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Compiled by: Prof. G B Rathod
EC Dept., BVM Engineering college.
Email: ghansyam.rathod@bvmengineering.ac.in
Transducers: Thermal Sensors
Outlines
 Definition ofTemperature.
 Metal Resistance versusTemperature Devices
 Thermistors
 Thermocouples
 OtherThermal Sensors
 Design Considerations
 References
Definition of Temperature.
 The materials that surround us and, indeed, of which we are
constructed are composed of assemblages of atoms.
 In presenting a physical picture of thermal energy, we need
to consider the physical relations or interaction of elements
and molecules in a particular material as either solid, liquid,
or gas.
 Thermal Energy
 Solid In any solid material, the individual atoms or
molecules are strongly attracted and bonded to each other, so
that no atom is able to move far from its particular location,
or equilibrium position.
Definition of Temperature.
 Each atom, however, is capable of vibration about it
particular location. We introduce the concept of thermal
energy by considering the molecules’ vibration.
 Consider a particular solid material in which molecules are
exhibiting no vibration; that is, the molecules are at rest.
Such a material is said to have zero thermal energy,WTH =0.
 If we add energy to this material by placing it on a heater, for
example, this energy starts the molecules vibrating about
their equilibrium positions.
 We may say that the material now has some finite thermal
energy,WTH > 0.
Definition of Temperature.
 Liquid If more and more energy is added to the material,
the vibrations become more and more violent as the thermal
energy increases.
 Finally, a condition is reached where the bonding attractions
that hold the molecules in their equilibrium positions are
overcome and the molecules ―break away‖ and move about in
the material.
 When this occurs, we say the material has melted and become
a liquid.
Definition of Temperature.
 Gas Further increases in thermal energy of the material
intensify the velocity of the molecules until finally, the
molecules gain sufficient energy to escape completely from
the attraction of other molecules. Such a condition is
manifested by boiling of the liquid.
 When the material consists of such unattached molecules
moving randomly throughout a containing volume, we say
the material has become a gas.
Definition of Temperature.
 Temperature
 If we are to measure thermal energy, we must have some sort of
units by which to classify the measurement.
 The proper unit for energy measurement is the joules of the
sample in the SI system, but this would depend on the size of the
material because it would indicate the total thermal energy
contained.
 Calibration To define the temperature scales, a set of calibration
points is used; for each, the average thermal energy per molecule is
well defined through equilibrium conditions existing between
solid, liquid, or gaseous states of various pure materials.
Definition of Temperature.
 Thus, for example, a state of equilibrium exists between the
solid and liquid phase of a pure substance when the rate of
phase change is the same in either direction: liquid to solid,
and solid to liquid. Some of the standard calibration points
are
 1. Oxygen: liquid/gas equilibrium
 2.Water: solid/liquid equilibrium
 3.Water: liquid/gas equilibrium
 4. Gold: solid/liquid equilibrium
Definition of Temperature.
 AbsoluteTemperature Scales An absolute temperature
scale is one that assigns a zero temperature to a material that
has no thermal energy, that is, no molecular vibration.There
are two such scales in common use: the Kelvin scale in kelvin
(K) and Rankine (R’)scale in degrees Rankine.
Definition of Temperature.
 The transformation between scales is given by
 RelativeTemperature Scales The relative temperature scales
differ from the absolute scales only in a shift of the zero axis.
Definition of Temperature.
 The quantity of energy represented by 1 degree Celsius is the
same as that indicated by 1 K, but the zero has been shifted in
the Celsius scale, so that
Definition of Temperature.
 Relation to Thermal Energy It is possible to relate
temperature to actual thermal energy in joules by using a
constant called Boltzmann’s constant.
 vTH is velosity of
molecules
Definition of Temperature.
 Example:
Definition of Temperature.
Metal Resistance versus Temperature
Devices
 One of the primary methods for electrical measurement of
temperature involves changes in the electrical resistance of
certain materials.
 In this, as well as other cases, the principal measurement
technique is to place the temperature-sensing device in
contact with the environment whose temperature is to be
measured.
 The two basic devices used are the resistance-temperature
detector (RTD), based on the variation of metal resistance
with temperature, and the thermistor,based on the variation of
semiconductor resistance with temperature.
Metal Resistance versus Temperature
Devices
 Metal Resistance versusTemperature
 A metal is an assemblage of atoms in the solid state in which
the individual atoms are in an equilibrium position with
superimposed vibration induced by the thermal energy.
 As electrons move throughout the material, they collide with
the stationary atoms or molecules of the material.
 When a thermal energy is present in the material and the
atoms vibrate, the conduction electrons tend to collide even
more with the vibrating atoms.
Metal Resistance versus Temperature
Devices
 This impedes the movement of electrons and absorbs some of
their energy; that is, the material exhibits a resistance to
electrical current flow.
 The graph in Figure shows the effect of increasing resistance
with temperature for several metals.
 To compare the different materials, the graph shows the
relative resistance versus temperature.
Metal Resistance versus Temperature
Devices
Metal Resistance versus Temperature
Devices
 Resistance versusTemperature Approximations
 The curves of upcoming Figure cover a large span of
temperature, from about 150°C to about 600°C, or a nearly
750°C span.
 By examining the curves you can see that for smaller ranges
of temperature, say the 100°C span between 100° and
200°C, the curves are nearly linear.
 This observation leads to development of a linear
approximation of the sensor resistance versus temperature.
Metal Resistance versus Temperature
Devices
Metal Resistance versus Temperature
Devices
 The equation of this straight line is the linear approximation
to the curve over the spanT1 toT2 .The equation for this line
is typically written as
Metal Resistance versus Temperature
Devices
 The value of can be found from values of resistance and
temperature taken either from a graph, as given in Figure , or
from a table of resistance versus temperature
0
Metal Resistance versus Temperature
Devices
 Quadratic Approximation A quadratic approximation to
the R-T curve is a more accurate representation of the R-T
curve over some span of temperatures.
Metal Resistance versus Temperature
Devices
 Example.A
Metal Resistance versus Temperature
Devices
Metal Resistance versus Temperature
Devices
 Example-B: Find the quadratic approximation of resistance
versus temperature for the data given in Example . A.
Between 60° to 90° F.
Metal Resistance versus Temperature
Devices
 Example-C:
Metal Resistance versus Temperature
Devices
 Resistance-Temperature Detectors:
 A resistance-temperature detector (RTD) is a temperature sensor that
is based on the principles discussed in the preceding sections; that
is, metal resistance increasing with temperature.
 Metals used in these devices vary from platinum, which is quite
sensitive, and very expensive, to nickel, which is not more
sensitive, and less expensive.
 Signal Conditioning In view of the very small fractional
changes of resistance with temperature (0.4%), the RTD is
generally used in a bridge circuit. Figure 4 illustrates the essential
features of such a system.
Metal Resistance versus Temperature
Devices
 The compensation line in the R3 leg of the bridge is required
when the lead lengths are so long that thermal gradients
along the RTD leg may cause changes in line resistance.
Metal Resistance versus Temperature
Devices-RTD
THERMISTORS
 The thermistor represents another class of temperature
sensor that measures temperature through changes of
material resistance.
 The characteristics of these devices are very different from
those of RTDs and depend on the peculiar behavior of
semiconductor resistance versus temperature.
 Semiconductor Resistance versusTemperature
 In contrast to metals, electrons in semiconductor materials
are bound to each molecule with sufficient strength that no
conduction electrons are contributed from the valence band
to the conduction band.
THERMISTORS
 When the temperature of the material is increased, the
molecules begin to vibrate. In the case of a semiconductor,
such vibration provides additional energy to the valence
electrons. When such energy equals or exceeds the gap
energy.
 As the temperature is further increased, more and more
electrons gain sufficient energy to enter the conduction band.
 It is then clear that the semiconductor becomes a better
conductor of current as its temperature is increased—that is,
as its resistance decreases.
THERMISTORS
THERMISTORS
 Fig:Thermistor resistance versus temperature is highly
nonlinear and usually has a negative slope
THERMISTORS
 Thermistor Characteristics
 A thermistor is a temperature sensor that has been developed
from the principles just discussed regarding semiconductor
resistance change with temperature.
 The particular semiconductor material used varies widely to
accommodate temperature ranges, sensitivity, resistance ranges,
and other factors.
 Sensitivity The sensitivity of the thermistors is a significant
factor in their application. Changes in resistance of 10% per °C
are not uncommon.
 When used in null-detecting bridge circuits, sensitivity this large
can provide for control, in principle, to less than 1 °C in
temperature.
THERMISTORS
 Construction Because the thermistor is a bulk
semiconductor, it can be fabricated in many forms.
 Thus, common forms include discs, beads, and rods, varying
in size from a bead 1 mm in diameter to a disc several
centimeters in diameter and several centimeters thick.
 Range The temperature range of thermistors depends on
the materials used to construct the sensor. In general, there
are three range limitation effects:
 (1) melting or deterioration of the semiconductor, (2)
deterioration of encapsulation material, and (3) insensitivity
at higher temperatures.
THERMISTORS
 Example:
THERMISTORS
THERMOCOUPLES
 There exists another dependence of electrical behavior of
materials on temperature that forms the basis of a large
percentage of all temperature measurement.
 This effect is characterized by a voltage-generating sensor in
which an electromotive force (emf) is produced that is
proportional to temperature. Such an emf is found to be
almost linear with temperature and very repeatable for
constant materials.
 Devices that measure temperature on the basis of this
thermoelectric principle are called thermocouples (TCs).
THERMOCOUPLES
 Thermoelectric Effects:
 The basic theory of the thermocouple effect is found from a
consideration of the electrical and thermal transport properties of
different metals.
 In particular, when a temperature differential is maintained across
a given metal, the vibration of atoms and motion of electrons is
affected so that a difference in potential exists across the material.
 This potential difference is related to the fact that electrons in the
hotter end of the material have more thermal energy than those in
the cooler end, and thus tend to drift toward the cooler end.
THERMOCOUPLES
 This drift varies for different metals at the same temperature
because of differences in their thermal conductivities. If a
circuit is closed by connecting the ends through another
conductor, a current is found to flow in the closed loop.
 The proper description of such an effect is to say that an emf
has been established in the circuit and is causing the current
to flow. Figure a shows a pictorial representation of this
effect, called the Seebeck effect.
THERMOCOUPLES
 Seebeck Effect Using solid-state theory, the aforementioned
situation may be analyzed to show that its emf can be given by an
integral over temperature,
 This equation, which describes the Seebeck effect, shows that the
emf produced is proportional to the difference in temperature and,
further, to the difference in the metallic thermal transport
constants.
THERMOCOUPLES
 Thus, if the metals are the same, the emf is zero, and if the
temperatures are the same, the emf is also zero.
THERMOCOUPLES
THERMOCOUPLES
 Example:
THERMOCOUPLES
 Peltier Effect : An interesting and sometimes useful
extension of the same thermoelectric properties occurs
when the reverse of the Seebeck effect is considered.
 In this case, we construct a closed loop of two different
metals, A and B,as before. Now, however, an external voltage
is applied to the system to cause a current to flow in the
circuit, as shown in Figure b.
THERMOCOUPLES
 Because of the different electrothermal transport properties
of the metals, it is found that one of the junctions will be
heated and the other cooled;that is, the device is a refrigerator!
This process is referred to as the Peltier effect.
 Some practical applications of such a device, such as cooling
small electronic parts, have been employed.
 Thermocouple Characteristics
 To use the Seebeck effect as the basis of a temperature sensor,
we need to establish a definite relationship between the
measured emf of the thermocouple and the unknown
temperature.
THERMOCOUPLES
 Furthermore, every connection of different metals made in
the thermocouple loop for measuring devices, extension
leads, and so on will contribute an emf, depending on the
difference in metals and various junction temperatures.
 To provide an output that is definite with respect to the
temperature to be measured, an arrangement such as shown
in Figure a is used.
THERMOCOUPLES
 This shows that the measurement junction, TM, is exposed to the
environment whose temperature is to be measured. This junction
is formed of metals A and B as shown.
 Two other junctions are then formed to a common metal, C,which
then connects to the measurement apparatus.
 The ―reference‖ junctions are held at a common, known
temperature TR, the reference junction temperature.
 When an emf is measured, such problems as voltage drops across
resistive elements in the loop must be considered.
 In this arrangement, an open-circuit voltage is measured (at high
impedance) that is then a function of only the temperature
difference (TM-TR) and the type of metals A and B.
THERMOCOUPLES
 To use the thermocouple to measure a temperature, the
reference temperature must be known, and the reference
junctions must be held at the same temperature.
 In most industrial environments, this would be difficult to
achieve if the measurement junction and reference junction
were close.
 It is possible to move the reference junctions to a remote
location without upsetting the measurement process by the
use of extension wires,as shown in Figure b.
 A junction is formed with the measurement system, but to
wires of the same type as the thermocouple.
THERMOCOUPLES
 Thermocouple Types Certain standard configurations of
thermocouples using specific metals (or alloys of metals) have
been adopted and given letter designations; examples are
shown inTable 2.
THERMOCOUPLES
 Fig: These curves of thermocouple voltage versus
temperature for a 0°C reference show the different
sensitivities and nonlinearities of three types.
THERMOCOUPLES
 Thermocouple Polarity The voltage produced by a TC is
differential in the sense that it is measured between the two metal
wires.
 As noted in the footnote to Table., by convention the description
of aTC identifies how the polarity is interpreted.
 A type J thermocouple is called iron-constantan. This means that if
the reference temperature is less than the measurement junction
temperature, the iron will be more positive than the constantan.
 Thus, a type J with a 0°C reference will produce +5.27 mV for a
measurement junction of , meaning that the iron is more positive
than the constantan.
THERMOCOUPLES
 Thermocouple Tables The thermocouple tables simply
give the voltage that results for a particular type of
thermocouple when the reference junctions are at a
particular reference temperature, and the measurement
junction is at a temperature of interest.
 The measured voltage,VM, lies between a higher voltage,VH,
and a lower voltage,VL, which are in the tables.
THERMOCOUPLES
 Thermocouple Sensors:
 Sensitivity A review of the tables shows that the range of
thermocouple voltages is typically less than 100 mV.
 The actual sensitivity strongly depends on the type of signal
conditioning employed and on theTC itself.
 Construction A thermocouple by itself is, of course,
simply a welded or even twisted junction between two
metals, and in many cases, that is the construction.
 There are cases, however, where the TC is sheathed in a
protective covering or even sealed in glass to protect the unit
from a hostile environment.
THERMOCOUPLES
 Reference Compensation A problem with the practical use of
thermocouples is the necessity of knowing the reference
temperature.
 Because the TC voltage is proportional to the difference between
the measurement and reference junction temperatures, variations
of the reference temperature show up as direct errors in the
measurement temperature determination. The following
techniques are employed for reference junction compensation:
 1. Controlled temperature reference block In some cases,
particularly when many thermocouples are in use, extension wires
bring all reference junctions to a temperature-controlled box in
the control room.
THERMOCOUPLES
 2. Reference compensation circuits The modern approach to
reference correction is supplied by specialized integrated circuits
(ICs) that add or subtract the correction factor directly to the TC
output.
 These ICs, which are called cold junction compensators or ice point
compensators, are actually temperature sensors themselves that
measure the reference junction temperature.
 The ICs include circuitry that provides a scaled correction voltage,
depending on the type ofTC being used.
 Upcoming Figure shows a block diagram of how the compensator
is used.
 The actual reference junctions are at the connection to the IC, so
the IC temperature is the reference temperature.
THERMOCOUPLES
 3.Software reference correction: In computer-based
measurement systems, the reference junction temperature
can be measured by a precision thermistor or another IC
temperature sensor and provided as an input to the
computer.
 Software routines then can provide necessary corrections to
the thermocouple temperature signal that is also an input to
the computer.
THERMOCOUPLES
 To use thermocouples effectively in industry, a number of noise reduction
techniques are employed.The following three are the most popular:
 1. The extension or lead wires from the thermocouple to the reference junction
or measurement system are twisted and then wrapped with a grounded foil
sheath.
 2. The measurement junction itself is grounded at the point of measurement.
The grounding is typically to the inside of the stainless steel sheath that covers
the actual thermocouple.
 3. An instrumentation amplifier that has excellent common-mode rejection is
employed for measurement.
OTHER THERMAL SENSORS:
 OTHERTHERMAL SENSORS:
 The sensors discussed earlier cover a large fraction of the
temperature measurement techniques used in process
control.
 Bimetal Strips
 This type of temperature sensor has the characteristics of
being relatively inaccurate, having hysteresis, having relatively
slow time response, and being low in cost.
 Such devices are used in numerous applications, particularly
where an ON/OFF cycle rather than smooth or continuous
control is desired.
OTHER THERMAL SENSORS:
 Thermal Expansion We have seen that greater thermal
energy causes the molecules of a solid to execute greater-
amplitude and higher-frequency vibrations about their
average positions.
 It is natural to expect that an expansion of the volume of a
solid would accompany this effect, as the molecules tend to
occupy more volume on the average with their vibrations.
 This effect varies in degree from material to material because
of many factors, including molecular size and weight, lattice
structure, and others.
OTHER THERMAL SENSORS:
 The temperature is raised to a new value, T,the rod will be
found to have a new length, l,given by
 where DeltaT= T – To and gamma is the linear thermal
expansion coefficient appropriate to the material of which
the rod is produced. Several different expansion coefficients
are given inTable .
OTHER THERMAL SENSORS:
 FIGURE : A bimetal strip will curve when exposed to a
temperature change because of different thermal expansion
coefficients. Metal thickness has been exaggerated in this
view.
OTHER THERMAL SENSORS:
 Bimetallic Sensor The thermal sensor exploiting the effect
discussed previously occurs when two materials with grossly
different thermal expansion coefficients are bonded together.
 Thus, when heated, the different expansion rates cause the
assembly curve shown in last Figure . This effect can be used
to close switch contacts or to actuate an ON/OFF
mechanism when the temperature increases to some
appropriate setpoint.
 The effect also is used for temperature indicators, by means
of assemblages, to convert the curvature into dial rotation.
OTHER THERMAL SENSORS:
 Example:
OTHER THERMAL SENSORS:
 GasThermometers:
 The operational principle of the gas thermometer is based on
a basic law of gases. In particular, if a gas is kept in a
container at constant volume and the pressure and
temperature vary, the ratio of gas pressure and temperature is
a constant:
OTHER THERMAL SENSORS:
 Example:
OTHER THERMAL SENSORS:
 Vapor-PressureThermometers :
 A vapor-pressure thermometer converts temperature
information into pressure, as does the gas thermometer, but
it operates by a different process.
 If a closed vessel is partially filled with liquid, then the space
above the liquid will consist of evaporated vapor of the liquid
at a pressure that depends on the temperature.
 If the temperature is raised, more liquid will vaporize, and
the pressure will increase. A decrease in temperature will
result in condensation of some of the vapor, and the pressure
will decrease.
OTHER THERMAL SENSORS:
 Fig:Vapor-pressure curve for methyl chloride.
OTHER THERMAL SENSORS:
 Liquid-ExpansionThermometers :
 Just as a solid experiences an expansion in dimension with
temperature, a liquid also shows an expansion in volume with
temperature. This effect forms the basis for the traditional
liquid in- glass thermometer that is so common in
temperature measurement.
OTHER THERMAL SENSORS:
 Solid-StateTemperature Sensors :
 Many integrated circuit manufacturers now market solid-
state temperature sensors for consumer and industrial
applications.
 These devices offer voltages that vary linearly with
temperature over a specified range. They function by
exploiting the temperature sensitivity of doped
semiconductor devices such as diodes and transistors.
 One common version is essentially a zener diode in which
the zener voltage increases linearly with temperature.
OTHER THERMAL SENSORS:
 Fig: Some solid-state temperature sensors operate like a
zener diode whose voltage depends upon temperature
DESIGN CONSIDERATIONS
 See theTopic No. 7 of the Reference book mention at the
upcoming slide.
Reference
 Curtis D. Johnson.―Process Control Instrumentation
Technology‖, Prentice Hall, 8/E, 2005 ISBN-10:
0131194577 • ISBN-13: 9780131194571
Thank You

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Transducers : Thermal Sensors

  • 1. Compiled by: Prof. G B Rathod EC Dept., BVM Engineering college. Email: ghansyam.rathod@bvmengineering.ac.in Transducers: Thermal Sensors
  • 2. Outlines  Definition ofTemperature.  Metal Resistance versusTemperature Devices  Thermistors  Thermocouples  OtherThermal Sensors  Design Considerations  References
  • 3. Definition of Temperature.  The materials that surround us and, indeed, of which we are constructed are composed of assemblages of atoms.  In presenting a physical picture of thermal energy, we need to consider the physical relations or interaction of elements and molecules in a particular material as either solid, liquid, or gas.  Thermal Energy  Solid In any solid material, the individual atoms or molecules are strongly attracted and bonded to each other, so that no atom is able to move far from its particular location, or equilibrium position.
  • 4. Definition of Temperature.  Each atom, however, is capable of vibration about it particular location. We introduce the concept of thermal energy by considering the molecules’ vibration.  Consider a particular solid material in which molecules are exhibiting no vibration; that is, the molecules are at rest. Such a material is said to have zero thermal energy,WTH =0.  If we add energy to this material by placing it on a heater, for example, this energy starts the molecules vibrating about their equilibrium positions.  We may say that the material now has some finite thermal energy,WTH > 0.
  • 5. Definition of Temperature.  Liquid If more and more energy is added to the material, the vibrations become more and more violent as the thermal energy increases.  Finally, a condition is reached where the bonding attractions that hold the molecules in their equilibrium positions are overcome and the molecules ―break away‖ and move about in the material.  When this occurs, we say the material has melted and become a liquid.
  • 6. Definition of Temperature.  Gas Further increases in thermal energy of the material intensify the velocity of the molecules until finally, the molecules gain sufficient energy to escape completely from the attraction of other molecules. Such a condition is manifested by boiling of the liquid.  When the material consists of such unattached molecules moving randomly throughout a containing volume, we say the material has become a gas.
  • 7. Definition of Temperature.  Temperature  If we are to measure thermal energy, we must have some sort of units by which to classify the measurement.  The proper unit for energy measurement is the joules of the sample in the SI system, but this would depend on the size of the material because it would indicate the total thermal energy contained.  Calibration To define the temperature scales, a set of calibration points is used; for each, the average thermal energy per molecule is well defined through equilibrium conditions existing between solid, liquid, or gaseous states of various pure materials.
  • 8. Definition of Temperature.  Thus, for example, a state of equilibrium exists between the solid and liquid phase of a pure substance when the rate of phase change is the same in either direction: liquid to solid, and solid to liquid. Some of the standard calibration points are  1. Oxygen: liquid/gas equilibrium  2.Water: solid/liquid equilibrium  3.Water: liquid/gas equilibrium  4. Gold: solid/liquid equilibrium
  • 9. Definition of Temperature.  AbsoluteTemperature Scales An absolute temperature scale is one that assigns a zero temperature to a material that has no thermal energy, that is, no molecular vibration.There are two such scales in common use: the Kelvin scale in kelvin (K) and Rankine (R’)scale in degrees Rankine.
  • 10. Definition of Temperature.  The transformation between scales is given by  RelativeTemperature Scales The relative temperature scales differ from the absolute scales only in a shift of the zero axis.
  • 11. Definition of Temperature.  The quantity of energy represented by 1 degree Celsius is the same as that indicated by 1 K, but the zero has been shifted in the Celsius scale, so that
  • 12. Definition of Temperature.  Relation to Thermal Energy It is possible to relate temperature to actual thermal energy in joules by using a constant called Boltzmann’s constant.  vTH is velosity of molecules
  • 15. Metal Resistance versus Temperature Devices  One of the primary methods for electrical measurement of temperature involves changes in the electrical resistance of certain materials.  In this, as well as other cases, the principal measurement technique is to place the temperature-sensing device in contact with the environment whose temperature is to be measured.  The two basic devices used are the resistance-temperature detector (RTD), based on the variation of metal resistance with temperature, and the thermistor,based on the variation of semiconductor resistance with temperature.
  • 16. Metal Resistance versus Temperature Devices  Metal Resistance versusTemperature  A metal is an assemblage of atoms in the solid state in which the individual atoms are in an equilibrium position with superimposed vibration induced by the thermal energy.  As electrons move throughout the material, they collide with the stationary atoms or molecules of the material.  When a thermal energy is present in the material and the atoms vibrate, the conduction electrons tend to collide even more with the vibrating atoms.
  • 17. Metal Resistance versus Temperature Devices  This impedes the movement of electrons and absorbs some of their energy; that is, the material exhibits a resistance to electrical current flow.  The graph in Figure shows the effect of increasing resistance with temperature for several metals.  To compare the different materials, the graph shows the relative resistance versus temperature.
  • 18. Metal Resistance versus Temperature Devices
  • 19. Metal Resistance versus Temperature Devices  Resistance versusTemperature Approximations  The curves of upcoming Figure cover a large span of temperature, from about 150°C to about 600°C, or a nearly 750°C span.  By examining the curves you can see that for smaller ranges of temperature, say the 100°C span between 100° and 200°C, the curves are nearly linear.  This observation leads to development of a linear approximation of the sensor resistance versus temperature.
  • 20. Metal Resistance versus Temperature Devices
  • 21. Metal Resistance versus Temperature Devices  The equation of this straight line is the linear approximation to the curve over the spanT1 toT2 .The equation for this line is typically written as
  • 22. Metal Resistance versus Temperature Devices  The value of can be found from values of resistance and temperature taken either from a graph, as given in Figure , or from a table of resistance versus temperature 0
  • 23. Metal Resistance versus Temperature Devices  Quadratic Approximation A quadratic approximation to the R-T curve is a more accurate representation of the R-T curve over some span of temperatures.
  • 24. Metal Resistance versus Temperature Devices  Example.A
  • 25. Metal Resistance versus Temperature Devices
  • 26. Metal Resistance versus Temperature Devices  Example-B: Find the quadratic approximation of resistance versus temperature for the data given in Example . A. Between 60° to 90° F.
  • 27. Metal Resistance versus Temperature Devices  Example-C:
  • 28. Metal Resistance versus Temperature Devices  Resistance-Temperature Detectors:  A resistance-temperature detector (RTD) is a temperature sensor that is based on the principles discussed in the preceding sections; that is, metal resistance increasing with temperature.  Metals used in these devices vary from platinum, which is quite sensitive, and very expensive, to nickel, which is not more sensitive, and less expensive.  Signal Conditioning In view of the very small fractional changes of resistance with temperature (0.4%), the RTD is generally used in a bridge circuit. Figure 4 illustrates the essential features of such a system.
  • 29. Metal Resistance versus Temperature Devices  The compensation line in the R3 leg of the bridge is required when the lead lengths are so long that thermal gradients along the RTD leg may cause changes in line resistance.
  • 30. Metal Resistance versus Temperature Devices-RTD
  • 31. THERMISTORS  The thermistor represents another class of temperature sensor that measures temperature through changes of material resistance.  The characteristics of these devices are very different from those of RTDs and depend on the peculiar behavior of semiconductor resistance versus temperature.  Semiconductor Resistance versusTemperature  In contrast to metals, electrons in semiconductor materials are bound to each molecule with sufficient strength that no conduction electrons are contributed from the valence band to the conduction band.
  • 32. THERMISTORS  When the temperature of the material is increased, the molecules begin to vibrate. In the case of a semiconductor, such vibration provides additional energy to the valence electrons. When such energy equals or exceeds the gap energy.  As the temperature is further increased, more and more electrons gain sufficient energy to enter the conduction band.  It is then clear that the semiconductor becomes a better conductor of current as its temperature is increased—that is, as its resistance decreases.
  • 34. THERMISTORS  Fig:Thermistor resistance versus temperature is highly nonlinear and usually has a negative slope
  • 35. THERMISTORS  Thermistor Characteristics  A thermistor is a temperature sensor that has been developed from the principles just discussed regarding semiconductor resistance change with temperature.  The particular semiconductor material used varies widely to accommodate temperature ranges, sensitivity, resistance ranges, and other factors.  Sensitivity The sensitivity of the thermistors is a significant factor in their application. Changes in resistance of 10% per °C are not uncommon.  When used in null-detecting bridge circuits, sensitivity this large can provide for control, in principle, to less than 1 °C in temperature.
  • 36. THERMISTORS  Construction Because the thermistor is a bulk semiconductor, it can be fabricated in many forms.  Thus, common forms include discs, beads, and rods, varying in size from a bead 1 mm in diameter to a disc several centimeters in diameter and several centimeters thick.  Range The temperature range of thermistors depends on the materials used to construct the sensor. In general, there are three range limitation effects:  (1) melting or deterioration of the semiconductor, (2) deterioration of encapsulation material, and (3) insensitivity at higher temperatures.
  • 39. THERMOCOUPLES  There exists another dependence of electrical behavior of materials on temperature that forms the basis of a large percentage of all temperature measurement.  This effect is characterized by a voltage-generating sensor in which an electromotive force (emf) is produced that is proportional to temperature. Such an emf is found to be almost linear with temperature and very repeatable for constant materials.  Devices that measure temperature on the basis of this thermoelectric principle are called thermocouples (TCs).
  • 40. THERMOCOUPLES  Thermoelectric Effects:  The basic theory of the thermocouple effect is found from a consideration of the electrical and thermal transport properties of different metals.  In particular, when a temperature differential is maintained across a given metal, the vibration of atoms and motion of electrons is affected so that a difference in potential exists across the material.  This potential difference is related to the fact that electrons in the hotter end of the material have more thermal energy than those in the cooler end, and thus tend to drift toward the cooler end.
  • 41. THERMOCOUPLES  This drift varies for different metals at the same temperature because of differences in their thermal conductivities. If a circuit is closed by connecting the ends through another conductor, a current is found to flow in the closed loop.  The proper description of such an effect is to say that an emf has been established in the circuit and is causing the current to flow. Figure a shows a pictorial representation of this effect, called the Seebeck effect.
  • 42. THERMOCOUPLES  Seebeck Effect Using solid-state theory, the aforementioned situation may be analyzed to show that its emf can be given by an integral over temperature,  This equation, which describes the Seebeck effect, shows that the emf produced is proportional to the difference in temperature and, further, to the difference in the metallic thermal transport constants.
  • 43. THERMOCOUPLES  Thus, if the metals are the same, the emf is zero, and if the temperatures are the same, the emf is also zero.
  • 46. THERMOCOUPLES  Peltier Effect : An interesting and sometimes useful extension of the same thermoelectric properties occurs when the reverse of the Seebeck effect is considered.  In this case, we construct a closed loop of two different metals, A and B,as before. Now, however, an external voltage is applied to the system to cause a current to flow in the circuit, as shown in Figure b.
  • 47. THERMOCOUPLES  Because of the different electrothermal transport properties of the metals, it is found that one of the junctions will be heated and the other cooled;that is, the device is a refrigerator! This process is referred to as the Peltier effect.  Some practical applications of such a device, such as cooling small electronic parts, have been employed.  Thermocouple Characteristics  To use the Seebeck effect as the basis of a temperature sensor, we need to establish a definite relationship between the measured emf of the thermocouple and the unknown temperature.
  • 48. THERMOCOUPLES  Furthermore, every connection of different metals made in the thermocouple loop for measuring devices, extension leads, and so on will contribute an emf, depending on the difference in metals and various junction temperatures.  To provide an output that is definite with respect to the temperature to be measured, an arrangement such as shown in Figure a is used.
  • 49. THERMOCOUPLES  This shows that the measurement junction, TM, is exposed to the environment whose temperature is to be measured. This junction is formed of metals A and B as shown.  Two other junctions are then formed to a common metal, C,which then connects to the measurement apparatus.  The ―reference‖ junctions are held at a common, known temperature TR, the reference junction temperature.  When an emf is measured, such problems as voltage drops across resistive elements in the loop must be considered.  In this arrangement, an open-circuit voltage is measured (at high impedance) that is then a function of only the temperature difference (TM-TR) and the type of metals A and B.
  • 50. THERMOCOUPLES  To use the thermocouple to measure a temperature, the reference temperature must be known, and the reference junctions must be held at the same temperature.  In most industrial environments, this would be difficult to achieve if the measurement junction and reference junction were close.  It is possible to move the reference junctions to a remote location without upsetting the measurement process by the use of extension wires,as shown in Figure b.  A junction is formed with the measurement system, but to wires of the same type as the thermocouple.
  • 51. THERMOCOUPLES  Thermocouple Types Certain standard configurations of thermocouples using specific metals (or alloys of metals) have been adopted and given letter designations; examples are shown inTable 2.
  • 52. THERMOCOUPLES  Fig: These curves of thermocouple voltage versus temperature for a 0°C reference show the different sensitivities and nonlinearities of three types.
  • 53. THERMOCOUPLES  Thermocouple Polarity The voltage produced by a TC is differential in the sense that it is measured between the two metal wires.  As noted in the footnote to Table., by convention the description of aTC identifies how the polarity is interpreted.  A type J thermocouple is called iron-constantan. This means that if the reference temperature is less than the measurement junction temperature, the iron will be more positive than the constantan.  Thus, a type J with a 0°C reference will produce +5.27 mV for a measurement junction of , meaning that the iron is more positive than the constantan.
  • 54. THERMOCOUPLES  Thermocouple Tables The thermocouple tables simply give the voltage that results for a particular type of thermocouple when the reference junctions are at a particular reference temperature, and the measurement junction is at a temperature of interest.  The measured voltage,VM, lies between a higher voltage,VH, and a lower voltage,VL, which are in the tables.
  • 55. THERMOCOUPLES  Thermocouple Sensors:  Sensitivity A review of the tables shows that the range of thermocouple voltages is typically less than 100 mV.  The actual sensitivity strongly depends on the type of signal conditioning employed and on theTC itself.  Construction A thermocouple by itself is, of course, simply a welded or even twisted junction between two metals, and in many cases, that is the construction.  There are cases, however, where the TC is sheathed in a protective covering or even sealed in glass to protect the unit from a hostile environment.
  • 56. THERMOCOUPLES  Reference Compensation A problem with the practical use of thermocouples is the necessity of knowing the reference temperature.  Because the TC voltage is proportional to the difference between the measurement and reference junction temperatures, variations of the reference temperature show up as direct errors in the measurement temperature determination. The following techniques are employed for reference junction compensation:  1. Controlled temperature reference block In some cases, particularly when many thermocouples are in use, extension wires bring all reference junctions to a temperature-controlled box in the control room.
  • 57. THERMOCOUPLES  2. Reference compensation circuits The modern approach to reference correction is supplied by specialized integrated circuits (ICs) that add or subtract the correction factor directly to the TC output.  These ICs, which are called cold junction compensators or ice point compensators, are actually temperature sensors themselves that measure the reference junction temperature.  The ICs include circuitry that provides a scaled correction voltage, depending on the type ofTC being used.  Upcoming Figure shows a block diagram of how the compensator is used.  The actual reference junctions are at the connection to the IC, so the IC temperature is the reference temperature.
  • 58. THERMOCOUPLES  3.Software reference correction: In computer-based measurement systems, the reference junction temperature can be measured by a precision thermistor or another IC temperature sensor and provided as an input to the computer.  Software routines then can provide necessary corrections to the thermocouple temperature signal that is also an input to the computer.
  • 59. THERMOCOUPLES  To use thermocouples effectively in industry, a number of noise reduction techniques are employed.The following three are the most popular:  1. The extension or lead wires from the thermocouple to the reference junction or measurement system are twisted and then wrapped with a grounded foil sheath.  2. The measurement junction itself is grounded at the point of measurement. The grounding is typically to the inside of the stainless steel sheath that covers the actual thermocouple.  3. An instrumentation amplifier that has excellent common-mode rejection is employed for measurement.
  • 60. OTHER THERMAL SENSORS:  OTHERTHERMAL SENSORS:  The sensors discussed earlier cover a large fraction of the temperature measurement techniques used in process control.  Bimetal Strips  This type of temperature sensor has the characteristics of being relatively inaccurate, having hysteresis, having relatively slow time response, and being low in cost.  Such devices are used in numerous applications, particularly where an ON/OFF cycle rather than smooth or continuous control is desired.
  • 61. OTHER THERMAL SENSORS:  Thermal Expansion We have seen that greater thermal energy causes the molecules of a solid to execute greater- amplitude and higher-frequency vibrations about their average positions.  It is natural to expect that an expansion of the volume of a solid would accompany this effect, as the molecules tend to occupy more volume on the average with their vibrations.  This effect varies in degree from material to material because of many factors, including molecular size and weight, lattice structure, and others.
  • 62. OTHER THERMAL SENSORS:  The temperature is raised to a new value, T,the rod will be found to have a new length, l,given by  where DeltaT= T – To and gamma is the linear thermal expansion coefficient appropriate to the material of which the rod is produced. Several different expansion coefficients are given inTable .
  • 63. OTHER THERMAL SENSORS:  FIGURE : A bimetal strip will curve when exposed to a temperature change because of different thermal expansion coefficients. Metal thickness has been exaggerated in this view.
  • 64. OTHER THERMAL SENSORS:  Bimetallic Sensor The thermal sensor exploiting the effect discussed previously occurs when two materials with grossly different thermal expansion coefficients are bonded together.  Thus, when heated, the different expansion rates cause the assembly curve shown in last Figure . This effect can be used to close switch contacts or to actuate an ON/OFF mechanism when the temperature increases to some appropriate setpoint.  The effect also is used for temperature indicators, by means of assemblages, to convert the curvature into dial rotation.
  • 66. OTHER THERMAL SENSORS:  GasThermometers:  The operational principle of the gas thermometer is based on a basic law of gases. In particular, if a gas is kept in a container at constant volume and the pressure and temperature vary, the ratio of gas pressure and temperature is a constant:
  • 68. OTHER THERMAL SENSORS:  Vapor-PressureThermometers :  A vapor-pressure thermometer converts temperature information into pressure, as does the gas thermometer, but it operates by a different process.  If a closed vessel is partially filled with liquid, then the space above the liquid will consist of evaporated vapor of the liquid at a pressure that depends on the temperature.  If the temperature is raised, more liquid will vaporize, and the pressure will increase. A decrease in temperature will result in condensation of some of the vapor, and the pressure will decrease.
  • 69. OTHER THERMAL SENSORS:  Fig:Vapor-pressure curve for methyl chloride.
  • 70. OTHER THERMAL SENSORS:  Liquid-ExpansionThermometers :  Just as a solid experiences an expansion in dimension with temperature, a liquid also shows an expansion in volume with temperature. This effect forms the basis for the traditional liquid in- glass thermometer that is so common in temperature measurement.
  • 71. OTHER THERMAL SENSORS:  Solid-StateTemperature Sensors :  Many integrated circuit manufacturers now market solid- state temperature sensors for consumer and industrial applications.  These devices offer voltages that vary linearly with temperature over a specified range. They function by exploiting the temperature sensitivity of doped semiconductor devices such as diodes and transistors.  One common version is essentially a zener diode in which the zener voltage increases linearly with temperature.
  • 72. OTHER THERMAL SENSORS:  Fig: Some solid-state temperature sensors operate like a zener diode whose voltage depends upon temperature
  • 73. DESIGN CONSIDERATIONS  See theTopic No. 7 of the Reference book mention at the upcoming slide.
  • 74. Reference  Curtis D. Johnson.―Process Control Instrumentation Technology‖, Prentice Hall, 8/E, 2005 ISBN-10: 0131194577 • ISBN-13: 9780131194571