Dr. David Verbitsky has over 20 years of experience in quality assurance, reliability engineering, and failure analysis. He has worked for various companies in industries such as telecommunications, aerospace, medical devices, and semiconductors. He specializes in root cause failure analysis, reliability improvement, and ensuring regulatory compliance. He has led teams to resolve critical product issues and enhance customer satisfaction. Dr. Verbitsky also has expertise in reliability modeling, statistical analysis, and developing corrective and preventive action plans.

1. Dr. DAVID E. VERBITSKY, CQE
Six Sigma Black Belt Training, Sr. Member of ASQ and IEEE, member of SAE
6 Cactus Court e-mail: deverbitsky@gmail.com
Edison, NJ 08820 phone: (908)754-5025 (res) / (908) 405-8463 (cell)
OBJECTIVE: LEAD POSITION in ROOT CAUSE FAILURE ANALYSIS, RELIABILITY, QUALITY
commensurate with my qualification, capabilities, contributions and professional interests
SUMMARY: Effective and Efficient Quality, Reliability, Failure Analysis, Improvement and Profitability
Engineering/Assurance (SQRIPT); Problem Preventing/Resolving in Highly Demanding Manufacturing and R&D
Environment (DOD/ASM, FDA, ISO, EIA, FCC, FAA, NIST); Result-Oriented Early Reliability/Failure (ERF) Root
Cause Analysis (RCA); Dramatic Reduction of Main Failure Modes, Mechanisms, Root Causes (FMMC) and Losses;
Focused Cost-Efficient Corrective/Preventive/Improvement Actions (CAPA, MRB, FRB, FRACAS, QRSIP); Customer
Satisfaction & Cost Reduction; Systemic FA incl., Six Sigma, Lean, Kaizen, TQM; New Project Review/Qualification;
Risk and Reliability Assessment/Prediction (MTBF, FMECA, FTA, QFD, DMAIC, 8D, 5 Why); Intensive Statistical
Analyses; Reliability & Maintainability Evaluation/Requirements; Incoming Component Qualification (COTS, MOTS,
ASC); US/European/Japanese Experience; FA/Reliability Lab Management; Strong Analytical Skills.
Note: Refer to a section Achievements below as well as to Bio and List of Publications upon request.
TEST, MEASUREMENT and ANALYTICAL TECHNIQUE: Electrical, Optical, Acoustical, RF, Pressure, Thermal
Measurements; Component Characterization (InGaAs LED/PD, SMD, ASICs, FPGA, CMOS, Hybrids, Various Transducers,
Precision R, C, L, filters; PCB, etc.); Physical and Chemical Failure Analysis (SEM-MA-AES, XRD, EDXS, WDXS;
Emission, AAS, IR, UV/VIS Spectroscopy; NDE (XRR, US, IR); Metallography; Qualification Tests (ESS, EST, (H)ALT,
(H)AST, (H)ASS, ESD, Safety; etc.); Built-In-test (BIT).
SOFTWARE SKILLS: MS Excel (w/macros & VBA), Access, Word, PowerPoint, Project, Paint, VISIO; Relex, Statistica,
JMP, Minitab, AT&T-RIN-7; Spice, Stress; Matlab; Visual Basic; LabView, Master Control, FORTRAN 77, CadStar,
Cadence, AutoSketch, QA-C, functional & regression (manual / automated) testing; WinRunner, Robot/Suite, SAS, SQL.
THEORETICAL ANALYTICAL TECHNIQUE: Reliability/Maintainability Prediction (incl., censored truncated life data,
complex hybrid components/systems; Weibull, Lognormal, exponential; Arrhenius); MTBF-part count/stress methods;
FMECA, FTA, DMAIC, 8D; 5 Why; QFD, Block Diagrams; MRB, FRB, FRACAS, CAPA; Practical SPC, ANOVA, DOE;
(H)ALT/HAST modeling; Burn-in Optimization; Database Design/Support.
REGULATORY DOCUMENTS: ISO 9000/13485/14001/14971, AS/QS/TL 9100; MIL-STD/HDBK-Q-
9858/105/210/217/252/338/344/414/454/470/690/721/756/781/785/883/1520/1540/1547/1629/2000/2155/2164/2165/
5400/9858; FDA 820/210/211/510K; ANSI/J-001-003; IPC 610/620; JEDEC/EIA 47/78/22/; IEC/IN
1000/60300/60601/60812/61025/61078; Telcordia 332/357/983; AT&T RIN-7, UL 94/1950.
EXPERIENCE:
Several reliability engineering contracts with highly demanding and visible AMS & TC projects,
including the Lockheed-Martin’s GPS-3 11/2008-current
[refer to RAMS 2009-2013 and SAE-2010-2014 publications and to a section Achievements below for details].
General: Quality, reliability and failure analysis engineering/assurance (SQRIPT) in AS9100, M-S-1543, TL90000
environment. Significantly contributed to smooth vital products’ deployment, manufacturing and service. Performed intensive
risk analysis and noticeably improved supplier and OEM analysis (FMECA, MTBF, FTA). Conducted routine spec, design,
process and product review; on-site audits, vendor control, etc.
Revealed, prevented, resolved serious systemic early SQRIPT problems. S/w and/or system: Possible interference/conflictof
redundant standby and active computers; Remote terminal address (RTA) failure, etc. Parts/Devices/Equipment: Ineffective
packages vs. water ingress (outdoor telecom); Glass bead cracks of Hybrid RF packages; Au over thick Ni plating cracks;
Hybrid trace/resistor delamination due to contamination; Worn out variable resistor due to overuse during RF tuning; Weak
power transistors and amplifiers. Missing/improper validations/verifications: Wrong operating power/protocols; EOS by
bidirectional radio signals; EMI; electrical, software and mechanical incompatibility of water protection, lightening, bio-
resistance of outdoor equipment; wrong vibration test, K level part (re)qualification, etc.
Field, repair and manufacturing data gathering/analysis, monitoring: Significantly improved, systemized, unified,
automated data gathering, processing, analysis and presentation using: MS Excel macros/scripts; SAP and vendors’ DB
capabilities; improved and uniform questionnaires and classificatories.
Supplier performance: Considerably rectified wide-range/diverse SQRIPT/FMECA and raw data presentation by suppliers in
US and oversees per AS-9100/TL-ISO 9000. Generalized respective innovations and prepared papers/presentations.

2. Dr. DAVID E. VERBITSKY, CQE
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Teletronics Technologies Corp (TTC) QA/Reliability engineer 10/2004-10/2008
ASM/FAA instrumentation, data acquisition and telemetric system design and manufacturing (AS9100 certified)
[Refer to RAMS 2007-2013 and to a section Achievements below for details].
* Provided comprehensive reliability support to the main ASM product designs, manufacturing and field use per customer and
government requirements/regulations (M-S-781/810/210; FAA for Boeing 787, F-35, missile flight termination, etc.).
* Performed complex failure / nonconformance analysis; resolved and prevented critical problems; led inter-disciplinary teams
and third party labs/centers; presented FARs to customers; gained their respect and appreciation (M-S-1520/2155; FRACAS).
* Revealed/fixed ERF: Insulation shorts, RF leakages/crosstalks; unbalanced/erratic current driver ASIC; unstable RF parts (filters, VCO
and load shifts); COTS part decapsulation and displacement; tilted RF connector solder joints and grove’s contamination, etc.
* Conducted reliability risk/mitigation per customer ASM requirements; created customized part library using vendors’ and
design data /documentation (MTBF part/stress count; FMECA, FTA; Relex, Excel, Matlab; M-S-1543/217/1629/756).
* Significantly improved assessment accuracy and efficiency, prevented/fixed reliability problems with new designs/processes.
* Planned, oversaw reliability / quality qualification of new projects per customer and gov specs / regulations (incl., B-787).
* Planned and developed reliability/quality corrective/preventive actions (CAPA) and improvement programs (QRSIP).
* Evaluated / certified vendors (PCB, assemblies, metalwork), noticeably improved their performance (M-S-1535/1546).
* Helped with COTS/MOTS component selection; wrote quality documentation per AS 9100 / ISO 9001, performed audits.
* Supported all types of inspections, customer on-site source audits, analyzed data, recommended optimization, GIDEP, etc.
ConvaTec (Bristol-Myers-Squibb) /Quality Engineering- Consultant 06/2003-08/2004
Class1 medical devices,; FDA 820/210/211 /510K; ISO 9000/13485/14971 environment / tasks.
Alepha-EEQE, NJ Quality / Reliability / Component Engineering-consultant 10/2002-06/2003
[Refer to section Achievements below for details].
All R&D and implementation stages: risk analysis & management; nonconformance, noncompliance, complaint &
statistical analysis followed by effective focused CAPA on drug tube complaints, filtering pouches, membranes; pouch
welding, etc.); QSIP; design / process/ test method / Q&R software verification and validation; component and mold
qualification; pre-clinical (bio-compatibility) and calibration administration; SOP writing, FDA/ISO environment, etc.
Globespan, NJ. (Purchased by Conexant. Principal R&D of digital/analog Broadband DSL VLSI CMOS ASIC)
Group Leader/Reliability and Failure Analysis 7/00- 8/02
[Refer to ASTR-2009, SAE-2012 publications and section Achievements below for details].
 Responsible for ~$700mln operational support of reliability, qualification and FA of fabless 0.1um IC (USA and oversees).
 Performed complex failure analysis; resolved critical problems with minimum resources; significantly enhanced principal
contracts; led cross-functional teams; achieved major customer long-term satisfaction (e.g., signal’s edge effect; package, etc.).
 Organized/rectified new product qualifications per JEDEC 48/MIL 883 (HTOL, THB, ESS, ESD, LU, HALT.
 Supported critical customers with part/system reliability and maintainability prediction, requirements, testing and inquiries.
 Closely worked with vendors (chip, packaging, test/FA houses monitoring); dramatically improved their efficiency.
 Performed reliability assessment based on field, test and vendor data (failure rate/modes, Ea, etc.)
 Built test stations, performed intensive testing, ordered test equipment. Conducted statistical evaluation.
 Fulfilled a set of intensive group-leader administrative responsibilities.
Lucent Technologies, NJ. (purchased by VTech; State-of-the-art consumer telephony communications)
Member of Technical Staff: FA, Reliability, Component Evaluation and Test Automation 4/97-7/00
[refer to RAMS-1999-2013, LTC IRF-1999, SAE-2013 publications and section Achievements below for details]
* Saved critical projects & resolved long-term telephone’s failure problems (first digital & analog GHz band phones, answering
sets; classical wired phones, caller ID, etc.); led cross-functional task forces; enhanced yield/reduced returns (~1.5-5 times).
* Revealed, characterized, prioritized, classified 3-5 major subclasses of industry-wide telephony fundamental FMMCs:
audio (AF), radio (RF) and dialing; PCBs and solder joints; missing and irrelevant ERF; proposed reliability models.
* Planned/conducted incoming component evaluation, significantly improved quality & reduced expenses ~20-80%
(microphones, receivers, batteries, ASICs, RF filters, discretes, PCB, ribbon cables, keyboards, key mechanical parts).
* Increased accuracy of reliability and maintainability prediction up to 80% (with major centers; AT&T RIN-7).
* Developed/improved/customized/automated component and system-level test stations (AF, batteries, EST & ESD tests).
* Selected/acquired analytical/ test equipment and software. Interfaced with vendors and third party labs.
** Developed theoretical models of fundamental telephone ERF: AF, RF, dialing; improved PCB and solder models.

3. Dr. DAVID E. VERBITSKY, CQE
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Epitaxx, Inc., NJ. (purchased by JDS Uniphase); State-of-the-art InGaAsP optoelectronic LD LED, PD and modules
for broadband communications). Reliability Engineer 2/95-4/97
[see RAMS2013, IRRW-2006; ASTR-2009 publications and section Achievements below for details].
* Revealed, characterized, classified 3-5 main prevalent LD/LED/PD/module FMMCs: chips (high Id, low Po, “dead”),
assemblies (over/under-bonding; EOS), packages (metal pkg disintegration; fiber misalignment; low robustness/fire resistance-
epoxy encapsulation); irrelevant T&M; ETOS (wrong polarity/test board/insertion; high T of HALT/HASS; customer abuse).
* Completely eliminated major customer complaints worldwide, saved critical (inter)national contracts; dramatically increased
yield based on FA; optimized wafer evaluation and burn-in (EST/ESS) w/o quality compromising; improved reliability test
metrology (ref samples; more accurate test equipment and fixtures; staff training).
* Planned, fixed, conducted product qualification tests per Bellcore/Telcordia 983/M-S-690+ regulations (incl., HALT, HASS).
* Performed intensive statistical quality and reliability analysis (life data, ANOVA, DOE, SPC, Telcordia 332/357/983).
* Conducted design/spec/requirement review with internal departments, customers and vendors.
* Developed several quality procedures for ISO 9001 certification; supervised two technicians;
* Developed cost-effective and efficient field return and manufacturing loss data base using Access and Excel.
* Ordered test equipment; built test stations; prepared manager reliability reports; supervised/trained technicians.
* Revealed non-Arrhenius behavior, estimated true discriminative Ea=f(T), ML/(T, t) of InGaAs components.
KB Electronics, Inc. NY (Relocated to Fl. Design and fabrication of commercial electronic controls for medical and
health care equipment and consumer needs). Senior QA Technician 4/94-2/95
Fulfilled all basic QA functions: incoming, in-process, final inspections, manufacturing audits/monitoring, calibration.
Conducted SPC and FMA; Revealed/fixed several prevalent super-early FMMC: solder/assembly/PCB; incoming
transistors, diodes and transformers early SQRIPT problems; Led ISO 9000 certification (IPC-610/620; M-S-883;
FDA820 adherence);
Andrea Electronics Corp. NY (military aerospace communication equipment).
QC Inspector/Supervisor 2/93-3/94
Fulfilled all basic QA activities including lot submission to Government representatives and release, on-site audit provision,
TQM, FMA; Revealed/fixed several critical/major (super)early FMMCs: assembly, package, audio performance, and
PCBs early SQRIPT problems; Incoming, in-process final inspection; supervised two QC technicians (M-S/Q-
9858/45208/105/2000).
NJIT, Newark, NJ. Lab Assistant. 3/92-2/93
Performed physics, chemical, mechanical and statistical analyses (silicon wafers; metals and alloys; composite
glass/polymer materials). Conducted studies with students, prepared short course and a paper on the subject.

4. Dr. DAVID E. VERBITSKY, CQE
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Diagnostic and Measuring Device R&D and Manufacturing Company. Kishinev, Moldova (former USSR). (Principal
branch of HP-like nation-wide company. application specific demanding precision components, measuring/diagnostic devices
and control systems for aerospace, MIL, health-care, chemical/nuclear, commercial, etc.).
Lead Reliability Engineer, Failure / Nonconformance Analysis Manager 1980-1991
[Refer to publications in the former USSR, PhD thesis and to a section Achievements below for details].
 Responsible for failure analysis addressing stringent military, NIST and FDA equivalent regulations. Established and
governed advanced laboratory of nine professionals.
 Personally conducted major failure analysis and coordinated efforts of multidiscipline task forces. Solved and prevented a
number of critical problems (incl., industry wide), significantly enhanced yield, and reduced R&D cycle of all product
lines.
 Revealed, characterized, classified 3-5 main FMMCs of the prevalent industry-wide ERF:
* Solder and welding joints of fine glass-and enameled insulated wirewound parts;
* Parametric/metrological EF of precision wirewound parts, measuring devices, sensors (pressure, temperature, acoustic,
magnetic transducers and circuitries +) and systems;
* PartPackages:metal/ceramic/epoxyencapsulation:epoxy coating; elastosil-epoxy interaction; outgassing in hermetic packages;
 Conceived and implemented process of systematic complementary hierarchical FA (part of TQM, FRACAS, CAPA);
designed computerized system of FA (repair and complaints) data gathering and analysis (FRACAS like); assisted
reliability director; coordinated task forces with regulatory organizations (AMS, NIST- and FDA-like).
 Substantiated, founded equipped, trained personnel and led a RCA lab (9 professionals and comprehensive electrical,
mechanical, physics and chemical, NDE and DPE analysis).
 Completed PhD study and dissertation, published over 30 papers/patent/presentations.
EDUCATION:
Ph.D. in Technical Sciences/Engineering (EEE equivalent: Integrated Components, Electronic Devices and Control Systems)
(“Early Reliability and Failure Analysis of Special Electronic Components, Devices and Control Systems”). Kishinev
Polytechnic Institute, Moldova (former USSR; reference organizations– Institute of Control Sciences/IPU, USSR/Russian
Academy of Science, Moscow; National Institute of Measuring Devices and Control Systems, St. Petersburg, Russia).
MS in Physics. BS in Special Automated Control Systems (Air Defense). Gorki State University, N. Novgorod, Russia.
Principal Advanced Courses/Conferences: SAP (2010); CMMI and ITAR (2009); Master Control, Relex Studio and
AS9100 (2005-2007); Six Sigma Black Belt training (2004);GMP/CAPA/Risk Analysis, ISO 9000/13485/14971 (2003-2004);
SAS/JUMP, SQL and Software QA/Testing (2002-2003); IRPS-2001; UL1950, Labview; Sarnoff Symposiums; Acoustical
testing; Advanced Soldering; NEPCON; Analytical Chemistry (1992-2000).
PROFESSIONAL ACTIVITIES: Sr. Member of ASQ and IEEE, member of SAE, ASQ Certified Quality Engineer (CQE).
Over 60 papers, presentations and patents are available upon request. (incl., IEEE Aerospace Conference/Big Sky 2015;
RAMS 1999-2013; SAE-2010-2014; ASQ-2003, ASTR-2009, ARS-2008; and IIRW-2006, etc.).

5. Dr. DAVID E. VERBITSKY, CQE
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PROFESSIONAL ACHIEVEMENTS:
Hundreds of revealed, resolved and prevented prevalent critical and catastrophic early safety, quality, reliability,
improvement, profitability, testing (SQRIPT) problems normally due to inherent systemic features, functions, factors, faults
and failures (F7) across technologies, applications, countries. Saved numerous multimillion $ contracts, losses and producer’s
reputations with concurrent significant SQRIPT raise for practically all employers.
Revealed/characterized/classified/prioritized/fixed 3-5 main prevalent new failure modes, mechanisms, root causes (FMMC)
and their derivatives/subclasses total, subtle, hidden, parametric, intermittent, unbalanced/upset/erratic). Revealed unique
relationships between main FMMCs and technological features (materials, parts, electrical and mechanical designs,
processes, s/w, applications, etc.). Rectified/improved qualification, NDE and screening methods and organization.
Provided effective and efficient focused CAPA/SQRIPT. Developed theoretical methodologies, techniques, methods, and
models addressing the abovementioned phenomena/problems: 3-stage systemic early FA (SEFA) methodology; joint
FTA-FMECA-F7, product/project-based organizational P7 classification, which helps asses problem scale and sources
and determine appropriate course of FA-CAPA; several types on F7 interactions; physics and classifications of various
failure types; models of several common electronics technologies; (non)Arrhenius phenomena and (H)ALT/qualification
optimization methodology. Exercised innovative result-oriented accomplished SQRIPT management based on early FA
(RCA). Formalized tailored Pareto-Juran rules; outlined practical unified SQRIPT and SEFA-MAD-CAPA chain
principles Showed that systemic early FA result in a unique combination of SQRIPT associated with reduction of
manufacturing losses, R&D facilitation, high profitability and customer delight.
1. Experimental Root Cause Analysis (RCA) and FA R&D
1.1 Relevant early failure modes, mechanisms and root causes (FMMC), typically 3-5 main subclasses: solder,
welding and bonding joints on PCBs, Hybrids, glass insulated and enameled fine-wire parts, discrete assemblies; bare
multilayer and double/single side PCBs and Hybrid substrates (corrosion, migration, delamination, interlayer joints, etc.);
conformal protecting coating (epoxy and Si elastosil); various measuring devices (pressure/thermal/magnetic/acoustic
transducers, moving coils, +); computers (memory, processor, and power supplies, etc.); telephones (dialing, audio/AF,
radio/RF, batteries, etc.); communication, data acquisition, control equipment/systems (analog/digital/power circuits and
s/f); Si VLSI and discrete parts (package and f/w); InGaAs opto-electronics (chip-, assembly- and package-related
FMMCs); electro-mechanical-magnetic-chemical parts; AF/RF parts (Rx, Tx, filters, multiplexers, etc.); Packages (metal,
ceramic,conformal protecting epoxy and Si elastosil coating); NiCd and Li batteries; connectors and sockets.
1.2 IrrelevantandAbuseFMMCs:TypicallyoccurbecauseofopenFA-CAPAloop. SpecificsourcesofEOSandMOS(powersupply
spikes; unnecessary tight parameter/tests (lightening, fungus, fire resistance; nomenclature, range and/or failure criteria
regardless of products, applications and customers). Power supply V-spikes; LD burn-in / (H)ALT/EST overstressing due
to wrong polarity, high T and lack of FA/POF/RP (see burned fine-wire fuses and InGaAs LD/PD above). FOD in the
transmission oil. Uncontrolled high humidity (open vessel vs. a regular controlled chamber).
1.3 Missing / Test Escapes FMMCs: missing failures/test escapes are shown to follow insufficient
(re)qualification/verification: ASIC/module current drivers at T (process/design shifts); Incomplete parameter range (e.g.,
L=f(F), Usat=f(T), trec=f(T) +); Interference of independent channels; Lot-to-lot drift (internal VLSI/transistor
parameters); Softened ATE failure criterion; Increased field EOS returns (poor LU and ESD qualification); Absent jitter
test (broadband and high speed applications); Ineffective packaging of outdoor TC equipment; Improper vibration test
(wrong Fres); Wrong operating parameters of TC and TM equipment, EMI, software and mechanical incompatibility etc.
1.4 S/wandf/wFMMCs:Redundantstandbyvs.activecomputerconflict;Wrong/misrepresentativepartparameters;Remote terminal
address (RTA) failure; Inadequately robust DSP software; Missing signal edge effect; Wrong spec parameters in ATE; Wrong spec
requirements/conditionsmismatching fieldapplication; etc.
1.5 Test/Screening methods: (a) using functional prototype; (b) non-destructive capacitive methods of conductivity
loss localization; (c) measuring and statistical determination of hidden parametric failures; (d) various special test methods
for application specific components; (e) method of solder iron selection optimization; (f) unified application specific
FMMC database structure and classificatory/catalogues, libraries and database structures as well as auxiliary software
macros and scripts; (g) Application specific library complementing standard Relex software; (e) (H)ALT customization
per FA data.
The above root cause analysis (RCA) and FA R&D revealed unique relationships between ERF, technology,
application and management F5. This allowed developing effective and efficient focused CAPA/SQRIPT, which saved
numerous multimillion $ contracts, significantly improved ERF, facilitated R&D and dramatically reduced various losses.

6. Dr. DAVID E. VERBITSKY, CQE
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2. Theoretical SQRIPT: Revealed, and consistently demonstrated vital importance of practical FA, RP and
POF especially for mass-produced products and vital criticality of early reliability & failures/infant mortality (ERF/IM)
occurring during testing, storage, transportation and beginning of field service. Distinguishedvarietyofsuperficiallysimilarearly
FMMCs previously deemed homogeneous. Proved that prevalent ERF of the modern mass-produced electronics are mostly related to inherent
F7 in contrast to traditionally deemed random causes (e.g., workmanship, ESD, space particles, supplier’s faults, etc.). Showed existence of
unique functional/causal relationships between main FMMCs and technological features, which provide basis for effective
and efficient focused CAPA/SQRIPT and “lessen learned” DB for various product families and applications.
Revealed and substantiated ERF-tailored Juran’s rules, incl., key “~80% similarity” between ERF, manufacturing,
R&D and normal life nonconformities. Discovered, substantiated and characterized several transition groups of
previously considered uniform ERF/IM: normal-early, early, super early and instantaneous failures (NEF, EF, SEF, IF)
thereby detailing/enriching a fundamental reliability bathtub curve.
Developed three-stage systemic early FA (SEFA) methodology based on systematic comprehensive hierarchical
ERF approach, which accommodates, stipulates and applies to all phases of product life cycle more general management
systems: FRACAS, CAPA, TQM, Six Sigma, Lean, Kaizen, Markey vigilance, etc. Presented criteria, rules and
recommendations for application depending on product/project/failure seriousness and specifics.
Developed joint risk analysis FTA-FMECA-F7 technique, which significantly widens understanding of product’s
quality and reliability problems The joint technique combines strengths of both FTA and FMECA and is considering not
only faults and failures, but also fundamental features, functions factors and fixes into a logical, natural unified methodic
approach (F7 concept). Defined and modeled several types on F7 interactions (matching, complementary and mixed);
physics of (super)early (non)degradative; (i)reversible, (i)relevant total, parametric, intermittent and unbalanced ERF.
Presented multifaceted ERF models of several common electronics technologies/phenomena: solder joints of
PCB, Hybrids and microwire wound parts; parametric precision measuring devices and sensors/transducers; telephone’s
dialing, AF and RF F7; chip-, assembly- and package-related InGaAsP optoelectronics; unbalanced/upset/erratic
(i)reversible IF of high speed electronics, etc. Proposed and substantiated a new practical product/project-based P7 failure
classification and three new stress test failure classes, which complement traditional failure classifications. The
classification emphasizes different organizational nature, sources and scale of failures/losses and different ways of their
addressing/tackling. Proposed FMMC-POF-RP based DIS-7 classification, which links ERF modes, mechanism and root
cause with physics, signs, symptoms and typical P7 and F7.
Revealed several specific classical as well as unconventional types of early non-Arrhenius and/or multi-
parametric modified Arrhenius-Eyring- Zhurkov model behaviors (e.g., changing activation energy Ea and Ka of some
complex compounds and alloys as well as a composition of Arrhenius parts). Managed to assess true changing Ea at
different environmental temperature intervals and functional stresses strengthening inspections and testing.
3. Early SQRIPT Management: Numerous times utilized three-stage Systematic Comprehensive Hierarchical ERF
analysis methodology and led interdisciplinary engineering FAB/task forces. Showed that systemic ERF analyses provide
the most effective and efficient tools for rare combination of quality-reliability improvement associated with reduction of
manufacturing losses, accelerated and smoothen R&D and its implementation; high profitability and customer delight.
Substantiated, founded, equipped, trained personnel and led (a) RCA lab (9 professionals and comprehensive electrical,
mechanical, physics and chemical, NDE and DPE analysis); (b) group of five RCA analysts; (c) experimental Hybrid ASIC
manufacturing shop. Organized/rectified (re)qualifications of (a) InGaAsP LD, LED, PD per Telcordia 332/357/983; (b)
broadband VLSI ASIC (re)qualifications per JEDEC 48/MIL 883; (c) test flight instrumentation per DOD, FAA-like and
Boeing’s spec ((H)TOL, (H)ALT, (H)ASS, THB, ESS, ESD, LU, etc.). Organized/rectified/optimized supplier
qualification, performance and monitoring for various product lines / companies / tasks. The above effectively and
efficiently improved early SQRIPT, dramatically improved customer satisfaction, enhanced contracts and competitiveness
concurrently with dramatic reduction of complaints, manufacturing and service losses, field returns, and maintenance
costs and facilitated R&D.
Refer to a full CV, Professional Bio and list of publications for complementary details.