The document outlines a business plan for a next-generation high-performance computing (HPC) environment that focuses on an advanced SSD storage solution. It highlights the evolution of storage technology, introducing a 3D multi-chip package (MCP) with optical interconnects and dual-core processing capabilities. The plan includes a product roadmap categorizing high-end and mid-range solutions with specific processing technologies.

1. HPC: NextGenISSD
Business Plan, April 2014

2. High Performance Compute (HPC) Environment
Application
Execution Environment
Storage
Infrastructure
SSD Arrays
Hive, Pig
OLAP, BI, KD, AI
HDFS
Data Center / IaaS / PaaS
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3. HPC Enterprise SSD Market
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HPC =

4. HPC Enterprise Environment Today
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5. HPC: Storage Technology Evolution
Smart
SSD Array
FPGA
Aided
SSD
Controllers
1 3
42
Server
Clusters
Application Task
Current Generation
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6. HPC Storage: Data Path Today
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7. Smart SSD Array - Today
Bottleneck
BottleneckRohan Hubli

8. HPC: Bottleneck & Limitations
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9. NextGenISSD: 3-D MCP Silicon Photonics Solution
❖ 3D SSD Array with Optical Interconnects (Feasibility:TBD)
❖ Host Connectivity: Optical Transceivers
❖ FLASH Technology: TT-SRAM
❖ On-Board Processing: Dual Core (Core1: FTL, Core2: Compute)
❖ Process Technology: 90-45nm (Logic) + SSD (20nm)
❖ Product Roadmap:
▪ High-End: Dual Core + 3D IC
▪ Mid-Range: Single Core + PCIe + 2D Interposer
Rohan Hubli
3-D Memory
Cache
3-D SSD
3-D MCP

10. THANK YOU
Rohan Hubli