1. Technology
development
By
Boy van Veghel
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2. Questionnaire result
1. Copper filled through vias
2. Different finish
3. Use of high temperature materials
4. High thermal conductivity PCB
5. Use of thinner, more flexible materials
6. Reduced track/gap
7. Smaller via holes
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3. Technology development
Choice of technology when using fine pitch
Options for thermal management in PCB
High vacuum PCB design
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4. Choice of technology when using fine pitch
Designers often make the wrong choice of
design rules with fine pitch BGA
Low yield/cost effective
long lead-time
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5. BGA pitch 0,64 mm
Standard blind/buried PCB
 Blind 0,1mm hole> 0,3mm pad> 0,27mm land pad
 Buried 0,15mm hole> 0,35mm pad
 Track/gap 100µ on inner layer
» Blind via Buried via
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6. BGA pitch 0,5 mm(via in pad)
Copper filled blind/buried PCB
 Blind 0,1mm hole> 0,3mm pad> 0,25mm land pad
 Buried 0,15mm hole> 0,30mm pad
 Track/gap 75µ on inner layer
» Blind via Buried via
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7. BGA pitch 0,4 mm(Stacked via)
Copper/resin filled stacked via PCB
 Blind 0,1mm hole> 0,3mm pad
 Track/gap 300µ on inner/outer layer
 Connect every level of balls on separate layer
Layer 1 Layer 2 Layer 3
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8. Stacked via
Cost effective
Low yield
Long lead-time
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9. Latest technology development
Replace “stacked via” by 1 layer 30µ VHDI
 Shorter lead-time
 Less layers
 Better yield
 More cost effective
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10. Latest technology development
Layer 1 blind via copper filled Layer 2(VHDI) fan out layer
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11. Latest technology development
Special additive process
 QPI own development
 Using standard PCB process
 Process not mature yet
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12. Latest technology development
Controlled impedance
Fan out to correct width within 10mm
Signal quality remains acceptable
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13. Thermal managment in PCB
IMS PCB
 Aluminium back
MC PCB
 Copper, aluminium, CIC core
Ceramic
 As fired
Thick copper PCB
 400µ Cu edged pattern
Copper bar PCB
 Wire, strip, coin, rectangular
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14. Thermal managment in PCB
IMS PCB (insulated metal substrate)
 LED industry
Cu 18/35/70/105/210µ
Prepreg 117µ
Aluminium 0,8/1/1,5/2/3mm
Material Standard Improved Special Copper Aluminium
Fr-4 Fr-4 Fr-4
W/m*K 0,2 1,8 3 385 240
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15. Thermal managment in PCB
MC PCB (metal core PCB/metal backed)
 COB, Heat components, RF
Standard Fr-4/CF3350
Copper/Aluminium/
CIC
Material Standard Copper Aluminium CIC Hysol
Fr-4 CF3350
W/m*K 0,2 385 240 108 7
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16. Thermal managment in PCB
Ceramic As-fired
 LED, COB
 Single or double sided
 Ag/Pd printed tracks 12-24µ thick
ENIG optional
Ag/Pd tracks printed
Ceramic
Composition 96% 99,5% 99,6% 91% 99,5 AlN
Al2O3 Al2O3 Al2O3 Al2O3 BeO
W/m*K 25 33 35 13 255 170
Dk 9,5 9,8 9,9 10,3 8,6 8,9
Color White White White Brown White Ivory
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17. Thermal managment in PCB
Thick copper PCB
 Power distribution, heat components
 Blind via’s copper filled
 400µ Cu etched pattern (design depended)
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18. Thermal managment in PCB
Copper bar PCB
 Local heat distribution, power lines
 Strip, coin, rectangular, wire etc.
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19. High vacuüm PCB design
More and more vacuüm applications
Typical vacuüm10-6/10-10 mbar
Outgassing PCB materials
 Hydrocarbons
Low moisture absorbtion materials
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20. High vacuüm PCB design for rigid
No solder mask or only solder dams
Via in pad(filled), no tracks on outer layer
Material Fr-4 Fr-4 Polyimid Teflon Rogers
improved 4350
Moisture absorbtion 0,25% 0,15% 0,4% 0,02% 0,06%
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21. High vacuüm PCB design for flex
Adhesiveless PY flex
 No acrylic between PY and copper
No acrylic in bondply and cover film
 Only modified PY(Espanex)
LCP is the best option
 Design depended, no cover layer
 No multiple bonding
Material LCP Polyimid Acrylic
flex
Moisture 0,04% 0,8% 2,8%
absorbtion
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22. High vacuüm PCB design for flex-rigid
Latest development
Material LCP Rogers Arlon
4350 6700
Moisture 0,04% 0,06% 0,005
absorbtion
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23. Thank you
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