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© Semiconductor Components Industries, LLC, 2013
November, 2013 − Rev. 8
1 Publication Order Number:
BC337/D
BC337, BC337-25,
BC337-40
Amplifier Transistors
NPN Silicon
Features
• These are Pb−Free Devices
MAXIMUM RATINGS
Rating Symbol Value Unit
Collector − Emitter Voltage VCEO 45 Vdc
Collector − Base Voltage VCBO 50 Vdc
Emitter − Base Voltage VEBO 5.0 Vdc
Collector Current − Continuous IC 800 mAdc
Total Device Dissipation @ TA = 25°C
Derate above 25°C
PD 625
5.0
mW
mW/°C
Total Device Dissipation @ TC = 25°C
Derate above 25°C
PD 1.5
12
W
mW/°C
Operating and Storage Junction
Temperature Range
TJ, Tstg −55 to +150 °C
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction−to−Ambient RqJA 200 °C/W
Thermal Resistance, Junction−to−Case RqJC 83.3 °C/W
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
http://onsemi.com
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
ORDERING INFORMATION
COLLECTOR
1
2
BASE
3
EMITTER
MARKING DIAGRAM
BC33
7−xx
AYWW G
G
BC337−xx = Device Code
(Refer to page 4)
A = Assembly Location
Y = Year
WW = Work Week
G = Pb−Free Package
(Note: Microdot may be in either location)
1 2
3
1
2
BENT LEAD
TAPE & REEL
AMMO PACK
STRAIGHT LEAD
BULK PACK
3
TO−92
CASE 29
STYLE 17
BC337, BC337−25, BC337−40
http://onsemi.com
2
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Characteristic Symbol Min Typ Max Unit
OFF CHARACTERISTICS
Collector−Emitter Breakdown Voltage
(IC = 10 mA, IB = 0)
V(BR)CEO 45 − − Vdc
Collector−Emitter Breakdown Voltage
(IC = 100 mA, IE = 0)
V(BR)CES 50 − − Vdc
Emitter−Base Breakdown Voltage
(IE = 10 mA, IC = 0)
V(BR)EBO 5.0 − − Vdc
Collector Cutoff Current
(VCB = 30 V, IE = 0)
ICBO − − 100 nAdc
Collector Cutoff Current
(VCE = 45 V, VBE = 0)
ICES − − 100 nAdc
Emitter Cutoff Current
(VEB = 4.0 V, IC = 0)
IEBO − − 100 nAdc
ON CHARACTERISTICS
DC Current Gain
(IC = 100 mA, VCE = 1.0 V) BC337
BC337−25
BC337−40
(IC = 300 mA, VCE = 1.0 V)
hFE
100
160
250
60
−
−
−
−
630
400
630
−
−
Base−Emitter On Voltage
(IC = 300 mA, VCE = 1.0 V)
VBE(on) − − 1.2 Vdc
Collector−Emitter Saturation Voltage
(IC = 500 mA, IB = 50 mA)
VCE(sat) − − 0.7 Vdc
SMALL−SIGNAL CHARACTERISTICS
Output Capacitance
(VCB = 10 V, IE = 0, f = 1.0 MHz)
Cob − 15 − pF
Current−Gain − Bandwidth Product
(IC = 10 mA, VCE = 5.0 V, f = 100 MHz)
fT − 210 − MHz
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
Figure 1. Thermal Response
t, TIME (SECONDS)
0.001 0.002 0.005 0.01 0.02 0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100
0.01
0.02
0.03
0.05
0.07
0.1
0.2
0.3
0.5
0.7
1.0
r(t),NORMALIZEDEFFECTIVETRANSIENT
THERMALRESISTANCE
D = 0.5
0.2
0.1
0.05
0.02
0.01
SINGLE PULSE
qJC(t) = (t) qJC
qJC = 100°C/W MAX
qJA(t) = r(t) qJA
qJA = 375°C/W MAX
D CURVES APPLY FOR
POWER
PULSE TRAIN SHOWN
READ TIME AT t1
TJ(pk) − TC = P(pk) qJC(t)
t1
t2
P(pk)
DUTY CYCLE, D = t1/t2
SINGLE PULSE
BC337, BC337−25, BC337−40
http://onsemi.com
3
CURRENT LIMIT
THERMAL LIMIT
SECOND BREAKDOWN LIMIT
1.0 ms1.0 s TJ = 135°C
TA = 25°C
TC = 25°C
dc
dc
(APPLIES BELOW RATED VCEO)
1000
10
1001.0 3.0 10 30
VCE, COLLECTOR-EMITTER VOLTAGE
Figure 2. Active Region − Safe Operating Area
IC, COLLECTOR CURRENT (MA)
Figure 3. DC Current Gain
IC,COLLECTORCURRENT(mA)
hFE,DCCURRENTGAIN
100
1000
10
10000.1 10 100
100
1.0
TJ = 135°C
100 ms
VCE = 1 V
TJ = 25°C
IB, BASE CURRENT (mA)
Figure 4. Saturation Region
IC, COLLECTOR CURRENT (mA)
Figure 5. “On” Voltages
100
10
1
VR, REVERSE VOLTAGE (VOLTS)
Figure 6. Temperature Coefficients
+1
IC, COLLECTOR CURRENT (mA)
Figure 7. Capacitances
0.1 11 10 100 1000
-2
-1
0
VCE,COLLECTOR-EMITTERVOLTAGE(VOLTS)
V,VOLTAGE(VOLTS)
V,TEMPERATURECOEFFICIENTS(mV/C)°θ
C,CAPACITANCE(pF)
1.0
0.8
0.6
0.4
0.2
0
0.01 0.1 10 1001
1.0
0.8
0.6
0.4
0.2
0
1 10 1000100
10 100
TJ = 25°C
IC = 10 mA
TA = 25°C
VBE(sat) @ IC/IB = 10
VBE(on) @ VCE = 1 V
VCE(sat) @ IC/IB = 10
qVC for VCE(sat)
qVB for VBE
Cob
Cib
100 mA 300 mA 500 mA
BC337, BC337−25, BC337−40
http://onsemi.com
4
ORDERING INFORMATION
Device Marking Package Shipping†
BC337G 7
TO−92
(Pb−Free)
5000 Units / Bulk
BC337RL1G 7 2000 / Tape & Reel
BC337−025G 7−25 5000 Units / Bulk
BC337−25RL1G 7−25 2000 / Tape & Reel
BC337−25RLRAG 7−25 2000 / Tape & Reel
BC337−25ZL1G 7−25 2000 / Ammo Box
BC337−040G 7−40 5000 Units / Bulk
BC337−40RL1G 7−40 2000 / Tape & Reel
BC337−40ZL1G 7−40 2000 / Ammo Box
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
BC337, BC337−25, BC337−40
http://onsemi.com
5
PACKAGE DIMENSIONS
TO−92 (TO−226)
CASE 29−11
ISSUE AM
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. CONTOUR OF PACKAGE BEYOND DIMENSION R
IS UNCONTROLLED.
4. LEAD DIMENSION IS UNCONTROLLED IN P AND
BEYOND DIMENSION K MINIMUM.
R
A
P
J
L
B
K
G
H
SECTION X−X
CV
D
N
N
X X
SEATING
PLANE DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A 0.175 0.205 4.45 5.20
B 0.170 0.210 4.32 5.33
C 0.125 0.165 3.18 4.19
D 0.016 0.021 0.407 0.533
G 0.045 0.055 1.15 1.39
H 0.095 0.105 2.42 2.66
J 0.015 0.020 0.39 0.50
K 0.500 --- 12.70 ---
L 0.250 --- 6.35 ---
N 0.080 0.105 2.04 2.66
P --- 0.100 --- 2.54
R 0.115 --- 2.93 ---
V 0.135 --- 3.43 ---
1
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. CONTOUR OF PACKAGE BEYOND
DIMENSION R IS UNCONTROLLED.
4. LEAD DIMENSION IS UNCONTROLLED IN P
AND BEYOND DIMENSION K MINIMUM.
R
A
P
J
B
K
G
SECTION X−X
C
V
D
N
X X
SEATING
PLANE DIM MIN MAX
MILLIMETERS
A 4.45 5.20
B 4.32 5.33
C 3.18 4.19
D 0.40 0.54
G 2.40 2.80
J 0.39 0.50
K 12.70 ---
N 2.04 2.66
P 1.50 4.00
R 2.93 ---
V 3.43 ---
1
T
STRAIGHT LEAD
BULK PACK
BENT LEAD
TAPE & REEL
AMMO PACK
STYLE 17:
PIN 1. COLLECTOR
2. BASE
3. EMITTER
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks,
copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC
reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any
particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without
limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications
and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC
does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for
surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where
personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and
its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly,
any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture
of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5817−1050
BC337/D
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: orderlit@onsemi.com
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative

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  • 1. © Semiconductor Components Industries, LLC, 2013 November, 2013 − Rev. 8 1 Publication Order Number: BC337/D BC337, BC337-25, BC337-40 Amplifier Transistors NPN Silicon Features • These are Pb−Free Devices MAXIMUM RATINGS Rating Symbol Value Unit Collector − Emitter Voltage VCEO 45 Vdc Collector − Base Voltage VCBO 50 Vdc Emitter − Base Voltage VEBO 5.0 Vdc Collector Current − Continuous IC 800 mAdc Total Device Dissipation @ TA = 25°C Derate above 25°C PD 625 5.0 mW mW/°C Total Device Dissipation @ TC = 25°C Derate above 25°C PD 1.5 12 W mW/°C Operating and Storage Junction Temperature Range TJ, Tstg −55 to +150 °C THERMAL CHARACTERISTICS Characteristic Symbol Max Unit Thermal Resistance, Junction−to−Ambient RqJA 200 °C/W Thermal Resistance, Junction−to−Case RqJC 83.3 °C/W Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com See detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet. ORDERING INFORMATION COLLECTOR 1 2 BASE 3 EMITTER MARKING DIAGRAM BC33 7−xx AYWW G G BC337−xx = Device Code (Refer to page 4) A = Assembly Location Y = Year WW = Work Week G = Pb−Free Package (Note: Microdot may be in either location) 1 2 3 1 2 BENT LEAD TAPE & REEL AMMO PACK STRAIGHT LEAD BULK PACK 3 TO−92 CASE 29 STYLE 17
  • 2. BC337, BC337−25, BC337−40 http://onsemi.com 2 ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted) Characteristic Symbol Min Typ Max Unit OFF CHARACTERISTICS Collector−Emitter Breakdown Voltage (IC = 10 mA, IB = 0) V(BR)CEO 45 − − Vdc Collector−Emitter Breakdown Voltage (IC = 100 mA, IE = 0) V(BR)CES 50 − − Vdc Emitter−Base Breakdown Voltage (IE = 10 mA, IC = 0) V(BR)EBO 5.0 − − Vdc Collector Cutoff Current (VCB = 30 V, IE = 0) ICBO − − 100 nAdc Collector Cutoff Current (VCE = 45 V, VBE = 0) ICES − − 100 nAdc Emitter Cutoff Current (VEB = 4.0 V, IC = 0) IEBO − − 100 nAdc ON CHARACTERISTICS DC Current Gain (IC = 100 mA, VCE = 1.0 V) BC337 BC337−25 BC337−40 (IC = 300 mA, VCE = 1.0 V) hFE 100 160 250 60 − − − − 630 400 630 − − Base−Emitter On Voltage (IC = 300 mA, VCE = 1.0 V) VBE(on) − − 1.2 Vdc Collector−Emitter Saturation Voltage (IC = 500 mA, IB = 50 mA) VCE(sat) − − 0.7 Vdc SMALL−SIGNAL CHARACTERISTICS Output Capacitance (VCB = 10 V, IE = 0, f = 1.0 MHz) Cob − 15 − pF Current−Gain − Bandwidth Product (IC = 10 mA, VCE = 5.0 V, f = 100 MHz) fT − 210 − MHz Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. Figure 1. Thermal Response t, TIME (SECONDS) 0.001 0.002 0.005 0.01 0.02 0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 0.01 0.02 0.03 0.05 0.07 0.1 0.2 0.3 0.5 0.7 1.0 r(t),NORMALIZEDEFFECTIVETRANSIENT THERMALRESISTANCE D = 0.5 0.2 0.1 0.05 0.02 0.01 SINGLE PULSE qJC(t) = (t) qJC qJC = 100°C/W MAX qJA(t) = r(t) qJA qJA = 375°C/W MAX D CURVES APPLY FOR POWER PULSE TRAIN SHOWN READ TIME AT t1 TJ(pk) − TC = P(pk) qJC(t) t1 t2 P(pk) DUTY CYCLE, D = t1/t2 SINGLE PULSE
  • 3. BC337, BC337−25, BC337−40 http://onsemi.com 3 CURRENT LIMIT THERMAL LIMIT SECOND BREAKDOWN LIMIT 1.0 ms1.0 s TJ = 135°C TA = 25°C TC = 25°C dc dc (APPLIES BELOW RATED VCEO) 1000 10 1001.0 3.0 10 30 VCE, COLLECTOR-EMITTER VOLTAGE Figure 2. Active Region − Safe Operating Area IC, COLLECTOR CURRENT (MA) Figure 3. DC Current Gain IC,COLLECTORCURRENT(mA) hFE,DCCURRENTGAIN 100 1000 10 10000.1 10 100 100 1.0 TJ = 135°C 100 ms VCE = 1 V TJ = 25°C IB, BASE CURRENT (mA) Figure 4. Saturation Region IC, COLLECTOR CURRENT (mA) Figure 5. “On” Voltages 100 10 1 VR, REVERSE VOLTAGE (VOLTS) Figure 6. Temperature Coefficients +1 IC, COLLECTOR CURRENT (mA) Figure 7. Capacitances 0.1 11 10 100 1000 -2 -1 0 VCE,COLLECTOR-EMITTERVOLTAGE(VOLTS) V,VOLTAGE(VOLTS) V,TEMPERATURECOEFFICIENTS(mV/C)°θ C,CAPACITANCE(pF) 1.0 0.8 0.6 0.4 0.2 0 0.01 0.1 10 1001 1.0 0.8 0.6 0.4 0.2 0 1 10 1000100 10 100 TJ = 25°C IC = 10 mA TA = 25°C VBE(sat) @ IC/IB = 10 VBE(on) @ VCE = 1 V VCE(sat) @ IC/IB = 10 qVC for VCE(sat) qVB for VBE Cob Cib 100 mA 300 mA 500 mA
  • 4. BC337, BC337−25, BC337−40 http://onsemi.com 4 ORDERING INFORMATION Device Marking Package Shipping† BC337G 7 TO−92 (Pb−Free) 5000 Units / Bulk BC337RL1G 7 2000 / Tape & Reel BC337−025G 7−25 5000 Units / Bulk BC337−25RL1G 7−25 2000 / Tape & Reel BC337−25RLRAG 7−25 2000 / Tape & Reel BC337−25ZL1G 7−25 2000 / Ammo Box BC337−040G 7−40 5000 Units / Bulk BC337−40RL1G 7−40 2000 / Tape & Reel BC337−40ZL1G 7−40 2000 / Ammo Box †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
  • 5. BC337, BC337−25, BC337−40 http://onsemi.com 5 PACKAGE DIMENSIONS TO−92 (TO−226) CASE 29−11 ISSUE AM NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. CONTOUR OF PACKAGE BEYOND DIMENSION R IS UNCONTROLLED. 4. LEAD DIMENSION IS UNCONTROLLED IN P AND BEYOND DIMENSION K MINIMUM. R A P J L B K G H SECTION X−X CV D N N X X SEATING PLANE DIM MIN MAX MIN MAX MILLIMETERSINCHES A 0.175 0.205 4.45 5.20 B 0.170 0.210 4.32 5.33 C 0.125 0.165 3.18 4.19 D 0.016 0.021 0.407 0.533 G 0.045 0.055 1.15 1.39 H 0.095 0.105 2.42 2.66 J 0.015 0.020 0.39 0.50 K 0.500 --- 12.70 --- L 0.250 --- 6.35 --- N 0.080 0.105 2.04 2.66 P --- 0.100 --- 2.54 R 0.115 --- 2.93 --- V 0.135 --- 3.43 --- 1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. CONTOUR OF PACKAGE BEYOND DIMENSION R IS UNCONTROLLED. 4. LEAD DIMENSION IS UNCONTROLLED IN P AND BEYOND DIMENSION K MINIMUM. R A P J B K G SECTION X−X C V D N X X SEATING PLANE DIM MIN MAX MILLIMETERS A 4.45 5.20 B 4.32 5.33 C 3.18 4.19 D 0.40 0.54 G 2.40 2.80 J 0.39 0.50 K 12.70 --- N 2.04 2.66 P 1.50 4.00 R 2.93 --- V 3.43 --- 1 T STRAIGHT LEAD BULK PACK BENT LEAD TAPE & REEL AMMO PACK STYLE 17: PIN 1. COLLECTOR 2. BASE 3. EMITTER ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5817−1050 BC337/D LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative