This document discusses designing high-performance computing (HPC) facilities for next-generation HPC systems. It notes trends towards increasing cores and threads per chip, improving power efficiency through process improvements and integration. The document presents data showing declining floor space needs per petaflop, from 171 sqm/PF in 2012 to an estimated 1.5 sqm/PF for the planned Aurora system in 2018. It also estimates the floor space and power required to build a 33 PF system with today's #1 performance would be around 50 sqm and 2.4 MW using very high density racks, or 100 sqm using 50% lower density racks.

1. HPCFacility:Designingfornext
generationHPCsystemsRamkumar Nagappan
System Architect
Technical Computing Group System Architecture and Pathfinding
Intel
May 11, 2015
6th European workshop on HPC centre infrastructures, Stockholm, Sweden

2. INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR
OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS
OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING
TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE,
MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
UNLESS OTHERWISE AGREED IN WRITING BY INTEL, THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED FOR ANY APPLICATION IN WHICH THE
FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL INJURY OR DEATH MAY OCCUR.
Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics
of any features or instructions marked "reserved" or "undefined." Intel reserves these for future definition and shall have no responsibility whatsoever for
conflicts or incompatibilities arising from future changes to them. The information here is subject to change without notice. Do not finalize a design with
this information.
The products described in this document may contain design defects or errors known as errata which may cause the product to deviate from published
specifications. Current characterized errata are available on request.
This document contains information on products in the design phase of development.
All products, computer systems, dates, and figures specified are preliminary based on current expectations, and are subject to change without notice.
Intel product plans in this presentation do not constitute Intel plan of record product roadmaps. Please contact your Intel representative to obtain Intel’s
current plan of record product roadmaps.
Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as
STREAM , NPB, NAMD and Linpack, are measured using specific computer systems, components, software, operations and functions. Any change to any
of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your
contemplated purchases, including the performance of that product when combined with other products.
Intel does not control or audit the design or implementation of third party benchmarks or Web sites referenced in this document. Intel encourages all of
its customers to visit the referenced Web sites or others where similar performance benchmarks are reported and confirm whether the referenced
benchmarks are accurate and reflect performance of systems available for purchase.
Relative performance is calculated by assigning a baseline value of 1.0 to one benchmark result, and then dividing the actual benchmark result for the
baseline platform into each of the specific benchmark results of each of the other platforms, and assigning them a relative performance number that
correlates with the performance improvements reported.
Intel, Xeon and the Intel logo are trademarks of Intel Corporation in the U.S. and other countries.
*Other names and brands may be claimed as the property of others
Copyright © 2014 Intel Corporation. All rights reserved.
Notices
2

3. OptimizationNoticeOptimization Notice
Intel's compilers may or may not optimize to the same degree for non-Intel microprocessors for
optimizations that are not unique to Intel microprocessors. These optimizations include SSE2, SSE3,
and SSE3 instruction sets and other optimizations. Intel does not guarantee the availability,
functionality, or effectiveness of any optimization on microprocessors not manufactured by Intel.
Microprocessor-dependent optimizations in this product are intended for use with Intel
microprocessors. Certain optimizations not specific to Intel microarchitecture are reserved for Intel
microprocessors. Please refer to the applicable product User and Reference Guides for more
information regarding the specific instruction sets covered by this notice.
Notice revision #20110804
* Other names and brands may be claimed as the property of others. Copyright © 2014 Intel
Corporation. All rights reserved.

4. Agenda
• Exponential Growth in Performance
• Trends
• Cores & Threads
• Power Efficiency
• Process Improvement
• Integration to increase system performance
• I must need a huge datacenter –right?
• Quick Survey
• How many Square Meter/PFlop?
• Past, Present & Future
• Power Delivery Challenges in the Horizon
• Technologies to measure component/node power
• Summary
4

5. ExponentialGrowthinPerformance
Advancement in key areas to
reach Exascale:
• Microprocessors
• Fabrics
• Memory
• Software
• Power Management
• Reliability
5
Source:Top500.org

6. Trends:CoresandThreadsperChip
6
Source: SICS Multicore Day’ 14

7. 7
Source: SICS Multicore Day’ 14

8. 8
Source: SICS Multicore Day’ 14

9. 9

10. More Integration
3+ TFLOPS1
In One Package
Parallel Performance & Density
On-Package Memory:
 up to 16GB at launch
 5X Bandwidth vs DDR47
Compute: Energy-efficient IA cores2
 Microarchitecture enhanced for HPC3
 3X Single Thread Performance vs Knights Corner4
 Intel Xeon Processor Binary Compatible5
 1/3X the Space6
 5X Power Efficiency6
.
.
.
.
.
.
Integrated Fabric
Intel® Silvermont Arch.
Enhanced for HPC
Processor Package
Source:SC’14
…
Knights Landing
(Next Generation Intel® Xeon Phi™
Products)
Jointly Developed with Micron Technology
System level benefits in cost, power, density, scalability & performance

11. HigherPerformance&Density
A formula for more performance….
advancements in CPU architecture
 advancements in process technology
 integrated in-package memory
 integrated fabrics with higher speeds
 switch and CPU packaging under one roof
 all tied together with silicon photonics
= much higher performance & density
11

12. Agenda
• Exponential Growth in Performance
• Trends
• Cores & Threads
• Power Efficiency
• Process Improvement
• Integration to increase system performance
• I must need a huge datacenter –right?
• Quick Survey
• How many Square Meter/PFlop?
• Past, Present & Future
• Power Delivery Challenges in the Horizon
• Technologies to measure component/node power
• Summary
12

13. Imustneedahugedatacenter–Right?
13

14. QuickSurvey
In what year, do you expect to see “rack” level
performance exceed 1 PF?
a) 2016
b) 2018
c) 2020
d) 2022
14
Note: 2018 is not an
official Intel projection

15. Designingforthefuture
What does “Large” mean?
A great example of reduced footprint with an equal
performance:
15
Credit: Thanks to LRZ -
Helmut Satzger for the
video
https://www.youtube.com/watch?v=qirUUlXR6XQ

16. 16

17. How many Sq mt Per PFlop?
System
Feature
LRZ Phase 1
Details
Year
2012
Performance
Pflop/s
3.2
# of Nodes
9216
Power
2.3 MW
Facility area
for Compute
Clusters
~546 sq
mt
How many Sq
mt Per PFlop
171
LRZ SuperMUC System
Source: lrz.de

18. How many Sq mt Per PFlop?
System
Feature
LRZ Phase 1
Details
LRZ Phase 2
Details
Year
2012 2015
Performance
Pflop/s
3.2 3.2
# of Nodes
9216 3096
Power
2.3 MW 1.1 MW
Facility area
for Compute
Clusters
~546 sq
mt
~182 sq
mt
(*Estimated)
How many Sq
mt Per PFlop
171 57
LRZ SuperMUC System
Source: lrz.de
Phase 2
Phase 1

19. How many Sq mt Per PFlop?
System
Feature
LRZ Phase 1
Details
LRZ Phase 2
Details
Trinity
Details
Year 2012 2015 FY 2015/16
Performance
Pflop/S
3.2 3.2 42.2
# of Nodes 9216 3096 >19,000
(Haswell, KNL)
Power 2.3 MW 1.1 MW < 10 MW
Facility area
for Compute
Clusters
546 sq mt ~182 sq mt
(*Estimated)
< 483 sq mt
How many Sq
mt Per PFlop
171 57 11.4
LRZ SuperMUC System
Source: lrz.de trinity.lanl.gov
Phase 2
Phase 1

20. How many Sq mt Per PFlop?
System
Feature
LRZ Phase 1
Details
LRZ Phase 2
Details
Trinity
Details
Aurora Details
Year 2012 2015 FY 2015/16 2018
Performance
Pflop/S
3.2 3.2 42.2 180
# of Nodes 9216 3096
(Haswell)
>19,000
(Haswell,
KNL)
>50,000
KNH
Power 2.3 MW 1.1 MW < 10 MW 13 MW
Facility area
for Compute
Clusters
~546 sq mt ~182 sq mt
(*Estimated)
< 483 sq mt ~279 sq mt
How many Sq
mt Per PFlop 171 57 11.4 1.5
Source: lrz.de
LRZ SuperMUC System
Phase 2
Phase 1
Past 2015/16 Future
Note: not an official Intel
projection

21. Significant improvement in Power efficiency
System
Feature
LRZ Phase
1 Details
LRZ Phase
2 Details
Trinity
Details
Aurora
Details
Year 2012 2015 FY
2015/16
2018
Performan
ce -Pflop/s
3.2 3.2 42.2 180
# of Nodes 9216 3096 >19,000
(Haswell,
KNL)
>50,000
Power 2.3 MW 1.1 MW < 10 MW 13 MW
System
Power
Efficiency
(GFlops/W
att)
1.4 2.9 4.2 13.8
LRZ SuperMUC System
Past 2015/16 Future
Source: lrz.de
Phase 2
Phase 1
Note: not an official Intel
projection

22. 33 PF (#1 now) System in 2018 timeframe
•What is the floor space and power required to
build today’s No.1 System in Top 500 list in
2018?

23. 33 PF (#1 now) System in 2018 timeframe
• What is the floor space and power required to build today’s No.1
System in Top 500 list in 2018
• Based on earlier projections/estimations
• Very High Density
• Facility area for Compute Clusters is ~50 Sq mt
• Power – ~2.4 MW
Very High
Density

24. 33 PF (#1 now) System in 2018 timeframe
• What is the floor space and power required to build today’s No.1
System in Top 500 list in 2018
• Based on earlier projections/estimations
• Very High Density
• Facility area for Compute Clusters is ~50 Sq mt
• Power – ~2.4 MW
• If we assume lower rack density
• 50% lower rack density – High Density
• Facility area for Compute Clusters is 100 Sq mt
Very High
Density
High
Density

25. 33 PF (#1 now) System in 2018 timeframe
• What is the floor space and power required to build today’s No.1
System in Top 500 list in 2018
• Based on earlier projections/estimations
• Very High Density
• Facility area for Compute Clusters is ~50 Sq mt
• Power – ~2.4 MW
• If we assume lower rack density
• 50% lower rack density – High Density
• Facility area for Compute Clusters is 100 Sq mt
• 75% lower rack density – High to Medium Density
• Facility area for Compute Clusters is 200 Sq mt
Do we still need a large data center?
High
Density
Very High
Density
Medium
Density

26. I must need a huge data center – Right?
26
• Facility area for Compute Cluster does
not have to be huge.
• Don’t forget
• If Storage is going to be large then
you will need additional floor space.
• If you are going to be using Xeon
instead of Xeon Phi then you may
need additional floor space.

27. HighDensityDatacenter-Challenges
• Performance density
• PF / rack – smaller HPC floor space
• Weight density
• 500 lbs/sf ~ 2500 kg/m2 – Likely needed
• Power density
• >100 kW / rack fed with 480Vac or 400Vac feeds
• Pipe size
• ~40 mm to/from each rack
• Ratios – Raised Floor vs Infrastructure Space
• m2/m2 < 1
27

28. Agenda
• Exponential Growth in Performance
• Trends
• Cores & Threads
• Power Efficiency
• Process Improvement
• Integration to increase system performance
• I must need a huge datacenter –right?
• Quick Survey
• How many Square Meter/PFlop?
• Past, Present & Future
• Power Delivery Challenges in the Horizon
• Technologies to measure component/node power
• Summary
28

29. PowerDeliveryChallengesinthehorizon
Maximum Power Cap
• Ex: 10 MW
• Several reasons
• Peak Shedding
• Reduction in renewable energy
Power rate of change
• Ex: Hourly or Fifteen minute average in platform power should not
exceed by X MW.
Controlled Power Ramp up/down
Power Monitoring at Component, Node, Rack/Cabinet, System
29

30. Howtomeasure
node/Componentpower?
30

31. IntelXeon/PhiComponentLevelEnergyMeasurement
31
RAPL (Running Average Power Limit) to Monitor and Limit – CPU and
Memory Power

32. Intel®NodeManager
Power Telemetry
• Total platform power
• Individual CPU,
Memory and Xeon
Phi power domains
Thermal Telemetry
• Inlet & Outlet
Airflow
temperature
• Volumetric
Airflow
Utilization Telemetry
• Aggregate Compute
Utilization per sec
• CPU, Memory and
I/O Utilization
Metrics
Power Controls
• Power limit
during operation
• Power limit
during boot
BMC
Intel® Node Manager
Firmware embedded in PCH’s
“Manageability Engine”
Console (e.g. Intel DCM)
Xeon
Xeon
PCH
(ME)

33. SUMMARY
• Trends
• Continuous growth in Cores & Threads
• Continuous & significant improvement in Power Efficiency
• More Integration to improve performance and efficiency
• Designing for the future
• It’s going to be Large! kg/rack, kW/rack, perf/rack, power ramps and
peak, pipe sizes, m2/m2
• It may get Smaller! Cluster footprint
• Power Challenges in the horizon
• Power Limiting, Power rate of change
• Technologies to measure component and Node power
33

34. 34

35. Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined". Intel
reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The information here is subject to change without notice. Do not finalize a design
with this information.
The products described in this document may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.
Copies of documents which have an order number and are referenced in this document, or other Intel literature, may be obtained by calling 1-800-548-4725, or go to: http://www.intel.com/design/literature.htm
Intel, Intel Xeon, Intel Xeon Phi™, Intel® Atom™ are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States or other countries.
Copyright © 2014, Intel Corporation
*Other brands and names may be claimed as the property of others.
Intel does not control or audit the design or implementation of third party benchmark data or Web sites referenced in this document. Intel encourages all of its customers to visit the referenced Web sites or others where similar
performance benchmark data are reported and confirm whether the referenced benchmark data are accurate and reflect performance of systems available for purchase.The cost reduction scenarios described in this document are
intended to enable you to get a better understanding of how the purchase of a given Intel product, combined with a number of situation-specific variables, might affect your future cost and savings. Nothing in this document should be
interpreted as either a promise of or contract for a given level of costs.
Intel® Advanced Vector Extensions (Intel® AVX)* are designed to achieve higher throughput to certain integer and floating point operations. Due to varying processor power characteristics, utilizing AVX instructions may cause a)
some parts to operate at less than the rated frequency and b) some parts with Intel® Turbo Boost Technology 2.0 to not achieve any or maximum turbo frequencies. Performance varies depending on hardware, software, and system
configuration and you should consult your system manufacturer for more information.
*Intel® Advanced Vector Extensions refers to Intel® AVX, Intel® AVX2 or Intel® AVX-512. For more information on Intel® Turbo Boost Technology 2.0, visit http://www.intel.com/go/turbo
All products, computer systems, dates and figures specified are preliminary based on current expectations, and are subject to change without notice.
Optimization Notice
Intel’s compilers may or may not optimize to the same degree for non-Intel microprocessors for optimizations that are not unique to Intel microprocessors.
These optimizations include SSE2®, SSE3, and SSSE3 instruction sets and other optimizations. Intel does not guarantee the availability, functionality, or effectiveness of any optimization on microprocessors not
manufactured by Intel. Microprocessor-dependent optimizations in this product are intended for use with Intel microprocessors. Certain optimizations not specific to Intel microarchitecture are reserved for Intel
microprocessors. Please refer to the applicable product User and Reference Guides for more information regarding the specific instruction sets covered by this notice.
Notice revision #20110804
Legal Disclaimer
* Other names and brands may be claimed as the property of others. Copyright © 2014 Intel
Corporation. All rights reserved. 35