A Silicon-to-System Review of Thermo-Mechanical Considerations in Electronics
Author: Kamal Karimanal, Cielution LLC
Thermal and Mechanical challenges to IC package reliability has been addressed with a sufficiently working system of information exchange across a supply chain that spans the foundries to system level assembly plants.The never ending market demand for miniaturization, performance, functionality and cost reduction invariably translates to manufacturing, design, assembly, and reliability challenges to the engineer. Within the Thermal and Mechanical realm these challenges manifest to the engineer in the form of seemingly disconnected problems areas such as BEOL yield, flipchip interconnect reliability, warpage mitigation, heat sink retention design, interface choice, thermally aware board and chassis layout, fan sizing and system level optimization. Evolving technology also introduces newer puzzles such as heterogeneous packaging using 3D ICs. The talk will focus on the tools, methodologies and information exchange protocols used by the thermal management and mechanical reliability professionals across the supply chain to address the various challenges.