Exllent

1. MediaTek Dimensity 9000
SUBMITTED BY
RITHIN K

2. CONTENTS
 What is MediatTek Dimensity 9000
 World’s 1st TSMC 4nm-class Smartphone Chip
 Extreme Performance with Incredible Power Efficiency
 MediaTek APU 590
 MediaTek Imagiq 790
 MediaTek HyperEngine 5.0
 Leading 3GPP Release-16 5G Smartphone Modem
 MediaTek MiraVision 790
 Latest Connectivity &Wireless Audio
 Specifications
 conclusion

3. What is MediaTek Dimensity 9000
 The Dimensity 9000 is the world's first mobile chip built
on the 4nm fabrication technology of TSMC, catapulting
MediaTek ahead of Qualcomm in the race. But that is
just one of many feathers Dimensity 9000 has in its cap.
MediaTek's new processor is also the first to use the Arm
v9 architecture and Cortex-X2 cores.

5. WORLD’S 1ST TSMC 4NM-CLASS
SMARTPHONE CHIP
 MediaTek Dimensity 9000 leads the industry by
embracing leading-edge TSMC N4 (4nm-class)
production – the most advanced and power
efficient chip-making process ever.

6. Extreme Performance with
Incredible Power Efficiency
 U ltra-Core - 1x Arm Cortex-X2 at 3.05GHz
 Super-Cores - 3x Arm Cortex-A710 up to 2.85GHz
 Efficiency Cores - 4x Arm Cortex-A510
 World’s first Arm Mali-G710 MC10 graphics processor
 Big in-chip caches: 8MB CPU L3 cache + 6MB system-level cache (SLC)
 LPDDR5X 7500Mbps support – 20% more power efficient than LPDDR5

7. MediaTek APU 590
 Up to 4X power efficiency upgrade compared to last generation
 Meets the strict power requirements of device makers - short burst,
thermal constraint and power-sensitive scenarios
 Total end-to-end design upgrade maximizes efficiency at every
pipeline step
 Easy Use Software Development Kits

8. MediaTek Imagiq 790
 Most Powerful 9Gpixel/s ISP
 World’s 1st simultaneous triple camera 18-bit HDR video recording (three cameras recording with three exposures per
frame)
 World’s 1st 320MP camera support for smartphones
 AI-NR photo – twice as fast as previous generation
 Capture 4K HDR Video with powerful AI noise reduction
 2X lossless zoom

9. MediaTek HyperEngine 5.0
 Extensive gaming power-efficiency enhancements
 AI-VRS – First AI-enhanced variable rate shading technology
 Industry’s 1st raytracing SDK using Vulkan for Android
 Industry’s 1st Hybrid AI-GPU Super Resolution for gaming on Android.
 MediaTek Wi-Fi Fast Path for lower latency connections
 Wi-Fi / Bluetooth Hybrid Coexistence 2.0

10. Leading 3GPP Release-16 5G
Smartphone Modem
 World’s 1st 3CC Carrier Aggregation (300MHz) 7Gbps downlink – incredible peak performance exclusively from sub-6GHz
 World’s 1st R16 UL Enhancement – the only 5G smartphone modem to support R16 SuperUL/UL Tx Switching for both SUL and
NR UL-CA based connections
 Leading MediaTek 5G UltraSave 2.0 – new generation power saving enhancement suite
 Leading Multimode Dual SIM Dual Active – continuing dual SIM leadership with simultaneously active cellular connections

11. MediaTek MiraVision 790
 144Hz WQHD+ / 180Hz Full HD+ display
support
 MediaTek Intelligent Display Sync 2.0
 Wi-Fi Display up to 4K60 HDR10+

12. Latest Connectivity &
Wireless Audio
 World’s 1st Bluetooth 5.3 support in smartphones
 Wi-Fi 6E 2x2 (BW160): up to 2X better performance efficiency than previous generation and support
for the latest 6GHz connectivity
 New Wi-Fi/Bluetooth hybrid coexistence design
 Bluetooth LE Audio technology with Dual-Link True Wireless Stereo Audio
 New Beidou III-B1C GNSS support

13. CONCLUSION

14. REFERENCE
 www.mediatek.com
 www.i.mediatek.com

15. THANK YOU