SPICE MODEL of 3D-22 in SPICE PARK

•

0 likes•355 views

SPICE MODEL of 3D-22 in SPICE PARK. English Version is http://www.spicepark.net. Japanese Version is http://www.spicepark.com by Bee Technologies.

Technology

Device Modeling Report

COMPONENTS: POWER THERMISTOR
PART NUMBER: 3D-22
MANUFACTURER: Ishizuka Electronics Corporation

Bee Technologies Inc.

All Rights Reserved Copyright (C) Bee Technologies Inc. 2004

Thermistor Current Transient Characteristic

Simulation result

20A

10A

0A

-10A

-20A
0s 2s 4s 6s 8s 10s
I(X_U1.Vsense)
Time

Evaluation circuit

U1

3D-22
V1
V OFF = 0
V AMPL = 10
FREQ = 50Hz

0

All Rights Reserved Copyright (C) Bee Technologies Inc. 2004

Thermal Characteristic (temperature vs. time)

Simulation result

°C
150

100

50

25
0s 2s 4s 6s 8s 10s 12s
V(X_U1.T_AVG)/1V
Time

Evaluation circuit

U1

3D-22
V1
V OFF = 0
V AMPL = 10
FREQ = 50Hz

0

All Rights Reserved Copyright (C) Bee Technologies Inc. 2004

Resistance Characteristic

Simulation result

3.0 Ω

2.0

1.0

0
25 40 80 120 160
V(X_U1.R_T)/1V
°C
V(X_U1.T_AVG)/1V

Evaluation circuit

U1

3D-22
V1
V OFF = 0
V AMPL = 10
FREQ = 50Hz

0

All Rights Reserved Copyright (C) Bee Technologies Inc. 2004

Recently uploaded

Linux Foundation Edge _ Overview of FDO Software Components _ Randy at Intel.pdfFIDO Alliance

Working together SRE & Platform EngineeringMarcus Vechiato

Secure Zero Touch enabled Edge compute with Dell NativeEdge via FDO _ Brad at...FIDO Alliance

Hyatt driving innovation and exceptional customer experiences with FIDO passw...FIDO Alliance

Collecting & Temporal Analysis of Behavioral Web Data - Tales From The InsideStefan Dietze

Introduction to FDO and How It works Applications _ Richard at FIDO Alliance.pdfFIDO Alliance

Structuring Teams and Portfolios for SuccessUXDXConf

Google I/O Extended 2024 WarsawGDSC PJATK

ERP Contender Series: Acumatica vs. Sage IntacctBrainSell Technologies

Where to Learn More About FDO _ Richard at FIDO Alliance.pdfFIDO Alliance

Portal Kombat : extension du réseau de propagande russe中央社

Event-Driven Architecture Masterclass: Engineering a Robust, High-performance...ScyllaDB

Introduction to FIDO Authentication and Passkeys.pptxFIDO Alliance

Human Expert Website Manual WCAG 2.0 2.1 2.2 Audit - Digital Accessibility Au...Skynet Technologies

Overview of Hyperledger FoundationHyperleger Tokyo Meetup

Easier, Faster, and More Powerful – Alles Neu macht der Mai -Wir durchleuchte...panagenda

Design Guidelines for Passkeys 2024.pptxFIDO Alliance

(Explainable) Data-Centric AI: what are you explaininhg, and to whom?Paolo Missier

TEST BANK For, Information Technology Project Management 9th Edition Kathy Sc...marcuskenyatta275

Breaking Down the Flutterwave Scandal What You Need to Know.pdfUK Journal

Recently uploaded (20)

Linux Foundation Edge _ Overview of FDO Software Components _ Randy at Intel.pdf

Working together SRE & Platform Engineering

Secure Zero Touch enabled Edge compute with Dell NativeEdge via FDO _ Brad at...

Hyatt driving innovation and exceptional customer experiences with FIDO passw...

Collecting & Temporal Analysis of Behavioral Web Data - Tales From The Inside

Introduction to FDO and How It works Applications _ Richard at FIDO Alliance.pdf

Structuring Teams and Portfolios for Success

Google I/O Extended 2024 Warsaw

ERP Contender Series: Acumatica vs. Sage Intacct

Where to Learn More About FDO _ Richard at FIDO Alliance.pdf

Portal Kombat : extension du réseau de propagande russe

Event-Driven Architecture Masterclass: Engineering a Robust, High-performance...

Introduction to FIDO Authentication and Passkeys.pptx

Human Expert Website Manual WCAG 2.0 2.1 2.2 Audit - Digital Accessibility Au...

Overview of Hyperledger Foundation

Easier, Faster, and More Powerful – Alles Neu macht der Mai -Wir durchleuchte...

Design Guidelines for Passkeys 2024.pptx

(Explainable) Data-Centric AI: what are you explaininhg, and to whom?

TEST BANK For, Information Technology Project Management 9th Edition Kathy Sc...

Breaking Down the Flutterwave Scandal What You Need to Know.pdf

SPICE MODEL of 3D-22 in SPICE PARK

1. Device Modeling Report COMPONENTS: POWER THERMISTOR PART NUMBER: 3D-22 MANUFACTURER: Ishizuka Electronics Corporation Bee Technologies Inc. All Rights Reserved Copyright (C) Bee Technologies Inc. 2004

2. Thermistor Current Transient Characteristic Simulation result 20A 10A 0A -10A -20A 0s 2s 4s 6s 8s 10s I(X_U1.Vsense) Time Evaluation circuit U1 3D-22 V1 V OFF = 0 V AMPL = 10 FREQ = 50Hz 0 All Rights Reserved Copyright (C) Bee Technologies Inc. 2004

3. Thermal Characteristic (temperature vs. time) Simulation result °C 150 100 50 25 0s 2s 4s 6s 8s 10s 12s V(X_U1.T_AVG)/1V Time Evaluation circuit U1 3D-22 V1 V OFF = 0 V AMPL = 10 FREQ = 50Hz 0 All Rights Reserved Copyright (C) Bee Technologies Inc. 2004

4. Resistance Characteristic Simulation result 3.0 Ω 2.0 1.0 0 25 40 80 120 160 V(X_U1.R_T)/1V °C V(X_U1.T_AVG)/1V Evaluation circuit U1 3D-22 V1 V OFF = 0 V AMPL = 10 FREQ = 50Hz 0 All Rights Reserved Copyright (C) Bee Technologies Inc. 2004

SPICE MODEL of 3D-22 in SPICE PARK

Recommended

Recommended

More Related Content

More from Tsuyoshi Horigome

More from Tsuyoshi Horigome (20)

Recently uploaded

Recently uploaded (20)

SPICE MODEL of 3D-22 in SPICE PARK