The document summarizes research on modeling fatigue damage in solder joints. It describes modeling a solder bump with cohesive zones at material boundaries. Cyclic loading is applied and damage starts at interfaces with stiff particles, propagating throughout the bump over cycles. The model tracks damage distribution and total damage increase over cycles. As damage accumulates, the bump's stiffness and reaction force decrease. The cohesive zone approach shows promise for modeling fatigue damage evolution in solder joints.