This document proposes a new system called the Chipmate for assembling electronic components onto circuit boards. It aims to improve on existing chipshooter machines that assemble components one by one and are expensive. The Chipmate would use EAP muscle foil technology to align multiple components simultaneously using vibrations, allowing for higher production rates. It would use a 3D camera and real-time software to ensure precise placement. Specifications include handling components up to 300mm wide at once with the potential to cover larger areas. The document discusses current technologies, proposed specifications, working mechanism, stakeholders and development needs to realize the Chipmate concept.

1. Van Haecke Stephanie 1
The technical-economical document.
Project by Van Haecke Stephanie
2011-2012

2. Van Haecke Stephanie 2
Contents
Introduction............................................................................................................................................. 3
Optional information............................................................................................................................... 3
Project fiche............................................................................................................................................. 4
Current systems on the market............................................................................................................... 5
 Panasonic..................................................................................................................................... 5
 Fuji ............................................................................................................................................... 6
 Siemens ....................................................................................................................................... 7
Our system. ............................................................................................................................................. 8
Specifications........................................................................................................................................... 9
Working................................................................................................................................................. 10
Technical composition........................................................................................................................... 11
Stakeholders.......................................................................................................................................... 11
1. Chipset manufracturers......................................................................................................... 11
2. Computer manufracturers .................................................................................................... 11

3. Van Haecke Stephanie 3
Introduction.
The main purpose of this project is to blow fresh life in the EAP muscle foil,
developed by Bayer and Holst.
I’ve thought about many new uses, which are all found in the outers corners
of each category possible. In the end I’ve stumbled upon assembling tiny
particles which vary from constructing printed circuit boards to any other
design which needs high precision.
The Chip-Mate design is only here to optimize the current systems which are
high-end Chip-Shooters which costs massive amounts of money and
operating skills.
Optional information.
The positive side of the improved design is that the Chip-Mate can be
imported to third world countries where they can mass-produce their own
basic computer chipsets for basic education. There is already a design for this
where the chipset is only the length of your thumb. The design is based
around an ARM 700 MHz processor, VideoCore IV GPU, and 128 or
256 megabytes of memory. The design does not include a built-in hard disk or
solid-state drive, instead relying on a SD card for booting and long-term
storage and has one HDMI output and one keyboard input.
This board is intended to run Linux or RISC OS operating system which are both
open source. Also basic calculating programs, render programs, brain games
can be installed on this for kids to learn on. This parts of this mini-computer
only costs up to €20 for the whole set.
Products like this can be easily assembled by Chipmate.

4. Van Haecke Stephanie 4
Project fiche.

5. Van Haecke Stephanie 5
Current systems on the market.
 Panasonic
Panasonic CM402-L, A-type
Year of Manufacture: 2006
Flow Direction: Left to Right
PCB DIMENSIONS: Min 50 mm × 50 mm
Max 510 mm × 460 mm
Number of nozzles - 4 x 8 nozzles
Maximum speed - 0.06 s/chip (60,000 cph)
Space productivity - 9,560 cph/m
Placement accuracy - ±0.05 mm/chip
Component dimensions - 0201 (0603) C, R to L 24 mm × W 24 mm
PCB Exchange Time: 0.9 s (board length: up to 240 mm)
Electric Source: 3-phase AC 200 V ±10 V / AC 400 V ±10 V, 2.5 kVA
Pneumatic Source: 490 kPa, 150 L/min (standard, machine body only)
Dimensions: W - 2,350 mm
D - 2,690 mm
H - 1,430 m
Mass: 3,000 kg (not including collective-exchange cart)
Comes with: 4 changeover tables on wheels

6. Van Haecke Stephanie 6
 Fuji
Applicable Parts: 0603 (0201 in.) to 74 x 74 mm
Max Board Dimension: 705 x 587 mm (23" x 27")
Part Capacity: 80 slots; 160 part types with 8 mm double channel feeders
Allowable Board Warping: ± 1.0 mm
PCB Weight: 1 kg (std), 2 kg (option with roller conveyor)
Height of Pre-mounted Parts: Top: 25.4 mm, Bottom: 25.4 mm
Conveyor Height: 900 mm (std), 950 mm (option)
Board Flow: Left to Right
Voltage: 3-phase 200 V AC
Frequency: 50/60 Hz
Power Consumption: 4.5 kVA
Air Pressure: 0.5 MPa (5 kgf/cm2)
Air Consumption: 200 Nl/min
Environment Temperature (no condensation): 15 à 35°C
Environment Humidity (no condensation): 30 à 80%

7. Van Haecke Stephanie 7
 Siemens
Siemens Siplace 80 S20
Left to Right Flow,
Placements 68.999.473
S/W ver. 407,04
Single conveyor,
2 RV12 heads, 2 Nozzle changers
Number of Placement Heads: 2 Revolver Heads (Vertical)
Number of Gantries: 2
Placement Rate: Max 20,000 components per hour
Placement Accuracy: 90 m, 4 Sigma, 67.5 m, 3 Sigma
Component Vision System: For component recognition.
PCB Vision System: For PCB and bad board marking recognition.
Range of Components: 0402 - LCC 44, inclusive DRAM, BGA, CSP
Component Height: Max. 6 mm
Component Feeder Capacity: 2 feeder stations at each side
Feeder Type: Tape feeders (8 - 32 mm), Stick feeders, Bulk feeders
PCB Changeover Time: 2.5 sec
PCB Transport:
- Inline transport
- Width adjust for PCB's
- 50mm x 50mm to 460mm x 460mmm

8. Van Haecke Stephanie 8
Our system.
Our developed system would only be a success if its capabilities and
functionality dominates the characteristics of its predecessors. The maximum
cap of this lays with the Siemens Siplace X4 at a fire rate of 20.000
components per hour.
Our technology is designed to beat those numbers. The vibrations cause
multiple particles to be aligned at once instead of the traditional one by one
placement. This way the particles don’t have to be presorted in previous
assembly-line processes and can be dumped right on the EAP muscle-foil.

9. Van Haecke Stephanie 9
But still, why would we care to beat those numbers? Simple: Because
technology creates better technology. We would be able to assemble
products at a higher rate, reducing the cost. It will improve the global
economy and the well-being of humanity by providing them with cheap
electronics. Education will be taken to a higher level and it will be available to
anyone, anywhere.
Specifications.
Our system will be provided with a 3 dimensional electronic eye with
recognition software. The connection between the recognition-software and
the EAP muscle foil will be real-time so Chipmate can make any adjustments
when needed to provide the highest precision possible.
The maximum width of the circuit-board to be injected with chips at once will
be 300mm, as this is the maximum width of the roll-to-roll production by Holst.
Although, the circuit board does not have any limits as the board can be
pressed on the electronics multiple times to cover larger areas.
The number of components aligned at once is determined by the frequency
the foil vibrates and the multiple points where the foil can vibrate. The more,
the better, and the more we can optimize our accuracy.
The different types of components that can be aligned are also determined
by the weight of the particle. The heavier a particle, the slower it will move,
but it will be aligned more accurate. Contrary to the lightweight objects, they
will move faster, but imprecise.
Prices will range between €20,000 and €30,000. As these prices are
completely negotiable and depending on different aspects such as size, it’s
hard to stick a steady price-tag on it. Today’s chipshooters cost between
€30,000 and €60,000, our goal is, again, to beat those.

10. Van Haecke Stephanie 10
Working.
On the start of the assembly of the
circuit board, all the components
are dropped at once on the
muscle foil.
The muscle foil will start vibrating in
such way it’s programmed to
match the specific design of the
circuit board.
The aid of a 3D camera adjusts the
position of a single piece where
needed to be aligned perfectly.
These signals are sent to the muscle
foil in real time.
When the particles are aligned in
the shape and position it should be,
the circuit board is then pressed on
the musclefoil with the components
on it. The pins of the particles are
now hooked in the printed circuit
board.
From this point the assembly
continues the traditional way by
going into a soldering bath and
melting the pieces and the circuit
board together.

11. Van Haecke Stephanie 11
Technical composition.
Stakeholders.
Of course we must consider the stakeholders. There must be courses needed
to follow to understand the machine and to operate it. Firms must be
interested in the Chipmate and be open for it.
1. Chipset manufracturers
Intel
ATI
AMD
2. Computer manufacturers
Dell
HP
Apple
Medion
…

12. Van Haecke Stephanie 12
Fin.
The concept of this product is still in development and not yet finalized until
real tests and experiments are done with the EAP musclefoil to check whether
this is possible. We must stay realistic and learn out of our mistakes and
upgrade or tweak where possible. As this will be a very large machine there
will be a lot of time, money and development needed to make this possible.
With the right know-how and specializations this beast could be an
immediate industry-hit.
I’ve enjoyed doing this project and therefore I would like to thank Bayer, Holst
and Howest for your time reading this concept and judging it on a fair way.