TULIPP - Energy Efficient Embedded Image Processing:
Architectures, Tools and Operating Systems
Sundance Multiprocessor Technology, Ltd.
Pedro Machado pedro.m@sundance.com
Flemming Christensen Flemming.c@sundance.com
Overview
• Overview
• Hardware Features
• Sensors compatibility
• Software compatibility
• Deep Learning
• Example of an application
• Open software and firmware
• Discussion
This project has received funding from the European
Union’s Horizon 20 20 research and innovation
programme under grant agreement No 688403
Zynq® UltraScale+™ MPSoC devices provide 64-bit Arm A53 processor scalability while combining real-time control with
soft and hard engines for graphics, video, waveform, and packet processing. The target device is the XCZU4EV.
Overview
Hardware Features
TSK-Agri features:
• 15x Digital I/Os [DB9]
• 12x Analogue Inputs [DB9]
• 8x Analogue Outputs [DB9]
• 1x Expansion [SEIC]
• 4x USB3.0 [USB-c]
• 28x GPIO [40-pin GPIO]
The TSK-Agri is compatible with a wide range of sensors.
Depth sensor (up to 20m). Interface USB3.0
Thermal imaging
Interface: Eth
Movidius Neural
Compute Stick
Interface: USB3.0
Sensors compatibility
Compatibility
TSK-Agri compatibility:
• Raspberry PI and Arduino compatible;
• Compatible with most of the Arduino/RPI sensors and actuators;
• 4x USB3.0 ports for interfacing with a wide range of sensors;
• MQTT and OpenCV compatible
• ROS compatible
• ROS2 ready
• HIPPEROS ready
The TSK-Agri will be fully compatible with the
Xilinx xfOpenCV.
• Includes support for the most popular neural
networks including AlexNet, GoogleNet, VGG,
SSD, and FCN.
• Optimized implementations for CNN network
layers, required to build custom neural networks
(DNN/CNN)
Xilinx reVISION stack
Deep learning
Open source software and firmware
Open Source hardware/software and online documentation:
• Open Hardware Repository
https://www.ohwr.org/projects/emc2-dp
• Microsoft Windows/Linux 64-bit SDK
https://github.com/SundanceMultiprocessorTechnology/VCS-1_FM191_Windows_SDK
• FM191 ARM SDK
https://github.com/SundanceMultiprocessorTechnology/VCS-1_FM191_SDK
• FM191 Firmware
https://github.com/SundanceMultiprocessorTechnology/VCS-1_FM191_FW
• EMC2 ROS
https://github.com/SundanceMultiprocessorTechnology/VCS-1_emc2_ros
A custom enclosure was specially designed for
accommodating the TSK-Agri.
Enclosure
Example of an application
Discussion
The TSK-Agri has the following characteristics:
1. Low power consumption (24V@1.1A)
2. High performance
3. Highly compatible with a wide range of commercially
available sensors and actuators
4. Highly optimised for computer vision applications
5. Fully reconfigurable
Questions?
Sundance Multiprocessor Technology, Ltd.
Pedro Machado pedro.m@sundance.com
Flemming Christensen flemming.c@sundance.com

HiPEAC 2019 Workshop - Hardware Starter Kit Agri

  • 1.
    TULIPP - EnergyEfficient Embedded Image Processing: Architectures, Tools and Operating Systems Sundance Multiprocessor Technology, Ltd. Pedro Machado pedro.m@sundance.com Flemming Christensen Flemming.c@sundance.com
  • 2.
    Overview • Overview • HardwareFeatures • Sensors compatibility • Software compatibility • Deep Learning • Example of an application • Open software and firmware • Discussion
  • 3.
    This project hasreceived funding from the European Union’s Horizon 20 20 research and innovation programme under grant agreement No 688403 Zynq® UltraScale+™ MPSoC devices provide 64-bit Arm A53 processor scalability while combining real-time control with soft and hard engines for graphics, video, waveform, and packet processing. The target device is the XCZU4EV. Overview
  • 4.
    Hardware Features TSK-Agri features: •15x Digital I/Os [DB9] • 12x Analogue Inputs [DB9] • 8x Analogue Outputs [DB9] • 1x Expansion [SEIC] • 4x USB3.0 [USB-c] • 28x GPIO [40-pin GPIO]
  • 5.
    The TSK-Agri iscompatible with a wide range of sensors. Depth sensor (up to 20m). Interface USB3.0 Thermal imaging Interface: Eth Movidius Neural Compute Stick Interface: USB3.0 Sensors compatibility
  • 6.
    Compatibility TSK-Agri compatibility: • RaspberryPI and Arduino compatible; • Compatible with most of the Arduino/RPI sensors and actuators; • 4x USB3.0 ports for interfacing with a wide range of sensors; • MQTT and OpenCV compatible • ROS compatible • ROS2 ready • HIPPEROS ready
  • 7.
    The TSK-Agri willbe fully compatible with the Xilinx xfOpenCV. • Includes support for the most popular neural networks including AlexNet, GoogleNet, VGG, SSD, and FCN. • Optimized implementations for CNN network layers, required to build custom neural networks (DNN/CNN) Xilinx reVISION stack Deep learning
  • 8.
    Open source softwareand firmware Open Source hardware/software and online documentation: • Open Hardware Repository https://www.ohwr.org/projects/emc2-dp • Microsoft Windows/Linux 64-bit SDK https://github.com/SundanceMultiprocessorTechnology/VCS-1_FM191_Windows_SDK • FM191 ARM SDK https://github.com/SundanceMultiprocessorTechnology/VCS-1_FM191_SDK • FM191 Firmware https://github.com/SundanceMultiprocessorTechnology/VCS-1_FM191_FW • EMC2 ROS https://github.com/SundanceMultiprocessorTechnology/VCS-1_emc2_ros
  • 9.
    A custom enclosurewas specially designed for accommodating the TSK-Agri. Enclosure
  • 10.
    Example of anapplication
  • 11.
    Discussion The TSK-Agri hasthe following characteristics: 1. Low power consumption (24V@1.1A) 2. High performance 3. Highly compatible with a wide range of commercially available sensors and actuators 4. Highly optimised for computer vision applications 5. Fully reconfigurable
  • 12.
    Questions? Sundance Multiprocessor Technology,Ltd. Pedro Machado pedro.m@sundance.com Flemming Christensen flemming.c@sundance.com