Analysis of electroplating plant on different materials

Analysis of electroplating plant on different materials
B.Sc Mechanical Engineering Technology (2015-2019) Page 1
Final Project
On
SUBMITTED BY:
UMAR HAYYAT T1MT033R15-018
ASFAND ALI T1MT033R15-024
B.Sc. Mechanical Engineering Technology
------------------------------
Submitted To: Registrar
Imperial College of Business Studies

This project is submitted to
Imperial College of Business Studies for the partial fulfillment of the requirement
for awarding the degree of
B.Sc. Mechanical Engineering Technology
-------------------------------
UMAR HAYYAT T1MT033R15-018
ASFAND ALI T1MT033R15-024
Assigned by:_____________________________
Faculty Member‟s Signature
Internal Examiner
Sign:____________________
Name:___________________
External Examiner
Sign:_____________________
Name:____________________

ACKNOWLEDGEMENT
I would like to take this opportunity to express my sincere gratitude and deep appreciation to my
supervisor Mr. Fahim Ishaq, for his invaluable insight, timely advice, and continual guidance.
His scientific foresight and excellent knowledge have been crucial to the accomplishment of this
work. I consider myself privileged for having had the opportunity to conduct research in the field
of electroplating of Cu-Sn alloys under his supervision. Sincere thanks are given to all dedicated
technical staffs and friends, especially Engr Mr. Asfand Ali, for their invaluable technical
support, without him my research works cannot be completed properly as scheduled. The
inspiration and support given by the fellow postgraduate students of The Imperial Collage of
Business studies have also been much appreciated.
I wish to express my deep gratitude to my parents, and My all Friends for their never-ending
support, love, encouragement and always provided me the energy and enthusiasm for completing
my work. I would like to dedicate the report to them.

DEDICATED TO
We dedicated to our beloved parents, teachers, friends and ourselves.
This work is dedicated to my Supervisor, family and friends, who encouraged me
to face challenges and whose efforts and prayers are great source of strength to
every noble venture, their love inspired us to the higher degree of the life.

ABSTRACT
This paper describes a copper electroplating enabling technology for filling microvias .Driven by
the need for faster, smaller and higher performance communication and electronic devices;
build-up technology incorporating microvias has emerged as a viable multilayer printed circuit
manufacturing technology. Increased wiring density, reduced line widths, smaller through-holes
and microvias are all attributes of these High Density Interconnect (HDI) packages.
Filling the microvias with conductive material allows the use of stacked vias and via in pad
designs thereby facilitating additional packaging density.
Other potential design attributes include thermal management enhancement and benefits for high
frequency circuitry. Electrodeposited copper can be utilized for filling microvias and provides
potential advantages over alternative via plugging techniques.
The features, development, scale up and results of direct current (DC) and periodic pulse reverse
(PPR) acid copper via filling processes, including chemistry and equipment, are described. Two
series of electroplating experiments have been carried out onto copper and nickel substrate at 65
°C in several electroplating baths under different constant applied current densities.
The objectives of the first series of experiments are to understand the behavior of electrode
position of Cu and Sn in the several alkaline cyanide baths and to explore the electroplating
conditions which are appropriate for fabricating binary Yellow, golden; black and White Mir
alloys coatings.
The second series of experiments deals with an experimental study on electroplating of
Compositionally Modulated Multilayer (CMM) consisting of multiple alternate Nano-layers of
quaternary Yellow and White Mir alloys using dual bath technique (DBT).

Analysis of
Electroplating plant
on different materials

TABLE OF CONTENTS
Title Page ...................................................................................................................................... 01
Acknowledgements ....................................................................................................................... 03
Dedication ................................................................................................................................. 04
Abstract .................................................................................................................................. 05
Tables Of Content.....................................................................................................07
List Of Tables .............................................................................................................. 09
List Of Figure.................................................................................................................................10
List Of Abbreviations .................................................................................................................... 11
Chapter 1..................................................................................................................................12
Introduction...................................................................................................................................... 12
1.1 Research Background ................................................................................................................ 14
1.2 Problem Statement..................................................................................................................... 17
1.3 Project Objectives ...................................................................................................................... 18
1.4 Project Scope Of Work.............................................................................................................. 19
1.5 Significance Of The Study......................................................................................................... 19
Chapter 2.................................................................................................................................. 21
Literature Review............................................................................................................................. 21
Chapter 3..................................................................................................................................28
Methodology;................................................................................................................................... 28
3.1Design Of Component For Electroplating Plant;........................................................................ 28
3.2 Process For Electroplating......................................................................................................... 33
3.3 Types Of Electroplating Processes ............................................................................................ 40
3.4 Types Of Metal Coatings........................................................................................................... 43
3.5 Related Processes....................................................................................................................... 46

3.6 The Uses Of Electroplating........................................................................................................ 49
Chapter 4 ............................................................................................................... 51
4.1 Data Analysis And Discussion................................................................................................... 51
4.2 The Purposes Of Electoplating .................................................................................................. 51
4.3 The Electrolysis Cell................................................................................................................. 52
4.4 Electrical Relationships ............................................................................................................. 55
4.5 Testing Corrosion....................................................................................................................... 57
Chapter 5.................................................................................................................................. 59
Conclusion And Recommendations................................................................................................. 59
References........................................................................................................................................ 62

LIST OF TABLE Page No
1. The coating densities,………………………………………………………………37
2. The coating densities, in terms of thickness ………………………………….........38

LIST OF FIGURE page No
1. Figure Electroplating of a metal (Me) 15
2. Figure Electroplating bath box drawing 29
3. Figure of Anode and Cathode 31
4. Figure ,220 primary 12v secondary step-down transformer 32
5. Figure Acid dips for degreasing 33
6. Figure. rinsing water 34
7. Figure. Zinc plating 36
8. Figure. rinsing water 40
9. Figure. Mass Plating 41
10. Figure. .rack plating 41
11. Figure .Continuous Plating 42
12. Figure .In-Line Plating 42
13. Figure. Sacrificial Coating 43
14. Figure. Decorative Protective Coatings 43
15. Figure. Engineering Coatings 44
16. Figure. Immersion Plating 47
17. Figure .Electroforming 48
18. Figure. Chrome plate 49
19. Figure. Flow Chat 50
20. Figure. Effect of initial pH on metal . Initial concentrations of Cu2+, Zn2+ 58

LIST OF ABBREVIATIONS
 at.% : Atom percentage
 ASM : American society of metals
 ASTM : American standards for testing of mater
 BCC : Body center cubic
 BSE : Back scattered electron
 CCE : Cathodic current efficiency
 CMM : Compositionally modulated multilayer
 Cu-Sn : Copper Tin
 CR : Corrosion rate
 DC : Direct current
 EDX : Energy dispersive x-ray spectroscopy
 FCC : Face center cubic
 FESEM : Field Emission scanning electron micro
 HER : Hydrogen evolution reaction
 ICCD : International center diffraction data
 SEM : Scanning electron microscope
 WE : Working electrode
 wt.% : Weight percentage
 TP : Throwing power
 Μm : Micrometer

CHAPTER 1
(INTRODUCTION)
Electroplating is an electrode position process for producing a dense, uniform, and adherent
coating, usually of metal or alloys, upon a surface by the act of electric current. The coating
produced is usually for decorative or protective purposes, or enhancing specific properties of the
surface. The surface can be conductors, such as metal, or nonconductors, such as plastics.
Electroplating products are widely used for many industries, such as automobile, ship, air space,
machinery, electronics, jewelry, defense, and toy industries. The core part of the electroplating
process is the electrolytic cell (electroplating unit). In the electrolytic cell (electroplating unit) a
current is passed through a bath containing electrolyte, the anode, and the cathode. In industrial
production, pretreatment and post treatment steps are usually needed as well.. [1]
Effluents issued from surface finishing and plating industry usually contains metal-ion
concentrations much higher than the permissible levels. Due to their high toxicity, industrial
wastewaters containing heavy metals are strictly regulated and must be treated before being
discharged in the environment. Various techniques have been employed for the treatment of
heavy metals, including precipitation, adsorption, ion-exchange and reverse osmosis.
Precipitation is most applicable among these techniques and considered to be the most
economical [2]. It is based on chemical coagulation by adding lime to raise the pH and aluminum
salt to remove colloidal matter as gelatinous hydroxides. Activated silica or polyelectrolytes may
also be added to stimulate coagulation. The former treatment may be followed by adsorption
onto activated carbon to complete metals removal at the ppm level. Although, it is shown to be
quite effective in treating industrial effluents, the chemical coagulation may induce secondary
pollution caused by added chemical substances. This drawback, together with the need for low
cost effective treatment, encouraged many studies on the use of electro coagulation for the
treatment of several industrial effluents. Electro coagulation is a simple and efficient method
where the flocculating agent is generated by electro-oxidation of a sacrificial anode, generally
made of iron or aluminum. In this process, the treatment is done without adding any chemical
coagulant or flocculants, thus reducing the amount of sludge which must be disposed [3]. The
electro coagulation has been successfully used to treat oil wastes, with a removal efficiencies as

high as 99%. A similar success was obtained when treating dye-containing solution spot able
water, urban and restaurant waste water and nitrate or fluoride containing waters. In addition, a
great deal of work performed in the last decades has proved that electro coagulation is an
effective technology for the treatment of heavy metal containing solutions. In the present work,
the efficiency of electro coagulation in removing copper, zinc and chromium from wastewater of
an electroplating unit was reported. The effect of the wastewater characteristics, initial pH and
metal-ion concentrations and operational variables, current density and treatment time, on the
removal efficiency is explored and discussed to determine the optimum operational conditions.
The optimum operational parameters were used for wastewater treatment of a local electroplating
unit.
Research into the production of Nano-composite coatings by electrolytic co-deposition of fine
particles with metal from plating baths has been investigated by numerous investigators [4].
Interest in electrodeposited Nano-composites has increased substantially during the past two
decades due mainly to the fact that Nano-composite coatings can give various properties, such as
wear resistance, high-temperature corrosion protection, oxidation resistance and self-lubrication,
to a plated surface. Research on electrode position of Nano-composite coatings has been
attention directed towards the determination of optimum conditions for their production, i.e.
current density, temperature, particle concentration and bath composition Nickel, being an
engineering material, is the widely used metal matrix. Ni–Sic composites have been
commercialized for the protection of friction parts, combustion engines and casting moulds [5].
The continuing trend of portability and increasing functionality of electronic devices has driven
the miniaturization and increased wiring density of printed circuit boards (PCBs). Conventional
multilayer PCBs with through hole interconnect visa are not really a practical solution to satisfy
these density requirements. This has driven the introduction of alternative approaches for high
density interconnects (HDI) for example sequential builds up (SBU) technologies incorporating
microvias. A number of differing SBU/micro via technologies is employed however a common
feature is the achievement of increased densification.. [6]

1.1 Research Background
The work piece to be plated is the cathode (negative terminal). The anode, however, can be one
of the two types: sacrificial anode (dissolvable anode) and permanent anode (inert anode).The
sacrificial anodes are made of the metal that is to be deposited. The permanent anodes can only
complete the electrical circuit, but cannot provide a source of fresh metal to replace what has
been removed from the solution by deposition at the cathode. Platinum and carbon are usually
used as inert anodes. Electrolyte is the electrical conductor in which current is carried by ions
rather than by free electrons (as in a metal). Electrolyte completes an electric circuit between two
electrodes. Upon application of electric current, the positive ions in the electrolyte will move
toward the cathode and the negatively charged ions toward the anode. This migration of ions
through the electrolyte constitutes the electric current in that part of the circuit. The migration of
electrons into the anode through the wiring and an electric generator and then back to the cathode
constitutes the current in the external circuit. The metallic ions of the salt in the electrolyte carry
a positive charge and are thus attracted to the cathode. When they reach the negatively charged
work piece, it provides electrons to reduce those positively charged ions to metallic form, and
then the metal atoms will be deposited onto the surface of the negatively charged work piece.
Figure. 1 illustrates a typical plating unit for plating F1 copper from a solution of the metal salt
copper sulfate (CuSO4). The cathode, which is the work piece to be plated, is charged
negatively. Some of the electrons from the cathode bar transfer to the positively charged copper
ions (Cu2þ), setting them free as atoms of copper metal. These copper atoms take their place on
the cathode surface and copper plate it. Concurrently, the same number of sulfate ions SO4 2is
discharged on the copper anodes, thereby completing the electrical circuit. In so doing, they form
a new quantity of copper sulfate that dissolves in the solution and restores it to its original
composition. This procedure is typical of ordinary electroplating processes with sacrificial
anodes; the current deposits a given amount of metal on the cathode and the anode dissolves to
the same extent (of the same electrical charge), maintaining the solution more or less
uniformly.[7]

Figure 1 Electroplating of a metal (Me) with copper in a copper sulfate bath
Tin is one of the first metals mined and has been recognized previously as an important metal in
industry. The largest tin mines are mostly in Asia. The most important ore-supplying countries in
the Asia are Indonesia, Malaysia and followed by China and only Indonesia and China after
about 1994. Currently, the Malaysian Smelting Corporation (MSC) group is one of the largest
integrated producers of tin metal and tin-based products in the world .In 2004, the group
contributed about 18% of the world‟s tin production with a combined production of 57,270 tons
of tin metal from the group‟s smelting operations in Malaysia and Indonesia Most of the tin
consumption in the world is for producing tin solders, tin coatings, tin compounds and alloys
containing tin. Besides tin metal exhibits unique properties such as low melting point and
resistant to corrosion, tin has also recognized as a green metal (nontoxic metal) and therefore tin
is still used as a base metal for producing lead free solders and it also considered as a proper
metal for substituting lead such as for fishing tackles and shot gun bullets. In ASEAN countries
for instance, the major consumption of tin metal is for producing tin solders, tin cans and pewter.
Even though tin is an important metal in industry, the annual (demand) is still small compared to
those of many other metals. It has been reported that the world production and consumption of
tin have not really grown in the past 20 years, due mainly to the substitution of tin by plastic,
paper or aluminum in the manufacture of cans and other containers, such as plastic tubes for
toothpaste and ointments. Consequently, attempts should be made by Tin Mining and Tin

Smelting Companies to increase or at least to maintain the world tin consumption. This is done
by increasing the role of tin in various applications. One of the possibilities to increase the world
tin consumption which is in consideration recently, is to increase the role of tin in electroplating
industries.. [8]
Electroplating is widely used for production of new materials that require specific mechanical,
chemical and physical properties. This technique has demonstrated to be very convenient
because of its simplicity and low cost in comparison with the other method such as sputtering
and vapor deposition. Pure tin is non-toxic, can be electrodeposited as an extremely bright, white
and lustrous deposit. It has excellent resistance to corrosion and easily to be soldered. As
mentioned previously, it is being applied to produce tin cans for food packaging. However, pure
tin is soft and is not practical to be used as coated material for automotive applications. While the
hardness of alloys coatings such as White Mir alloy (55%Cu-45%Sn or 55%Cu-30%Sn-15%Zn)
and Yellow Mir alloy (80%Cu-17.5%Sn-2.5%Zn, 80%Cu- 15%Sn-5%Zn or 85%Cu-15%Sn) are
respectively 550 HV and 400 HV. These coating layers are extremely abrasion resistant and are
suitable for automotive application. The coatings also exhibit other interesting characteristics
such as low surface tension, good sliding ability, high hardness, sufficient ductility; solder
ability, low porosity and/or resistance to corrosion depending on their composition. Such
properties have led to these coating being widely used in industries. For example, because of
White Mir alloys exhibit an acceptable contact resistance. [9], it may be used for coating electric
connectors. Moreover, worn machine parts can be re-electroplated by these alloys to extend their
service live. These may lead to a decrease in the cost of the parts. Recently, it has been reported
that electroplating of Cu-Sn alloys can be successfully done in laboratories using non cyanide
solution e.g. in acid sulfate solution. Even though co-deposition of such alloys can be done using
non cyanide baths, most of the industrial tin alloys plating use cyanide solutions because of the
high quality requirement of the coating. Electrode position in cyanide bath will produced
adherent, smooth and uniform coating on both planar and non-planar substrates. Moreover
quaternary alloys (e.g. an alloy which contains Cu 50 %wt., Sn 32 %wt., Zn 17 %wt. and Ni
1%wt) can be easily electrode posited from cyanide baths. Cyanide is deemed typical of
completing agents that have been used for long time in providing stable solution. It is still used
intensively in industries such as in gold extraction plants and in electroplating industries as

“strike” solution. [10]. However, extra care has to be performed to avoid fatal accident and to
eliminate environmental problem especially during disposal of cyanide. Despite the fact that
cyanide systems are the most toxic electrolytes known, the technology of waste disposal
treatment on them is well established and has been implemented in industries for many years.
1.2 PROBLEM STATEMENT
For this evaluation, current process of nickel electroplating on copper and nickel is considered to
be around 3 to 15 mint to get some of coating on material. The experiment was divided into 8
units. It was conducted with constant time to get different thicknesses for each of the
electroplating. In addition, different type of material to coat has a different of microstructure
after electroplating on market. One of the most effects to focus during screening the surface is
morphology test by using SEM (scanning electron microscope). All specimens are rectangular in
shape with 0.05 m x 0.03 m x 0.001 m in size. But for the future improvement during electro less
plating process, it required to use various types of shape on specimen with various time coating

1.3 PROJECT OBJECTIVES
Basically this project is based on these two objectives:
 To evaluate the effect of nickel and zinc electroplating on metal.
 To study the result of electroplating by using different chemical analysis on metal
 Treatment of electroplating wastewater containing Cu2+, Zn2+
 To study of Electroplating of Amorphous Thin Films of Tungsten/ Nickel Alloys
 To study of Electrode position of Ni–Sic Nano-composite coatings and evaluation of
wear and corrosion resistance and electroplating characteristics
 To study of Copper Electroplating Technology

1.4 PROJECT SCOPE OF WORK
In this study, the experiment or analysis test will be held in the Material Laboratory and the area
of university lab. This process is carried out by a chemical reaction and without the use of an
external source of electricity. The scopes of the study are as follows:-
a) For the test in the laboratory, the Sodium hypophosphite is consider to use as the
reducing .It is mainly used for electro less nickel plating and with this method, a durable
nickel-phosphorus film can coat objects with irregular surfaces, and can widely be used
Ionics, aviation and the petroleum field.
b) Use the nickel metal as Anode (positive terminal) and a piece of metal as a
Cathode (negative terminal) in Sodium hypophosphite.
c) Plating area wills conduction in Material Laboratory at university lab by following a
Parameter needed.
d) Parameters that will be analyzed is a constant coating time during conducts the
Electroplating, concentration of solution (contents, mole and pH) and
Types of solution that use during electro plating process (fix and constant

1.5 SIGNIFICANCE OF THE STUDY
Electro nickel (EN) plating is a chemical reduction process that depends upon the catalytic
reduction process of nickel ions in an aqueous solution (containing a chemical reducing agent)
and the subsequent deposition of nickel metal without the use of electrical energy. Thus in the
Electro nickel plating process, the driving force for the reduction of nickel metal ions and their
deposition is supplied by a chemical reducing agent in solution. This driving potential is
essentially constant at all points of the surface of the component, provided the agitation is
sufficient to ensure a uniform concentration of metal ions and reducing agents. The electro
deposits are therefore very uniform in thickness all over the part‟s shape and size..[11] The
process thus offers distinct advantages when plating irregularly shaped objects, holes, recesses,
internal surfaces, valves, threaded parts, and so forth. Electro less as autocatalytic nickel coating
provides a hard, uniform, corrosion-, abrasion-, and wear-resistant surface to protect machine
components in many industrial environments. EN is chemically deposited, making the coating
exceptionally uniform in thickness. Careful process control can faithfully reproduce the surface
finish, eliminating the need for costly machining after plating. In a true electro less plating
process, reduction of metal ions occurs only on the surface of a catalytic substrate in contact with
the plating solution. As a result, electro less plating processes are widely used in industry to meet
the end-use functional requirements and are only rarely used for decorative purposes. Electro less
plating is ideal for the salvage of miss-machined parts & recycling worn components and it can
reduce wear and corrosion. Besides, electro less plating can be hardened on metal that using and
it can change magnetic tendency of a substrate.
Oxidation-reduction (redox) chemistry occurs in two types of electrochemical cells: electrolytic
and galvanic. In electrolytic cells, a voltage source provides the electrical energy that produces
chemical change. In galvanic cells, a chemical reaction occurs spontaneously, without an
external source of electrical energy. The batteries that power our flashlights, hand-held electronic
games, and cars are common examples of galvanic cells. Recharging a battery is an electrolytic
process that uses an external source of electrical energy to reverse the direction of the reaction.
[12]

CHAPTER 2
( LITERATURE REVIEW)
Metal finishing is the name given to a wide range of process carried out in order to modify the
surface properties of a metal, e.g. by the deposition of a layer of another metal alloy, composite,
or by formation of an oxide film. The origins of the industry lay in the desire to enhance the
value of metal articles by improving their appearance, but in modern times the importance of
metal finishing for purely decorative reason has decreased. The trend is now towards surface
treatment which will impart corrosion resistance or particular physical or mechanical properties
to the surface (e.g. electrical conductivity, heat or wear resistance, lubrication or solder ability)
and hence, to make possible the use of cheaper substrate metals or plastics covered to give them
essential metallic surface properties. It should be emphasized that not all surface finishing is
carried out using electrochemical methods.[13]but electroplating is still represents a large portion
of the metal finishing industry.
Preparation of Cu2ZnSnS4thin films by sulfur zing electroplated precursors is Cu2ZnSnS4
(CZTS) thin films are one of the most promising materials for low-cost thin-film solar cells since
they consist of abundant materials, and have a band-gap energy of 1.4–1.5 eV and an absorption
coefficient of104 cm1 [14]. In 1988, Ito and Nakazawa reported the photovoltaic effect in a
heterodiode for the first time. Subsequently, several researchers have fabricated CZTS thin films
by RF magnetron sputtering and hybrid sputtering .We have reported the fabrication and
characterization CZTS thin-film solar cells Recently, a conversion efficiency of 5.74% has been
achieved in CZTS-based solar cells by growing CZTS films using a co-sputtering system
equipped with an annealing chamber [15]. All of these CZTS thin-film deposition processes were
performed in vacuum, so that the CZTS thin films produced were quite expensive and it was
difficult to produce films having large areas. In order to further reduce the cost of producing
CZTS thin films, it is necessary to use a non-vacuum process. Several research groups have
fabricated CZTS thin films using a spray technique, photochemical deposition and a sol–gel
method [16]. For the chalcopyrite CuInS2, which has an analogous structure to that of CZTS, the
sulfurization of a Cu/In precursor layer electroplated onto a Mo-coated glass substrate has been
studied. To the best of our knowledge, this type of process has not been applied to the

preparation of CZTS thin films. In this paper, we propose a novel CZTS thin-film fabrication
process that involves electroplating. This method is anticipated to have the advantages of being
low cost and of being capable of producing large-area films.
Copper Electroplating Technology for Micro via Filling is this paper describes a copper
electroplating enabling technology for filling microvias. Driven by the need for faster, smaller
and higher performance communication and electronic devices, build-up technology
incorporating microvias has emerged as a viable multilayer printed circuit manufacturing
technology. Increased wiring density, reduced line widths, smaller through-holes and microvias
are all attributes of these High Density Interconnect (HDI) packages. Filling the microvias with
conductive material allows the use of stacked vias and via in pad designs thereby facilitating
additional packaging density. [17]. other potential design attributes include thermal management
enhancement and benefits for high frequency circuitry. Electrodeposited copper can be utilized
for filling microvias and provides potential advantages over alternative via plugging techniques.
The features, development, scale up and results of direct current (DC) and periodic pulse reverse
(PPR) acid copper via filling processes, including chemistry and equipment, are described.
The continuing trend of portability and increasing functionality of electronic devices has driven
the miniaturization and increased wiring density of printed circuit boards (PCBs) [18].
Conventional multilayer PCBs with through hole interconnect vias are not really a practical
solution to satisfy these density requirements. This has driven the introduction of alternative
approaches for high density interconnects (HDI) for example sequential builds up (SBU)
technologies incorporating microvias. A number of differing SBU/microvia technologies are
employed however a common feature is the achievement of increased densification. Novel and
enabling copper electroplating DC and PPR via fill systems have been developed for reliable and
consistent blind via filling. [19]. each system has distinct attributes and offer the end user the
flexibility to select a via fill process best tailored for their application
Amorphous alloys present a separate class of materials, different from regular polycrystalline
metals. Although both polycrystalline and amorphous thin films may have the same composition,
they differ in many physical and electrical properties. Amorphous alloys do not have grain
boundaries, thus they have better corrosion resistance and their permeability to diffusion of metal
ions is lower. Amorphous alloys can be prepared by very fast cooling of the molten alloy, at rates

that are on the order of 1 × 106 °C/s.[20] Brenner2 was the first to develop a low-temperature
method for plating amorphous Ni/P alloys from an electro less plating bath, employing
NaH2PO2 as the reducing agent. Similar baths have been developed for amorphous Co/P plating.
When a compound such as dimethylaminoborane is used as the reducing agent, similar
amorphous alloys, which contain boron instead of phosphorus, are produced [21]. Electro less
plating baths for plating Co/W/P alloys that were “X-ray amorphous”, as determined by X-ray
diffraction, but Nano crystalline, as determined by TEM, have been developed recently. The
electroplating of W/Ni alloys has been studied for a long time. Careful examination of the alloys
by different techniques proved that there was no oxygen in the bulk. Surprisingly, he reports that
the tungsten content of the alloys was independent of pH and of the concentration of the iron-
group metal in the plating bath, over a wide range. Yamasaki et al. [22] studied the mechanical
properties of Ni/W alloys before and after annealing at high temperatures and reported the
existence of amorphous alloys when the tungsten content of the alloy exceeded about 20 a/o. The
commonly used plating bath for Ni/W deposition consists of a solution of NiSO4, Na2WO4, and
Na3Cit, in which the pH is adjusted with sulfuric acid and ammonium hydroxide to a value of
8.0. At this pH citric acid is predominantly in the form of the Coition. The tungsten content
reported is usually in the range of 5-25 a/o. It was found difficult to increase the concentration of
W in the alloy, even when the concentration of the WO4 2- ion in solution was in large excess,
compared to Ni2+. It should be noted that the citrate ion, which is known to form complexes
both with Ni18 and with the Tung state ions added as a ligand. Ammonium hydroxide or an
ammonium salt, on the other hand, is added to increase the Faradic efficiency and sometimes to
fine-tune the pH to a desired value, in the range of 7-9. The role of NH3 as a ligand has so far
been ignored .Electrode position of Ni–Sic Nano-composite coatings and evaluation of wear and
corrosion resistance and electroplating characteristics IS Ni–Sic Nano-composite coatings with
different contents of Sic Nano-particulates were prepared by means of the conventional electro
deposition in a nickel-plating bath containing Sic Nano-particulates to be co-deposited. The
dependence of Sic Nano-particulates amount in the Nano-composite coatings was investigated in
relation to the Sic concentration in bath, cathode current density, stir rate and temperature of
plating bath and it is shown that these parameters strongly affected the volume percentage of Sic
Nano-particulates.. [23] The deposition efficiency with and without Sic Nano-particulate in bath
was studied. The morphology and phases of the electrodeposited Nano-composite were studied.

The wear behavior of the Nano-composite coatings was evaluated on a ball-on-disk test. The
corrosion behavior of the Nano-composite coatings was evaluated in the solution of 0.5 M Na
CL at room temperature. It was found that the cathodic polarization potential increased with
increasing the Sic concentration in the bath. The micro hardness and wear and corrosion
resistance of the Nano-composite coatings also increased with increasing content of the Sic
Nano-particulate in bath. The Sic distribution in the Nano-composite coatings at low
concentrations of Sic in bath was uniform across the coatings, but at high concentrations, Sic
Nano-particulates on the surface were agglomerated. © 2007 Elsevier B.V. All rights reserved.
Research into the production of Nano-composite coatings by electrolytic co-deposition of fine
particles with metal from plating baths has been investigated by numerous investigators [24-25].
Interest in electrodeposited Nano-composites has increased substantially during the past two
decades due mainly to the fact that Nano-composite coatings can give various properties, such as
wear resistance, high-temperature corrosion protection, oxidation resistance and self-lubrication,
to a plated surface. Research on Electrode position of Nano-composite coatings has been
attention directed towards the determination of optimum conditions for their production, i.e.
current density, temperature, particle concentration and bath composition [26] Nickel, being an
engineering material, is the widely used metal matrix. Ni–Sic composites have been
commercialized for the protection of friction parts, combustion engines and casting moulds. The
availability of Nano-size particles in late 1990s and the resulting enhanced properties imparted
by them to the coating have increased the interest in the production of nickel-base Nano-
composite coatings [27]. Quite a lot of researchers have studied the incorporation of micro/sub
micro-Sic in nickel matrix. Studies have also been reported on the influence of operating
parameters on the code position of Nano-Sic. Gyftou et al. have reported the co-deposition
mechanism of micro and Nano-Sic particles incorporated in nickel matrix. The mechanical
properties of Ni–Sic Nano-composites from modified Watt‟s Bath have been studied by
Zimmerman et al. [28]. As mentioned above, a lot of research work has been carried out on the
effect of operating conditions on the mechanical properties of Nano-composite coatings [29] but
very few have examined the influence of electrochemical aspects such as determination of the
cathodic efficiency on the co-deposition process and the properties of the resulting Nano-
composite coatings. This paper presents results of research into the Electrode position of Ni–Sic
Nano-composite coatings with particular reference to the electroplating parameters of the bath

used. The microstructure and surface morphology of the composite coatings were investigated.
The effects of the incorporated Sic on the catholic efficiency of bath, corrosion and wear
resistance of the Nano composite coatings were analyzed .Electro less (without the use of
electricity) plating refers to the deposition of metal layers over a suitably treated / activated
surface in a controlled manner so as to prepare the material / substrate for further electroplating
process .Plating using electro less technique is more frequently used in POPs due to its
advantages like giving an unbroken uniform coating on materials with greater complexity, its
easiness in transforming nonconductors into conductors, its inexpensiveness, etc., makes it an
affordable and reliable technique for POPs [30]. The reducing agent actually converts the metal
ions (Mn+) to the metal (M) which gets plated over a catalytic surface as shown in Eqn. 2.1.
𝑀𝑛+ + 𝑅𝑒𝑑𝑢𝑐𝑖𝑛𝑔𝑎𝑔𝑒𝑛𝑡𝑐𝑎𝑡𝑎𝑙𝑦𝑡𝑖𝑐𝑠𝑢𝑟𝑓𝑎𝑐𝑒 → 𝑀 + 𝑂𝑥𝑖𝑑𝑖𝑧𝑒𝑑𝑝𝑟𝑜𝑑𝑢𝑐𝑡 …2.1
The driving force in electro less plating is an autocatalytic redox reaction on a pretreated active
surface. An important aspect of electro less plating is the preparation of the surface of the object
such that an active surface is obtained and for that, the electro less plating process involves
degreasing, etching, surface seeding with a catalyst, electro less plating and electroplating. [31]
(a) The degreasing process is usually a cleaning process that uses alkaline or acid solutions
containing surfactants to remove oils and 53 other organic chemicals and make the surface of the
polymer dirt free. (b) Chromic acid and/or sulfuric acid are some of the strong oxidative acids
used for chemical etching or hydrogen peroxide, to roughen the sample surface for adhesion
enhancement [32]. The roughening actually creates a bonding site for further plating of samples.
(c) Surface seeding with a catalyst involves treating the surface of polymers with stannous
chloride and a palladium chloride solution alternatively
(d) In the electro less plating, the catalyst imbued polymer substrate is dipped in a solution
containing a metal salt, a reducer, a stabilizer and a buffer system.
(e) Electroplating involves the deposition of a metal over the electro less plated substrate, by
electrolysis. This process actually produces a dense, uniform and adherent coating, which may
later be used for decorative and/or protective purposes or for enhancing the specific properties of
the surface .Damascene Cu electroplating for on-chip metallization, which we conceived and
developed in the early 1990s, has been central to IBM'S Cu chip interconnection technology. We

review here the challenges of filling trenches and vias with Cu without creating a void or seam,
and the discovery that electrode position can be engineered to give filling performance
significantly better than that achievable with conformal step coverage. This attribute of super
conformal deposition, which we call super filling, and its relation to plating additives are
discussed, and we present a numerical model that represents the shape-change behavior of this
system.
The advantages of Cu relative to Al (Cu) for chip wiring, which include lower resistance, higher
allowed current density, and increased scalability [33], have long been recognized. Copper
metallization of chips has thus been the subject of intense investigation for more than a decade
[34]. In 1997, IBM published results from fully integrated devices with Cu interconnections that
showed a 40-45% drop in the resistance of cladded Cu wiring compared to Al(Cu) wiring, and a
substantial improvement in electro migration resistance. A paper on Cu interconnections was
also published by Motorola [35]. We have developed electroplating technology for copper that
has been successfully implemented in IBM for the fabrication of chip interconnect structures. In
this paper we discuss aspects of the plating process in relation to a method of integration called
damascene (or dual damascene). We show that under certain conditions, electroplating inside
trenches occurs preferentially in the bottom, leading to void-free deposits. We call this
phenomenon super filling. We present a mathematical model of super filling based on the
assumptions that additives--compounds added in Cu plating solutions to improve deposit
properties--are consumed on the wafer surface and suppress the kinetics of Cu deposition. Since
interior locations of trenches are less accessible to additives, less suppression of the reaction
kinetics occurs there, causing higher deposition rates. Super filling seems to be a unique property
of electroplating, which is therefore a particularly suitable technology for the fabrication of Cu
chip interconnections.
In order for a metal or alloy to be deposited on the surface of a wafer by electroplating, it is first
necessary to cover the surface with a seed layer, or plating base, whose function is to conduct the
current from a contact at the wafer edge to all points on the wafer where a deposit is desired. The
requirement of a seed layer has led to a variety of approaches for the integration of plating; two
such approaches Through-mask plating uses a masking material on top of the seed layer.
Electroplating occurs only on those areas of the seed layer that are not covered by the mask. The

masking material and the surrounding seed layer are subsequently removed. Through-mask
plating has been implemented in the fabrication of thin-film recording heads and C4
interconnections [36].
Damascene plating, in contrast, involves deposition of the seed layer over a patterned material,
which, in the case of interconnects structures, is the insulator, a functional part of the device that
must remain in place. The plated metal covers the entire surface; excess metal must be removed
by a planarization step such as chemical-mechanical polishing (CMP).
Damascene electroplating is ideally suited for the fabrication of interconnect structures, since it
allows inlaying of metal simultaneously in via holes and overlying line trenches [37] by a
process called dual damascene. Further, it is compatible with the requirement for a barrier layer
between the seed layer and the insulator; the barrier prevents interaction between the metal and
the insulator [38]. The foremost requirement for success of the plating process (as well as for any
other process of potential use in the fabrication of damascene copper interconnects) is its ability
to fill trenches, vias, and their combinations completely, without any voids or seams. How
plating makes it possible to obtain void-free and seamless deposits is discussed in the next
section.

CHAPTER 3
(Methodology)
3.1 Design of Component for electroplating plant;
Electroplating bath box
Electroplating bath box is made from acrylic sheet. The size of this plant length is 457mm,
304mm width 304mm, 5mm thickness. Acrylic is a plastic manufactured using one or more
derivatives of acrylic acid. Polymethyl Methacrylate acrylic, or PMMA, is one of the more
widely used forms of acrylic due to its exceptional weather ability, strength, clarity and
versatility. There are a variety of acrylic polymer grades available for extrusion and injection
molding manufacturing processes. Transparent, translucent opaque and colored polymers are
available with varying levels of heat resistance, light transmissions, impact strength, flow
rates and release capabilities. PMMA acrylic sheet exhibits glass-like qualities – clarity,
brilliance, transparency, translucence – at half the weight with up to 10 times the impact
resistance. It can be tinted or colored, mirrored or made opaque. A number of coatings can be
applied to a sheet or finished part for performance enhancing characteristics such as scratch
resistance, anti-fogging, glare reduction and solar reflectivity.

Figure.2. Electroplating bath box drawing with anode and cathode
Anode
Anode
Cathode

ISOMETRIC VIEW
TOP VIEW
FRONT VIEW SIDE VIEW

Electrode
The two type of electrode which can used in electroplating plant.
 Anode
The positively charged electrode by which the electrons leave an electrical device. The
negatively charged electrode of an electrical device, such as a primary cell, those supplies
current.
 Cathode
The negatively charged electrode by which electrons enter an electrical device. The
positively charged electrode of an electrical device, such as a primary cell, that supplies
current.
Figure 3.of Anode and Cathode
Power supply
A power supply is an electronic device that supplies electric energy to an electrical load. The
primary function of a power supply is to convert one form of electrical energy to another and, as
a result, power supplies are sometimes referred to as electric power converters.

This is a transformer less power supply for low current applications. C1 is the X rated AC
capacitor that reduces high volt AC. D1-D4 rectifies AC to DC and C2 removes ripples. R1 is
the bleeder to remove stored current in AC when power is off. R2 limits inrush current. A Zener
can be used in the output to get regulated DC .We use this power supply for convert 220 v AC to
12 V DC for ionization.
Figure 4.220 primary 12v secondary step-down transformers
Chemicals
Clean agent AM 104 2.25 KG
Nitric acid HNO3
H2SO4 means Sulfuric Acid
Zinc plate
Chrome salt

Sodium cyanide NaCN
Caustic soda 1/2kg
ZN brighter ½ kg
Water
10kg water is used for week solution.
3.2 Process for Electroplating
Process 3.2.1;
 Degreasing
Solvent degreasing is a process used to prepare a part for further operations such as
electroplating or painting. Typically it uses petroleum, chlorine, or alcohol based solvents to
dissolve the machining fluids and other contaminants that might be on the part . We use
clean agent AM104 with water .After making solution heat the solution 50~70 c and dipping
the part for 5 minute .The ph. of solution 10~14.
Figure.5.Acid dips for degreasing

Process 3.2.2;
 Rinsing water
Rinse Water Options It may not be typical for all metal finishing operations but it is fairly
common to have water costs at or near the top of the cost of operations. Rinsing is critical in
the metal finishing process but more water use does not necessarily mean better rinsing.
 Best practices for producing effective rinsing are:
 Double counter flow immersion rinse tanks between process tanks.
 Reactive rinsing for the appropriate process chemistry combinations.
 Spray rinsing.
 Rinse controls such as automatic valves controlled by timers or water conductivity limits.
 We use the 10 liter water at normal temperature for rinsing.
Figure.6.Rinsing water

Process 3.2.3;
 Zinc plating
Electroplated zinc protects steel, cast iron, malleable iron, copper, and brass from destructive
corrosion. The zinc chemically bonds to the part surface and functions as a "sacrificial coating",
corroding before the base material but in the process greatly extending part life. To increase the
corrosion protection Chem Processing Inc. offers RoHS compliant clear trivalent chromium and
yellow trivalent chromium seals, as well as yellow dichromate and olive drab hexavalent
chrome-based seals. Chemo Processing, Inc. also offers a range of inorganic and organic
topcoats; such as Doer kenDeltaSeal that can significantly enhance the corrosion protection
offered by zinc Plating. ContactCPI for more on these options. Zinc is an efficient, economical
coating, with a minimal environmental impact. Plated zinc is not recommended for equipment
that is continually immersed in solutions, petroleum applications, pharmaceutical applications, or
foodhandling applications. Zinc should not be used in vacuum (spaceflight) applications
(seeNASAprohibition ). It is also not recommended for aerospace applications.
 In zinc plating we use Zn 2kg
 Sodium cyanide 1kg
 Caustic soda ½ kg
 Zinc brightener ½ liter
 Normal room temperature
 Ph of week solution is 12~1

Figure.7.Zinc plating
Selection of Zinc Coatings
Once the decision is made to use a zinc coating for corrosion protection, a few additional factors
must be considered to ensure the proper coating is selected for the application and service
environment. Each zinc coating covered in this section provides varying degrees of corrosion
protection and it is important to identify the corrosiveness of the exposure environment to
determine if the coating selected will provide adequate service life.
Some zinc coatings will be eliminated by the nature alone, (zinc coating processes limited to
small parts or sheet steels cannot be considered for the protective coating of structural steel
members); others may be ruled out based on cost, appearance, availability, etc.

Table 1the coating densities, in terms of thickness required to equal 1 oz. of
zinc per square foot of surface,

Coating Thickness vs. Coating Weight
The service life of zinc coatings is a linear function of the zinc coating thickness. However, zinc
coating thickness alone can be deceiving when evaluating zinc applied by different processes. In
addition to thickness, the amount of available zinc per unit volume, or density, is also important.
Various ASTM and/or other specifications require different weights or thicknesses, so it is
imperative to convert all coatings to a common denominator for comparison. While coating
densities for some types of zinc coatings are nearly identical, others differ considerably. The
coating densities, in terms of thickness required to equal 1 oz of zinc per square foot of surface,
are:
Coating Thickness to reach 1 oz/ft2
Hot-dip galvanizing (batch or continuous), electroplating, zinc plating 1.7 mils (43 µm)
Metallizing (zinc spraying) 1.9 mils (48 µm)
Mechanical plating 2.2 mils (55 µm)
Zinc-rich paint 3-6 mils (75-100 µm)
Table 2the coating densities, in terms of thickness required to equal 1 oz of
zinc per square foot of surface,

Each of these thicknesses, representing the same weight per unit area of zinc, would be expected
to provide equivalent service life; i.e. 1.7 mils of hot-dip galvanized would give about the same
service life as 2.2 miles of mechanical plating or 3-6 mils (depending on the paint formulation)
of zinc-rich paint, assuming bond strength and edge protection are not factors . It is also
important to remember for all continuous galvanized sheet materials, including electro
galvanized, the coating weight is given for the total for both sides of the sheet. To obtain the
amount of zinc per unit area of surface, the weight given must be divided in two, assuming equal
distribution on both sides. For example, an ASTM A653 Class G90 sheet contains 0.90 oz. /ft2
of
zinc or about 0.45 oz. /ft2
per side.
Chemical Processing Inc. Zinc Plating Capabilities:
 Plating thickness range of 0.0001 to 0.002 in.
 Precision rack processing
 Bulk barrel processing
 Precision masking
 Post-plate hydrogen Embrittlement relief thermal treatment
 RoHS compliant clear, yellow and black post-plate treatments
 Clear, yellow, black and olive drab chromate treatments
 XRF thickness analysis

Process 3.2.4;
 Rinsing water
Rinse Water Options It may not be typical for all metal finishing operations but it is fairly
common to have water costs at or near the top of the cost of operations. Rinsing is critical in
the metal finishing process but more water use does not necessarily mean better rinsing.
 Best practices for producing effective rinsing are:
 Double counter flow immersion rinse tanks between process tanks.

 Reactive rinsing for the appropriate process chemistry combinations.
 Spray rinsing.
 Rinse controls such as automatic valves controlled by timers or water conductivity limits.
 We use the 10 liter water at normal temperature for rinsing.
Figure.8. rinsing water
Purpose
The purpose of this experiment is to make a copper ornament plated with zinc, introducing the
procedure of electroplating zinc onto copper. It also investigates the oxidation-reduction reaction
involved in this process.
3.3 Types of Electroplating Processes
Depending on the size and geometry of the work pieces to be plated, different plating processes,
including mass plating, rack plating, continuous plating, and in-line plating, may be adopted.
[39]

Mass Plating
Mass plating is used for small work pieces to be plated in large quantities, such as nuts and
bolts, but it is not used for delicate work pieces. The most widely used mass plating system is
called barrel plating, where the work pieces are loaded into a plating barrel. Other mass plating
containers include plating bells and vibratory units.
Figure.9. Mass Plating
Rack Plating
Some work pieces cannot be mass plated because of their size, shape, or special features. Rack
plating means work pieces are mounted on a rack for the appropriate pretreatment plating and
post treatments. Racks are fixtures suitable for immersion in the plating solution. Rack plating is
sometimes called batch plating.
Figure.10. Rack Plating

Continuous Plating
Continuous plating means the work pieces to be plated move continuously passing either one
row or between two rows of anodes. Continuous plating is usually used for a work piece of
simple and uniform geometry, such as metal strip, wire, and tube.
Figure.11.Continuous Plating
In-Line Plating
In-line plating is used to integrate the plating and finishing processes into a main production line.
The benefit of in-line plating includes exclusion of pretreatment steps and a significant reduction
in material, chemical and energy consumption, and waste discharge.
Figure.12.In-Line Plating

3.4 Types of Metal Coatings
Plating metals can be roughly classified into the following categories with the typical
applications.[40]
Sacrificial Coatings
Sacrificial coatings are primarily used for the protection of the base metal, usually iron and steel.
Another name for sacrificial coating is anodic coating, because the metal coatings are anodic to
the substrate metal, so the coatings sacrifice themselves to protect the base metal from corrosion.
Zinc (Zn) and cadmium (CD) coatings can be used as sacrificial coatings. Because of high
toxicity, cadmium plating is now forbidden by law in many countries.
Figure.13. Sacrificial Coatings
Decorative Protective Coatings
Decorative protective coatings are primarily used for adding an attractive appearance to some
protective qualities. Metals in this category include copper (Cu), nickel (Ni), chromium (Cr),
zinc (Zn), and tin (Sn).
Figure.14. Decorative Protective Coatings

Engineering Coatings
Engineering coatings (sometimes called functional coatings) are used for enhancing specific
properties of the surface, such as solder ability, wear resistance, reflectivity, and conductivity.
Metals for engineering purpose include precious gold (Au) and silver (Ag), six platinum metals,
tin, and lead (PB). The six platinum metals are ruthenium (RU), rhodium (RH), palladium (Pd),
osmium (Os), iridium (IR), and platinum (Pt). These six metals are noble, i.e., with positive
electrode potentials and they are relatively inert.
Figure.15. Engineering Coatings
Minor Metal Coating
Minor metals here refer to iron (Fe), cobalt (Co), and indium (In). They are easily plated but
have limited applications in electroplating.
Unusual Metal Coating
The unusual metals are rarely electroplated and can be divided into the following categories: 1)
easily palatable from aqueous solutions but not widely used, such as arsenic (As), antimony (Sb),
bismuth (Bi), manganese (Mn), and rhenium (Re); 2) palatable from organic electrolyte but not
aqueous electrolyte, such as aluminum (Al); and 3) palatable from fused-salt electrolyte but not

aqueous electrolyte, including refractory metals (named because of their relatively high melting
points), such as titanium (Ti), zirconium (ZR), hafnium (HF), vanadium (V), niobium (NB),
tantalum (Ta), molybdenum (Mo), and tungsten (W). The periodic table in Fig. 3 shows that the
metals that can be electrodeposited from aqueous solutions are those inside the frame.
Alloy Coatings
An alloy is a substance that has metallic properties and is composed of two or more chemical
elements, at least one of which is a metal. The elements composing the alloy are not
distinguishable by the unaided eye. Examples of alloy coating include gold–copper–cadmium,
zinc–cobalt, zinc–iron, zinc–nickel, brass (an alloy of copper and zinc), bronze (copper–tin), tin–
zinc, tin– nickel, and tin–cobalt. Alloy coatings are produced by plating two metals from the
same solution.
Multilayered Coatings
Multilayered coatings are produced by plating different metals from the same solution at
different potentials. A pulse train-shaped potential is enforced, resulting in the multilayer
deposition. For example, multilayered coatings based on copper, nickel, chromium, in that order,
can be applied to either metal or plastic components for visual appearance, corrosion and wear
resistance, and weight saving.
Composite Coatings
Composite materials can be defined as coatings consisting of minute second-phase particles
dispersed throughout a metal matrix. The size of the second phase particles may range from 10
mm down to Nano scale and the particles can be inorganic, organic, or occasionally metallic. The
presence of fine particles in a metal matrix generally improves its mechanical and chemical
properties, resulting in a wide range of applications. Composite coatings with an electrodeposited

metal matrix and nonmetallic inclusions have excellent wear resistance and permit emergency
dry running of machinery.
Conversion Coatings
Conversion coatings are formed by a reaction of the metal on the surface of the substrate with a
solution. [41] For example, chromate coatings are formed by the reaction of water solutions of
chromic acid or chromium salts. The chromate coatings can be applied to aluminum, zinc,
cadmium, and magnesium. The coatings usually have good atmospheric corrosion resistance.
Chromate coatings are widely used in protecting common household products, such as screws,
hinges, and many hardware items with the yellow-brown appearance.
Anodized Coatings
Anodizing is produced by electrochemical conversion. In an anodizing process, the metal work
piece to be plated is the anode in a suitable electrolyte. With the electric current passing through
the electrolyte, the metal surface is converted to a form of its oxide. An anodizing process is
usually used on aluminum for protection and cosmetic purposes. The electrolyte provides oxygen
ions that react with metal ions to form the oxide, and hydrogen is released at the metal or carbon
cathode. Anodizing differs from electroplating in two aspects. In electroplating, the work piece
to be plated is the cathode, and the metallic coatings are deposited on the work piece. In
anodizing, the work piece is the anode, and its surface is converted to a form of its oxide.
3.5 Related Processes
The related processes for metal deposition include electro less deposition, immersion plating, and
electroforming .They follow the basic principles of electrochemistry.
Electro less Deposition (Autocatalytic Plating)
A special type of electroplating is called electro less deposition, autocatalytic plating, or
„„chemical deposition.‟‟ In electro less plating, there is no external power source. The deposited
metal is reduced from its ionic state in solution by a chemical reducing agent. This reaction takes

place only on a catalytic surface. Therefore, once deposition is initiated, the metal deposited
must itself be catalytic for the deposition to continue. Not all metals can be plated auto
catalytically. The reducing agents are usually more expensive electron sources as compared with
the electric current. The major advantages of electro less deposition are as follows:
 It can be used to deposit metal on nonconductive surfaces, such as plastics, glass, or
ceramics. Some proper pretreatment steps are needed to activate these surfaces. The
metalizing of printed circuit board is one such example.
 The throwing power is perfect. Deposits are laid down on the surface with no excess
buildup on projections or edges.
Immersion Plating
Immersion plating is the deposition of a metallic coating on a substrate by chemical replacement
from a solution of salt of the coating metal. It requires no electric circuitry or source of power,
but it differs from autocatalytic plating in not requiring a chemical reducing agent to reduce the
metal ions to metal. Immersion deposition stops when the substrate is completely covered by a
layer of coating. The major advantages of immersion plating include simplicity, minor capital
expense, and the ability to deposit in recesses and on the inside of the tubing. But, the
applicability of immersion plating is limited.
Figure.16. Immersion Plating

Electroforming
Electroforming is to produce or reproduce a metal work piece by electrode position in a plating
bath over a base form (mold) or mandrel, which is subsequently removed. In some cases, the
mandrel or mold may remain within the finished metal work piece. A mandrel is a form used as a
cathode in electroplating. The advantage of the process is that it faithfully reproduces a form of
mandrel exactly, to within one micrometer, without shrinkage and distortion associated with
other metal forming techniques, such as casting, stamping, and drawing. Because the mandrel is
machined as an outside surface, close dimensional tolerances and high surface finishes can be
held and maintained on complex interior configurations. The disadvantage of electroforming
includes slow production, relatively high cost, design limitations of the geometry, and the
separation of work pieces from the mold or mandrel.
Figure.17.electroforming

3.6 The uses of electroplating
Decoration
Chrome plate
The most familiar of all electroplated coatings is chrome plate, not as common as it used to be
on cars, but usual still on bicycles, domestic goods and fittings, hospital equipment, tubular
furniture and wire goods, as well as many fasteners and other small items. The surface is usually
bright, but satin and black finishes are also available. In spite of the name, chrome plate is
mainly a nickel coating, sometimes on a copper undercoat, with only a thin top coat of
chromium. Whether it is bright, satin or matt depends on the surface texture of the nickel, but
black chrome-requires an additional process. If produced to the appropriate specification, its
decorative appearance is very long-lasting in most conditions of use. This is because chromium
is hard and abrasion resistant and, although inherently a base metal rapidly forms a tenacious,
impermeable and self-healing oxide film, which causes it to behave in a noble manner in
ordinary atmospheric conditions. Thus it is highly resistant to tarnish and corrosion. The metal is
brittle, however, and is deposited in a stressed condition, so that cracking occurs when the
thickness exceeds one or two micrometers (µm)*, the precise limiting thickness depending on
the plating conditions. At thicknesses below about 0.5 µm, the coating is porous. Consequently,
as the thickness varies significantly over a shaped article, it is difficult to achieve a chromium
coating that is entirely free from discontinuities. Fortunately, the underlying nickel is resistant to
corrosion and able to delay penetration to the basis metal without giving rise to unsightly
corrosion product
Figure.18. Chrome plate

PROJECT FLOW DIAGRAM
Gather information
Collection information
Analysis on Parameter
Experiment preparation
Polishing process
Analysis on physical properties
Discussion
Figure.19.Flow Chat
Morphology test
Documentation
start
End

CHAPTER 4
4.1 Data Analysis and Discussion
Electroplating is the application of a metal coating to a metallic or other conducting surface by
an electrochemical process. The article to be plated (the work) is made the cathode (negative
electrode) of an electrolysis cell through which a direct electric current is passed. The article is
immersed in an aqueous solution (the bath) containing the required metal in an oxidized form,
either as an equated cat ion or as a complex ion. The anode is usually a bar of the metal being
plated. During electrolysis metal is deposited on to the work and metal from the bar dissolves:
At cathode Mz+ (aq) + ze- → M(s)
At anode M(s) → Mz+ (aq) + ze
Faraday's laws of electrolysis govern the amount of metal deposited. Articles are electroplated to
(i) Alter their appearance;
(ii) To provide a protective coating;
(iii) To give the article special surface properties;
(iv) To give the article engineering or mechanical properties.
4.2 The Purposes Of Electroplating
Some of the purposes for which articles are electroplated are:
(1) Appearance
(2) Protection
(3) Special surface properties
(4) Engineering or mechanical properties.
The distinctions between these aims are not, of course, clear-cut and there are many overlapping
categories. A deposit applied purely for appearance must be, at least to some extent, protective as
well. But the classification is convenient. Some finishes are purely decorative. Many objects
meant to be used indoors, in a dry environment and where danger of corrosion is slight, are

nevertheless finished with lacquers, paints and electroplated coatings for purely aesthetic
reasons. The very thin layer of gold applied to some articles of inexpensive jewellery has little or
no protective value; it is there principally to attract a potential buyer.
There are many applications of electroplating; some of them of increasing importance at present,
in which neither corrosion prevention or decorative appeal is the reason for using finish. Copper
is an excellent conductor of electricity and is therefore basic to such items as printed circuits and
communications equipment. It does, however, quickly form tarnish films that interfere with
joining operations such as soldering and that also render contact resistances unacceptably high in
relays and switches. To make soldering easier, coatings of tin or tin-lead alloys are often applied
to copper, and for better contacts over plates of gold are frequently required. Other surface
properties may call for modification; if light reflection is important, a silver or rhodium plate
may be necessary. In wave guides for radar, high electrical conductivity is the most important
criterion, and silver is the preferred coating. Good bearing properties may require coatings of tin,
lead or indium. If a hard surface is required, chromium or nickel usually will serve. These few
examples illustrate another use of metal finishing; to modify the surface properties, either
physical or chemical, to render them suitable for the intended use.
4.3The Electrolysis Cell
The components of the cell
The physical embodiment of an electroplating process consists of four parts:
1. The external circuit, consisting of a source of direct current (dc), means of conveying
this current to the plating tank, and associated instruments such as ammeters, voltmeters,
and means of regulating the voltage and current at their appropriate values.
2. The negative electrodes or cathodes, which are the material to be plated, called the
work, along with means of positioning the work in the plating solution so that contact is
made with the current source.
3. The plating solution itself, almost always aqueous, called by platters the "bath";

4. The positive electrodes, the anodes, usually of the metal being plated but sometimes of
a conducting material which serves merely to complete the circuit, called inert or
insoluble anodes.
The plating solution, of course, is contained in a tank, which must be of a material appropriate to
the solution it contains: often plain mild steel for alkaline solutions and of steel lined with
resistant material for acid solutions. Such linings may be of rubber, various plastics, or even
glass or lead. The typical plating tank will have three bare copper or aluminum conductors
running down its length; these are called bus bars, and they are insulated from the tank itself by
various means such as ceramic insulators. The two outside bars are connected to the positive side
of the dc source, and on them are hung the anodes, usually by means of hooks. The central bus
bar is connected to the negative side of the dc source and holds the work, usually held on racks
which are similarly hung on the cathode bar by hooks. The racks themselves are so constructed
as to hold one or many parts, depending on their size and shape, and are often custom-made for
the particular work being processed[43]. The racks usually are covered with insulating material
except where they make contact with the work and the cathode bus bar. When the work consists
of many small parts (screws, nuts, small electric connectors, and the like) which do not lend
themselves to being hung individually on plating racks, they may be placed in bulk in a barrel,
which takes the place of the cathode and is rotated in the plating bath so that all parts at some
time come into contact with a cathode placed inside the barrel. The barrel has holes, too small to
permit the parts to fall out but large enough to permit fairly good circulation of the solution and
passage of the electrolytic current. Barrels are of many types; some are self-contained (oblique
barrels) and hold the solution, the anode, and the cathode contact, thus dispensing with plating
tank altogether. Barrels meant to be inserted into a plating tank may be of many shapes and of
many materials, and the cathode contacts may be so-called danglers, buttons or of other forms.
Barrel plating is no different in principle from plating on racks, though it has its own problems of
design and plate distribution.[44]

Ingredients of a Plating Bath
Every plating bath contains ingredients which serve one or more of the following functions:
1. To provide a source of the metal or metals being deposited.
2. To form complexes with ions of the depositing metal
3. To provide conductivity.
4. To stabilize the solution e.g. against hydrolysis.
5. To act as a buffer to stabilize the ph.
6. To modify or regulate the physical form of the deposit.
7.To aid in dissolving the anodes.
8. To modify other properties, either of the solution or of the deposit, peculiar to the
specific case.
There are two main purposes of forming complex ions of certain actions:
 To stabilize the cat ion. Some metal cat ion is not stable in the simple equated form, e.g.
gold. They are much more stable when complexes to some ligand. The presence of the
ligand lowers the concentration of the free (equated) ion.
 To hold the equated form at suitably low concentration allowing control of the evenness
of plating.
The cyanide ion, CN-, is a common ligand forming complex ions such as Zn (CN) 42-, Cu (CN)
42-, Ag (CN) 2- and Au (CN) 2-.
The Plating Metals
Most electroplating coatings fall into one of the following six categories:
 Sacrificial coatings, used primarily for protection of the basis metal, usually iron and
steel (sometimes call anodic coatings, meaning that electrochemically they are anodic to
the substrate). Sacrificial denotes that the coatings "sacrifice" themselves in the act of
protecting the basis metal.
 Decorative protective coatings, used primarily for adding attractive appearance to some
protective qualities.

 Engineering coatings - a rather miscellaneous group whose members are used for
specific properties imparted to the surface, such as solder ability, wear resistance,
reflectivity, conductivity, and many others. They are sometimes called functional
coatings, though it would seem that protection is also a "function"
 Minor metals - a small group of metals that are easily plated but have rather limited
application.
 . "Unusual" metals - rarely electroplated, and when they are, they require special
conditions, such as non-aqueous solutions.
 Alloys - an almost unlimited number of alloys has been plated experimentally, since the
possible combinations of the plate able metals, in various proportions, are innumerable.
Only a few have attained commercial importance
4.4 Electrical Relationships
Faraday's laws of electrolysis
Michael Faraday, perhaps the greatest experimental scientist in history, enunciated his laws of
electrolysis in 1833, and these laws have remained unchallenged ever since. They are basic to
both the understanding and the practical use of electrolytic processes. They may be stated as
follows:
o The amount of chemical change produced by an electrical current is proportional to the
quantity of electricity that passes.
o The amounts of different substances liberated by a given quantity of electricity are
inversely proportional to their chemical equivalent weights.
Equivalent weight is an older term, but still used widely in analytical and electrochemistry. In
redox chemistry it is the molar mass divided by the number of electrons in the balanced redox
half-equation.
Mathematically Faraday's laws of electrolysis can be expressed as:
Q ∝ zm/M

Q = It = zFn
where Q is the charged passed, I is the current passed, t is the time the current is passed, z is the
change in oxidation state, m and M are the mass and molar mass respectively of oxidised or
reduced species, F is the Faraday constant (96 485 C mol-1, the charge of one mole of electrons),
and n is the amount of substance oxidized or reduced.
These laws correctly predict that:
 by measuring the quantity of electricity passed, one has a measure of the amount of
chemical change that will thereby be produced;
 Knowing the chemical equivalent weight of a substance, one can predict the amount of
that substance that will be liberated by a given quantity of electricity
Current Efficiency
It has been stated that the total amount of chemical change at an electrode is exactly proportional
to the quantity of electricity passing. Often, however, we are interested in only one of the several
chemical changes taking place, and any current used up in causing other changes is considered
"wasted". In the usual electroplating situation, our interest focuses on the quantity of metal
deposited at the cathode or dissolved at the anode, and any hydrogen evolved at the cathode by
the reaction
2H2O + 2e → H2 + 2OH-
Or oxygen at the anode by the reaction
2H2O → O2 + 4H+ (aq) + 4e
Represents a waste of electricity and a reduction in the efficiency of the process.
Thus we speak of percentage current efficiency as the ratio of the desired chemical change to the
total chemical change multiplied by 100:
Current efficiency (CE) = 100 x Act/Theo

Where CE is current efficiency in percent, Act is the weight actually deposited and Theo is the
weight to be expected from Faraday's laws if there were no side reactions.
Cathode efficiency is current efficiency as applied to the cathode reaction, and anode efficiency
is current efficiency as applied to the anode reaction.
Current Distribution
The current divided by the apparent area yields an average figure. Except for the simplest
geometries of a cell, such as when the anode and cathode are concentric, the current is not
uniform over the surface of an electrode. In fact, the manner in which the current distributes
itself over an electrode surface in any practical case is quite complicated, usually far too much so
to be simply calculated from geometry. Current will tend to concentrate at edges and points, and
unless the resistance of the solution is extremely low (lower than in any practical case), it will
flow more readily to parts near the opposite electrode than to more distant parts. Thus, except for
the simplest parts subject to electroplating, the thickness of deposit, which depends on the
current density, will not be uniform over the surface.
4.5 Testing Corrosion
In order to determine whether a metal, a combination of metals, or a coating system is suitable
for use in a given environment, it is necessary to test it in that environment. It is well to repeat
here that corrosion is not an action but an interaction, which involves both the metal and its
environment. It is pointless to test a panel in dilute sulfuric acid if the contemplated use involves
exposure to seawater. As nearly as possible, corrosion testing should be carried out in an
environment that simulates that in which the part will be used. For most finished metal articles,
this requirement is not at all easy to meet. Because corrosion is usually a fairly gradual process,
the user or manufacturer cannot afford to wait for the results of a test carried out in strictly
natural environments; by the time results are available, the purpose of the test - to predict the
performance of the item - would be negated [45]. Therefore many accelerated tests have been
devised, with the aim of speeding up the process of corrosion while at the same time simulating
its effects. But because the nature of the environment is so important to corrosion processes, it is
difficult to speed up the process without changing it, and the best that can be hoped is that

accelerated tests will be fairly accurate in predicting the actual service performance of an
electroplated or otherwise finished metal article.[46]
The electro coagulation process is quite complex and may be affected by several operating
parameters, such as pollutants concentrations, initial pH and current density. In order to enhance
the process performance, the effects of those parameters have been explored.
Figure.20. Effect of initial pH on metal ions removal. Initial concentrations of
Cu2+, Zn2+

CHAPTER 5
(Conclusion and Recommendations)
The results of this study have shown the applicability of electro coagulation in the treatment of
electroplating wastewater containing copper, zinc and chromium. The most effective removal
capacity was achieved in the pH range between 4 and 8. The treatment rate was shown to
increase upon increasing the current density. Indeed, the highest current produced the quickest
treatment with an effective reduction of Cu and Zn concentrations in the industrial wastewater
under the admissible level, after only 5 min. whereas; 20 min. were needed to achieve an
equivalent removal of Cr (VI). The slower removal of chromium compared to copper and zinc is
attributed to a difference in the removal mechanisms. Moreover, the charge loading required to
achieve an effective treatment, increased with initial concentration. In comparison to chemical
coagulation where several hours are needed and adsorption on activated carbon the electro
coagulation method achieves faster removal of pollutants.
The electrodeposited nickel percent depends on current density and temperature. The current
density and Sic content in solution influence the cathode efficiency; with decrease of current
density or increase of the Sic content in bath, the cathode efficiency increases. Sic Nano-
particulates can be successfully co-deposited with nickel by electrode position. The catholic
polarization potential of the Ni–Sic electrolyte increases with increasing Sic concentration in the
plating bath, but the Sic Nano-particulates do not significantly affect the electrode position
process of the nickel coating
The electroplating industry has been experiencing continuous innovations and also facing
significant challenges from economic and environmental perspectives. The purpose of
electroplating is to produce a qualified coating with the desirable attributes. Based on the
specifications of the coating and the substrate, one may select a specific electroplating process
for a given application.
Novel and enabling copper electroplating DC and PPR via fill systems have been developed for
reliable and consistent blind via filling. Each system has distinct attributes and offer the end user
the flexibility to select a via fill process best tailored for their application

The nickel copper alloy and nickel copper-alumina Nano composite deposition was carried out
on recessed electrodes and rotating cylinders from citrate electrolytes at two different pHs.
Numerical models were developed to describe steady state and Non steady state deposition,
which treat the metal depositions as reductions from M (II) species to metal. The effect of
alumina was simulated by a surface coverage model. The results and conclusions resulting are
summarized as:
1. A graded nickel-copper alloy electrodeposited by a pulse plating scheme incorporating long
off-times into 500 µm deep recesses was fabricated. Two pHs at 4.0 and 8.0 were demonstrated.
This is the first such demonstration of high aspect ratio nickel-copper alloys.
2. Alumina was introduced into the electrolyte to produce a Ni-Cu-γ Al2O3 Nano composite.
Electro deposition was successfully carried out from the composite electrolyte at both pHs
producing compositionally graded Nano composites in recesses. This is the first such
demonstration of a nickel copper composite either in a recess or a planar electrode.
3. The presence of alumina was found to increase the rate of copper deposition in the recess. An
increase in the concentration of alumina in the electrolyte resulted in an increase in the
percentage of copper in the deposit. In the low pH electrolyte, the increase was both deep in the
recess and at greater heights. In the high pH electrolyte, the effect deep within the recess was not
as pronounced as in the low pH case. In both cases the enhancement of copper increased at
greater heights. The morphology of the Nano composite deposits was smoother than the alloy.
4. The enhancement of copper concentration in the micro posts at the mouth or the recess
corresponds to the region of highest particle concentration. In addition, greater alumina
concentrations lead to an even greater enhancement.
5. The effect of alumina on the metal partial currents and the side reactions were studied using
RCE experiments. In a low pH electrolyte, the alumina shifted the nickel [47] reaction
catholically, while suppressing the copper reaction to a much smaller extent. No such effect was
observed in the high pH electrolyte. In both electrolytes the side reaction was increased.
6. The pulsing times and duty cycles applied play an important role in deep recess plating. Long
pulse off times is essential for highly recessed geometries. Increased off times beyond 70

seconds, with a 10 second on pulse did not produce any significant variation in deposit
concentration, while increased on times lead to a lower concentration of copper in the deposit.
7. A steady-state mathematical model for the Electro deposition was developed to describe the
alloy deposition on RCEs. The effect of alumina was incorporated by using a surface coverage
model. The metal partial currents and current efficiencies were successfully simulated.
8. A non-steady-state model for the deposition in the recess was developed. The model was used
to explain and understand the rise of surface pH, compositional gradients and effect of bath
composition and pH on the alloy deposition in the recess.
9. The enhancement of copper in the recess in the presence of Nano particles can be explained by
considering the effects of particle motion, micro convective effects and metal rate inhibition. The
effect of Brownian diffusion, diffusiomigration and micro convective eddies produced by
particles contribute to the fluid motion in the recess.

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