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Personalization Specialist
M2M Chip Personalization Machine
SCM3000
www.piotec.cn
SCM3000 M2M Chip Personalization Machine is applied to chip personalization and laser marking of smart devices such as
semiconductor M2M Chip with the packaging mode of QFN, DFN etc, plug-in of SIM and Micro SD etc.
Equipped with personalization and production management system proven by market for more than 10 years, SCM3000 provides
high-speed, safe and stable smart devices personalization production service for mobile operators, smart device sub-contractors
as well as semiconductor chip manufacturers around the world.
-Meeting production demand for various M2M chips or other smart devices;
-Equipped with personalization system widely recognized and proven by the market;
-Mature chip personalization, laser marking and surface information verification technology;
-Online re-perso & quality detection supported;
-Modules can be customized according to customers' demand.
SCM3000
High-speed, safe and stable
smart device personalization solution
Overview
ADVANTAGES
Micro SD
QFN Semiconductor Chip
Smart Card
Plug-in of SIM
M2M Chip Personalization Machine
www.piotec.cn
Configurations
Throughput(UPH)
25
2200
<21
2500
30
1820
35
1540
40
1340
45
1180
Perso Time (S)
Throughput Table (16 Stations )
Input Module
Compatible for tray (20 trays at most can be loaded) and reel (specifications of
1000pcs and 3000pcs supported) material container.
Equipped with 12W Fiber laser and 1 fume extractor.
Laser Marking Module
IC Checking Module
Compatible for tray (20 trays at most can be loaded) and reel (specifications of
1000pcs and 3000pcs supported) material container.
Output Module
Reject Module
1 set of reject module after IC perso module, laser marking module and IC
checking module (3 sets in total) to store reject chips of corresponding module.
OCR Checking Module (Optional)
Equipped with1 set of OCR checking module to realize the reading and verifying
of the surface information on the chips.
Equipped with 2 perso stations (Model: PIOTEC PT201NT ) to realize the reading
and verification of the internal data of the chips.
Chip perso can be realized; Equipped with 16 perso stations for standard, which
can be extended to 32 stations; Configured with Piotec industrial-class reader
PT204PT; Online re-perso supported.
IC Perso Module
Input/Output Module
IC Perso Module
Laser Marking Module
Reject Module
OCR Checking Module
IC Checking Module
www.piotec.cn
Shenyang Piotec Technology Co., LTD
Add: No37, Shiji Rd, Hunnan District, Shenyang, China
Tel: +86-024-23782485 Fax: +86-024-23783285 Website: www.piotec.cn
Technical Specification
Parameters
1850mm X 1600mm X 1750mm
600kg
220V(-5%~+10%),50Hz,6KW
<65dB
23℃±3℃
50±10%
Pressure:0.5Mpa; Flow:300LPM
<1/5000
2500UPH
Name
Dimension
Weight
Power Supply
Noise
Operation Temperature
Operation Humidity
Air Supply
Jam Rate
MaximumThroughput
SOP
For example:
Changeover details of tooling kit for QFN8 (2 x 2) chip are as follows (customers can change the corresponding chip tooling kit
needed by themselves to realize quick production switching).
Configured Module
Input/Output Module
IC Perso/Checking Module
Tray/Feeder/Carrier tape/Cover tape
Socket
Changed Parts Time
Less than 20 min
QFN
DFN
SOIC
TTSOP
BGA
DIP
K I T
Production Diversity

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M2M Chip Personalizaiton Machine SCM3000

  • 1. Personalization Specialist M2M Chip Personalization Machine SCM3000
  • 2. www.piotec.cn SCM3000 M2M Chip Personalization Machine is applied to chip personalization and laser marking of smart devices such as semiconductor M2M Chip with the packaging mode of QFN, DFN etc, plug-in of SIM and Micro SD etc. Equipped with personalization and production management system proven by market for more than 10 years, SCM3000 provides high-speed, safe and stable smart devices personalization production service for mobile operators, smart device sub-contractors as well as semiconductor chip manufacturers around the world. -Meeting production demand for various M2M chips or other smart devices; -Equipped with personalization system widely recognized and proven by the market; -Mature chip personalization, laser marking and surface information verification technology; -Online re-perso & quality detection supported; -Modules can be customized according to customers' demand. SCM3000 High-speed, safe and stable smart device personalization solution Overview ADVANTAGES Micro SD QFN Semiconductor Chip Smart Card Plug-in of SIM M2M Chip Personalization Machine
  • 3. www.piotec.cn Configurations Throughput(UPH) 25 2200 <21 2500 30 1820 35 1540 40 1340 45 1180 Perso Time (S) Throughput Table (16 Stations ) Input Module Compatible for tray (20 trays at most can be loaded) and reel (specifications of 1000pcs and 3000pcs supported) material container. Equipped with 12W Fiber laser and 1 fume extractor. Laser Marking Module IC Checking Module Compatible for tray (20 trays at most can be loaded) and reel (specifications of 1000pcs and 3000pcs supported) material container. Output Module Reject Module 1 set of reject module after IC perso module, laser marking module and IC checking module (3 sets in total) to store reject chips of corresponding module. OCR Checking Module (Optional) Equipped with1 set of OCR checking module to realize the reading and verifying of the surface information on the chips. Equipped with 2 perso stations (Model: PIOTEC PT201NT ) to realize the reading and verification of the internal data of the chips. Chip perso can be realized; Equipped with 16 perso stations for standard, which can be extended to 32 stations; Configured with Piotec industrial-class reader PT204PT; Online re-perso supported. IC Perso Module Input/Output Module IC Perso Module Laser Marking Module Reject Module OCR Checking Module IC Checking Module
  • 4. www.piotec.cn Shenyang Piotec Technology Co., LTD Add: No37, Shiji Rd, Hunnan District, Shenyang, China Tel: +86-024-23782485 Fax: +86-024-23783285 Website: www.piotec.cn Technical Specification Parameters 1850mm X 1600mm X 1750mm 600kg 220V(-5%~+10%),50Hz,6KW <65dB 23℃±3℃ 50±10% Pressure:0.5Mpa; Flow:300LPM <1/5000 2500UPH Name Dimension Weight Power Supply Noise Operation Temperature Operation Humidity Air Supply Jam Rate MaximumThroughput SOP For example: Changeover details of tooling kit for QFN8 (2 x 2) chip are as follows (customers can change the corresponding chip tooling kit needed by themselves to realize quick production switching). Configured Module Input/Output Module IC Perso/Checking Module Tray/Feeder/Carrier tape/Cover tape Socket Changed Parts Time Less than 20 min QFN DFN SOIC TTSOP BGA DIP K I T Production Diversity