Rubén Peña's CERTS, COURSES, CREDITS, LICENSURES, PROFESSIONAL SKILLS & TRAINING [NEW FORMAT]

1. CERTIFICATIONS COURSES CREDITS LICENSURES & PROFESSIONAL-SKILLS TRAINING
QA / RELIABILITY / TEST / FAILURE-ANALYSIS, STATISTICS, METHODOLOGIES, SPECIFICATIONS & TECHNICAL TRAINING
♦ 5s: Organizing Shared Workspace: Seiri, Seiton, Seisō, Seiketsu & Shitsuke [LM Trained]
♦ Advanced Probability / Statistics; Analysis of Variance (ANOVA) [NJIT Edu]
♦ Analysis/Design of Dynamic Nano/MEMS Systems [NJIT Edu, HP Trained]
♦ Analysis/Design of Electromechanical Assembles/Systems/Networks [NJIT Edu, HP Trained]
♦ ANSI Y14.5M: Geometric Dimensioning & Tolerancing (GD&T) [HP Trained]
♦ DATA-ANALYTICS / DATA-MINING: Correlation Techniques; Factorial & Time Series Analysis; Excel, JMP, MathCAD, Mathematica, MS-Access / Info-Access, Tableau [NJIT, IBM, HP,
Agilent, MicroJet, Lockheed-Martin, Pro-Data Trained]
♦ DMAIC(R): Define, Measure, Analyze, Implement & Control (Realize) [NJIT Edu]
♦ DOE: Design of Experiments; Statistical Sampling Theory; Accelerated LIFE Test [NJIT Edu, HP, MicroJet Trained]
♦ FAILURE-ANALYSIS: QA / ReliabilityTests; Instruments; Inspection;Characterization& Diagnostics Equipment for Failure-Analysisof Products: Sample Preparation; Cross-Sectioning; Dye & Pry;
Red-Dye PenetrationTest; Air/BubbleHe+ LeakTest; Battery Analyzer;Characterization; Chemical Detection & Surface ChemistryAnalysis; Environmental Chambers; IR & Thermal Cameras;
Microscopes; Oscilloscopes;Power Analyzer; ProbingStation;SolderingStation; SpectrumAnalyzer; Thermal Couples; etc.; … Triage / Debug / Troubleshoot / Root-Cause / Reproduce /
Autopsy / Forensic-Analysis / Reports with Corrective-Actions & Conclusions [Agilent, HP, MicroJet, Pro-Data Trained]
♦ FISHBONE ANALYSIS: Cause & Effect Analysis (Ishikawa Diagram) [NJIT Edu]
♦ FIT: Failure in Time Rate – (FIT to MIL-HDBK-217F) [Agilent, HP & Lockheed Trained]
♦ GAGE R&R (“Repeatability & Reproducibility” = “Precision & Accuracy”) [NJIT Edu]
♦ LM21: Lockheed Martin’s Quality Assurance Program [Lockheed-Martin Trained]
♦ MTBF: Mean Time Between Failures; Failure Rate; Bathtub Curve [Agilent, HP & LM Trained]
♦ PATENTS: Creation, Filing & Prosecution activities [HP; NJIT Edu]
♦ PDCA: Plan, Do, Check, Act; Kaizen Methods; Taguchi Methods [NJIT Edu]
♦ PROCESS CONTROL: Gage R&R; X-Bar; R-Bar; Cp / Cpk; ±3σ(6 -sigma) [NJIT Edu, HP, MicroJet Trained]
♦ PROJECT MANAGEMENT CHARTS: Gantt; PERT (Network Diagram); WBS: Work Breakdown Structure; Pareto; Process Control; Cause & Effect (Ishikawa); Stakeholder Analysis Matrix;
Responsibility Assignment Matrix (RACI) [Pro-Data Trained]
♦ QUALITY: Verify Validate Qualify Commission; URS: User Requirement Specs: DQ IQ OQ PQ MQ CQ [HP, Agilent Trained]
♦ REGULATORY LABS: UL NIST NRTL NSF-Intl. [HP, Agilent, Lockheed & Pro-Data Trained]
♦ RELIABILITY: Weibull, Pareto, Gaussian, Trend / Control Charts, Cp / Cpk Charts, 6M, 5Y, etc. [NJIT Edu. HP, Agilent, MicroJet, Pro-Data Trained]
♦ Root-Cause (Fall Out) Analyses / Fault Tree Analyses / Post-Partum Analyses [NJIT Edu]
♦ Stage-Gate: Product Development Cycle [HP Trained]
♦ STANDARDS: ANSI ASTM CE EN IEC IEEE ISO JEDEC MIL-SPEC MIL-STD [HP, Agilent, LM, Pro-Data Trained]
♦ Statistical Principals in Experimental Design: Statistical Models, Test Plans,Test Designs, Test Execution/Management, Data Collection/Analysis [HP, Agilent, Lockheed-Martin, MicroJet,
Pro-Data Trained]
HARDWARE / TOOLS FOR: “VERIFICATION / VALIDATION / QUALIFICATION” VIA “RELIABILITY / QUALITY / TEST / ROOT-
CAUSE ANALYSIS / FAILURE-ANALYSIS / FORENSIC-ANALYSIS & ANALYTICAL-DIAGNOSTICS” TRAINING
General & special purpose: manufacturing, electronic, electro-mechanical, mechanical & environmental test equipment & solutions for analysis, characterization, inspection, measurement,
monitoring, simulation, powering, certifying & commissioning of electro-mechanical, data center, smart mobile, wearable devices, aerospace flight hardware & semi-conductor products &
infrastructure . . . . .
♦ Chemical Detection / Surface Chemistry Analysis (of Organictrace compound molecules & thin-film materials): AES: Aüger Electron Spectroscopy; AFM: AtomicForce Microscopy; CT-
Scan: ComputedTomographyScan; EDS(EDX):Energy-Dispersive X-RaySpectroscopy; ERD: ElasticRecoil Detection; ESCA=XPS: X-Ray Photoelectron/ PhotoemissionSpectroscopy; FTIR:
Fourier Transform InfraRedSpectroscopy; MRI: MagneticResonanceImaging; OP:Optical Profilometry; OES: Optical EmissionSpectrometry; OSM: Optical ShearingMicroscopy; RAMAN:
Raman micro-Spectroscopy; RBS:Rutherford Backscattering Spectroscopy; SEM:Scanning ElectronMicroscopy; SIMS:Secondary IonMassSpectrometry; SONOSCAN:Scanning Acoustic
Microscopy; TEM:TransmissionElectron-Microscopy; ULP:UniScanLaser Profileometry; UV-Vis:Ultraviolet-VisibleSpectroscopy& VisibleSpectrophotometry; XMA: Electron-probe X-Ray
Micro-Analysis; X-RayImagingScan; Alpha Stepper Stylus Profileometer; Contact Angle Meter (measures surface energy& surface tension); Ellipsometer; Ellipsometry; Standard Optical
Microscopes & Digital Microscopes; etc. [IBM, NJIT Edu, HP , Agilent, MicroJet, Lockheed-Martin, Pro-Data Trained]
♦ HARDWARE MECHANICAL TESTS, ENVIRONMENTAL TESTS & WEATHER / CLIMATIC TESTS: Abrasion / Shock / Drop / Tumble / 3-axis Vibration; Accelerated LIFE Test (using the Temperature-
Humidity Model & Arrhenius Model); Acoustic / Tomography / Emission/ Ultrasonic (NDT) Non-Destructive / ball-chain impact Tests of Plastics / Ceramics / Metal-Chassis-Frames /
Enclosures; Air/Bubble Helium(He+) Leak Test; Archival Aging Test; Burn-In of PCB boards Test; Calibration Procedures; Corrosion / Dust / Rain / Salt-Fog Test Chamber; Data
Acquisition Systems; Electric-Magnetic Fields Test; EMI/EMC Test Chamber; Environmental Stress Screening (ESS) Chamber for Pressure / Altitude / Temperature / %R.H.;
Environmental Test Chambers; FaradayCage; Hardware Testers: Schlumberger Analog / Digital / MixedSignal (PCB) Tester & Teradyne L321 / L323 UUT (PCB) Tester; HP / Agilent /
DITMCO: COTS / GOTS / STE Test Consoles; IR & UV Aging Test Chamber & HALT / HASS Chamber … for HALT (Highly Accelerated Life Tests) Testing & HASSTM (Highly Accelerated
Stress Screens) Tests; Liquid Ingress Test; Mass Properties Test; Red-Dye Penetration Test; Space Simulation Test; Static / Dynamic Load Test; Strain Guages; Thermal Couples;
Thermal-Vacuum / Thermal-Cycle / Thermal-Shock Tests; etc. [NJIT Edu, IBM, HP, Agilent, MicroJet, Lockheed-Martin, Pro-Data Trained]
♦ HP 3D STRUCTURED-LIGHT™ LASER-SCANNING: with the HP 3D Z-Camera-Light / Structured Light™ Laser Scanner Pro-S3. [HP & Agilent Trained]
♦ HP MULTI-JET-FUSION™AND METALJET™ 3DPRINTING: Rapid Prototyping via Digital Additive Mfg. using ThermoPlastic Polyurethane (TPU) copolymer powders, CarbonFiber (CF), Glass Fiber
(GF), Polyamide (PA), PolyEthylene Terephthalate (PET); or, Rapid Prototyping via Digital Additive Mfg. using anHP BindingAgent to a Metal Injection Molding (MIM) powdered metal
bed [HP, Agilent, MicroJet, Pro-Data Trained]
♦ MACHINE TOOLS FOR INDUSTRIAL FABRICATION, ADVANCED MANUFACTURING &MACHINING FOR PROTOTYPING &TESTING: CNC Lathe; Drill & Tap press; Gear shaper; Grinding; Hobbing; Hone;
Laser-Ablation & Laser-Cutting; Milling; Planer; Saws; Screw; Shaper; Shear; etc. [NJIT Edu, IBM, HP, Agilent, MicroJet, Lockheed-Martin, Pro-Data Trained]
♦ MANUFACTURING HARDWARE CAPITAL EQUIPMENT: 6-axis Robots; Altino intelligence Robot Car (SAEON); Arduino-IDE/C/C++/Python coding of Robots; Automated Mfg. Tester Robots;
Cold rolling of Al / Cu / Steel; Curing Equipment; Diamond Saw; Dispensing; ESD Control; Excimer Laser-Ablation & Laser-Cutting; Extreme High-Volume Mfg.; He+ Leak Check;
Lamination; Manual Assembly Mfg.; Packaging; Pick-&-Place Surface-Mount PCB Mfg. Robots; Plastic Injection Molding; PLCs; Raspberry-Pi; Reflow/Rework/Repair equipment;
Rotating Machinery (gear boxes, actuators, pneumatics, hydraulic sensors); SCARA Robots; Surface Finish/Coating; T.A.B. Assembly; Walking Beam Assembly; Wave-Solder & Thru-
Hole Mfg.; etc. [IBM, HP, Agilent, MicroJet, Lockheed-Martin, Pro Data Trained]
♦ MECHANICAL METROLOGY / METALLURGICAL / MATERIALS /MACHINING TECHNIQUES: Curve Tracer; Cross-sectioning; Hardness, Tensile & Bend testing; HP-Agilent Linear Interferometers; HP
Dynamic Light-based& HeNe gas Optical Laser measurement-calibration system; HP-Agilent Linear Retroreflector & Optics for opto-mechanical aligning; OES: Optical Emission
Spectrometry; Optical Microscopy; PoDFA: Inclusion Measurement and Quantification Analysis; Sputter Depth Profiling; etc. [NJIT Edu, IBM, HP, Agilent, MicroJet, Pro-Data
Trained]
♦ SEMICONDUCTOR HARDWARE CAPITAL EQUIPMENT: ASML, Applied-Materials, KLA-Tencor, LamResearch, Novellus, Tokyo-Electron, AdvanTest, Perkin-Elmer, Hitachi, Veeco; Nikon, Planar, Dai-
Nippon SCREEN-Semiconductor, Teradyne & Tokyo-Seimitsu… for Semiconductor Processing: (a)Preventionof Contamination & Prevention of Defects; (b) Wafer Preparation; (c)
Wafer Processing: Wet cleans, Photolithography, Gate Oxide,Ionimplantationof Metal layers, Dry Etching; Wet Etching; Plasma Ashing, Thermal treatments , Chemical Vapor Deposition
(CVD), Physical Vapor Deposition (PVD), Molecular Beam Epitaxy(MBE), Electro-Chemical Deposition (ECD)/Electroplating, Chemical-Mechanical Planarization (CMP), Wafer Electrical
Performance Testing, Wafer back-grinding; (d) Wafer Test; (e) Die Preparation: (Wafer mounting; Die DiamondSaw Cutting); (f)Die Interconnect: IC Encapsulation; (g) Device Test;
(h) Device Packaging; (i) I.C. Testing; (j) Hazardous Materials Handling & Disposal. [NJIT Edu, IBM, HP, Agilent, MicroJet, Pro Data Trained]
♦ TEST & MEASUREMENTINSTRUMENTATION –HP/ AGILENT / KEYSIGHT /ANRITSU / AEROFLEX /FLUKE /IFR /JDSU / KEITHLEY / ROHDE-&-SCHWARZ / TEKTRONIX / VIAVI: Arbitrary Waveform Generator;
Battery Analyzer; Break-Out-Box; Cable Tester; Capacitance Meter; Continuous Wave (CW) Counter; Data Acquisition Equipment; Digital & Graphical Strip-Chart Recorders; Digital
Multi-Meter (DMM); Digital Pattern Generator; Digital Volt-Meter (DVM); EMF-Meter; Frequency Analyzer; Frequency Counter; Frequency Synthesizer; Function Generator; Hipot /
Continuity Tester; Infrared (IR) & Thermal ImagingCameras; LCR-Meter; Logic Analyzer; MixedSignal Infinium Oscilloscope; Network Analyzer; Power Analyzer; Power Sensor; Power
Supply; ProbingStation; Pulse / Pattern Generator; RF Power Meter; RF Probe; SamplingScope; Signal Generator; Signal Tracer; SolderingStation; S-Parameter Test Set; Spectrum
Analyzer; Transistor Tester; Wheatstone Bridge; etc. [NJIT Edu, HP, Agilent, MicroJet, Lockheed-Martin, Pro-Data Trained]
SOFTWARE /TOOLS FOR: “DATA-MINING /CODING/SCRIPTING /VERIFICATION/VALIDATION/QUALIFICATION”TRAINING
♦ ADOBE: Acrobat / Editor pro / Creative Suite CS6 [Pro-Data Trained]
♦ APPLE IPHONE: 3GS / 4 / 4S / 5 / 6 / 6S / 7 / 7S / 8 / 8S / 10 / 10S / 11, Apps [NJIT, MicroJet, Lockheed-Martin, Pro-Data Trained]
♦ APPLE IWORK: Keynote, Pages, Numbers [NJIT, MicroJet, Lockheed-Martin, Pro-Data Trained]
♦ APPLE OS: Mac OSX, iOS, Safari [NJIT, MicroJet, Lockheed-Martin, Pro-Data Trained]
♦ AUTOMATED TEST SYSTEMS: HP Quality Center, HP QuickTest Professional, GBIP, VME, cPCI, PXI [NJIT, HP, Agilent, Lockheed-Martin Trained]
♦ CAD 2D/3D: AutoCAD-2000, ANSYS, CADAM / CATIA, Creo Elements/Pro, Creo Parametric, ME30, Pro-Engineer, Solidworks, SDRC I-DEAS, VersaCAD [NJIT edu, IBM, HP,
Agilent, Lockheed-Martin Trained]
♦ CODECS: Audio-Codecs, Video-Codecs
♦ CODING: SQL, Flash, Java, CSS3, PHP, JavaScipt (JQuery), ActionScript, scripts, batch-files & Web-technologies: HTTP, HTML, HTML5, XML, DNS & TCP/IP [NJIT edu, IBM, HP,
Agilent, LM, Pro-Data Trained]

2. ♦ DATA-ANALYTICS / DATA-MINING: Correlation Techniques; Factorial & Time Series Analysis; Excel, JMP, MathCAD, Mathematica, MS-Access / Info-Access, Tableau [NJIT, IBM, HP,
Agilent, MicroJet, Lockheed-Martin, Pro-Data Trained]
♦ FINANCIALS: Quickbooks [Pro-Data Trained]
♦ GOOGLE OS: Android OS 2/3/4/4.2 [Pro-Data Trained]
♦ GOOGLE TOOLS: Apps, Analytics, Chrome [Pro-Data Trained]
♦ HP/MAC: PC/Laptop/Workstation; 3D Printers; 3D-Scanners; InkJet-&-LaserJet Printers/Plotters/Scanners [NJIT, IBM, HP, Agilent, Pro-Data Trained]
♦ MS OFFICE SUITE, SHAREPOINT, PROJECT: Word, Powerpoint, Excel, Visual Basic, macros, pivot tables, data-analytics, data mining [NJIT, IBM, HP, Pro-Data Trained]
♦ RELATIONAL DATABASES: Oracle, Informix, SAP, Teamcenter, EPDM, MySQL, LiveLink, VisualSourceSafe [IBM, HP, Agilent, Lockheed-Martin, Pro-Data Trained]
♦ SOFTWARE FOR TEST STAND CONTROL (OF HW PRODUCTS): APIS IQ-RM (FMEA), Arduino, MATLAB, Simulink, MiniTab, Mathematica, JMP, LabView, Tableau, VXWorks, CVI,
C#/C/C++, Python, UNIX, Linux, X-Windows, LMSTAR [NJIT, IBM, HP, Agilent, Lockheed-Martin, Pro-Data Trained]
♦ WINDOWS: 95 / 98 / NT / 2K / XP / Vista / 7 / 8 / 10; UNIX; LINUX [IBM, HP, Agilent, Lockheed-Martin, Pro-Data Trained]
♦ WIRELESS: Bluetooth, Wi-Fi, Wireless-USB, InfraRed, 802.11, 3G, 4G, 5G [Pro-Data Trained]
STANDARDS TRAINING
♦ ANSI/NEMA C18: Safety Standards for Primary, Secondary & Lithium-Ion Batteries [Lockheed-Martin & Pro-Data Trained]
♦ AS5553/AS6081: Counterfeit Electronic Parts: Avoidance, Detection, Mitigation, & Disposition [Lockheed-Martin Trained]
♦ AS 9100/EN 9100 (Rev.D-2016): QMS: Quality Management System standard model for Quality Assurance in Design, Development, Production, Installation & Servicing for the
Aeronautical/Aviation, Space and Defense industries [Lockheed-Martin Trained]
♦ ASNT TC 1A: Practice, Personnel Qualification & Certification in Non-Destructive Testing [HP Trained]
♦ ASTM D256-10(2018): Standard Test Methods for Determining the Izod Pendulum Impact Resistance of Plastics [HP Trained]
♦ ASTM D638-14: Standard Test Method for Tensile Properties of Plastics [HP Trained]
♦ ASTM D648-18: Standard Test Method for Deflection Temperature of Plastics Under Flexural Load in the Edgewise Position [HP Trained]
♦ ASTM D790-17: Standard Test Method for Flexural Properties of Unreinforced and Reinforced Plastics and Electrical Insulating Materials [HP Trained]
♦ ASTM E566: Practice for Electromagnetic (Eddy-Current) Sorting of Ferrous Metals [Lockheed-Martin Trained]
♦ ASTM F2391-05: Test Method Standard for Measuring Package & Seal Integrity with He+ as Tracer Gas in a Helium Mass Spectrometer [HP Trained]
♦ DoD 3235.1-H: Test & Evaluation of System ‘RAMS’ Reliability, Availability, & Maintainability / Serviceability [Lockheed-Martin Trained]
♦ EMI/EMC: International Regulatory Electro-Magnetic Interference/Compliance (Emissions/Immunity) & Safety Standards Testing [HP & Agilent Technologies Trained]
♦ EN 50130 & EN 61000 & IEC 61000: Electromagnetic Compatibility (EMC) & Environmental Test Methods [Lockheed-Martin Trained]
♦ EN-ISO 9000 & EN 45000: European Quality Assurance Standards [Lockheed-Martin Trained]
♦ ERP: Enterprise Resource Planning / MRP: Materials Requirement Planning / MRP-II: Manufacturing Resource Planning [Pro-Data Trained]
♦ FED STD-209E: Airborne Particulate Cleanliness Classes in Clean Rooms & Clean Zones [HP & Agilent Technologies Trained]
♦ IATA-DGR & ADR: UN3480 – Lithium-Ion battery shipped by themselves (Rechargeable Batteries) [Lockheed-Martin & Pro-Data Trained]
♦ IATA-DGR & ADR: UN3481 – Lithium-Ion battery contained in equipment; or Lithium-Ion batteries packed w/ equipment (Rechargeable Batteries) [LM & Pro-Data Trained]
♦ IEC 60259: Electrotechnology Enclosure Liquid Ingress Testing [HP, Agilent Technologies & Pro-Data Trained]
♦ IEC 60940 & IEC 62132: Electromagnetic Interference (EMI) suppression [Agilent Technologies & Lockheed-Martin Trained]
♦ IEC 61566: Measurement of exposure to radio-frequency Electro-Magnetic Fields – field strength in the frequency range 100 kHz ~ 1 GHz, using the: Biot-Savart law [low
frequency, <106 Hz] & the Hertzian Dipole equations [high frequency, >106 Hz] [Agilent Technologies & Lockheed-Martin Trained]
♦ IEC 62133 / UL 62133: Secondary Cells & Batteries containing Alkaline or other Non-Acid Electrolytes – Safety Requirements for use in Portable Applications [Lockheed-
Martin & Pro-Data Trained]
♦ IEC 62226: Exposure to Electric & Magnetic Fields in the low & intermediate frequency range – Calculating the current density & internal electric field induced in the human body
[Agilent & Lockheed-Martin Trained]
♦ IEC 62233: Measurement methods for Electro-Magnetic Fields with regard to human exposure [Agilent Technologies & Lockheed-Martin Trained]
♦ IEEE 1625-2008: Standard for Rechargeable Batteries in Multi-Cell Mobile Computing Devices [Lockheed-Martin & Pro-Data Trained]
♦ IEEE 1725-2011: Standard for Cellular / Mobile phone Rechargeable Batteries [Lockheed-Martin & Pro-Data Trained]
♦ ISO 05348:1998: Mechanical Vibration & Shock – Mechanical mounting of accelerometers [Lockheed-Martin Trained]
♦ ISO 09000: Quality Mgmt. Systems (Standards) & QA Improvement Plans [HP Trained]
♦ ISO 09001:2015: Quality Management Systems — Requirements (5th Ed.) [Pro-Data Trained]
♦ ISO 10012:2003: Measurement Management Systems -- Requirements for measurement processes & measuring equipment [IBM, Hewlett-Packard, Agilent Technologies,
Lockheed-Martin & Pro-Data Trained]
♦ ISO 14001: Environmental Management Systems (EMS) [Lockheed-Martin Trained]
♦ ISO 14040(2006)/14044(2006): Environmental Management - Life Cycle Assessment - Principles & Framework / Requirements & Guidelines [HP Trained]
♦ ISO 18000 / IEC 18000: Information Technology — Radio Frequency Identification (RFID) for item management
♦ ISO 19011:2011: Guidelines for Auditing Management Systems (AMS) [Lockheed-Martin Trained]
♦ JCGM 100-2008: “Evaluation of Measurement Uncertainty Data” [HP Trained]
♦ MIL Q9858: Quality Program Requirements [Lockheed-Martin Trained]
♦ MIL STD 1629A: Performing Failure Mode, Effects & Criticality Analysis (FMECA) [Lockheed-Martin Trained]
♦ MIL STD 45662: Establish/Maintain Calibration/Quality Procedures to control Accuracy of Test/Measuring Equipment [Lockheed-Martin Trained]
♦ NASA GSFC 431-REF-000370: Performing a FMEA [Lockheed-Martin Trained]
♦ NASA JPL D-5703: Reliability Analysis Handbook [Lockheed-Martin Trained]
♦ NASA PD-ED-1255: Preferred Reliability Practice: Problem Reporting & Corrective Action System (PRACAS) [Lockheed-Martin Trained]
♦ NEMA 250: Environmental Operability Testing of Products with Liquid Ingress [HP Trained]
♦ OHSAS 18001: Occupational Health & Safety Management System [HP Trained]
♦ PMP: Project Management Professional & Global Client Management
♦ SAE J-2929: Electric & Hybrid Vehicle Propulsion Battery System Safety Standard – Lithium-Ion-Based Rechargeable Cells [Lockheed-Martin & Pro-Data Trained]
♦ UL 1642-2015: Standard for Safety of Lithium Batteries [Lockheed-Martin & Pro-Data Trained]
♦ UL 2054: Household & Commercial Batteries [Lockheed-Martin & Pro-Data Trained]
♦ UN/DOT 38.3: UN Transportation Testing for Lithium Cells & Batteries (T1 ~ T8) [Lockheed-Martin & Pro-Data Trained]
CERTIFICATIONS TRAINING
♦ ASQ: Reliability Engineer [CERTIFICATION] ♦ ASQ: Quality Engineer [CERTIFICATION]
♦ NILA: National Institute for Leadership Advancement [CERTIFICATION] ♦ PMP: Project Management Professional [CERTIFICATION]
♦ DESIGN FOR “X” EXCELLENCE: Manufacturability / Reliability / Testability [CERT]♦ SIX SIGMA: Reliable System Design, Manufacturing & Test to Six Sigma (±3) [CERT]
♦ KEPNER-TREGOE: Systematic Failure Analysis /Problem Solving to Root Cause [CERT] ♦ CMMI: Capability Maturity Model Integration (Level 5 – Optimizing) [CERT]
♦ CCNA: CISCO Certified Network Associate [CERTIFICATION] ♦ CCIE: CISCO Certified Internetwork Expert [CERTIFICATION]
♦ CTL: Substitute Teaching License, S.T.E.A.M. & K-12 [CERTIFICATION] ♦ SPC:Capability Tools in Cell, FAB,Continuous Flow, LEAN High-Volume &BatchMfg.Processes [CERT]
♦ LIFEGUARD – AMERICAN RED CROSS: [CERTIFICATION] ♦ FIRST-AID & CPR – AMERICAN RED CROSS: Cardiopulmonary Resuscitation [CERTIFICATION]
♦ CM2-P: Configuration Management-2 Professional [CERTIFICATION] ♦
MANAGEMENT & LEADERSHIP TRAINING
♦ EMPLOYEE ASSESSMENT & CAREER DEVELOPMENT [HP Trained] ♦ MANAGING HUMAN CAPITAL: KEEPING MORAL ROBUST [Stanford Education]
♦ MANAGEMENT OF TECHNOLOGICAL ORGANIZATIONS [Stanford Education] ♦ MANAGING INNOVATION & PRODUCT DEVELOPMENT [Stanford Education]
♦ COMMERCIALIZING SCIENCE & HIGH TECHNOLOGY [Stanford Education] ♦ ENTREPRENEURSHIP IN A TECHNOLOGICAL ENVIRONMENT [Stanford Education]
♦ THE CHALLENGE OF LEADERSHIP [HP Trained] ♦ “HP WAY” VALUES [HP & Agilent Technologies Trained]
♦ SHPE CORPORATE RELATIONS OFFICER [SHPE Silicon Valley Chapter] ♦ SWIM TEAM CAPTAIN [Academic High School, NJ ..&.. Moanalua High School, HI]
♦ CROSS-COUNTRY TEAM MANAGER [NJIT Athletics] ♦
♦ LEADERSHIP BY DESIGN: Using “Design Thinking” to Transform Companies and Careers [Stanford Education]