1. RESUME
_____________________________________________________________________________________
Name TAN BOON SIEW
Address 58, Solok Rawana
10460 Georgetown, Penang
IC Number 821031-07-5071
D.O.B 31-10-1982
Age 32
Sex Male
Race Chinese
Religion Buddhist
Nationality Malaysian
Marital Status Single
Mobile Number ( 016 ) 4737382
E-mail boonsiew38@hotmail.com
boonsiew38@yahoo.com.sg
Objectives : I would like to have a successful career and be able to contribute all the skills,
which I have obtained through my working experience to produce higher quality performance in
whichever future undertaking given to me by the company. Listed below are some of my
capabilities, which I have formed from my working experience:-
 Computer Literate
 Good communication and interpersonal skills
 Able to work independently and with minimum supervision
 Pro-active and highly motivated
 Willing to meet new challenges
 Strong analytical problem solving
 Fast Learner
Education
1996 – 2000 SMJK Chung Ling
~~ SPM 2000
2001 ( May )
– 2003 ( May )
[ TUNKU ABDUL RAHMAN COLLEGE ] Penang Campus
~~ Diploma In Technology ( Electronic Engineering )
( Merit )

2. 2003 ( May )
- 2005 ( January )
[ TUNKU ABDUL RAHMAN COLLEGE ] Kuala Lumpur Campus
~~ Advanced Diploma In Technology ( Electronic Engineering )
2005 ( June) [ Sheffield Hallam University ] Sheffield, United Kingdom
~~ BEng ( Hons ) Electronic System Engineering
Skills
Software ~ PORTEL
~ Multisim 2001
~ Microsoft Visual Basic
~ Microsoft C Programming
~ Microsoft Word, Excel , Power Point
~ Mathlab
~ JMP 5.1
Hardware ~ Basic electronic Circuitry
Project/Assignment Relevant Electronic Engineering
Knowledge
~ Design a timing system by using 16bit single chip Infineon
Controller
~ PIC16F84A Vehicle Retriever
Activities
2005- 2006 Rotaract Club of Georgetown Vice President
2001- 2004 Rotaract Club of Georgetown Community Service Director
2001-2003 Buddhist Society of TARC Committee Members
1999-2000 Badminton Club of SMJK Chung Ling President

3. 1999-2000 Interact Club of SMJK Chung Ling Vice President
1999-2000 Consumer Club of SMJK Chung Ling Exco Member
1999-2000 Judo Club of SMJK Chung Ling Exco Member
Working Experience
ASE Electronic ( M ) Sdn Bhd.
 16th November 2005 until 5th March 2006
 Position : Customer Service Engineer
Job Description :
 Develop and manage sales, marketing and operation of customer service
activities.
 Establish competent quality, concepts, cost estimation, mechanical and
electrical engineering, installation for customer service activities.
 Formulate new business forecasts and budgets as well as participate in the
determination of regional market potential and staffing of people to meet these
targets.
 Participate with new pricing strategies, new product development and strategic
planning.
 Be the primary customer contact and key interface to comprehend and translate
customers’ requirements into action items for factory support groups to execute.
 Communicate customer changes and complaints with various departments.
 Achieve ease of doing business by knowing the factory well and respond to
customers promptly to drive for service excellence.
 Responsible for order fulfillment and planning customers’ deliverables.
6th March 2006 until 21st June 2009 ( Molding Process )
Position Title : Process /Product Engineer
Specialization : Engineering - Electrical
Industry : Electronics Components
Current Salary : RM2922
Job Description :
 Responsible on the EOL molding process in leaded package area such as
PLCC,PQFP,QFP,LQFP and TQFP family and lead the mold process engineering
team.

4.  Responsible for performing analysis study on all the product at New Product
Introduction (NPI) stage for manufacturing.
 Responsible in handling all equipment process characterization and optimization for
New Product Introduction (NPI).
 Responsible to resolving problem and issue occurred in the line.
 Responsible yield improvement project / cost saving / UPH improvement project for
products plastic packages eg PLCC,PQFP,QFP,LQFP and TQFP family.
 Responsible for carry out Failure Analysis study on all the failure units in order to
provide an analysis report to customer.
 To provide a leading role ( 2 technicians ) in the developing, transferring and
maintaining the product with good process capability and high yield .
 Ensure continuous improvement of new and existing products
 Create process flow with the collaboration of modules
 To support pilot run build and ensure manufacturing readiness for new product.
 Key person to resolve customer complaints on product issues and communicate with
customer on engineering requirement.
 Developed a training program for trainer and operator regarding basic operation
instruction and reject defects criteria for leaded packages.
 Monitor process performance indices on qualified processes and establish good
controls to maintain process performance.
 Troubleshoot process issues, specifications for procedures to be followed and work
with other departments to create new recipes.
 Handling ASA and Towa Mold machine and technical improvement on the machine
 Responsible and as a champion for OS ( Open Short ) Improvement Program for ASE
customer.
 Coordinate with test department and to lead on the whole assembly line on the
analysis on OS failure unit.
 Responsible in distributes workloads and assignments to subordinates and making
sure the subordinate's contributions exceed expectation level.
Experiences Gained :
 Troubleshoot process issues, specifications for procedures to be followed and work
with other departments to create new recipes.
 Good team player and multitasking capabilities.
Proven initiative and minimal supervision.

5.  Very good in technical analysis on OS failure and mold defects
Courses Attandance :
1) The 8D Method-Technical Trouble Shooting Techniques
2) Problem Solving Through 7QC Tools
3) ISO/TS 16949 Process Based Internal Auditing
4) DOE
5) Statistical Process Control
6) FMEA
 Familiar with the 8D approach
 ASA auto molding system, model 808S & OMEGA series;
TOWA and FICO model.
Achievement / Project Completed :
 Successfully identified the root cause and resolve on ( PLCC and PQFP ) Intel wire
related issue by improving machine mechanism and tooling part.
Done improvement and solved the Intel Packages Wire Issue from 2500 ppm
since end of Quarter 2006 to >100 ppm since July' 2007 and even until today and
maintain the yield as 99.80 % sinceJuly’2007.
 Successfully lead a project team and achieved TQFP & LQFP packages Mold Goal Yield
from 99.30% to 99.80% since end of Quarter 2 2006 and maintain the Goal Yield until
today.
 Implemented a documented procedure and successfully fabricate a tilting jig to verify
reject units on wire related issues and reduces over reject.
 Successfully lead a project team in resolving LQFP package internal bent lead issue by
improving the lead finger design and machine OT arm vacuum system.
 Successfully lead a task force team in solving LQFP exposed pad issue by create a
special mold parameter and changing the mold die and cavity design.
 Lead an Open Short ( OS ) team and successfully meet Average OS Yield Trend 0.2% by
doing improvement plan in FOL and EOL based on customer complaint and high trigger
Open Short ( OS ).

6. Osram Opto Semiconductor
Position : EOL Process Engineer ( 5th July 2009 – 1st January 2011 )
: EOL Senior Process Engineer ( 1st January 2011 until 25th August 2013 )
Industry : LED
Duration : 5th February 2010 until 25th August 2013
Job Description :
 Responsible and taking care on the EOL process ( Dispensing system ) – Glob Top,
Silicone Casting and Molding process ( Transfer Mold and Compression Molding ).
 Leading a group of persons ( 1 engineer and 2 technicians ) for maintaining the
production, equipment and process improvement activities.
 Work with R& D team and handling all equipment process characterization and
optimization parameter for process transfer and new machine buyoff.
 Responsible to resolving problem and issue occurred in the line.
 Responsible for performing analysis study on all the defect units.
 Responsible yield improvement project / cost saving / UPH improvement project for
LED products
 Responsible for carry out Failure Analysis study on all the failure units in order to
provide an analysis report to customer.
 Developed a training program for trainer and operator regarding basic operation
instruction and reject defects criteria for each product
 Monitor process performance indices on qualified processes and establish good
controls to maintain process performance.
 Troubleshoot process issues, specifications for procedures to be followed and work
with other departments to create new recipes.
 Handling Asymtek Dispensing and Protec Dispensing Machine for technical and
process parameter improvement.
 Implementation of new Work Instruction and Built Sheet for new product.
 Key person to resolve customer complaints on product issues and communicate with
customer on engineering requirement.
 Involved and work with Finance Department on cost down project and UPH
improvement.
 Responsible and fully involved buyoff the machine once shipped from machine
supplier.
 Green belt candidates for cost saving and yield improvement for Garnet Bubble
Improvement.
Experiences Gains :

7.  Troubleshoot process issues, specifications for procedures to be followed and work
with other departments to create new process parameter for Asymtek Dispensing and
Protec Dispensing Machine.
 Familiar with the Auger Valve and Jetter system for the dispensing.
 Preferable hand-on in assembly process & equipment and strong practical skills in
equipment trouble-shooting.
 Able to setup and buyoff process of new equipment during development phase.
 Proven initiative and minimal supervision. Is a good team player.
 Familiar with the FMEA, OCAP, Control Plan and Work Instruction for new product
and qualification.
 Implementation process flow for new product and new process transfer.
 Six Sigma Green Belt Experience.
Achievement / Project Completed :
 Successfully implemented One pass Glob Top instead Two pass Glob Top. The UPH had
been improved 40% with the current process.
 Successfully solve the needle bent issues by changing the fiducial finding method. The
Glob Top yield trend had been improved from 98.1% to 99.2%.
 Implementation auto Pre and Post Inspection system after glob top and casting process.
This had been improved for headcount saving and shorten the process cycle time.
 Improved the quality glob top material by increased the hardness shore A to reduce the
percentage of sagging wire at customer side.
 Implementation SPC buyoff material system to avoid wrong mixing ratio issues and
reduced high reject cost ( Silicone Preparation System ).
 Work with German Osram counterpart and transfer the Headlamp Pro from Germany to
Penang Osram.
 Work with R&D material group and supplier to qualify new glob top material. The
material cost had been reduced down for 20% of a product cost.
 Lead and head Six Sigma Project by reducing the bubble reject from 3-4% to 0.5% reject
yield.
 Obtained monthly best employee awards.
AMD Export (M) Sdn Bhd.
Position : Senior Packaging/ NPI Engineer ( 28th August 2013 until now )
Industry : Microprocessor

8. Duration : 28th August 2013 until now
Job Description :
 To lead new product development & qualification in flip chip assembly process. -
involve in product design stage, assembly process, material characterization &
optimization - responsible for product qualification & reliability.
 Lead and act as main technical inputs to all new product introduction activities
including wafer bumping, substrate design and product design based on design rule.
 Involve in product design stage, assembly process optimization, material
characterization & optimization of the process flow.
 Responsible taking care material supplier for improvement & qualification process
 Drive team to ensure flawless execution of new product introduction & meet all the
KPIs.
 Collaborates & frequently interface with internal & external counterparts &
multifunction groups.
 Identify problems that relate to product, process & reliability & work with process
engineers to provide solutions.
 Responsible establish DFMEA for new product.
 To lead and review PFMEA with each process engineer.
 Establish and setup new process capability.
 Responsible design and work with suppliers to fabricate tools, jig and fixtures for
assembly bring-up process.
 Responsible buyoff on new processes and equipment
Experiences Gains :
 Good communication skill and good interpersonal skill. Good in time & project
management.
 Good statistical knowledge (basic six sigma analysis tool – DOE , minitab & data
analysis) & technical report writing.
 Proven initiative and minimal supervision. Is a good leader to lead a team for new
product development.
 Good and have a wide of process assembly knowledge which indirectly become a fast
learner of new assembly process.
 Familiar with substrate knowledge.
 Basic knowledgeable with Thermal / Mechanical package reliability.
 Experience in semiconductor/electronic environment & engineering field. Experienced in
new product development & NPI

9. Languages
~ English
~ Mandarin
~ Bahasa Malaysia
~ Chinese Local Dialects ( Hokkien)
~ Japanese Languages ( Beginner )
Referee
Mr. Teh Choon Keat
Course Tutor ( Tunku Abdul Rahman College)
( Electronic Engineering Division)
DipTech(TARC), Ex Exam (UK)
tehck@mail.tarc.edu.my
Mobile phone : 0124775739
77,Lorong Lembah Permai 3,
Tanjung Bungah, 11200 Penang.
Ms. GH Ooi
Customer Service Department Manager
ASE Electronic ( M ) Sdn Bhd.
Gh_ooi@asemal.com.my
Tel: 04-6328202 Hp : 0124770849