Tan Boon Siew is a 32-year-old Malaysian citizen seeking a career that allows him to utilize his electronic engineering skills. He has over 10 years of experience in roles such as Process Engineer, Customer Service Engineer, and Senior Packaging/NPI Engineer. Tan holds a BEng in Electronic System Engineering and various diplomas in Electronic Engineering. He is proficient in software like Microsoft Office, MATLAB, and programming languages. Tan aims to take on new challenges and contribute his technical and problem-solving abilities to improve performance.

1. RESUME
_____________________________________________________________________________________
Name TAN BOON SIEW
Address 58, Solok Rawana
10460 Georgetown, Penang
IC Number 821031-07-5071
D.O.B 31-10-1982
Age 32
Sex Male
Race Chinese
Religion Buddhist
Nationality Malaysian
Marital Status Single
Mobile Number ( 016 ) 4737382
E-mail boonsiew38@hotmail.com
boonsiew38@yahoo.com.sg
Objectives : I would like to have a successful career and be able to contribute all the skills,
which I have obtained through my working experience to produce higher quality performance in
whichever future undertaking given to me by the company. Listed below are some of my
capabilities, which I have formed from my working experience:-
 Computer Literate
 Good communication and interpersonal skills
 Able to work independently and with minimum supervision
 Pro-active and highly motivated
 Willing to meet new challenges
 Strong analytical problem solving
 Fast Learner
Education
1996 – 2000 SMJK Chung Ling
~~ SPM 2000
2001 ( May )
– 2003 ( May )
[ TUNKU ABDUL RAHMAN COLLEGE ] Penang Campus
~~ Diploma In Technology ( Electronic Engineering )
( Merit )

2. 2003 ( May )
- 2005 ( January )
[ TUNKU ABDUL RAHMAN COLLEGE ] Kuala Lumpur Campus
~~ Advanced Diploma In Technology ( Electronic Engineering )
2005 ( June) [ Sheffield Hallam University ] Sheffield, United Kingdom
~~ BEng ( Hons ) Electronic System Engineering
Skills
Software ~ PORTEL
~ Multisim 2001
~ Microsoft Visual Basic
~ Microsoft C Programming
~ Microsoft Word, Excel , Power Point
~ Mathlab
~ JMP 5.1
Hardware ~ Basic electronic Circuitry
Project/Assignment Relevant Electronic Engineering
Knowledge
~ Design a timing system by using 16bit single chip Infineon
Controller
~ PIC16F84A Vehicle Retriever
Activities
2005- 2006 Rotaract Club of Georgetown Vice President
2001- 2004 Rotaract Club of Georgetown Community Service Director
2001-2003 Buddhist Society of TARC Committee Members
1999-2000 Badminton Club of SMJK Chung Ling President

3. 1999-2000 Interact Club of SMJK Chung Ling Vice President
1999-2000 Consumer Club of SMJK Chung Ling Exco Member
1999-2000 Judo Club of SMJK Chung Ling Exco Member
Working Experience
ASE Electronic ( M ) Sdn Bhd.
 16th November 2005 until 5th March 2006
 Position : Customer Service Engineer
Job Description :
 Develop and manage sales, marketing and operation of customer service
activities.
 Establish competent quality, concepts, cost estimation, mechanical and
electrical engineering, installation for customer service activities.
 Formulate new business forecasts and budgets as well as participate in the
determination of regional market potential and staffing of people to meet these
targets.
 Participate with new pricing strategies, new product development and strategic
planning.
 Be the primary customer contact and key interface to comprehend and translate
customers’ requirements into action items for factory support groups to execute.
 Communicate customer changes and complaints with various departments.
 Achieve ease of doing business by knowing the factory well and respond to
customers promptly to drive for service excellence.
 Responsible for order fulfillment and planning customers’ deliverables.
6th March 2006 until 21st June 2009 ( Molding Process )
Position Title : Process /Product Engineer
Specialization : Engineering - Electrical
Industry : Electronics Components
Current Salary : RM2922
Job Description :
 Responsible on the EOL molding process in leaded package area such as
PLCC,PQFP,QFP,LQFP and TQFP family and lead the mold process engineering
team.

4.  Responsible for performing analysis study on all the product at New Product
Introduction (NPI) stage for manufacturing.
 Responsible in handling all equipment process characterization and optimization for
New Product Introduction (NPI).
 Responsible to resolving problem and issue occurred in the line.
 Responsible yield improvement project / cost saving / UPH improvement project for
products plastic packages eg PLCC,PQFP,QFP,LQFP and TQFP family.
 Responsible for carry out Failure Analysis study on all the failure units in order to
provide an analysis report to customer.
 To provide a leading role ( 2 technicians ) in the developing, transferring and
maintaining the product with good process capability and high yield .
 Ensure continuous improvement of new and existing products
 Create process flow with the collaboration of modules
 To support pilot run build and ensure manufacturing readiness for new product.
 Key person to resolve customer complaints on product issues and communicate with
customer on engineering requirement.
 Developed a training program for trainer and operator regarding basic operation
instruction and reject defects criteria for leaded packages.
 Monitor process performance indices on qualified processes and establish good
controls to maintain process performance.
 Troubleshoot process issues, specifications for procedures to be followed and work
with other departments to create new recipes.
 Handling ASA and Towa Mold machine and technical improvement on the machine
 Responsible and as a champion for OS ( Open Short ) Improvement Program for ASE
customer.
 Coordinate with test department and to lead on the whole assembly line on the
analysis on OS failure unit.
 Responsible in distributes workloads and assignments to subordinates and making
sure the subordinate's contributions exceed expectation level.
Experiences Gained :
 Troubleshoot process issues, specifications for procedures to be followed and work
with other departments to create new recipes.
 Good team player and multitasking capabilities.
Proven initiative and minimal supervision.

5.  Very good in technical analysis on OS failure and mold defects
Courses Attandance :
1) The 8D Method-Technical Trouble Shooting Techniques
2) Problem Solving Through 7QC Tools
3) ISO/TS 16949 Process Based Internal Auditing
4) DOE
5) Statistical Process Control
6) FMEA
 Familiar with the 8D approach
 ASA auto molding system, model 808S & OMEGA series;
TOWA and FICO model.
Achievement / Project Completed :
 Successfully identified the root cause and resolve on ( PLCC and PQFP ) Intel wire
related issue by improving machine mechanism and tooling part.
Done improvement and solved the Intel Packages Wire Issue from 2500 ppm
since end of Quarter 2006 to >100 ppm since July' 2007 and even until today and
maintain the yield as 99.80 % sinceJuly’2007.
 Successfully lead a project team and achieved TQFP & LQFP packages Mold Goal Yield
from 99.30% to 99.80% since end of Quarter 2 2006 and maintain the Goal Yield until
today.
 Implemented a documented procedure and successfully fabricate a tilting jig to verify
reject units on wire related issues and reduces over reject.
 Successfully lead a project team in resolving LQFP package internal bent lead issue by
improving the lead finger design and machine OT arm vacuum system.
 Successfully lead a task force team in solving LQFP exposed pad issue by create a
special mold parameter and changing the mold die and cavity design.
 Lead an Open Short ( OS ) team and successfully meet Average OS Yield Trend 0.2% by
doing improvement plan in FOL and EOL based on customer complaint and high trigger
Open Short ( OS ).

6. Osram Opto Semiconductor
Position : EOL Process Engineer ( 5th July 2009 – 1st January 2011 )
: EOL Senior Process Engineer ( 1st January 2011 until 25th August 2013 )
Industry : LED
Duration : 5th February 2010 until 25th August 2013
Job Description :
 Responsible and taking care on the EOL process ( Dispensing system ) – Glob Top,
Silicone Casting and Molding process ( Transfer Mold and Compression Molding ).
 Leading a group of persons ( 1 engineer and 2 technicians ) for maintaining the
production, equipment and process improvement activities.
 Work with R& D team and handling all equipment process characterization and
optimization parameter for process transfer and new machine buyoff.
 Responsible to resolving problem and issue occurred in the line.
 Responsible for performing analysis study on all the defect units.
 Responsible yield improvement project / cost saving / UPH improvement project for
LED products
 Responsible for carry out Failure Analysis study on all the failure units in order to
provide an analysis report to customer.
 Developed a training program for trainer and operator regarding basic operation
instruction and reject defects criteria for each product
 Monitor process performance indices on qualified processes and establish good
controls to maintain process performance.
 Troubleshoot process issues, specifications for procedures to be followed and work
with other departments to create new recipes.
 Handling Asymtek Dispensing and Protec Dispensing Machine for technical and
process parameter improvement.
 Implementation of new Work Instruction and Built Sheet for new product.
 Key person to resolve customer complaints on product issues and communicate with
customer on engineering requirement.
 Involved and work with Finance Department on cost down project and UPH
improvement.
 Responsible and fully involved buyoff the machine once shipped from machine
supplier.
 Green belt candidates for cost saving and yield improvement for Garnet Bubble
Improvement.
Experiences Gains :

7.  Troubleshoot process issues, specifications for procedures to be followed and work
with other departments to create new process parameter for Asymtek Dispensing and
Protec Dispensing Machine.
 Familiar with the Auger Valve and Jetter system for the dispensing.
 Preferable hand-on in assembly process & equipment and strong practical skills in
equipment trouble-shooting.
 Able to setup and buyoff process of new equipment during development phase.
 Proven initiative and minimal supervision. Is a good team player.
 Familiar with the FMEA, OCAP, Control Plan and Work Instruction for new product
and qualification.
 Implementation process flow for new product and new process transfer.
 Six Sigma Green Belt Experience.
Achievement / Project Completed :
 Successfully implemented One pass Glob Top instead Two pass Glob Top. The UPH had
been improved 40% with the current process.
 Successfully solve the needle bent issues by changing the fiducial finding method. The
Glob Top yield trend had been improved from 98.1% to 99.2%.
 Implementation auto Pre and Post Inspection system after glob top and casting process.
This had been improved for headcount saving and shorten the process cycle time.
 Improved the quality glob top material by increased the hardness shore A to reduce the
percentage of sagging wire at customer side.
 Implementation SPC buyoff material system to avoid wrong mixing ratio issues and
reduced high reject cost ( Silicone Preparation System ).
 Work with German Osram counterpart and transfer the Headlamp Pro from Germany to
Penang Osram.
 Work with R&D material group and supplier to qualify new glob top material. The
material cost had been reduced down for 20% of a product cost.
 Lead and head Six Sigma Project by reducing the bubble reject from 3-4% to 0.5% reject
yield.
 Obtained monthly best employee awards.
AMD Export (M) Sdn Bhd.
Position : Senior Packaging/ NPI Engineer ( 28th August 2013 until now )
Industry : Microprocessor

8. Duration : 28th August 2013 until now
Job Description :
 To lead new product development & qualification in flip chip assembly process. -
involve in product design stage, assembly process, material characterization &
optimization - responsible for product qualification & reliability.
 Lead and act as main technical inputs to all new product introduction activities
including wafer bumping, substrate design and product design based on design rule.
 Involve in product design stage, assembly process optimization, material
characterization & optimization of the process flow.
 Responsible taking care material supplier for improvement & qualification process
 Drive team to ensure flawless execution of new product introduction & meet all the
KPIs.
 Collaborates & frequently interface with internal & external counterparts &
multifunction groups.
 Identify problems that relate to product, process & reliability & work with process
engineers to provide solutions.
 Responsible establish DFMEA for new product.
 To lead and review PFMEA with each process engineer.
 Establish and setup new process capability.
 Responsible design and work with suppliers to fabricate tools, jig and fixtures for
assembly bring-up process.
 Responsible buyoff on new processes and equipment
Experiences Gains :
 Good communication skill and good interpersonal skill. Good in time & project
management.
 Good statistical knowledge (basic six sigma analysis tool – DOE , minitab & data
analysis) & technical report writing.
 Proven initiative and minimal supervision. Is a good leader to lead a team for new
product development.
 Good and have a wide of process assembly knowledge which indirectly become a fast
learner of new assembly process.
 Familiar with substrate knowledge.
 Basic knowledgeable with Thermal / Mechanical package reliability.
 Experience in semiconductor/electronic environment & engineering field. Experienced in
new product development & NPI

9. Languages
~ English
~ Mandarin
~ Bahasa Malaysia
~ Chinese Local Dialects ( Hokkien)
~ Japanese Languages ( Beginner )
Referee
Mr. Teh Choon Keat
Course Tutor ( Tunku Abdul Rahman College)
( Electronic Engineering Division)
DipTech(TARC), Ex Exam (UK)
tehck@mail.tarc.edu.my
Mobile phone : 0124775739
77,Lorong Lembah Permai 3,
Tanjung Bungah, 11200 Penang.
Ms. GH Ooi
Customer Service Department Manager
ASE Electronic ( M ) Sdn Bhd.
Gh_ooi@asemal.com.my
Tel: 04-6328202 Hp : 0124770849