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Fifth Level
September 6, 2017
A25 – High-Performance VMEbus SBC with
Intel Xeon D
2
Multicore VMEbus Board based on Intel Xeon D
▪ Up to 32 DDR4 DRAM memory
▪ Intel Xeon D CPU with 4, 8, and 16 cores
▪ 7 years CPU long-term availability
▪ Trusted Platform Module (TPM)
▪ VMEbus interface implemented as FPGA
▪ Versatile front I/O and interface options
3
Flexible Open-Source Solution
▪ VMEbus interface FPGA-based
▪ Future-proof and cost-effective functionality extension
▪ Versatile front I/O
▪ Two USB
▪ Three Gigabit Ethernet
▪ Two RS232 ports at the front
▪ Expandable with an XMC/PMC mezzanine card and a PCI Express Mini Card
▪ Additional front I/O for e.g. graphics, mass storage, further Ethernet
4
Flexible and Future-Proof for High-End Applications
▪ Reliable Solution in High-
Performance Embedded Applications
▪ Industrial Automation
▪ Energy Segment
▪ Long product life-time due to robust
design
▪ -40° C to +60° C
▪ Prepared for coating
▪ Soldered components
▪ Long-term availability of CPU
▪ Future-proof use of open FPGA
interface
▪ Proven reliability in CERN LHC
A25 – High-Performance VMEbus SBC with Intel Xeon D

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A25 – High-Performance VMEbus SBC with Intel Xeon D

  • 1. Textmasterformat bearbeiten ▪ Second Level ▪ Third Level ▪ Fourth Level Fifth Level September 6, 2017 A25 – High-Performance VMEbus SBC with Intel Xeon D
  • 2. 2 Multicore VMEbus Board based on Intel Xeon D ▪ Up to 32 DDR4 DRAM memory ▪ Intel Xeon D CPU with 4, 8, and 16 cores ▪ 7 years CPU long-term availability ▪ Trusted Platform Module (TPM) ▪ VMEbus interface implemented as FPGA ▪ Versatile front I/O and interface options
  • 3. 3 Flexible Open-Source Solution ▪ VMEbus interface FPGA-based ▪ Future-proof and cost-effective functionality extension ▪ Versatile front I/O ▪ Two USB ▪ Three Gigabit Ethernet ▪ Two RS232 ports at the front ▪ Expandable with an XMC/PMC mezzanine card and a PCI Express Mini Card ▪ Additional front I/O for e.g. graphics, mass storage, further Ethernet
  • 4. 4 Flexible and Future-Proof for High-End Applications ▪ Reliable Solution in High- Performance Embedded Applications ▪ Industrial Automation ▪ Energy Segment ▪ Long product life-time due to robust design ▪ -40° C to +60° C ▪ Prepared for coating ▪ Soldered components ▪ Long-term availability of CPU ▪ Future-proof use of open FPGA interface ▪ Proven reliability in CERN LHC