SOT (Small Outline Transistors) Diodes Crystals SOIC (Small Outline Intergraded Circuits) PLCC (Plastic Leaded Chip Carriers) PQFP (Plastic Quad Flat Pack) TSOP (Thin Small Outline Package) MELF (Metal Electrode Leadless Face)

1. A Seminar on
PRESENTED BY:
Mr. ABDUL MUNAFF
Asst. Professor
DEPARTMENT OF ELECTICAL & ELECTRONICS
ENGINEERING, SIET, VIJAYAPURA.

2. Types of SMT components
SOT (Small Outline Transistors)
Diodes
Crystals
SOIC (Small Outline Integrated Circuits)
PLCC (Plastic Leaded Chip Carriers)
PQFP (Plastic Quad Flat Pack)
TSOP (Thin Small Outline Package)
MELF (Metal Electrode Leadless Face)

3. SOT (Small Outline Transistor)

4. PLCC (Plastic leaded chip carrier)

5. Leadless Ceramic chip

6. Diode (MELF)

7. Capacitor
Case Sizes 0402-2225 0402-2225 0402-1210 0603-2225
Capacitance 0.5 pf- 100 pf 1000 pf 0.001 uf-
Range 0.065 uf 2.2 uf 0.47uf 4.7 uf

8. Resistor Case Sizes
W
L
T
H

9. Resistor Case Sizes
LENGTH WIDTH HEIGHT TERMINATION
DESIGNATION NOM (L) NOM (W) MAX (H) MIN (T)
R0402 0.04 0.02 0.016 0.004
R0603 0.06 0.03 0.024 0.006
R0805 0.08 0.05 0.028 0.006
R1206 0.12 0.06 0.028 0.01
R1210 0.12 0.1 0.028 0.01
R2010 0.2 0.1 0.028 0.014
R2512 0.25 0.12 0.028 0.014

10. MELF (Metal Electrode Leadless Face)
Cylindrical in shape (like discrete through
hole without leads)
Used for diodes (lamp), resistors, and
capacitors
May require notch land pattern

11. QFP (Quad Flat Package)

12. SOIC (tape feed)

13. Chip (tape feed)

14. QFP (matrix tray)