPC Researchers
40
NVIDIA introduced NVIDIA Magnum IO, a suite of software to help data scientists and AI and high performance computing
researchers process massive amounts of data in minutes, rather than hours. Optimized to eliminate storage and input/output
bottlenecks, Magnum IO delivers up to 20x faster data processing for multi-server, multi-GPU computing nodes when working
with massive datasets to carry out complex financial analysis, climate modeling and other HPC workloads. NVIDIA has
developed Magnum IO in close collaboration with industry leaders in networking and storage, including DataDirect Networks,
Excelero, IBM, Mellanox and WekaIO. At the heart of Magnum IO is GPUDirect, which provides a path for data to bypass
CPUs and travel on “open highways” offered by GPUs, storage and networking devices. Compatible with a wide range of
communications interconnects and APIs — including NVIDIA NVLink™ and NCCL, as well as OpenMPI and UCX —
GPUDirect is composed of peer-to-peer and RDMA elements. Its newest element is GPUDirect Storage, which enables
researchers to bypass CPUs when accessing storage and quickly access data files for simulation, analysis or visualization.
NVIDIA Magnum IO software is available now, with the exception of GPUDirect Storage, which is currently available to select
early-access customers. Broader release of GPUDirect Storage is planned for the first half of 2020.

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OMRON (Japan) Develops Industry's Fastest 3D Vision Sensing Technology for
Robot Hands
41
OMRON Corporation has developed the industry's fastest*1 3D vision sensing technology for compact vision sensors to three-dimensionally recognize the
position and orientation of target objects. Incorporating this technology with robots will enable fast and accurate assembly of bulk parts by automating the
conventional human-intensive process. The commercialization of a compact 3D vision sensor based on this technology is slated for 2020. The automation
of processes such as assembly, inspection and transportation that very much rely on people's experience and senses is imperative amid deepening labor
shortage and increasing labor costs of recent years. However, to automate the picking of bulk parts performed by humans in an assembly process, robots
need to be equipped with "eyes", and that requires high-speed 3D vision sensing technology capable of instantly recognizing the position and orientation of
parts. To this end, both of the two component technologies of 3D measurement to generate 3D images of a shape, and 3D recognition to recognize the
position and orientation of the target object need to be faster. To address this need, OMRON developed a 3D vision sensing technology. This new
technology enables high-speed, high-accuracy three-dimensional object recognition and provides a compact and lightweight vision sensor that can be
mounted onto robot hands. Whereas measurement by conventional 3D measurement technology using the phase-shifting method*2 requires time since 10
or more images need to be captured, OMRON developed a 3D measurement technology capable of generating a 3D image of a target object in a single
shot using a proprietary pattern illumination. In addition, by extending the high-speed 2D search technology*3 it accumulated in the image processing field
to 3D, OMRON developed a high-speed object position and orientation recognition algorithm for the 3D recognition technology. These technologies allow
for high-speed part recognition for fluid part picking in approximately 0.5 seconds*4. Furthermore, mounting cameras onto compact robot hands became
possible as OMRON's proprietary pattern illumination reduced the camera size and weight to approximately 500g. The 3D vision sensor's visual point can
be moved in accordance with the part setup, allowing for flexible picking of parts in various positions and orientations.

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OMRON (Japan) Globally Launches LD-250 Mobile Robot to Move Payloads
Up to 250kg
42
OMRON Corporation announced that it will globally start selling a new mobile robot called the LD-250 on November 15,
2019. With a payload capacity of 250kg, the LD-250 is the strongest and newest addition to the company's LD series of
mobile robots. Together with the Fleet Manager, which for the first time in the industry enables the control of multiple
mobile robots with different payloads through one system, it will contribute to realizing a more flexible and optimized
autonomous material transport system. Factories worldwide are facing challenges in increasing the productivity and
profitability of high-mix production with the decreasing workforce in industrialized nations and rising labor costs in
emerging countries. The mobile robot LD series can autonomously avoid people and obstacles while automatically
calculating the best routes to transport material. The new LD-250 mobile robot has a 250kg payload capacity and almost
double the surface area, so it can be used to transport large automobile components such as transmission blocks and
voluminous packaging materials - things that would traditionally be moved by human workers using carts. To optimize the
autonomous material transport system, customers will use OMRON's industry-first Fleet Manager, which can control a
diverse fleet of up to 100 of OMRON's mobile robots that can consist of different payloads and capabilities, by conducting
traffic management, battery management, and navigation of vehicles.

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OMRON (Japan) Releases World's First MOS FET Relay Module G3VM-21MT with
Solid State Relay in "T-type Circuit Structure"
43
OMRON Corporation will globally release its new MOS FET*1 relay module "G3VM-21MT" on December 2, 2019. The product will be the first
electronic component in the world*2 to adopt a "T-type circuit structure"*3. With T-type circuit structure consisting of compact size and longer
lifecycle solid state relays that output signals using no physical contact, the relay module minimizes the leakage current*4 which has long been a
problem with semiconductor test equipment. G3VM-21MT allows high-precision measurement and improves productivity of electronic components.
G3VM-21MT enables switching measurement signals in the test equipment mainly used to perform electrical tests for semiconductor devices. In
addition to the MOS FET relay features of compact size and longer lifecycle, G3VM-21MT is the world's first MOS FET relay Module with "T-type
circuit structure" which consists of three MOS FET relays that help reduce the leakage current to a minimal level without affecting the test
equipment's inspection accuracy while allowing high-precision measurement and decreasing maintenance frequency of the test equipment. Amid the
digital age where functions of electronic components are getting diversified and production volume increasing, there is a growing need for higher
performance of semiconductor test equipment. Mechanical reed relays*5, which have been used for a part that performs high-precision measurement
in semiconductor test equipment, have extremely low leakage current but they require replacement on a regular basis, maybe several times for every
single month due to wear and abrasion of the contacts that lead to affecting the measurement accuracy. Such maintenance work may substantially
affect the production efficiency so adoption of solid state relays has been long desired as its longer lifecycle. So far, MOS FET relays are considered
not suitable for precise electrical tests due to technological difficulty to reduce the leakage current in relation with its feature, and were not used in
test equipment which requires high reliability.

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Ericsson, Swisscom and Qualcomm (USA) make huge step towards nationwide 5G
coverage in Switzerland
44
Ericsson, Swisscom and Qualcomm Technologies achieve 5G data call over-the-air using spectrum sharing. The data call on commercial platforms in
Swisscom lab is the first part of a large-scale 5G rollout across Switzerland, making it a 5G leader in Europe. Spectrum Sharing technology allows
for a smooth transition from 4G to 5G with a software upgrade in the commercial network An industry leading step in 5G has taken place in
Switzerland on October 31 when the first over-the-air, Dynamic Spectrum Sharing (DSS) 5G data call was successfully carried out by Ericsson
(NASDAQ: ERIC), Swisscom, and Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated. This latest 5G milestone marks the first
time an over-the-air, 5G data call using dynamic spectrum sharing has been conducted with a service provider in Switzerland. In September, Ericsson
and Qualcomm Technologies achieved the world’s first 5G data call using Ericsson Spectrum Sharing on a 3GPP Frequency Division Duplex (FDD)
low band. Together with Swisscom, the ecosystem partners have once again demonstrated leadership in 5G by continuing collaborative efforts to
deploy 5G services on a broader scale in Switzerland. Swisscom was the first service provider in Europe to launch 5G services commercially last
April, using the 3.6 GHz band, and is now taking the next step toward realizing its goal of reaching 5G coverage of 90 percent population by end of
this year. Ericsson Spectrum Sharing, which is embedded in Ericsson Radio System, enables a cost-effective and smooth transition from 4G to 5G
nationwide coverage through a network software upgrade. The solution will dynamically share spectrum between 4G and 5G carriers based on traffic
demand. The switch between carriers happens within milliseconds, which minimizes spectrum wastage and allows for best end-user performance. It
is compatible with all 5G FDD capable smartphones and other devices based on the Qualcomm® Snapdragon™ 5G Mobile Platform, supporting the
standardized spectrum sharing functionality.

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Qualcomm Technologies (USA): AT&T Validates Qualcomm 9205 LTE Modem on
Carrier’s Low-Power Wide-Area Networks
45
Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated, announced that AT&T has validated its Qualcomm® 9205 LTE
multimode modem’s capabilities for the carrier’s LTE-M and NB-IoT networks. AT&T is the first carrier to complete the verification of the
industry-leading Qualcomm 9205 LTE modem designed for Internet of Things applications. Compared to its predecessor, the modem is
engineered to reduce power consumption by up to 70% in idle mode, a critical consideration for battery-powered IoT devices that need to
operate for 10 years or longer in the field. The Qualcomm 9205 LTE modem is also 50% smaller and 40% more cost-effective than its
predecessor – making it ideal for IoT applications requiring low-power, wide-area connectivity in a small form factor device. The Qualcomm
9205 LTE modem is also software-compatible with our prior LPWA LTE IoT solutions which allows module manufacturers to reuse software
investments to develop new module solutions. Qualcomm invents breakthrough technologies that transform how the world connects, computes
and communicates. When we connected the phone to the Internet, the mobile revolution was born. Today, our inventions are the foundation for
life-changing products, experiences, and industries. As we lead the world to 5G, we envision this next big change in cellular technology
spurring a new era of intelligent, connected devices and enabling new opportunities in connected cars, remote delivery of health care services,
and the IoT - including smart cities, smart homes and wearables. Qualcomm Incorporated includes our licensing business, QTL, and the vast
majority of our patent portfolio. Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated, operates, along with its subsidiaries,
substantially all of our engineering, research and development functions, and substantially all of our products and services businesses, including
our QCT semiconductor business.

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Qualcomm (USA) Introduces the World’s Most Advanced 5G Mobile Platform
46
Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated, introduced the Qualcomm® Snapdragon™ 865 5G Mobile Platform, which
combines the world’s most advanced 5G Modem-RF System with the world’s most advanced mobile platform designed to deliver the unmatched
connectivity and performance required for the next generation of flagship devices. The platform’s best-in-class Qualcomm® Snapdragon™ X55 5G
Modem-RF System provides peak speeds of up to 7.5 Gbps, surpassing most wired connections and transforming the mobile experience. The leading 5th
generation Qualcomm® AI Engine and new Qualcomm® Sensing Hub provides more intelligence and personalization than ever before. Snapdragon 865
includes the blazing fast Qualcomm Spectra™ 480 Image Signal Processor (ISP), which brings new features to mobile photography and videography
thanks to gigapixel speeds – up to 2 gigapixels per second. Gamers can use Snapdragon to compete at the highest levels with an array of brand-new
Qualcomm® Snapdragon Elite Gaming™ features for desktop-quality gaming and ultra-realistic graphics. Our next generation Qualcomm® Kryo™ 585
CPU delivers up to 25% performance improvement, and the new Qualcomm® Adreno™ 650 GPU offers up to 25% overall performance boost compared
to the previous generations[1], ensuring superior processing power for the next generation of flagship devices. The Snapdragon 865 empowers you to
game, capture, cross-task and connect like never before. Qualcomm invents breakthrough technologies that transform how the world connects, computes
and communicates. When we connected the phone to the Internet, the mobile revolution was born. Today, our inventions are the foundation for
life-changing products, experiences, and industries. As we lead the world to 5G, we envision this next big change in cellular technology spurring a new era
of intelligent, connected devices and enabling new opportunities in connected cars, remote delivery of health care services, and the IoT - including smart
cities, smart homes and wearables. Qualcomm Incorporated includes our licensing business, QTL, and the vast majority of our patent portfolio. Qualcomm
Technologies, Inc., a subsidiary of Qualcomm Incorporated, operates, along with its subsidiaries, substantially all of our engineering, research and
development functions, and substantially all of our products and services businesses, including our QCT semiconductor business.

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Qualcomm Technologies (USA) Announces the World’s First 5G XR Platform
47
The Qualcomm® Snapdragon™ XR2 Platform is the world’s first 5G-supported extended reality (XR) platform. It unites Qualcomm
Technologies, Inc.’s 5G and AI innovations with our industry leading XR technology to usher in a new era of mobile computing. This
premium-quality platform unveils custom features and boasts multiple firsts that can be scaled across augmented reality (AR), virtual reality
(VR) and mixed reality (MR). The Snapdragon XR2 Platform is packed with significant performance improvements compared to our
current widely adopted premium-tier XR platform[1] to deliver 2x the CPU and GPU performance, 4x more video bandwidth, 6x higher
resolution and 11x AI improvement. The Snapdragon XR2 Platform is the world’s first XR platform to support seven (7) concurrent
cameras and a dedicated computer vision processor. Additionally, this is the first XR platform to enable low latency camera pass-through to
unlock true MR, which allow users to see, interact and create a hybrid of the virtual and real world while wearing a VR device. To meet the
demands of truly immersive XR, the platform has customized visuals, interactivity and audio technologies, all of which utilize the
foundational technology of AI and option of 5G connectivity. The Snapdragon XR2 Platform delivers innovation that the new digital era
requires. Multiple OEMs are committed to commercializing devices with the Snapdragon XR2 Platform and other customers are in various
stages of prototyping and evaluation. Today marks a significant milestone for the entire XR industry and we are excited to continue our
efforts to transform how the world connects and communicates using XR.

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Qualcomm (USA) Snapdragon Powered Always On, Always Connected PC Portfolio
Expansion Disrupts Entry, Mainstream, and Premium Mobile PC Industries
48
Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated, announces a broad Qualcomm® Snapdragon™ Compute platform portfolio with long battery life, cellular
connectivity, and AI accelerated performance to enable fanless, thin and light designs for modern computing. Built with mobility in mind, the portfolio accommodates the evolving
needs of mobile consumers. The Snapdragon 7c and 8c now join the previously announced Snapdragon 8cx, delivering lightning fast cellular connectivity to premium, mainstream,
and entry-level notebook PCs. The portfolio is available in various price points allowing partners to design always on, always connected PCs for a wide array of consumers. In
addition, the Snapdragon 8cx enterprise compute platform brings connected security software and secured-core PC support for modern enterprises looking to bring mobility to their
workers. The Snapdragon 7c compute platform upgrades entry level devices bringing a 25% boost in system performance and up to twice the battery life vs. competing platforms
plus lightning- fast connectivity via the Snapdragon X15 LTE modem. The Octa-core Qualcomm® Kryo™ 468 CPU and Qualcomm® Adreno™ 618 GPU deliver responsive
performance with incredible battery life in the entry-tier. In addition, the Qualcomm® AI Engine delivers over five trillion operations per second (TOPS) of performance for the
latest AI accelerated experiences offered by Windows 10. A first of its kind in the entry-level PC that consumers want to experience. The advanced 7nm Snapdragon 8c Compute
Platform boosts performance up to 30% over the Snapdragon 850, powering multi-tasking and productivity with faster CPU performance. Purpose-built with the instant-on
responsiveness and multi-day battery life of a smartphone, its integrated Snapdragon X24 LTE modem enables multi-gigabit connectivity speeds for seamless cloud computing. Its
Qualcomm AI Engine dedicates six TOPS to accelerate machine learning applications, while the powerful GPU provides stunning graphics, all in an ultra-thin, fan-less design
optimized for mainstream use. Building upon the world’s first 7nm PC platform, the Snapdragon 8cx, the new Snapdragon 8cx Enterprise Compute Platform delivers
next-generation capabilities to the 21st century modern workplace. Corporations can now take advantage of optimized system performance and connected security software to bring
an additional level of performance and security to complement the extreme performance, extreme battery life, and extreme connectivity of Snapdragon 8cx to drive an ever more
productive workforce and enhanced security for their data. The full Snapdragon Mobile Compute portfolio gives partners greater flexibility to choose how to differentiate their
offerings, meeting the diverse needs of the industry.

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Renesas Electronics (Japan) Expands RA Microcontroller Ecosystem with Ready to
Use Partner Solutions
49
Renesas Electronics Corporation a premier supplier of advanced semiconductor solutions, announced the first 10 ready to use partner solutions that support the Renesas Advanced (RA)
microcontroller (MCU) Family of 32-bit Arm® Cortex®-M MCUs. RA MCUs deliver optimized performance and ease of use with the Flexible Software Package (FSP) and partner building block
solutions that work out-of-box to address a range of Internet of Things (IoT) endpoint and edge applications. The RA MCU ecosystem today has more than 30 partners with continuous investments
planned. Each partner’s building block solution will be labelled with the RA READY badge and is designed to solve real-world customer problems. Ready to use RA solutions accelerate time to
market by providing plug & play options that enable a variety of IoT capabilities like security, connectivity, artificial intelligence (AI), machine learning (ML) and human machine interface (HMI).
Because the RA FSP is an open architecture, it allows customers to re-use their legacy code and combine it with software examples from Renesas and ecosystem partners to easily implement
complex IoT capabilities.
First 10 Ready to Use RA Partner Solutions Immediately Available:
• Advanced Media Inc. (AMI) and Techno Mathematical Co. (TMC) deliver a smart voice solution using algorithms and decoding for human machine interface communication
• BFG Engineering provides algorithms, hardware, and software in a motor control reference driver platform for home appliances
• CapExt capacitive touch simulation software reduces prototyping time and delivers optimal touch screen performance
• Cyberon offers a voice recognition command and control solution for human machine interface communications
• Cypherbridge Systems provides SDKPac™ secure go-to-cloud connectivity and IoT gateway operation, along with the uLoadXL™ secure bootloader
• GT&T has developed a small, reliable and ready-to-manufacture GPS and Cat-M1/NB-IoT fleet tracking solution
• Reloc provides a production ready Wi-Fi driver enabling connected IoT devices
• SecureRF DOME™ platform provides zero-touch onboarding, authentication, secure firmware update delivery and ownership management for IoT endpoint devices leveraging its quantum
resistant Group Theoretic Cryptography (GTC) technology
• SEGGER emWin embedded GUI is integrated out-of-box in the RA FSP to enable the creation of highly efficient and high-quality graphical user interfaces
• Silex provides Wi-Fi and Bluetooth® Low Energy (BLE) 5.0 connectivity modules for IoT devices

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Renesas Electronics (Japan) Introduces Industry’s First ASi-5 ASSP for
Industrial Automation
50
Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, introduced the ASI4U-V5 ASSP – the industry’s first silicon
solution to fully implement the ASi-5 (Actuator Sensor Interface specification version 5) standard for industrial network equipment. ASi-5 offers superior
performance and usability over ASi-3, delivering 1.27 ms cycle time, 200m cable length and 96 slaves per segment. The field-proven ASSP delivers an
easy-to-use fieldbus integration option for developers working with sensors, actuators, and other industrial equipment requiring easy and cost-efficient
fieldbus connectivity. The new ASI4U-V5 ASSP features a fully verified and field-proven firmware that reduces the complexity associated with ASi-5
implementations, allowing users to minimize design risks. The ASSP is fully backwards compatible with ASi-3 devices while incorporating the shorter
cycle times, higher bandwidth resulting from the use of Orthogonal Frequency Division Multiplexing (OFDM), enhanced diagnostics, and state-of-the-art
robustness associated with the ASi-5 standard. The ASSP also supports all bus topologies, including line, star, and tree. Users can also take advantage of
easy and cost-efficient integration with other industrial protocols such as IO-Link and HART.
Key Features of the Renesas ASI4U-V5 ASSP
• The integration of up to 96 devices and operation down to 1.2 ms cycle time with less than 10ns jitter compared with 5 ms cycle times for ASi-3 solutions
• Support for up to 200m cable and 16 data bits per transport channel
• Diagnostics and event handling for industry 4.0 applications
• Backwards compatibility with ASi-3 devices
• Exceptional robustness against electromagnetic disturbers
• Fully verified and field-proven firmware enables easy integration, as no further programming of the chip is required.

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Renesas’ (Japan) R-IN32M4-CL3 IC Boosts Next-Generation Ethernet TSN, Linking
IT and OT Seamlessly With CC-Link IE TSN
51
Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, announced the development of the
R-IN32M4-CL3 IC for industrial Ethernet (IE) communication. Renesas’ latest industrial network device heralds support for CC-Link
IE Time Sensitive Networking (TSN), a communication standard for next-generation Ethernet TSN technology. As one of the first
controllers to support CC-Link IE TSN, the R-IN32M4-CL3 satisfies the strict specifications of less than one-millionth of a second
time synchronization accuracy between applications, accelerating TSN support for applications such as AC servos, actuators, and vision
sensors which demands high-speed responsive control, as well as remote I/O widely used in network communication. As a result, users
are able to implement ultra high-speed and high-precision motion control. Furthermore, TSN enables seamlessly linked interoperation
between information technology (IT) networks and operational technology (OT) networks, allowing product models or production
volumes to be changed in real time, while also providing flexible support for the manufacture of multiple product types in varying
quantities and boosts factory productivity overall. In addition to driver software, Renesas will provide the TCP/IP protocol software,
CC-Link IE TSN protocol software, and CC-Link IE Field protocol software essential to developers. Tessera Technology, Inc., one of
Renesas’ partner vendors, will offer an evaluation board, and Renesas will provide a start-up manual, enabling customers to jump-start
industrial application development, incorporating the new technology without delay.

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Renesas Electronics (Japan) Delivers Enhanced Security and Privacy for Bluetooth®
5 Connections With 32-Bit RX23W Microcontroller
52
Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, introduced the RX23W – a 32-bit
microcontroller (MCU) featuring Bluetooth® 5.0 for IoT endpoint devices such as home appliances and healthcare equipment. By
combining Bluetooth 5.0 with Renesas’ Trusted Secure IP on its popular high-performance RX MCU family, Renesas offers
customers an optimized single-chip solution for system control and wireless communication, while also providing a more secure
way to answer the Bluetooth security risks such as eavesdropping, tampering, and viruses. The new RX23W is based on Renesas’
RXv2 core (Note 1), which provides outstanding computational performance with improved FPU (Note 2) and DSP functions and
operates at a maximum clock frequency of 54 MHz. The RX23W provides full Bluetooth® 5.0 Low Energy support including
long-range and mesh networking functions and achieves the industry’s lowest level reception mode peak power consumption at 3.0
mA. Furthermore, it integrates a rich set of peripheral functions that are indispensable for IoT equipment, including security, touch
key, USB, and CAN functions. These functions allow the RX23W to implement both system control and Bluetooth wireless
functions for IoT endpoint equipment such as home appliances, health care equipment, and sports and fitness equipment on a single
chip. In addition, the RX23W's Bluetooth mesh functions make it optimal for industrial IoT equipment collecting sensor data
within a factory or a building.

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Renesas Electronics (Japan) Introduces Low-Power RL78 Prototyping Board to Simplify
IoT Endpoint Equipment Prototyping
53
Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, today launched the RL78/G14 Fast Prototyping
Board – a low-cost, function-rich board to enable rapid product development for IoT endpoint equipment. Quicker development prototyping and
lower costs give users the agility to respond to rapid changes in technology and market needs, and reduces the time to market window for new
products. Renesas also introduced the RL78/G1D BLE Module Expansion Board, which users can combine with the new prototyping board to
add Bluetooth® Low Energy wireless communication functions (Note 1) with ease. The new prototyping board is based on the RL78/G14
microcontroller (MCU), which provides the richest set of functions in the low-power RL78 Family, making it well suited for motor control in
portable equipment and IoT sensors, as well as a wide range of IoT endpoint equipment, such as home appliances, industrial equipment, building
automation, and health care equipment. Previously, the RL78/G14 starter kit and target boards required an external emulator, and additional
costs were associated with high performance versions. The new prototyping board released today is easily affordable and has an on-board
emulator circuit with the same functions as the E2 Emulator (E2 Lite), removing the need to purchase additional debugging tools. The new
board provides access to all of the RL78/G14 signal pins and includes Arduino and Pmod™ interfaces to allow easy functional expansion.
Additionally, by combining a Semtech SX1261 or SX1262 LoRa® transceiver with this prototyping board, prototyping for IoT sensor devices
using wireless communication based on LoRa® with extended period battery drive becomes possible (Note 1). Furthermore, Renesas provides
not only these boards, but also circuit diagrams, parts lists, and user manuals necessary to jump-start development, in addition to sample code
and application notes related to these products.

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Sharp (Japan) Develops 30-inch 4K Flexible OLED Display
54
Sharp Corporation and Japan Broadcasting Corporation (NHK) have co-developed a 30-inch 4K flexible organic LED (OLED)
display. The OLED display, with light-emitting elements formed onto each of the RGB subpixels (RGB light emission method)
of a 30-inch-diagonal (approx. 76 cm) flexible film substrate, is the largest display of its kind in the world. The light-emitting
elements are formed with ultra-high precision onto each of the RGB subpixels using the vapor deposition method. This renders
a color filter unnecessary and gives high light-use efficiency. The use of a film substrate means the display part of the panel is
approximately 0.5-mm thick, and this allows the display to be rolled into a cylinder approximately 2 cm in radius that fits
neatly in a storage case. The display employs IGZO*2 thin film transistors (TFTs) to drive the OLED elements. NHK’s
proprietary signal-processing technologies and panel drive technology were used in order to improve brightness uniformity and
the sharpness of moving objects. In June 2018, Sharp began mass production of flexible OLED displays for smartphones, the
first company in Japan to do so. Sharp will continue to develop cutting-edge technologies that will pave the way for the
displays of the future. Sharp’s 30-inch-diagonal 4K flexible OLED display is featured at the joint booth of NHK and the
Japanese Electronics and Information Technology Industries Association (JEITA) at Inter BEE 2019 (International Broadcast
Equipment Exhibition 2019), held at the Makuhari Messe in Chiba, Japan from November 13 to 15, 2019.

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STMicroelectronics (Switzerland) Adds Wireless Support to Proven Smart-Meter
Chipset for More Flexible, Scalable Smart Infrastructures
55
STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, is facilitating smarter city and industry
infrastructures through the combination of powerline and wireless communication in its market-proven smart-meter chipset. Already widely used in smart electricity
meters, ST’s ST8500 powerline communication (PLC) chipset now enables smart meters to communicate through existing power cables or radio frequency (RF)
waves, combining the strengths of both types of connection. Where power lines may be too noisy for PLC, or where local regulations dictate, equipment makers can
now implement wireless and PLC quickly and efficiently using the ST8500. In addition, the built-in RF capability lets equipment designers leverage the ST8500’s high
feature integration and ease of use in other smart devices such as gas and water smart meters, environmental monitors, lighting controllers, and industrial sensors. By
embedding support for RF Mesh at the physical (PHY) layer and in the data-link layer (Media Access Control, MAC, and 6LoWPAN) firmware, the ST8500 gives
developers extra flexibility to leverage the strengths of combined powerline and wireless mesh networking for communication between smart nodes and data
collectors. Unlike simple point-to-point links, hybrid mesh networking interconnects nodes extensively to create more reliable and fault-tolerant connections and
extend communication distances. ST is continually enhancing its ST8500 programmable system-on-chip and companion STLD1 line driver to update and extend
functionality. Earlier in 2019, the ST8500 was certified in accordance with the latest PRIME 1.4 base node and G3-PLC CENELEC B PAN coordinator specifications,
in addition to existing protocols, enabling use in a wider variety of PLC-network node types. ST’s certified solutions enable device manufacturers to gain product
approval and deploy quickly and easily in territories worldwide. ST also recently introduced a complete turnkey development package to help users create G3-PLC
nodes for smart-energy, smart-building, smart-city, and similar applications. The package supports ST’s EVALKITST8500-1 evaluation kit and provides a full
open-source firmware framework including protocol stacks, the 6LowPAN adaptation layer for IPv6, and protocol-engine and real-time engine firmware images. The
package also includes an STM32 application example and the STSW-SGKITGUI SmartGrid LabTool GUI for configuring and controlling the EVALKITST8500-1
hardware, running application commands, and applying firmware upgrades.

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Temperature Sensor Accurate to 0.25°C, from STMicroelectronics, Delivers Flexible
Power Savings for Mobile Monitoring
56
With typical temperature-reading accuracy of 0.25°C and low operating and standby current, the STMicroelectronics STTS22H enhances
temperature and heat-flow monitoring in asset trackers, shipping-container loggers, HVAC systems, air humidifiers, refrigerators,
building-automation systems, and smart consumer devices. The STTS22H is I2C and SMBus 3.0 compliant, and supports flexible operating
modes including configurable output data rate (ODR) down to 1Hz, a power-saving one-shot mode, and an interrupt pin that supports
SMBus Alert Response Address (ARA). This allows the sensor, as an SMBus slave, to signal the application if a user-programmed upper or
lower temperature threshold is exceeded. Programmable I²C/SMBus slave addresses allow up to two STTS22H sensors to share the same
bus. Power consumption is very low, drawing just 2.0µA at 1Hz ODR and 1.75µA during periodic one-shot measurements, helping extend
the running time of battery-powered devices. In standby mode with the serial port inactive, the STTS22H draws a mere 0.5µA (typical). The
1.5-3.6V operating-voltage range allows use with various power sources such as a small lithium cell. The sensor is fast-acting, with
conversion time of 5ms, and provides 16-bit temperature data. The package features a metal slug that minimizes thermal resistance to
ensure fast settling at the ambient temperature. Devices come factory-calibrated and maintain the 0.25°C typical accuracy from -10°C to
60°C, eliminating any need for user calibration.

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Industry’s First 4Mbit EEPROM Memory Chips from STMicroelectronics (Switzerland)
Let Small Devices Handle Bigger User Data
57
STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, has introduced a new
generation of memory chips that combine unprecedented storage density with speed and reliability, enabling the devices we use every day to do more
to enrich life and work. With 4Mbit capacity, ST’s new EEPROM memories let small devices capture and store more data through the serial SPI bus.
This enables equipment such as smart meters to intensify data logging for managing grids more effectively and providing more user-friendly billing.
Also, portable medical devices can log patients’ data more intensively to improve care quality, and consumer devices such as smart wearables can
support more user features and greater precision. In these applications, the memory’s low power consumption helps extend battery runtime. A wide
range of applications in industrial controls and communication infrastructure such as network switches can also benefit from these higher density
memories. ST’s M95M04 EEPROM memories combine their unprecedented data storage with excellent energy efficiency for budget-conscious
applications. They extend ST’s wide portfolio recognized for high reliability, lasting one billion full-memory read-write cycles. Capable of writing
512 Bytes in 5ms, the new devices enable fast system operation with low latency. M95M04 EEPROMs provide high-density non-volatile storage for
persistent data such as application code, calibration tables, and user parameters, as well as for intensive data logging. Offering the highest density on
the market in small 8-pin SO8N and TSSOP8 packages, they are cost-effective versus competing devices. These include EEPROM-emulation
memories that combine a microcontroller and Flash, ferroelectric FRAMs, and magneto-resistive MRAMs, which consume more power and have
narrower supply-voltage range than CMOS EEPROMs. M95M04 EEPROMs benefit from a wide power supply range of 1.8V to 5.5V, as well as
40-years data retention, and a state-of-the-art 8-bump WLCSP chip-scale package option in addition to SO8N and TSSOP8 packages.

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New STM32WB Wireless Microcontrollers from STMicroelectronics (Switzerland)
Delivered in a New Affordable Value Line
58
STM32WB50* Value Line wireless microcontrollers (MCUs) from STMicroelectronics are a full and pin-compatible derivative of the
STM32WB55 System-on-Chip, created to serve cost-sensitive connected devices that need to support Bluetooth® 5.0, ZigBee® 3.0, or
OpenThread. The devices offer a good link budget from 100dB in Bluetooth 5.0 mode up to 104dB in 802.15.4 mode. With the Arm®
Cortex®-M4 to handle the user-application software and a Cortex-M0+ to run the radio subsystem including radio stack and security, the
STM32WB50 is the best fit for developers seeking radio and application isolation for security reasons or real-time application constraints. The
STM32WB50 combines strong security with Value Line affordability. An AES-256 as well as other basic security features are on board to ensure
application robustness. The device has 1MByte of Flash and 128Kbyte of RAM and allows Over-The-Air (OTA) updates for the radio stack. The
STM32WB50 also benefits from the power-saving modes of the STM32WB55, thus making it ideal for energy-saving applications. By
integrating balun circuitry, the new STM32WB50 devices save BOM cost and simplify PCB layout. To further reduce BOM cost, the
STM32WB50 package allows a very simple PCB with a maximum of two layers. As a full derivative of the STM32WB55, the STM32WB50 is
integrated in the same market-proven STM32Cube ecosystem. As such, it comes with Bluetooth 5.0, BLE Mesh, ZigBee 3.0, or OpenThread
certified stacks, distributed free of charge in the STM32CubeWB MCU Package, as well as a comprehensive toolset including
STM32CubeMonRF dedicated to radio performance evaluation and the STM32CubeProg programmer that provides features including secure
programming of the RF stacks.

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STMicroelectronics (Switzerland) Launches Affordable and Easy-to-Use STM8
Nucleo-32 Boards
59
STMicroelectronics is making design starts using 8-bit STM8 microcontrollers (MCUs) faster, more affordable, and more
accessible for creative minds of all types by introducing new development boards in the easy-to-use Nucleo-32 form factor.
The compact boards are controlled and powered conveniently through a USB connection. An ST-LINK
debugger/programmer is integrated, which saves using an external debug probe and allows simple drag-and-drop Flash
programming. Arduino™ Nano pins simplify functional expansion using off-the-shelf shields and let users connect with
open-source hardware communities. The boards are supported by major development toolchains including IAR Embedded
Workbench for STM8 and Cosmic CXSTM8. STM8 MCUs feature a high-performing 8-bit core, generous on-chip memory
including up to 128Kbyte of Flash, and state-of-the-art peripherals shared with the STM32 MCU family such as timers,
analog peripherals, CAN2.0B, and digital interfaces. The STM8 MCUs are a popular choice for creating smart sensors,
actuators, and other products within tight power, space, and cost constraints. The first available STM8 Nucleo-32 board, the
NUCLEO-8S207K8, contains a 32-pin STM8S207K8 MCU, which provides features including 12 high-current outputs and
multiple capture-compare channels.

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Toshiba (Japan) Releases its First eFuse, an Electronic Fuse that can be
Repeatedly Used
60
Toshiba Electronic Devices & Storage Corporation has launched the “TCKE8xx series,” its first-ever eFuse ICs, a lineup of six
products that support various functions needed for circuit protection in power supply lines. Shipments of two products in the lineup
start. The most remarkable feature of the eFuse ICs is that they can be used repeatedly. Conventional physical fuses—glass tube fuses
and chip fuses—protect power line circuits by physically shutting them down when they are in an over-current state, and are needed to
be replaced once broken. eFuse IC products use their own circuitry to shut power lines down when an abnormality occurs, and can be
reset and reused. Another advantage is that eFuse ICs eliminate complex circuit design and a number of components, realizing much
simpler circuit designs with fewer components and a smaller area than a protection function secured with discrete parts. The new
TCKE8xx Series realizes highly robust circuit protection by raising over-current detection accuracy to a level beyond that of physical
fuses. Since the eFuse ICs also have current clamp and voltage clamp to protect against over-current and over-voltage, they can protect
circuits and maintain power supply by clamping voltage and current at specified values, even when excess over-current or over-voltage
is applied. Their over-temperature and short-circuit protection functions protect circuits by instantly shutting off in the event of extreme
overheating, or unexpected short circuiting. The combination of these characteristics allow the products to help protect electronic
equipment such as servers and laptop PCs, which have been required for to handle increasingly higher withstand voltages and currents
in recent years. As Toshiba intends to obtain IEC 62368-1 certification, the international safety standard for high level safety, they will
also simplify the certification tests customers’ devices are required to undergo.

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Toyota Lexus UX and Lexus NX with Toshiba’s Image Recognition Processor Win
Highest Score in Japan’s Assessment of Preventive Safety Performance
61
Toshiba Electronic Devices & Storage Corporation announced that its Visconti™4 image recognition processor was a key component of the driver
assistance systems of Lexus sedans from Toyota Motor Corporation (“Toyota”) that received excellent evaluations in the 2019 first half Japan New
Car Assessment Program (JNCAP). The government-sponsored program assesses the road safety of new vehicles, and the highest ranked are
recognized as advanced safety vehicles (ASV). The Toyota Lexus UX and Lexus NX recorded industry-leading scores of 141 points and, along with
the Lexus ES, were evaluated as ASV+++, the highest possible level. JNCAP was initiated by the Japanese government in 1995 to promote the safety
of new cars launched in Japan. It brings together the results of vehicle safety tests carried out by the Ministry of Land, Infrastructure, Transport and
Tourism (MLIT) and the National Agency for Automotive Safety and Victims' Aid (NASVA). Tests cover vehicle performance in respect of
preventive safety, collision safety, and pedestrian protection. The Preventive Safety Performance Assessment evaluates advanced safety technologies,
such as emergency braking. In 2018, JNCAP introduced evaluation of damage mitigation braking for pedestrians on lit streets at night. This year the
standard was made even more rigorous, and now evaluates damage mitigation braking for pedestrian at night on unlit streets. Toshiba supplies
Visconti™4 to Toyota vehicles as an integral part of DENSO Corporation’s Front-Camera-Based Active Safety System. The LSI’s ability to process
luminance differences between objects and their backgrounds, realizing better detection of pedestrians at night and in low light conditions, helped the
Toyota vehicles win high scores in the assessment. The Lexus UX and Lexus NX integrating the system received a high score of 141 points, and all
of the Toyota models integrating Visconti™4 were evaluated as ASV+++. Toshiba continues to channel resources into Visconti™ as a contribution to
advanced driver assistance systems (ADAS). The company has already started sample shipments of Visconti™5, which delivers advanced Deep
Neural Network IP, in September this year.

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Wirecard’s (Germany) boon and SwatchPAY! launch in Germany and Austria
62
Wirecard, the global innovation leader for digital financial technology, is the exclusive payment partner for the
SwatchPAY! launch in Germany and Austria. With the help of the mobile payment solution boon, consumers can carry
out easy and contactless payments with the brand new line of Swatch watches. How it works: Via the boon app on their
smartphone, watch owners receive a virtual Mastercard, which is stored in the SwatchPAY! app as a means of payment.
The virtual card can be topped up by credit card or bank transfer. Contactless payment is very easy: To carry out a
payment, the watch is simply held up to a compatible terminal in-store, and a signal tone confirms that the payment has
been completed. Since the power required is supplied by the terminal, this process works even when the watch battery is
empty, as opposed to when paying with smartphones. Like all conventional Swatch models, the new SwatchPAY!
watches are waterproof to a depth of 30 meters, making them ideal companions and payment options when, for example,
going for a swim. As a result, the traditional wallet can stay at home. SwatchPAY! and boon are equipped with
numerous security functions according to the strictest industry standards, ensuring that a user’s card details are never
disclosed to merchants or Swatch itself.

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Xilinx (USA) Announces the World's Highest Performance Adaptive Devices for
Advanced ADAS and AD Applications
63
Xilinx Developer Forum Europe 2019 -- Xilinx, Inc., the leader in adaptive and intelligent computing, announced the expansion of its automotive-qualified
16 nanometer (nm) family with two new devices – the Xilinx® Automotive (XA) Zynq® UltraScale+™ MPSoC 7EV and 11EG. These two new parts
deliver the highest programmable capacity, performance and I/O capabilities enabling high-speed, data aggregation, pre-processing, and distribution
(DAPD), as well as compute acceleration for L2+ to L4 advanced driver-assistance systems (ADAS) and autonomous driving (AD) applications. With
these new additions, Xilinx now offers the world's highest level of silicon integration that meets the safety, quality and reliability requirements for
automotive, with a comprehensive line of products scaling from small devices powering edge sensors to new high-performance devices for centralized
domain controllers. The new XA Zynq UltraScale+ MPSoC 7EV and 11EG devices were developed as a result of customer demand. The devices offer over
650,000 programmable logic cells – and nearly 3,000 DSP slices, which is 2.5X increase versus the previous largest device. In addition, the XA 7EV
contains a video codec unit for h.264/h.265 encode and decode, while the XA 11EG includes 32 12.5Gb/s transceivers and provides four PCIe® Gen3x16
blocks. The addition of these high-performance devices to the XA portfolio enables carmakers, robotaxi developers, and Tier-1 suppliers to perform the
DAPD and compute acceleration in a power envelope that allows for scalable production deployments for AD vehicles. The XA Zynq UltraScale+
MPSoC portfolio is qualified according to AEC-Q100 test specifications and integrates both Xilinx programmable logic and a feature-rich 64-bit quad-core
Arm® Cortex®™-A53 and dual-core Arm Cortex-R5 based processing system that is certified to ASIL-C level in the low power domain. The combination
of these features, paired with the high data throughput capability of the new devices, accelerate the deployment of autonomous vehicles on the road today.
To date, Xilinx has shipped more than 67 million auto-qualified solutions for ADAS systems and AD production vehicles to over 200 automotive
companies including global Tier-1 suppliers, OEMs and start-ups.

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Xilinx (USA) Vitis Unified Software Platform Now Available for Download
64
Xilinx Developer Forum Europe 2019 -- Xilinx, Inc., the leader in adaptive and intelligent computing, announced its new Vitis™
unified software platform and optimized open source libraries are available for immediate download, and free of charge. Vitis
enables a broad range of developers – from software engineers to AI scientists – to work with and benefit from the power of
Xilinx's adaptable hardware, using software tools and frameworks they already know and understand. Using the Vitis platform,
software developers can accelerate their applications with Xilinx® adaptive hardware, without the need for hardware expertise.
Rather than imposing a proprietary development environment, the Vitis platform plugs into common software developer tools and
utilizes a rich set of open source libraries optimized for Xilinx hardware. The associated Xilinx developer site provides easy access
to examples, tutorials and documentation, as well as a space to connect the Vitis developer community. It is managed by Xilinx
Vitis experts and enthusiasts, providing valuable information on the latest Vitis updates, tips and tricks. Xilinx develops highly
flexible and adaptive processing platforms that enable rapid innovation across a variety of technologies – from the endpoint to the
edge to the cloud. Xilinx is the inventor of the FPGA, hardware programmable SoCs, and the ACAP, designed to deliver the most
dynamic processor technology in the industry and enable the adaptable, intelligent, and connected world of the future.

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Xilinx (USA) Vitis AI Now Available for Download
65
Xilinx, Inc., the leader in adaptive and intelligent computing, announced its AI inference development platform, Vitis™ AI is available
for immediate download free of charge. Combined with the Vitis unified software platform, Vitis AI empowers software developers
with deep learning acceleration, as part of their software code. Vitis AI integrates a domain-specific architecture (DSA) and configures
Xilinx hardware to be optimized and programmed using industry-leading frameworks like TensorFlow and Caffe. It provides the tools
to optimize, compress and compile trained AI models running on a Xilinx device in as little as one minute. Xilinx has also open sourced
Vitis accelerated libraries and Vitis AI models, as well as corresponding example designs that can be used from endpoint to edge in
addition to cloud platforms. At the Xilinx Developer Forum (XDF) Americas in early October, Xilinx first unveiled Vitis (pronounced
Vī-tis), a unified software platform that enables a broad new range of developers – including software engineers and AI scientists – to
take advantage of the power of hardware adaptability. Five years and a total of 1,000 man years in the making, Vitis automatically
tailors the Xilinx hardware architecture to the software or algorithmic code without the need for hardware expertise. Rather than
imposing a proprietary development environment, the Vitis platform plugs into common software developer tools and utilizes a rich set
of optimized open source libraries, enabling developers to focus on their algorithms. Vitis is separate to the Vivado® Design Suite,
which will still be supported for those who want to program using hardware code, but the new platform can also boost the productivity
of hardware developers by packaging hardware modules as software-callable functions.

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Technology Industry

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Agilent (USA) Named One of Top 10 Best Workplaces in Singapore
66
Agilent Technologies, Inc. announced it has been named among the top 10 Best Workplaces™ in Singapore for 2019
by the Great Place to Work® (GPTW) Institute. Agilent was selected as a Best Workplace in Singapore in the
"medium and large workplace" category, which includes companies with local offices of 100 or more employees.
Agilent has also received Great Place to Learn™ certification from GPTW. The certification is jointly offered by
GPTW and the Institute for Adult Learning as a way of recognizing achievements in promoting continuous learning
at work and to foster a high-performing workplace culture. As a global company, Agilent enjoys the diversity of
cultural and individual perspectives held by its employees. Yet the company has a common bond in the form of an
enduring set of values. Agilent values are the basis for every decision and every action taken around the world by the
people that make up the company. These values include: innovation and contribution; trust, respect, and teamwork;
uncompromising integrity; speed; focus; and, accountability. They are central to what makes Agilent a great
workplace for its employees.
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Agilent (USA) Receives Multiple Life Science Industry Awards for Innovation
67
Agilent Technologies, Inc. announced that it has received two Life Science Industry Awards (LSIA) for 'Most
Innovative New Products in 2019' from BioInformatics Inc. Since 2002, the LSIA have recognized manufacturers of
the 'tools of science' that help advance biological research and drug discovery. The Agilent products were the Magnis
NGS Prep System, which received a Silver Award in the genomics category, and the xCELLigence RTCA eSight,
which received a Bronze Award in the cell analysis category. Agilent was the only life sciences company nominated
twice. The xCELLigence RTCA eSight provides label-free, real-time biosensor measurements, as well as kinetic
imaging of the same live cell populations, independently, or simultaneously. It enables scientists to obtain
unprecedented information and deep insight into cell health and their responses to a variety of chemical or biological
manipulations across a wide spectrum of basic research and therapeutics fields, including cell biology, immunology,
immuno-oncology, and immunotherapy. Agilent Technologies Inc. (NYSE: A) is a global leader in life sciences,
diagnostics and applied chemical markets. Now in its 20th year as an independent company delivering insight and
innovation toward improving the quality of life, Agilent instruments, software, services, solutions and people provide
trusted answers to customers' most challenging questions. The company generated revenue of $5.16 billion in fiscal
2019 and employs 16,300 people worldwide.
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Arrow Electronics (USA) Named a 2019 CDW Partner of the Year
68
Arrow Electronics, Inc. was named a 2019 CDW Partner of the Year. CDW’s Partner of the Year Awards,
presented recently at the 2019 CDW Partner Summit in Las Vegas, honored top-performing CDW partners that
provided exemplary products, programs, solution and services to support CDW and its customers throughout
the year. CDW Partner of the Year Awards are based on input from CDW’s sales team and backbone
departments such as product and partner management, marketing and partner finance. Additional selection
criteria include growth of the partners’ sales through CDW, overall profitability at CDW and market strategy
alignment. Arrow Electronics guides innovation forward for over 200,000 leading technology manufacturers
and service providers. With 2018 sales of $30 billion, Arrow develops technology solutions that improve
business and daily life. “We are excited and honored to receive this award from CDW,” said President of
Arrow’s enterprise computing solutions business in the Americas. “It is a testament to the strong working
relationships that our team has built with CDW and the value of our line card.”
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ASUS (Taiwan) Wins 11 CES 2020 Innovation Awards
69
ASUS and ASUS Republic of Gamers (ROG) announced that 11 of its products have received CES® 2020 Innovation Awards for
demonstrating outstanding design and engineering within the consumer technology realm. ASUS honorees of the CES Innovation Award
include ZenBook Pro Duo, ZenFone 6, ZenBook 15, ZenBook Flip and ProArt Display PA32UCG. ROG honorees include ROG Phone II,
ROG Strix SCAR III, ROG Strix Arion M.2 NVMe USB3.2 Gen 2 SSD enclosure and ROG Kunai Gamepad. An additional two ASUS
honorees will be unveiled during CES 2020. The award wins underscore the ASUS commitment to delivering incredible consumer
experiences through consummate design and innovation. An annual program that celebrates outstanding design, the CES Innovation Awards
recognizes honorees across 28 product categories. A panel of judges, including designers, engineers and members of the tech media,
reviews submissions based on design, functionality, consumer appeal, engineering and how the products compare with the competition. The
announcement was made today during CES Unveiled New York, an invite-only tech event bringing together top media, exhibitors and
industry leaders for a sneak peek of the products and trends expected at CES 2020, which will run from January 7–10, 2020 in Las Vegas.
ASUS ZenBook Pro Duo is equipped with a full-width ScreenPad™ Plus, a secondary display that gives users options for multitasking like
never before. The 14-inch ScreenPad Plus on ZenBook Pro Duo is a 4K secondary touchscreen that works seamlessly with the main
15.6-inch 4K UHD OLED HDR touchscreen, giving users endless ways to optimize and personalize their workflow. Extreme performance
for effortless creativity is provided by up to 9th Generation Intel® Core™ processors, combined with up to 32GB RAM and an NVIDIA®
GeForce RTX™ 2060 GPU, with ultrafast storage provided by up to a 1TB PCIe® 3.0 x4 SSD. These elite components empower content
creators to effortlessly handle all the apps on both the main screen and ScreenPad Plus.
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AU Optronics (Taiwan) Receives Zicheng CSR Impact Award
70
AUO adheres to the core concept of sustainable operation and implements long-term social participation. It participated in the documentary film of the AUO
Weimei Pavilion in the Taichung Flower Expo 2018, and won the third CSR Impact Award-Technology Innovation from Zicheng. "Influence Award". AUO has
invested in research and development of display technology for a long time, continued to exert its innovative scientific and technological capabilities, and
devoted itself to communicating with multiple stakeholders, striving to obtain high recognition. Zicheng's "3rd CSR Impact Award" is an annual event in the
CSR field. It is co-organized by the official representative of Taiwan and the Cannes International Creative Festival. With the theme of "Using Story Power to
Create Impact", companies are encouraged to apply The spirit of CSR is integrated into the core business, and the cases that give back to the society are made
into films, which are passed to the public through the lens, driving the society to respond to the trend of sustainable management. Based on the corporate citizen
’s sense of mission and its connection with Taichung, AUO participated in the 2018 Taichung Flower Expo to build the AUO Weimei Pavilion, the first
cross-border international exhibition venue, and created the largest 556 inches in Taiwan with the ultimate craftsmanship. The display splicing wall and the
production of ultra-high-resolution original images are used to present microscopic images of pollen at beautiful and delicate angles, allowing viewers to
immerse them and experience the tough vitality of plants and the penetrating power of technology. The participating partners, from architectural design,
construction, curation to image and visual creation, are all teams from Taiwan. They work together to interpret the concept of sustainability through cross-border
visual arts, which not only fully demonstrates the strength of Taiwan's software and hardware integration, but also allows the world to see To Taiwan's proud R
& D and creative energy. In addition, AUO also mobilized up to 2,400 corporate volunteers, serving more than 400,000 visitors during the exhibition period, and
using its passion and professionalism to guide visitors into the wonderful microcosm of the plant. At the end of the exhibition, the AUO Weimei Pavilion made
of recyclable and weather-resistant building materials will also continue its sustainable journey of rebuilding in different places. It will return to the AUO
Taichung Plant in 2020, and will present the new face of the West Dadun Cultural Center to continue to praise the land Proud and beautiful.
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AUO wins 12 awards of Taiwan Sustainable Enterprise Award
71
The Taiwan Enterprise Sustainability Awards 2019 held an award ceremony today (28th). AU Optronics was awarded 12 awards for its
outstanding sustainable performance, including the "Top Ten Sustainability Model Taiwanese Enterprise Awards" for comprehensive
performance, and corporate sustainability reports. The "Electronic Information Manufacturing Platinum Award" and the "English Report
Gold Award", as well as individual performance categories won the "Climate Leadership Award", "Circular Economy Leadership Award",
"Sustainable Water Management Award", "Social Inclusion Award", The "Creative Communication Award", "Transparency and Integrity
Award", "Talent Development Award", "Gender Equality Award" and "Supply Chain Management Award" and other awards have been
evaluated and affirmed in various fields such as environment, society and governance. Including the most award-winning companies. AUO
docks the core competitiveness of the company with the SDGs of the United Nations Sustainable Development Goals, and outlines three
major aspects of the EPS (Environment, People, Society). Among them, AUO promotes low-carbon production and green product
development in terms of environment. As a concept, develop low power consumption products, and improve material utilization rate
through advanced processes to minimize the energy consumption of each product. We can work together with the value chain to complete
the daily reduction of water consumption by 2025. The goal of reducing carbon emissions by 100,000 tons and accumulating 6.5 million
tons has been recognized by the Climate Leadership Award, Circular Economy Leadership Award and Sustainable Water Management
Award for outstanding environmental performance.
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Hikvision (China): Smart Thermal camera has explosive performance in GIT
Security Award 2020
72
Hikvision, the world’s leading supplier of innovative video security products and solutions, has won a GIT Security Award
for its Thermal Explosion Proof Camera (DS-2TD2466T-25X). In a vote by GIT’s security professional readers, the product
was hailed as winner in the ‘Fire and Explosion Protection’ category of the popular annual awards. One focus of the awards
is innovation in products – and the Hikvision camera does not disappoint. It uses a vanadium oxide uncooled focal plane
sensor to deliver enhanced thermal image quality. It also uses a smart fire detection algorithm to identify potential fire risks
by monitoring irregular temperature rises in a sensitive area. The camera adopts 316L stainless steel material to meet the
requirements of environments that have a risk of explosion, like chemical plants, oil depots and gas stations. GIT
SECURITY is the security magazine with the highest circulation in the EMEA region, reaching all security decision makers
in the private as well as in the public sector. This publication speaks to the whole distribution channel, from the
manufacturer and all kinds of distributors along to the end-users. The magazine deals with the diversity and complexity of
safety and security topics and covers them in regular sections: Management, Security, Information Technology, Fire
Protection and Safety. Decision makers and opinion leaders inform themselves with GIT SECURITY about market news,
products, companies, applications and trends.
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Hikvision (China) wins the prestigious Innovative Achievement Award at the
2019 Detektor International Awards
73
Hikvision, the world’s leading supplier of innovative video security products and solutions, has been awarded the Innovative
Achievement Award for its Thermal & Optical Network Turret Camera at the 2019 Detektor International Awards in Sweden. The
award winning Hikvision camera DS-2TD1217-2/V1 enables rapid indoor fire detection through bi-spectrum technology, which
captures images using both thermal radiation and visible light. By displaying optical and thermal images together through image
fusion or picture-in-picture, the camera helps safety personnel to quickly pinpoint the source of a fire. Importantly, the camera also
triggers an alarm once the temperature goes higher than a user-set limit – potentially allowing personnel to prevent ignition or
combustion. In addition, the camera contains a built-in GPU for running the Hikvision deep learning algorithm, in order to support
indoor monitoring and advanced intrusion detection. Equipped for double-duty – both fire detection and intrusion detection – this
camera is highly recommended for indoor solutions, especially in application scenarios such as warehouses, museums, data centers,
and offices. 2019 marks the 20th anniversary of the Detektor International awards, which were established by security trade
magazine Detektor International in the year 1999. The aim of the awards is to recognize and celebrate outstanding innovations that
advance the security industry. This year’s award ceremony was held on November 19 at the security industry banquet of the
Stockholm International Fair, in conjunction with the SECTECH seminar and exhibition in Sweden.
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Hikvision (China) Thermal Network Bullet Camera wins Product Innovation
of the Year at Security and Fire Excellence Awards 2019
74
Hikvision has won the IFSEC and FIREX Product Innovation of the Year award for its DS-2TD2136 Thermal Network Bullet Camera at the 2019
Security and Fire Excellence Awards in London. The Awards were presented at a gala ceremony at the London Hilton on Park Lane on Wednesday
November 20, hosted by TV personality Tess Daly. The DS-2TD2136 camera provides the security market with a powerful, effective and affordable
networked thermal camera solution, which reduces the need for lighting and can complement and enhance the coverage of standard video cameras. It
utilizes cutting edge image processing technology and its powerful behaviour analysis algorithm enables automatic smart detection. At the same time
the camera provides a reliable temperature exception alarm function and advanced fire detection algorithm. The camera offers the optional use of
7mm, 10mm,15mm, 25mm, and 35mm lenses depending on project requirements. The DS-2TD2136 is suitable for the widest possible variety of
environments, even those where conventional visibility is severely limited: at night, in the glare of harsh sunlight, in fog or smog, or during snow or
rainstorms. Thermal imaging is more accurate when it comes to Video Content Analysis for detecting subjects than conventional cameras which use
visible light. This has the effect of reducing false alarms and increasing security efficiency. As part of its winning submission for the Security and Fire
Excellence Awards, Hikvision detailed the case of Foxlake Dundee, a water adventure centre in the heart of Dundee. In this instance Webster Security
& Fire installed a system based on Hikvision’s Thermal Network Bullet Cameras, in place of an out-of-hours manned guarding option. Because of its
location, night-time trespassing is an issue, and accidental or deliberate damage or vandalism to the equipment is a real risk, as well as the danger of
injury or worse to intruders. As the thermal cameras can work in all weather conditions, including those that can severely impede the performance of
conventional cameras, they are ideal for a water-based site like Foxlake Dundee. There, when the thermal cameras detect an intruder, a remote
monitoring centre is alerted, and trespassers are warned off via a PA system – while those in danger can be rescued.
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Jabil (USA) Recognized as Philanthropic Corporation of the Year
75
Jabil received recognition as Philanthropic Corporation of the Year by the Tampa Bay chapter of the Association of Fundraising
Professionals (AFP). Johns Hopkins All Children’s Foundation and the American Heart Association nominated Jabil for the
philanthropic work that the global manufacturing company does in the Tampa Bay community. National Philanthropy Day was begun
in 1986 to “celebrate the extraordinary change that fundraising and philanthropy have helped to create in our world” according to the
AFP. Throughout the month of November, the professional association highlights honorees from National Philanthropy Day chapter
events around the world, showcasing outstanding donors, volunteers, corporations, foundations and others who are being recognized
for their commitment to change and philanthropy. Specific to the Tampa Bay area, Jabil established the Jabil Center for Behavioral
Health Fund at Johns Hopkins All Children’s Hospital to help address youth mental health solutions. Jabil employees participate in the
American Heart Association’s annual walk to raise money and bring awareness to cardiovascular diseases and living a heart-healthy
lifestyle. In addition, Jabil works closely with the area’s local national sports franchises (Buccaneers, Rays and Lightning) on
community programs, as well as the Pinellas Education Foundation, Tampa Bay Watch and other organizations. Jabil (NYSE: JBL) is a
manufacturing solutions provider that delivers comprehensive design, manufacturing, supply chain and product management services.
Leveraging the power of over 200,000 people across 100 sites strategically located around the world, Jabil simplifies complexity and
delivers value in a broad range of industries, enabling innovation, growth and customer success.
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Konka Group (China) Receives Shenzhen Industrial Award
76
On November 18, after six months of application and multiple rounds of reviews, the presidents of Konka Group and Zhou Bin won the fourth
"Shenzhen Industrial Award" and "Shenzhen Industrial Award" respectively. The "Shenzhen Industrial Award" and "Shenzhen Industrialists Award"
are jointly sponsored by the Shenzhen Industry Association and Shenzhen Commercial Daily. They aim to promote the "industrial spirit" and
recognize industrial enterprises and industrialists who have long been committed to the development of the real economy and rejuvenated national
industries , Is the highest honor in Shenzhen's industry. The 4th "Shenzhen Industrial Awards" have undergone preliminary review. There are 32
companies and 18 companies in more than 20 sub-sectors such as new-generation information technology, communication equipment, integrated
circuits, new materials, semiconductors, electronic components, new energy vehicles, and biomedicine. Shortlisted industrialists. Throughout this
year's "Shenzhen Industrial Awards", most of the companies applying for the industry are leading enterprises with high market share, focusing on R
& D investment in emerging technologies and industries, producing more R & D results, strong core technology, and large revenue. And Konka's
ability to win this award not only means that the group has become a representative of the high-quality development of the Shenzhen industrial
community, but also confirms the group's mission and responsibilities with technology innovation as the guidance and the physical industry as the
carrier. On October 30, the Group officially released the third quarter of 2019 performance report. In the first three quarters, the Group achieved a
total operating revenue of 41.681 billion yuan, an increase of 40.05% compared with the same period last year; total profit was 646 million yuan, an
increase of 44.64% year-on-year. In 2018, Konka launched a comprehensive transformation strategy, and has successfully transformed into a platform
company driven by technological innovation. Through comprehensive deepening of reforms, it has promoted the coordinated development of
multiple businesses, continued expansion of industrial boundaries, and steadily moved towards the goal of 100 billion yuan.
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Lenovo (Hong Kong) Honoured in HKICPA Best Corporate Governance
Awards 2019
77
Lenovo has been honoured with two Platinum Awards in the annual Best Corporate Governance Awards by the Hong Kong Institute of
Certified Public Accountants (“HKICPA”) – the first for Corporate Governance and the second for Sustainability and Social
Responsibility Reporting. This is the seventh consecutive year that Lenovo has been presented with the Corporate Governance award
and the second consecutive year receiving the Sustainability and Social Responsibility reporting award, highlighting once again the
company’s outstanding efforts and commitment in corporate governance and in ESG (environmental, social and governance) reporting.
Over the past two decades, the prestigious Best Corporate Governance Awards have become a recognized and respected yardstick of
corporate governance standards and, more recently also, of sustainability and social responsibility reporting standards, in both the
private and public sectors in Hong Kong. The awards look beyond the minimum legal and regulatory requirements to identify best
practices that set a high bar. The Awards promote a culture of good corporate governance and sustainable business practices, a priority
that aligns well with Lenovo’s continuous efforts in this area. Lenovo is a US$50 billion Fortune Global 500 company, with 57,000
employees and operating in 180 markets around the world. Focused on a bold vision to deliver smarter technology for all, we are
developing world-changing technologies that create a more inclusive, trustworthy and sustainable digital society. By designing,
engineering and building the world’s most complete portfolio of smart devices and infrastructure, we’re also leading an Intelligent
Transformation to create better experiences and opportunities for millions of customers around the world.
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LG (South Korea) Honored With 2020 CES Innovation Awards
78
The Consumer Technology Association (CTA™) is recognizing LG Electronics (LG) for groundbreaking innovations in technology and design with 2020 CES® Innovation Awards – led by
another Best of Innovation Award for LG OLED TV technology. This marks the eighth consecutive year that LG OLED TVs, home appliances and flagship smartphones all have received
CES Innovation Awards, the official industry recognition for the most innovative products introduced at CES, the global stage for innovation.
• CES Best of Innovation: For CES 2020, LG OLED TV technology is again being recognized with the CES Best of Innovation Award in the video display category, earning this highest
honor in three of the past five years. LG, the world’s best-selling OLED TV brand, created the premium OLED TV category, which delivers perfect black, incredible color and unparalleled
high-dynamic range capabilities.
• LG Home Entertainment: Particularly noteworthy for 2020 are two Innovation Awards for one of the industry’s first NEXTGEN TVs to be unveiled at CES 2020 – an LG OLED TV
incorporating the ATSC 3.0 next-generation standard, co-developed by LG. More details on the award-winning LG entertainment products – including 8K and 4K Ultra HD TVs, audio and
computer products and more – will be announced at CES 2020 in January.
• LG Home Appliances: CES 2020 Innovation Awards will go to a number of new LG home appliances, highlighted by an LG InstaView™ Door-in-Door® refrigerator with the
industry-first Craft Ice™ feature, which reimagines home entertaining. Other award-winning LG home appliances include the second win for the LG Styler clothing care system with its
black-tinted mirror front, an all-new portable LG PuriCare™ Mini air purifier and laundry innovations to be announced at CES.
• LG Mobile Phones: Leading the company’s CES Innovation Awards for mobile devices is the groundbreaking LG G8XThinQ Dual Screen smartphone, which provides more control for
scenarios where two identical OLED displays simply work better than one. Also receiving awards are the LG V50ThinQ 5G smartphone designed to connect, stream, browse, play, share
and experience more, without limits, and the LG G8ThinQ with its refined minimalist design, innovative audio experiences, new camera hardware and software, and state-of-the-art
touchless controls and biometric security features.
• CES Innovation Awards: Owned and produced by CTA, the CES Innovation Awards program is an annual competition honoring outstanding design and engineering in consumer
technology products across 28 product categories. An elite panel of industry expert judges, including members of the media, designers, engineers and more, reviewed submissions based on
engineering qualities, aesthetic and design, functionality and consumer appeal.
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LONGi (China) Mono-Si R&D team wins Special Award for outstanding contribution
to the realization of PV grid parity
79
LONGi Mono-Si R&D (research and development) team has won the Special Award for outstanding contribution to the realization of
PV grid parity during the 29th International Conference on Photovoltaic Science and Engineering and the 18th China Photovoltaic
Conference, on November 4, 2019 in historic city of Xi’an, where the headquarters of LONGi is located. The Special Award, generally
awarded to the expert or group that has made significant progress in PV technology or is actively engaged in public policy. On behalf of
the Mono-Si R&D team, founder and president of LONGi, Li Zhenguo, received the Special Award from the PVSEC29 at the
conference. The award acquired by LONGi Mono-Si R&D team, is a positive affirmation and encouragement to LONGi from the PV
industry. Consisting of R&D center and subsidiary technology departments, LONGi Mono-Si R&D team has formed first-class
technology accumulations and projects reserved in the field of monocrystalline silicon material through years of research and
development. The team has promoted the application of monocrystalline silicon material in PV industry and made it the mainstream
through technology innovation. LONGi Mono-Si R&D team has taken the leading role in the research and application of core
technologies such as RCZ, diamond wire slicing, large thermal field, high pulling speed, low oxygen process and thin wafer slicing. In
2015, LONGi completed the switching of diamond wire slicing equipment, which reduced the cost of silicon wafer by 10%~15% and
the cost of module by 5%-8%. The application of diamond wire slicing has saved the PV industry an annual cost of RMB 20 billion,
triggering the slicing technology reformation across the PV industry.
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Nanya Technology (Taiwan) received ISO 27001 Information Security Certification
80
Nanya Technology has received the ISO/IEC 27001:2013 Information Security Management System certification, issued by
Societe Generale de Surveillance S.A. (SGS) Taiwan. A ceremony was held on Nov. 13th, David Huang, Senior Director CBE,
Taiwan & NEA Region awarded the certification to Nanya Technology President. The scope of the certification includes
transferred and self-developed Dynamic Random Access Memory (DRAM) manufacture process and product technology
information, as well as the related information flow include related server room maintenance, network service, and the
development, operation and maintenance of information systems. Nanya Technology believes Information Security is the key to
sustain the company’s core competitiveness. The company continues to promote information security operations, and protect
business secrets and intellectual property rights. “Nanya Technology’s long-term competitiveness and sustainability come from
continuous development and innovation in advanced process and product technology and the protection of valuable assets.
These are the foundation of Nanya Technology to provide high value and secured DRAM products and professional services to
our global customers. Award by SGS on the ISO 27001 Information Security Management System Certification has
demonstrated the determination and importance of our protection of intellectual property, and has promoted a company culture
of information security” said President of Nanya Technology Corporation.
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OMRON (Japan) Awarded Gold Rating from EcoVadis for Sustainability
81
OMRON Corporation announced that it has been awarded the EcoVadis Gold rating (the highest distinction) for the
first time, which puts the company within the top 5% of all the businesses assessed for sustainability performance.
Based in France, EcoVadis is an independent and trusted provider of a shared sustainability platform, which assesses
more than 50,000 businesses using its unique CSR rating methodology that covers 190 purchasing categories and
150 countries in conjunction with several thousands of external stakeholders, including NGOs, trade unions,
international bodies, local governments, and auditing organizations. The assessment considers a comprehensive
range of CSR issues, which are grouped into four themes: Environment, Labor Practices & Human Rights, Ethics,
and Sustainable Procurement. OMRON's initiatives in Environment, Labor Practices & Human Rights, and
Sustainable Procurement were rated highly. In Environment, in particular, OMRON is included within the top 1% of
businesses in the same trade.
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OMRON (Japan)Receives the SDGs Strategy / Economic Value Award at the Nikkei
SDGs Management Grand Prix
82
OMRON Corporation announced that it received the SDGs Strategy / Economic Value Award at the Nikkei SDGs Management Grand Prix,
which was held for the first time this fiscal year under the sponsorship of Nikkei Inc. The objective of this henceforth annual award is to
commend companies who have successfully enhanced their corporate value by tackling social, economic, and environmental issues through their
business by linking the SDGs to management, based on the results of the "Nikkei SDGs Management Survey," a major survey organized by
Nikkei Inc., to achieve SDGs. A recipient of the SDGs Strategy / Economic Value Award is determined based on the comprehensive evaluation
of: "Policy", "Reporting and Communication", "Promotion Systems and Internal Penetration", "Services via Business", and "Business
Performance". Since its foundation, OMRON has based its management on and upheld the OMRON Principles under the mission of "improving
lives and contributing to a better society through its businesses," which is derived from the belief that a business should create value for society
through its key practices. The Award has been granted in recognition of OMRON's Group-wide endeavors in this regard.
OMRON has been presented the SDGs Strategy / Economic Value Award chiefly due to the following reasons:
1. Contributions to social development through its business by playing its roles as a public organ of society.
2. Inclusion of third-party Sustainability Evaluation*1 as a parameter for the medium- to long-term performance-linked compensation of
Compensation Policy for Directors from fiscal 2017.
3. Focusing on improving lives and contributing to a better society through its business since its foundation. (Particularly, in the three domains
of factory automation, healthcare, and social solutions)
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ON Semiconductor’s (USA) ARX3A0 Image Sensor Wins World Electronics Achievement Award
83
ON Semiconductor, driving energy efficient innovations, has won the Innovative Product of the Year award in the sensor category of the prestigious World
Electronics Achievement Awards (WEAA) 2019 for its ARX3A0 CMOS image sensor. The WEAA scheme honors products, companies and individuals that
have made outstanding contributions to the innovation and development of the electronics industry worldwide. Winners are selected by a committee comprising
Aspencore editors and online users from Asia, the US and Europe. Aspencore is the largest electronics industry media and SaaS group in the world featuring
media titles including EE Times and EDN. The ARX3A0 is a breakthrough CMOS image sensor that provides a cost-effective solution for a wide range of
applications. The miniature (1/10th inch optical format), ultra-low power device brings new design and performance opportunities for engineers developing,
amongst other things, Internet of Things (IoT) devices, drones and robotics. The product has an innovative ‘super low power’ mode where just the sensor is
active and the device draws less than 2.5 milliwatts (mW). This helps increase duty cycles while active, and allows the monitoring and detection of motion or a
change in lighting conditions that then prompts the rest of the system to wakeup via a ‘Smart Wake’ function. Being capable of capturing 360 frames per second
(fps) means that, in many use cases, the ARX3A0 can behave like a global shutter sensor while still offering the same power, size, and performance benefits of a
2.2 µm rolling shutter pixel format. The sensor also includes a MIPI interface as standard. ON Semiconductor (Nasdaq: ON) is driving energy efficient
innovations, empowering customers to reduce global energy use. The company is a leading supplier of semiconductor-based solutions, offering a comprehensive
portfolio of energy efficient power management, analog, sensors, logic, timing, connectivity, discrete, SoC and custom devices. The company’s products help
engineers solve their unique design challenges in automotive, communications, computing, consumer, industrial, medical, aerospace and defense applications.
ON Semiconductor operates a responsive, reliable, world-class supply chain and quality program, a robust compliance and ethics program, and a network of
manufacturing facilities, sales offices and design centers in key markets throughout North America, Europe and the Asia Pacific regions.
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Renesas (Japan) RE Microcontroller Wins 2019 Aspencore’s World Electronic
Achievement Award
84
Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, announced that its RE microcontroller (MCU),
developed based on Renesas’ proprietary SOTB™ (Silicon-on-Thin-Buried-Oxide) process technology, was selected as a winner of 2019
Aspencore’s World Electronic Achievement Awards in the MCU and interface category. Aspencore’s editors evaluated more than 100
products launched in 2019 from major semiconducter suppliers and selected 10 finalists across 12 electronic component categories before
naming the winners. Renesas’ energy harvesting devices feature the company’s unique and revolutionary SOTB process technology, which
allows users to simultaneously achieve low active current and low standby current and high-speed operation at low voltage. The RE01 with
its 32-bit CPU core, which was launched on October 31, enables users to implement intelligent functions in equipment powered by low
levels of harvested energy through ambient energy such as light, vibration, or fluid flow. These embedded controllers make it possible for
applications to perform highly accurate sensing and data judgement by excluding noise from signal data when they are used as biological
monitors or outdoor environmental sensing applications. By eliminating the need for battery maintenance in a wide range of applications,
these embedded controllers will contribute to the increasingly widespread use of IoT equipment. Renesas Electronics Corporation (TSE:
6723) delivers trusted embedded design innovation with complete semiconductor solutions that enable billions of connected, intelligent
devices to enhance the way people work and live. A global leader in microcontrollers, analog, power, and SoC products, Renesas provides
comprehensive solutions for a broad range of automotive, industrial, home electronics, office automation, and information communication
technology applications that help shape a limitless future.
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Perth Airport choose Amadeus (Spain) to transform the passenger experience
and support growth
85
Fully-integrated suite of automated, self-service technology solutions from Amadeus and ICM Airport Technics create a flexible,
modern airport environment. Across the globe, passenger numbers are rising steadily and at Perth Airport where nearly 15 million
passengers are served each year, it has never been more important to ensure passengers are handled efficiently to avoid long queues
and congestion. It’s against this backdrop that Perth Airport has committed to an extensive upgrade of its passenger handling
systems, underpinned by a fully integrated suite of solutions from Amadeus and ICM Airport Technics (an Amadeus company). The
extensive agreement sees Perth build on its use of Amadeus’ cloud-based passenger handling platform, which has been in operation
since 2015. The new upgrades will mean that the airport can rapidly scale services up and down to match peaks and troughs in
demand. The platform’s ability to deliver flexibility has been an important factor in the airport’s decision to choose Amadeus to
modernize its entire passenger handling systems. Automation is at the heart of Perth’s passenger experience strategy with the
introduction of ICM’s Hybrid Auto Bag Drop units and check-in kiosks, along with ICM’s common use self-service platform. The
hybrid functionality means passengers can check-in and drop their bags independently, or the same units can be switched to
full-service mode and staffed for conventional check-in. This provides both airlines and travelers at Perth with the flexibility they
need to ensure a smooth journey for everyone, whether they are frequent fliers or occasional holiday-makers.
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Rimac Chooses Analog Devices (USA) to Enable Precision Battery Management
in High Performance Electric Vehicles
86
Analog Devices, Inc. (ADI) announced that Rimac Automobili is planning to incorporate ADI’s precision battery management system (BMS)
integrated circuits (ICs) into Rimac’s BMS. ADI’s technology provides Rimac’s BMS with the ability to extract maximum energy and capacity out of
its batteries by calculating reliable State of Charge and other battery parameters at any given time. The Rimac C_Two is a fully electric hypercar
capable of speeds of up to 258 miles per hour. With 1,914 horsepower under the hood, the C_Two accellerates 0-60 mph in 1.85 seconds and 0-186
mph in 11.8 seconds. To support these high-performance outputs, the Rimac team designs and engineers superior underlying technologies, such as
electric drivetrain and battery packs. BMS technology acts as the “brains” behind battery packs by managing the output, charging and discharging as
well as providing precision measurements during vehicle operation. A BMS also provides vital safeguards to protect the battery from damage. A
battery pack consists of groups of individual battery cells that work seamlessly together to deliver maximum power output to the car. If the cells go
out of balance, the cells can get stressed leading to premature charge termination and a reduction in the battery’s overall lifetime. ADI’s battery
management ICs deliver the highly accurate measurements, resulting in safer vehicle operation and maximizing vehicle range per charge. Analog
Devices offers a broad portfolio of precision battery management ICs serving multiple cell configurations and battery types across a wide range of
applications in multiple industries. In addition to electric vehicle battery management systems, applications include on-board chargers (OBCs), high
power electrical storage systems (ESS), backup battery systems, and high voltage data acquisition systems.
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Long-Term Credit Union Clients Extend Fiserv (USA) Relationship with New
Core Platform to Support Continued Growth
87
Fiserv, Inc., a leading global provider of payments and financial services technology solutions, announced that Minnesota-based Hiway Federal
Credit Union and Oregon-based Rogue Credit Union will continue their Fiserv core processing relationships to support ongoing growth. Each
credit union decided to extend and expand their multi-decade relationship with Fiserv following competitive evaluation processes in which they
sought capabilities to create operational efficiencies, deepen member relationships and expand commercial services. After 32 years as a Fiserv
client, Hiway Federal Credit Union began a significant digital transformation effort in 2017 with the adoption of cloud-based services and digital
platforms, and wanted to ensure its core platform could readily support commercial services and provide consistent member experiences. In
addition to selecting DNA® from Fiserv, Hiway extended its use of a range of services including enterprise content management, wire transfers
and interactive voice response. The credit union also looks forward to being part of the collaborative DNA client community, and to having the
ability to create DNAapps™ to efficiently bring new technology online in the future. Rogue Credit Union has a notable focus on creating
exceptional experiences that are effortless, personalized and seamless. The credit union selected DNA to help drive its digital transformation
strategy, including enhancing commercial service offerings and improving member experiences. Having grown rapidly in the past 10 years,
Rogue Credit Union is now a leader in consumer lending and deposit market share in southwest Oregon, and DNA offered flexibility and
sophistication that will help allow Rogue to build and retain its market leadership.
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SAFE Credit Union Extends Its 38-Year Relationship with Fiserv (USA) to
Expand Member Services and Accelerate Growth
88
Fiserv, Inc., a leading global provider of financial services technology solutions, announced that SAFE Credit Union, headquartered in
Folsom, California and serving the greater Sacramento region, has chosen to extend its 38-year relationship with Fiserv to increase its
overall agility in today’s digital banking environment. With nearly $3 billion in assets, SAFE Credit Union is among the nearly 150 credit
unions with at least $1 billion in assets using a core account processing platform from Fiserv. The credit union has grown exponentially
since its beginnings in 1940 as a ten-member cooperative serving Army Air Corps service members. The institution’s goal is to reach $5
billion in assets by 2023. SAFE Credit Union decided to migrate to DNA® from Fiserv to take advantage of the platform’s open
architecture, APIs, and holistic view of member relationships. These capabilities will allow SAFE to operate effectively and strategically as
it continues to scale. The move to DNA will also help the credit union advance its business services capabilities, an important part of its
long-term growth strategy. SAFE is one of the few credit unions offering business banking services in California. DNA is a modern core
account processing platform with an open architecture built for collaboration, making it easier for financial institutions to integrate other
solutions, bring products and services online quickly, and add new capabilities using downloadable DNAapps™. DNA provides a holistic
view of member relationships that will enable SAFE Credit Union to deliver personalized service and more relevant product offerings. The
platform also supports business account growth with powerful built-in commercial servicing capabilities.
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JBM Group exclusively selected LONGi (China) high efficiency monocrystalline
modules for their 135MW Maharashtra project in India
89
Residents in Chalisgaon Village, Jalgaon District of Maharashtra, India can now use the clean energy generated by the
Maharashtra solar plant, thanks to a strategic cooperation between the JBM Group, a leader in solar energy generation and
LONGi, the world’s leading solar manufacturer. Covering an area of 600 acres, the solar plant is the largest in Maharashtra
State, India, with capacity of 135MW. LONGi is the exclusive module supplier selected for its high efficiency monocrystalline
modules and quality of the product. The plant was connected to grid in June 2018 and has generated cumulative power of about
280 million kWh since inception. The Maharashtra plant is invested and developed by JBM Group as part of its leadership in
solar energy generation providing world class alternative energy solutions. Product performance and quality are paramount to
the Group. In the selection process, executives and technical experts from JBM Group audited LONGi’s silicon wafer factory in
Wuxi and cell and module production facilities in Taizhou, China. LONGi was selected exclusive solar module supplier for the
project. LONGi's products are specified in more than 15% of the world's new energy installations each year and the company
has become the world's largest power generation equipment company in the power sector. In propelling the energy
transformation, LONGi will continue to create maximum return on investment to our customers and partners through
technological innovations.
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Wirecard (Germany) ensures a smooth online shopping experience for
Playmobil customers
90
Wirecard, the global innovation leader for digital financial technology, and Playmobil are working together to improve the
online shopping experience for customers throughout Europe. Thanks to Wirecard, Playmobil is able to offer and accept a wide
variety of local and international payment methods on its e-commerce sites. In order to grow an international e-commerce
business and convert one-off shoppers into regular customers, merchants must provide a smooth and reliable purchasing
process. Thanks to Wirecard, brands such as Playmobil can not only offer a wide range of digital payment options but also
ensure that these payments are processed quickly and reliably for an optimal online checkout experience. When consumers find
their way to a merchant’s e-commerce site, customer experience takes a leading role. According to Gartner, 64% of people find
the customer experience to be more important than price when it comes to making a purchasing decision. As the world’s first
payment service provider to support more than 200 different local and global payment solutions, Wirecard put together a
customized payment mix for Playmobil. Thanks to a quick acceptance, authentication and processing of digital payments,
Wirecard reduces payment friction and ensures a seamless checkout process for Playmobil’s online customers. First invented by
Hans Beck in 1974, Playmobil is a popular line of toys produced by the Brandstätter Group. Over three billion Playmobil
figures have been produced, with the toy now being played with by children in over 100 countries worldwide.
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Amadeus (Spain) and KPMG join forces to simplify compliance in business
travel
91
Amadeus, leading technology provider to the travel industry, and business advisory firm KPMG (UK) are excited to announce a
collaboration which will bring the worlds of travel and global compliance together. Whilst most people enjoy traveling for work, it
always involves a certain degree of planning and form-filling, for both the corporation and the traveler. As business travel continues
to increase year-on-year (the Global Business Travel Association predicts that business travel spend will reach $1.7 trillion by 2022
), the collaboration launches with the aim of taking the hassle out of travel. Through a combined technological offering, companies
and employees will be able to book their business travel and receive immigration, tax and regulatory assessments and assistance
throughout the journey. Companies using both Amadeus and KPMG business travel technology can elect to have their employee
travel data sent directly and seamlessly by Amadeus cytric Travel & Expense to KPMG LINK Business Traveller for assessment.
Business Traveller can then identify travel requirements at the point of booking or planning a trip, triggering the next steps to
ensure compliance with the necessary requirements ahead of their business trip. This combined solution – which is now being
implemented for joint Amadeus & KPMG customers – aims to provide a unified experience for corporations and employees alike,
saving time and costs.
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Vistara renews partnership with Amadeus (Spain), expanding its global footprint
for continued growth
92
Vistara, Indian full-service airline and a joint venture of TATA Sons and Singapore Airlines, reinforces its growth strategy with an extended
distribution and IT partnership with Amadeus. Through this extended partnership, Vistara renews its contract for the full Altéa suite of
solutions, including inventory, reservation, ticketing and departure control systems. Amadeus’ technology supports Vistara’s international
expansion plans, including optimization of several areas of the business including passenger services, revenue management and payments.
Vistara has also renewed and strengthened its distribution agreement with Amadeus ensuring worldwide distribution of a full range of the
airline’s content and fares to Amadeus-connected travel sellers. This is part of Amadeus’ key commitment to India and our long-term vision
for the country and broader Asia-Pacific market. The airline has been growing at nearly double the rate of the aggregate market growth,
setting itself apart from its competition and on track to be a leading airline in India. Aiming to expand its footprint through 2023, last year
Vistara placed firm orders worth $3.1 billion at list prices with Airbus for 13 aircrafts from the A320neo family and with Boeing for six
787-9 Dreamliners. In addition, the airline is leasing another 37 new A320neo-family aircrafts from leasing companies over the said period
to significantly grow its fleet. Amadeus’ global network of travel sellers will have access to a broader range of Vistara’s content, including
the full range of international, as well as preferred and negotiated fares. All content will be available for travel sellers to shop, book and
service through the Amadeus Travel Platform. In addition, Amadeus-connected travel agents will enjoy complete visibility of the airline’s
inventory in real time; to enable travel sellers to deliver an even greater level of customer service than through any other provider.
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Elgama-Elektronika to Design Electricity Meters with Analog Devices’ (USA) mSure®
Technology for Remote Accuracy Monitoring and Enhanced Tamper Detection
93
Analog Devices, Inc. (ADI) announces a collaboration with Elgama-Elektronika, a Lithuania-based manufacturer of static electricity
meters. Elgama will design electricity meters enabled by ADI’s mSure® diagnostics technology to help utilities remotely monitor
accuracy of meters in the field. This allows meters to have greater useful life while reducing overall costs of meter sample testing. In
addition, meter tampering accounts for 10 percent of stolen energy worldwide – a nearly $100 billion revenue loss for utilities in
Europe alone and ADI’s mSure technology can provide actionable intelligence to identify many different types of meter tampers.
Elgama plans to bring these meters to market by the end of 2020. Currently, when managing meter assets over their deployed lifetime,
utilities check meters in the field on a case-by-case basis, replacing good meters based on age rather than need and investigating false
tamper alerts. mSure, when combined with an analytics service, directly monitors meter accuracy and reports data back on individual
meter health, helping to identify both malfunctioning meters and more electricity tamper cases. Raw data generated by mSure-enabled
meters is provided to and processed by a cloud-based analytics service, allowing utilities to run reports on their entire meter population
at desired intervals. Analog Devices is a leading global high-performance analog technology company dedicated to solving the toughest
engineering challenges. We enable our customers to interpret the world around us by intelligently bridging the physical and digital with
unmatched technologies that sense, measure, power, connect and interpret.
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Arrow Electronics (USA) Expands Sensor Portfolio with InvenSense, a TDK Group
Company
94
Arrow Electronics has expanded its sensor portfolio through an agreement with InvenSense, which provides access to a leading range
of sensing technology platforms. The new contract covers Europe, Middle East and Africa (EMEA). InvenSense/TDK’s comprehensive
portfolio features sensor systems such as MEMS motion sensors, MEMS microphones, and ultrasonic Time-of-Flight (ToF) range
sensor solutions. InvenSense offers sophisticated MEMS analogue and digital microphones with their SmartSound platform meeting
the growing demands of high-performance audio in markets such as home automation and the Internet of Things. The recently
introduced SmartSonic platform comprises ultrasonic (Time of Flight) sensors utilizing a tiny ultrasonic transducer chip to send out an
ultrasonic pulse, and then listen for echoes returning from targets in the sensor’s field-of-view. By calculating the distance based on the
ToF and speed of sound, the sensor can determine the distance of an object relative to a device and trigger a programmed behaviour.
These ToF sensors are intended for consumer electronics, AR/VR, robotics, drones, IoT, automotive, and industrial market segments.
InvenSense, a TDK company, delivers motion interface solutions with fully integrated sensors and robust sensor fusion firmware
algorithms. InvenSense’s SmartMotion platform of MEMS motion devices enables users to integrate a motion interface capability
directly into products in a straightforward manner and with minimal development cost and effort. Arrow is now offering TDK’s
DK-42605 development kit and the new T-series microphones from InvenSense to address this fast-growing and emerging opportunity.
The TDK DK_CH101 development kit will also be available from Arrow in Q1 2020.
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Arrow Electronics (USA) Appointed as Reseller for MindSphere Portfolio in EMEA
95
Arrow Electronics announced its appointment as the first reseller for the MindSphere Program for industrial Internet of Things
(IIoT) and solution and technology providers in the Europe, Middle East and Africa (EMEA) region. Arrow will market
MindSphere hardware and software products, including MindConnect IoT 2040 and MindConnect Nano hardware. MindSphere,
the cloud-based, open IoT operating system from Siemens, connects products, plants, systems and machines, enabling businesses to
harness the wealth of data generated by IoT with advanced analytics. Arrow is already well established as a MindSphere partner,
with multiple technical staff trained by Siemens through the MindSphere technical curriculum. It also has a variety of MindSphere
applications in development, and a joint go-to-market agreement to assist customers in achieving substantial business value through
IoT technology generally and MindSphere specifically. The new reseller agreement further extends Arrow’s ability to support
industrial companies embarking on the journey to full IoT integration and Industry 4.0. Arrow addresses every layer of an IoT
solution stack, ranging from electronic components to IT solutions, including consultancy and development. Arrow’s portfolio
includes sensors, connectivity, cloud, analytics, security and IT infrastructure. Arrow Electronics will be exhibiting at SPS,
Nuremberg, 26-28 November, in the MindSphere Lounge (Hall 11). Demonstrations of industrial equipment connectivity will
include predictive maintenance, health monitoring and system analytics. There will also be a focus on the integration of legacy
systems into IoT deployments.
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Autodesk (USA) and Virgin Hyperloop One Announce Joint Effort to Explore Advanced
Route Optimization, Transportation Design, and Construction Technology
96
Autodesk, Inc. and Virgin Hyperloop One, a leader of hyperloop technology and the evolution of how the world moves
people and goods, announced an alliance to explore new opportunities in extending the value of Building Information
Modeling (BIM) for transportation route optimization and improved digital engineering and construction workflows. Virgin
Hyperloop One’s visionary technology features depressurized tubes that carry on-demand passenger or cargo pods at speeds
of up to 670 miles per hour, powered by magnetic-levitation and electric propulsion. Its depressurized tube infrastructure
eliminates the impacts of air-drag and friction, requiring less energy and cost to operate, and allows travel to occur at
exceptionally high speeds. Since 1984, Autodesk continues to be a recognized leader in BIM and an innovator of
technology used by architects, engineers, and construction teams globally. Autodesk technology connects all stakeholders
on infrastructure and building projects from design through construction to operations and maintenance. Autodesk
technology has been used on some of the most complex building and infrastructure projects on the planet, including Pan
Borneo Highway Sarawak, New York Metropolitan Transit Authority’s East Side Access, the San Francisco Airport
Terminal 1 redevelopment, Dubai’s Museum of the Future, and the world’s tallest skyscrapers including the Shanghai
Tower, and many others around the world.
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Amadeus (USA) for Developers offers Artificial Intelligence APIs to stimulate next wave
of travel tech innovation
97
In an industry first, Amadeus makes ready-to-use, AI-driven insights and functionality available to innovators and
developers, helping them create exciting new travel solutions Artificial Intelligence is here to stay. AI systems are set to
provide a $14 trillion boost to the global economy by 2035. In the travel industry, this technology has the potential to
produce $400 billion of value, more than double the value achievable through traditional analytical methods. In today’s
fourth industrial revolution economy, AI is becoming indispensable for travel players to better understand and inspire
travelers, create tailored experiences and compete for more savvy, demanding customers as they move between devices
and channels. To this end, Amadeus is empowering startups, independent developers and emerging businesses to gain an
edge by launching a new set of AI Application Programming Interfaces (APIs) as part of the Amadeus for Developers
program. These APIs will allow developers to build solutions that can predict travel intent, traveler behavior, and flight
delays, amongst others - without needing any prior background in AI or data. This is the first time in the travel industry
that AI capabilities are made available to startups and independent developers via open APIs. Amadeus is providing
ready-to-implement predictive models based on valuable insights and functionalities fed by Amadeus’ vast sources of
travel data.
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Applied’s (USA) New Materials Engineering Technology Accelerator Is Open For Collaboration
98
Applied Materials, Inc. announced the opening of the Materials Engineering Technology Accelerator (META Center), a
first-of-its-kind facility aimed at speeding customer prototyping of new materials, process technologies and devices. As chipmaking
becomes increasingly challenging, the META Center extends Applied’s ability to collaborate with customers to pioneer new ways
of improving chip performance, power and cost. Located at the State University of New York Polytechnic Institute (SUNY Poly)
campus in Albany, New York, the META Center’s cleanroom provides customers and partners access to state-of-the-art process
systems to help shorten the time from lab to fab. At the META Center, engineers can evaluate novel chip materials, structures and
devices, testing them in a robust pilot manufacturing environment and accelerating their readiness for customer high-volume
manufacturing facilities. Among the first chip devices under evaluation at the META Center is a new magnetic random-access
memory (MRAM) targeted at Internet of Things devices, providing low-power, nonvolatile code storage and high-density working
memory. Applied’s recently launched Endura® CloverTM MRAM PVD platform is among the systems at the META Center
enabling this capability. The META Center is a strategic addition to Applied’s global R&D environment. It complements Applied’s
Maydan Technology Center in Silicon Valley where new process systems are developed, along with the company’s Advanced
Materials Lab and Advanced Packaging Development Center, both located in Singapore. Applied’s global R&D environment
demonstrates the company’s commitment to a new playbook for industry innovation and collaboration, from materials to systems.
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Delta (Taiwan) Partners with Alibaba to Develop Next-Generation Power Supply Technology for
Internet Data Center (IDC) Applications
99
Delta, a global provider of power and thermal management solutions, unveiled a partnership with Alibaba, China’s leading e-commerce
company, for the development of cutting-edge power supply technology for internet data centers (IDC) at the 2019 China Data Center
Committee Summit, held yesterday in Beijing, China. The aforementioned power supplies leverage Delta’s core competence in
high-efficiency power electronics to enable lower power equipment quantity by up to 40%(1) and reduced space by half(1) in IDCs. These
advanced power supplies directly convert medium voltage 10kV AC into 240V DC, thus, enhancing energy efficiency up to 98.5% as well
as reliability by eliminating the need for traditional energy conversion equipment commonly present in IDCs. These jointly-developed
power supplies successfully integrate the 10kV AC power system, isolation transformer, modular DC power system, and the output power
accessories to enhance energy conversion efficiency, reliability, power density, power output and maintenance efficiency. Its modular design
enables scalability to at least 2.5MW, thus highly suitable for IDCs of the near future, which will require unprecedented efficiency,
reliability, power density and capacity, as well as maintenance convenience. Delta boasts not only advanced high-efficiency power
electronics technology, but also a robust track record regarding the integration and global deployment of energy-saving solutions in a broad
spectrum of fields. The joint development of cutting-edge power supply technology with Alibaba, enables higher energy efficiency by up to
3 percentage points and reduces related total power equipment total investment costs by close to 20% in IDCs, an application that is
expected to see explosive growth for the IoT and telecom sectors. Data centers in Zhejiang Province and in Jiangsu Province have already
adopted these state-of-the-art power supplies.
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Lenovo (Hong Kong) Collaboration with Starlight Children’s Foundation® Shows the Power of
Virtual Reality to Reduce Pain for Hospitalized Children
100
Lenovo previews results from a new global survey that shows people believe in the potential of technologies, such as Virtual
Reality (VR), to positively impact our health. In fact, VR is starting to be used in some hospitals in place of general anesthetics
to alleviate pain for young patients. The new Lenovo THIS IS LIFE film, premiered today at the Denver Film Festival,
showcases the groundbreaking use of its technology in collaboration with Starlight Children’s Foundation, which is using the
Lenovo Mirage™ Solo VR headset in its Starlight Virtual Reality program. The VR technology enables pediatricians at
Children’s Hospital Colorado and hundreds of Starlight partner hospitals and healthcare facilities in the US to use the headsets
as a procedural tool for critically ill young patients, primarily to reduce anxiety during mild to moderately painful procedures.
By using VR as a calming distraction, several patients have been able to undergo these procedures whilst awake, cutting down
lengthy recovery times, and reducing the need for medication. To unearth new insights into the social changes and benefits of
intelligent technology and smart devices, Lenovo surveyed more than 15,000 individuals, across the US, Mexico, Brazil, China,
India, Japan, UK, Germany, France and Italy. The research found that people around the world believe new technologies have
the power to transform the healthcare space, with 47 percent of global respondents saying technology will be “critical” in
transforming health care in the future.
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Lenovo (Hong Kong) and Schneider Electric Announce Strategic Partnership to Work on Smart
Green Manufacturing in China
101
Lenovo Group at Lenovo Tech World, the company’s annual innovation summit, Lenovo Chairman and CEO, and Schneider
Electric Chairman and CEO, announced a strategic partnership that will see the two companies working together on smart
green manufacturing solutions for the flourishing Chinese manufacturing sector. Leveraging the strengths of both companies,
the strategic partnerships will create powerful synergies by combining Lenovo’s Industrial Internet of Things (IIoT) LeapIOT
solution with Schneider Electric’s smart green manufacturing solution based on EcoStruxure. The combination will build a
blueprint that can be provided as a best-in-class smart manufacturing solution to discrete and hybrid manufacturing operations,
regardless of the vertical industry they operate in. In particular, the focus will include AI algorithms and big data as it relates to
all aspects of efficiency management, predictive maintenance, production quality and other industrial applications. Lenovo is a
US$50 billion Fortune Global 500 company, with 57,000 employees and operating in 180 markets around the world. Focused
on a bold vision to deliver smarter technology for all, we are developing world-changing technologies that create a more
inclusive, trustworthy and sustainable digital society. By designing, engineering and building the world’s most complete
portfolio of smart devices and infrastructure, we are also leading an Intelligent Transformation – to create better experiences
and opportunities for millions of customers around the world.
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LONGi (China) and Adani Green Energy entered strategic partnership agreement for supply of
up to 1.2GW Hi MO4 modules in India by 2020
102
LONGi, the world's leading solar technology company and Adani Green Energy, India’s largest photovoltaic power station developer, has
entered into a strategic partnership agreement on November 28, 2019 where LONGi will supply Adani Green Energy with its new
generation Hi MO4 modules. The agreement set guidance of up to 1.2GW modules to be delivered to Adani by 2020. Both parties agreed to
continue to deepen their strategic partnership over the next 3 5 years. The electric power infrastructure in India is weak and photovoltaic
energy has great potential for growth in the next five years. The strategic partnership agreement represents a strong alliance and a “win win”
cooperation between the world's leading energy investment company and the world's leading solar technology company, and is a milestone
in the development of global renewable energy. The Adani Group is an integrated business conglomerate in India that consists of six
publicly traded companies with combined revenues of $13 billion. Its renewable energy subsidiary, Adani Green Energy, is one of the
largest renewable companies in India engaged in the development of solar, wind and hydro energy with a current project portfolio of 5,290
MW. LONGi leads the solar PV industry with product innovations and optimized power cost ratio with breakthrough monocrystalline
technologies. LONGi supplies more than 30GW of high efficiency solar wafers and modules worldwide yearly, about a quarter of global
market demand. Today, LONGi is recognized as the world’s most valuable solar technology company with the highest market value and a
major power generation equipment supplier in the global solar energy field.
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NEC (Japan) and Council of Scientific & Industrial Research (CSIR) sign MoU to increase focus
on Big Data and High-Performance Computing
103
NEC Technologies India (NECTI), a subsidiary of NEC Corporation, and the Council of Scientific & Industrial Research (CSIR)
signed an MoU to collaborate in the development of innovative solutions using big data analytics and High-Performance Computing
(HPC). Under this collaboration, NECTI and CSIR will jointly harness the capabilities of AI and machine learning in data science to
solve critical issues plaguing society in areas including water shortages, energy, agriculture, healthcare and social security. NECTI and
CSIR plan to set up a Center of Excellence to create and test new solutions. It will also facilitate local talent development, particularly
in the areas of big data analytics and machine learning. NEC is a leader in the integration of IT and network technologies and brings
more than 100 years of expertise in technological innovation to provide solutions for empowering people, businesses and society.
Headquartered in Japan, NEC started operations in India in the 1950s, accelerating its growth through the expansion of business to
global markets. NEC in India expanded its business from telecommunications to public safety, logistics, transportation, retail, finance,
unified communication and IT platforms, serving across governments, businesses as well as individuals. With its Centre of Excellence
for analytics platform solutions, big data, biometrics, mobile and retail, NEC in India offers innovative new services and solutions for
India and global markets. NEC operates across India with offices in New Delhi (head office), Noida, Mumbai, Chennai, and Bengaluru.
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NRI (Japan) to Provide Data Governance Service for Financial Institutions with Collibra
104
Nomura Research Institute, Ltd. (NRI), a leading provider of consulting services and system solutions is collaborating with Collibra, a
leading software provider specializing in Data Intelligence, to jointly introduce data governance service for financial institutions. Using
Collibra’s technology, NRI’s new service offers total solutions for financial institutions by providing both business and systems
consulting. As digital transformation continues to revolutionize the global banking industry, financial firms are faced with increasingly
large caches of data to process, often more than they can handle with their existing data infrastructure. Many commit significant
resources on ineffective data discovery or inefficient processes which result in significant underutilization of corporate data. Collibra
has a significant track record in solving this issue. Over 400 major institutions around the world have successfully deployed and use
Collibra, an enterprise-wide solution that delivers governance, data catalog and privacy capabilities for all Data Citizens. Recently, the
company officially announced that they will collaborate with NRI to bring business and systems consulting to even more financial
institutions. To address these challenges, NRI and Collibra are helping financial firms to establish robust data governance
cross-organizationally across business functions within the enterprise. The process includes establishing a data stewardship code and
data management policies, setting up data catalogues, sharing glossaries and measuring data quality regularly.
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Olympus (Japan) and the Jikei University School of Medicine
105
Olympus Corporation announce the Olympus Corporation and the Jikei University School of Medicine made a breakthrough in their
joint research1 by developing an AI-assisted sperm selection system that can calculate sperm motility in real time with high accuracy.
The research aims to reduce the intracytoplasmic sperm injection (ICSI) workload and standardize the sperm selection process among
embryologists2 as the demand for assisted reproductive technology grows. After evaluating 1,066 sperm images in the research, the AI
system learned the criteria to recognize sperm in a live image with high accuracy (99% sensitivity3 , 92% positive predictive value4
92%) and calculate its motility. This innovative AI technology can help embryologists distinguish fast-moving sperm from
slow-moving sperm in real time. Going forward, the research team will develop the AI system to evaluate sperm morphology, including
the sperm head and neck. The goals are to further enhance the AI and deploy a microscope equipped with this technology by December
2020. Olympus, the department of obstetrics and gynecology at the Jikei University of Medicine, and LPIXEL Co., Ltd.5 will continue
to collaborate to meet these goals as part of Olympus’ Office of Innovation6. The AI-powered microscope under development will help
to solve challenges in the assisted reproductive technology workflow like the growing workload and lack of standardized selection
criteria. This content was presented by the Jikei University School of Medicine in a paper called, "Study of the Feasibility of
Supporting Favorable Sperm Selection by Machine Learning in Microinsemination" at the 64th Annual Meeting of the Japan Society of
Reproductive Medicine on November 7 and 8, 2019.
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Qualcomm Technologies (USA) and Siemens set up the first 5G private standalone
network in an industrial environment using the 3.7-3.8GHz band
106
Qualcomm Technologies, Inc. and Siemens have setup a joint proof-of-concept project at the Siemens Automotive Test Center in Nuremberg, Germany,
demonstrating the first private 5G standalone (SA) network in a real industrial environment using the 3.7-3.8GHz band. Qualcomm Technologies is providing
the 5G test network and 5G industrial test devices that run on our foundational 5G technologies, and Siemens is supplying industrial end-devices like automated
guided vehicles (AGV). The 5G private standalone network proof-of-concept at the Siemens Automotive Test Center enables Siemens and Qualcomm
Technologies to test technologies, solve problems, and come up with solutions for the future of private wireless applications in industrial settings. Qualcomm
Technologies set up 5G industrial test devices along with a 5G standalone test network that includes a 5G core network and 5G base station with remote radio
head. Siemens provided the actual industrial setup including Simatic control systems and IO devices. In the course of this joint research effort at the Siemens
Automotive Test Center, currently available industrial technologies such as OPC UA and Profinet will be tested and evaluated - technologies that require a 5G
private network in order to work. In Germany, private networks can use the local broadband spectrum from 3.7-3.8 GHz, which has been reserved for industrial
usage in local deployments. These private networks allow industrial sites to control and manage their own networks as they see fit, allowing for high reliability,
low latency, and the ability to reconfigure the network to suit changing needs while at the same time keeping data onsite for added security. Qualcomm
Technologies and Siemens have a longstanding technical collaboration focused on cooperation in wireless technologies. This has resulted in over 15 years of
success and the development of Siemens’ unique Scalance portfolio of industrial wireless products. With Qualcomm Technologies’ leading expertise in 5G
technologies, this collaboration continues to evolve —leading into the first 5G private standalone network in an industrial environment using the 3.7-3.8GHz
band. This allows solutions to be tested and developed which the industry will be able to use with the upcoming Release 16 of the 5G standard.
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Cree and STMicroelectronics (Switzerland) Expand and Extend Existing Silicon
Carbide Wafer Supply Agreement
107
Cree, Inc. and STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications,
announced the expansion and extension of an existing multi-year, long-term silicon carbide (SiC) wafer supply agreement to more than
$500 million. The extended agreement is a doubling in value of the original agreement for the supply of Cree’s advanced 150mm silicon
carbide bare and epitaxial wafers to STMicroelectronics over the next several years. The increased wafer supply enables the semiconductor
leaders to address the rapidly growing demand for silicon carbide power devices globally, particularly in automotive and industrial
applications. The adoption of silicon carbide-based power solutions is rapidly growing across the automotive market as the industry seeks to
accelerate its move from internal combustion engines to electric vehicles, enabling greater system efficiencies that result in electric cars
with longer range and faster charging, while reducing cost, lowering weight and conserving space. In the industrial market, silicon carbide
modules enable smaller, lighter and more cost-effective inverters, converting energy more efficiently to unlock new clean energy
applications. Cree is an innovator of Wolfspeed® power and radio frequency (RF) semiconductors and lighting class LEDs. Cree’s
Wolfspeed product portfolio includes silicon carbide materials, power-switching devices and RF devices targeted for applications such as
electric vehicles, fast charging, inverters, power supplies, telecom and military and aerospace. Cree’s LED product portfolio includes blue
and green LED chips, high-brightness LEDs and lighting-class power LEDs targeted for indoor and outdoor lighting, video displays,
transportation and specialty lighting applications.
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STMicroelectronics (Switzerland) and maxon Collaborate on Precision Motor
Control for Robotics and Automation
108
STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, is working with
maxon, a leading precision-motor provider and a member of the ST Partner Program, to accelerate the design of robotics applications
and industrial servo drives. The companies will demonstrate a jointly developed servo control kit at sps 2019 trade show in Nuremberg,
November 26-28 (Booth 10.1/138). The EVALKIT-ROBOT-1 is a plug-and-play solution aimed to help users easily approach the
world of precise positioning and high-end motion in servo drives and robotics. A maxon 100-Watt BLDC motor with built-on
1024-pulse incremental encoder is included in the kit, embodying the company’s expertise in magnetic design in motors that ensures
smoothness and balance to allow fine control even at low rotor speeds. The servo control board supplied with the kit contains ST’s
STSPIN32F0A intelligent 3-phase motor controller and a complete inverter stage built with ST power transistors ready to connect to
the motor. Motor-control firmware is also included, making it easy for users to start the motor and begin sending commands. ST’s
STSPIN32F0A system-in package contains critical circuitry for motor control, including an STM32F031C6* microcontroller and
three-phase inverter driver in a compact 7mm x 7mm VFQFPN package. The microcontroller comes loaded with plug-and-play
firmware for MODBUS communication and field-oriented control (FOC) with precise positioning capabilities. Power management and
current sensing circuitry are also embedded in the device making it more flexible and versatile.
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FUJIFILM (Japan) Toyama Chemical enters agreement with Appili Therapeutics regarding the assignment of rights
for the development and marketing of T-2307, a candidate compound for the treatment of fungal diseases.
109
FUJIFILM Toyama Chemical Co., Ltd. announced it has entered an agreement with Appili Therapeutics regarding the assignment of
rights for the development and marketing of T-2307 outside of Japan. Subject to terms of the agreement, FUJIFILM Toyama Chemical
will transfer the development and marketing rights of the compound to Appili and receive milestones payments as well as royalties in
the future. T-2307, an antifungal candidate compound developed by FUJIFILM Toyama Chemical, exhibits it’s antifungal activity
through a novel mode of action whereby it actively accumulates in fungal cells*1 and is designed to selectively disrupt the function of
fungal mitochondria. In the course of R&D with primary focus of targeting fungi, FUJIFILM Toyama Chemical has discovered and
developed T-2307 for the treatment of various mycoses*3 including those due to drug resistant strains. The company continued to
conduct clinical development of T-2307, including Phase I clinical trials in the United States. Appili established in 2015 in Canada, is
engaged in the R&D of drugs specializing in the area of infectious diseases. The company was listed in July 2019 on the Toronto Stock
Exchange, and has been accelerating the development of new drugs. Through conclusion of this agreement, Appili plans to carry out a
Phase II clinical trial of T-2307 targeting cryptococcal meningitis*4, a disease for which an effective treatment drug is being sought.
FUJIFILM Toyama Chemical has been promoting the R&D of treatment drugs with unique mode of action, focusing on “infectious
diseases” as one of the key areas. The agreement will contribute to solving social issues through the provision of innovative and high
value-added drugs through the cooperation of Appili and FUJIFILM Toyama Chemical and also would widen the physician’s choice by
treating fungal infections as well as the treatment options of the patient.
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Wirecard (Germany) announces strategic partnership with HERE Mobility
to launch integrated smart mobility solutions
110
Wirecard, the global innovation leader for digital financial technology, is collaborating with HERE Mobility, to jointly develop
integrated B2B2C payment and mobility services. HERE Mobility is the mobility unit of HERE Technologies, a global leader in
location platform services owned by automotive companies including Audi, BMW and Daimler. HERE Mobility operates an open and
competitive smart mobility marketplace for all transportation services. Over 2 million vehicles are connected to HERE Mobility’s
Marketplace across Europe, Latin America, and the US. Wirecard and HERE Mobility will collaborate on a variety of projects aimed at
capitalizing on the payment and geolocation services both companies already offer, including innovation cases in the area of predictive
mobility services. Wirecard sees “Commerce on the Move” as a new megatrend and expects a transaction potential of over EUR 10
billion per year via its platform when all services are rolled out. An initial project will be to integrate HERE Mobility’s Marketplace
into boon.PLANET, Wirecard’s digital banking and payment app. As a result, boon.PLANET users will be able to search, book and pay
for rides using the embedded HERE Mobility Marketplace without leaving the boon.PLANET app. Wirecard’s intelligent digital
platform will be able to process customers’ geolocation and mobility profiles for additional value added services. Additional projects
include offering mobility services with an integrated payment flow for merchants in the travel and leisure industry, including airlines,
hotels, restaurants and stadiums. Furthermore, the companies plan to work together in the area of personalized data solutions for
businesses and end-consumers leading for example to predictive ride services. It is also planned for Wirecard to act as payment service
provider for HERE Mobility.
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Wirecard (Germany) wins YeePay, leading Chinese travel payment company,
as a new partner for airline bookings globally
111
Wirecard, the global innovation leader for digital financial technology, continues to expand its business with major
Chinese partners through a new cooperation with YeePay. As the leading independent mobile and online acquirer in
China for the airline and travel industry, YeePay serves all Chinese commercial airlines and major travel agencies.
Wirecard and YeePay will cooperate to provide payment processing services to these customers outside of China.
YeePay, a leading e-payment service provider in China, reported a transaction volume in airline and travel of EUR 34
billion in 2018, with nearly all transactions being online-based. By working with Wirecard, YeePay can now facilitate
international payments with a potential transaction volume of more than EUR 17 billion which will be handled by
Wirecard. The companies will leverage their payment technology and licenses to give current and new customers of
YeePay a convenient and regulatory checkout process. Travel agencies, airlines and consumers outside of China will
benefit from this improved service offering.
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Wirecard (Germany) and Bank Mandiri, one of Indonesia’s largest banks, cooperate
on digital financial solutions for corporate customers
112
Wirecard, the global innovation leader for digital financial technology, cooperates with one of the largest banks in Indonesia, Bank
Mandiri, on digital financial solutions for corporate customers. Thanks to Wirecard, Bank Mandiri has been able to launch a new
service for its 27,000 corporate clients which enables them to streamline Customs and Excise payments thanks to direct integration
with the Indonesian Directorate General for Customs and Excise (DJBC). Bank Mandiri has more than 2,620 domestic branches
and seven overseas branches, and reported a consolidated profit of EUR 1.6 billion in 2018. The Customs Management service is a
new feature within the Mandiri Cash Management (MCM) solution, supported by Wirecard technology and provided to over
27,000 active Bank Mandiri corporate customers. The MCM solution enables these clients to carry out a wide range of operations,
including liquidity management and online foreign exchange. The solution covers the entire cash management services value chain
in an easy-to-use and customizable interface. Based on the company’s international expertise, Wirecard has developed specific
solutions tailored to the needs of banks in Asia that want to provide digital banking services to corporate or retail clients. In
Indonesia, Wirecard is already market leader in corporate transaction banking software solutions. The new payment solution is a
result of the Indonesian Directorate General for Customs and Excise (DJBC) integration with Bank Mandiri, based on open APIs.
This allows corporate customers to search DJBC invoices, check their billing status and make payments all in one transaction
cycle. Corporate customers benefit from real-time information, avoiding duplicate payments, as well as accelerated transaction
times and increased efficiency in the payment process.
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Wirecard (Germany) provides seamless payment solutions to ride hailing platform
CarGo Technologies
113
Wirecard, the global innovation leader for digital financial technology is cooperating with CarGo Technologies for
seamless payment solutions. The goal is to team up for all in-app payments for the ride hailing platform in Belgrade,
Vienna and Zurich where CarGo Technologies is present, and as a payment partner for the company’s expansion.
CarGo Technologies is the first ride hailing platform servicing the Balkan region, with plans to expand across
Europe, and was recognized by Forbes as one of the top 10 disruptive companies in 2019. To book a ride, users
simply open the app and enter their desired destination. The next available driver confirms the ride, and with a simple
pre-payment function powered by Wirecard, the user can enjoy the ride with no need to exchange cash or scan their
card. CarGo Technologies has over 800,000 registered users and more than 4,000 partners to provide roadside
services. MaaS (Mobility-as-a-Service) solutions, such as platforms where users can book public and private
transportation services without the need of a personal vehicle, are entering the market on a global scale. As a result,
Wirecard sees “Commerce on the Move” as a new megatrend that is now more relevant than ever. According to
Statista, the mobility services market in Europe is expected to surpass EUR 400 billion by 2030.
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Miscellaneous Updates
Technology Industry

Miscellaneous Updates
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Fujifilm (Japan) Announces Expansion of its Biopharmaceutical Contract Development
and Manufacturing Business
115
FUJIFILM Corporation will make a capital investment of approximately 13 billion yen in the gene therapy field, one of the priority areas for
growth in the Contract Development and Manufacturing (CDMO) business, in order to further expand the contracted development and
manufacturing business. The investment will include the addition of dedicated gene therapy laboratories. The new building will be part of
Fujifilm Diosynth Biotechnologies (FDB) College Station, Texas campus. This site has been FDB's Center of Excellence for gene therapy
products since 2014. The laboratories will be approximately 6,000 square meters and will house state-of-the-art upstream, downstream and
analytical development technologies. They will be operational in the fall of 2021. Fujifilm has also announced that additional investments
include expanding FDB's the gene therapy cGMP capacity. This will include the addition of new clean rooms and the expansion of its upstream
capacity with eight new 500 / 2,000L single use bioreactors. The site has been offering gene therapy fill finish services for both clinical and
commercial products since early 2019. The first stage of the manufacturing expansion is expected to be completed and in operation by the spring
of 2021. Fujifilm is aggressively pursuing growth strategies with both capital investment and in-house development of high-efficiency /
high-productivity new technologies. Sales of 100 billion yen are expected for the CDMO business by the end of fiscal year 2021 ending March
2022. In August 2019, Fujifilm acquired the Biogen (Denmark) Manufacturing ApS facility, which added a significant increase in cell culture
production capacity. Fujifilm is committed to supporting the delivery of new drugs with its customers through stable supply of high-quality
products. The company strives to play a role in the creation of solutions to solve social issues such as responding to unmet medical needs and
contributing to the overall progress of the healthcare industry.
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Event Updates
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Event Updates
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Upcoming Events - Technology
AUTOSPORT ENGINEERING 2020
TE Connectivity (TE) creates electrical interconnect solutions
that help customers solve their future needs for ever smaller,
lighter more rugged motorsport applications. Please visit our
Booth #E621 in Hall 3A, to connect with our motorsport team
and see our latest innovations.
Hosted By : TE
Birmingham - UK
9-10 Jan, 2020
https://www.te.com/usa-en/about-te/events/autosport-engineering-2020.html
PERFORMANCE RACING INDUSTRY (PRI) INDIANAPOLIS 2019
TE Connectivity (TE) offers interconnect parts and solutions that help
withstand the harsh conditions found in the fast moving and competitive
autosport arena. Please visit our distributor’s booth, IS Motorsport #3625 in
the Yellow Hall during PRI Indianapolis tradeshow, to connect with our
autosport experts.
Hosted By : TE
Indianapolis, IN - USA
12-14 Dec, 2019
https://www.te.com/usa-en/about-te/events/pri-indianapolis-2019.html
The 27th Annual Marketing Partner Forum
In January 2020, Marketing Partner Forum visits The Ritz-Carlton Key Biscayne in
Miami, Florida for three days of rigorous education and professional networking at
one of the nation’s most luxurious properties. Conveniently situated near Miami
International Airport (MIA), Key Biscayne is the ideal backdrop for one of the legal
profession’s most revered programs dedicated to law firm profitability and client
development in a dynamic legal services market. Please join us as we continue our
annual examination of critical law firm marketing and client-oriented trends
impacting the business of law.
Hosted By : LEGAL EXECUTIVE INSTITUTE.
Florida, USA
22-24 Jan, 2020
http://www.legalexecutiveinstitute.com/events/the-27th-annual-marketing-partner-forum/
National Conference on Computer Vision, Pattern Recognition,
Image Processing and Graphics
National Conference on Computer Vision, Pattern Recognition, Image Processing and
Graphics aims to bring together researchers and practitioners from the allied areas of
computer vision, graphics, image processing and pattern recognition, in order to promote
community-wide discussions of ideas that will influence and foster continued research in the
field. The conference following topics areas are stereo and 3D vision, active and real-time
vision, industrial vision systems, motion and video analysis, image and video compression,
image and video retrieval, object detection & recognition, and etc.
Hosted By : KLE Technological University
Dharwad, India
22-24 Dec, 2019
http://ncvpripg.kletech.ac.in/
International Conference on Contemporary Issues in Engineering,
Technology, Computers & Applied Sciences (CITA)
Artificial Intelligence is based on the research of fundamental and applied sciences. Through
the evolution of information and engineering, it has gradually penetrated and changed not
only ourlives but our work style, which has resulted in bringing new experiences and
convenience. AI is creating a new economy and a new business model. It is changing how we
work and how we communicate. At this conference, we will cover AI strategy,
implementation, and various use cases in the industry. And we will touch on AI technology
from Autonomous-Driving to Computer Visioning, Face Recognition, RPA and other trending
technologies.
Hosted By : Isceas
Singapore
31 Dec, 2019 - 1 Jan, 2020
http://www.isceas.org/
Tenth International Conference on Computer
Applications
The 10th International Conference on Computer Applications ICCA 2020,
aims to bring researchers, scientists, engineers and research scholar together
to exchange and share their experiences, new ideas and the research outcome
of all possible aspects of Computer Applications in Database, Networks,
Telecom and Management. The networking has been experiencing a drastic
development these days; networking is a segment which can’t be operated
specially without the impact of Computer.
Hosted By : India
New Delhi, India
3-4 Jan, 2020
https://confintl.org/icca/
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Connections Summit
Connections Summit creates the opportunities to gain C-level insights and make
some connections of your own with leading companies in the digital living space.
International research firm Parks Associates presents consumer and industry trends,
new business models and technologies, and growth opportunities for companies
developing products and services for the digital home. Hear groundbreaking
research on connected devices and Smart TV, digital content and multiple platforms,
value-added services and new roles for service providers, and strategies for
monetizing it all.
Hosted By :Parkassociations
Las Vegas, USA
7 Jan, 2020
http://www.parksassociates.com/events/connections-summit
African Electronics, Computer and Communication Conference
2020 2nd African Electronics, Computer and Communication
Conference (AECCC 2020) will take place in Rabat, Morocco during
January 6-8, 2020. It is co-sponsored by International University of
Leadership, Private International Institute of Management and
Technology and International Association of Computer Science and
Information Technology.
Hosted By : AECCC
Rabat, Morocco
6-8 Jan, 2020
http://aeccc.org/
International Symposium on Artificial Intelligence and
Mathematics (ISAIM)
The International Symposium on Artificial Intelligence and
Mathematics is a biennial meeting that fosters interactions between
mathematics, theoretical computer science, and artificial intelligence.
The series was started by Martin Golumbic, Peter L. Hammer and
Frederick Hoffman in 1990, and the editorial board of the Annals of
Mathematics and Artificial Intelligence serves as the permanent
Advisory Committee.
Hosted By : ISAIM.
Fort Lauderdale, USA
6-8 Jan, 2020
http://isaim2020.cs.ou.edu/
International Conference on Recent Trends in Computer Science and
Electronics
The 5th Annual International Conference on Recent Trends in Computer Science and
Electronics (RTCSE® 2020) will be held from January 7th (Tuesday) to January 9th
(Thrusday) at the University of Hawaii (Manoa campus) in Honolulu, Hawaii on the
island of Oahu ("the gathering place"), home to about two-thirds of the population of
the U.S. state of Hawaii.
Hosted By : rtcse
Hawaii, USA
7-9 Jan, 2020
http://www.rtcse.org/
Heber International Conference on Applied Actuarial Science,
Mathematics, Management and Computer Science
The Heber International Conference on Applied Actuarial Science, Mathematics,
Management and Computer Science aims to provide a forum for researchers,
educators, students, and industries exchange ideas, to communicate and discuss
research findings and new advancements in mathematics and statistics, and to
explore possible avenues to foster academic and student exchanges, as well as
scientific activities within the region.
Hosted By : HICAAMMC
Tiruchirappalli, India
9-10 Jan, 2020
http://bhc.edu.in/HICAAMMC2020/
International Conference On Communication Systems And
Networks
International Conference On Communication Systems And Networks is a
premier international conference dedicated to advances in Networking and
Communications Systems. The conference will include a highly selective
technical program consisting of submitted papers, a small set of invited
papers on important and timely topics from well-known leaders in the field,
and poster session of work in progress.
Hosted By : comsnets
Bengaluru, India
7-11 Jan, 2020
https://www.comsnets.org/
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International Conference on Information
Management and Processing
ICIMP is the conference aimed at presenting current research about Information Management
and Processing. The idea of the conference is for the scientists, scholars, engineers and
students from the Universities all around the world and the industry to present ongoing
research activities, and hence to foster research relations between the Universities and the
industry. This conference provides opportunities for the delegates to exchange new ideas and
application experiences face to face, to establish business or research relations and to find
global partners for future collaboration.
Hosted By : ICIMP
London, UK
9-10 Jan, 2020
http://www.icimp.org/
International Conference On Science Technology And Management
The primary goal of the conference is to promote research and developmental
activities in Science Technology and Management. Another goal is to promote
scientific information interchange between researchers, developers, engineers,
students, and practitioners working in and around the world. The conference will be
held every year to make it an ideal platform for people to share views and
experiences in Science Technology and Management related areas.
Hosted By : iastem
Madrid, Spain
10-11 Jan, 2020
http://iastem.org/Conference2019/UK/5/ICSTM/
International Conference on Mathematics, Statistics & Computer Science
International Conference on Mathematics, Statistics & Computer
Science features illustrations on the topics of Pure Mathematics,
Applied Mathematics, Statistics, Applied Statistics, Operations
Research, Computer Science, Information Technology and much
more.
Hosted By : IMRF
Dubai, UAE
10-11 Jan, 2020
https://www.imrfedu.org/icmscdubai
International Conference On Computer Networks and Information Technology
(ICCNIT)
International Conference On Computer Networks and
Information Technology will will feature peers sharing best
practices, open roundtable discussions, and networking
opportunities, all while discussing the hottest topics in human
resources.
Hosted By : Innovative Research Publication
Pattaya, Thailand
10-11 Jan, 2020
http://www.icrcnit.com/#one
Innovations in Theoretical Computer Science Conference
Theoretical computer science has produced a remarkable wealth of
beautiful ideas with tremendous impact on computer science and
beyond. Some of the most powerful contributions, such as P versus
NP, pseudo randomness, zero-knowledge proofs, PCP, quantum
computers, boosting, etc, represent not only major technical
breakthroughs, but also distill fundamental computational concepts
and make deep connections between different fields and areas.
Hosted By : ITCS
Seattle, USA
12-14 Jan, 2020
http://itcs-conf.org/
International Conference on Networking and Computer
Application
The International Conference on Networking and Computer
Application will provide an opportunity for informal, interactive
presentation and discussion of diverse topics in the field of
Research Science and Technology.
Hosted By : Innovative Research Publication
Bangkok, Thailand
13-14 Jan, 2020
http://www.icrnca.com/
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