1. ~ Electronics Over 35 years of continuous and successful operations
PoP Process Capabilities
Memo
PoP is package-on-package assembly that consists of two or more fine- O.5mm pitch
pitch ball grid arrays (BGAs) stacked one on top another. In a two-piece as- OMAP Processor FtKlU Fw
P"rlll
sembly, the bottom package is usually a high-density logic device, while the
O.4mm pitch
top package is a high-capacity memory device. Both devices may contain
more than one die. PCB
Source: T1 Package-on-Package (PoP) structure
ONYX29 PoP Assembly Process
ONYX29 PoP Assembly Process
Challenge
Package & PCBwarp, variation in solder balls height may lead to open connections
Solution
Bake and dry box process control for PoPand PCB.Developing ball-dipping method
using solder paste for PoPassembly and rework
OSI Electronics Manufacturing Capabilities
OSI Electronics is a Lead-Free qualified factory that can manufacture the PCBAs in both
lead-free and leaded processes.
We have the advanced equipment and manufacturing process capabilities on the following:
• PoP assembly and rework using advanced SMT robotic station.
• Screen printer with 2D paste inspection
• Advanced SMT pick-a-place machines that are capable of placing 01005 & OAmm pitch uBGA
• 10- Zone Lead-Free approved convection reflow ovens
• Wave soldering & Thru-Hole connector rework
For more information contact: Sales Corporate Headquarters: 805-499-6877 www.osielectronics.com

2. Over 35 years of continuous and successful operations
Southern California NPI Center
Dedicated NPI process established within the Camarillo
factory
The NPI Department has its own document control and
process engineering support, a dedicated NPI Buyer and
associated staff
MY1 00 Line - Ability to accept cut tape
• Intelligent feeders that can be loaded while machine is in operation
• Accommodates board size from 2"x 2"to 20"x 17.4" We have a dedicated NPIline
• Electrical and dimensional component verification on the fly which is supported by our new
• 176 feeders allow for a single set up for the majority of runs MY Data, MYl 00 Line
• Ability to place 01005, FC, CSP,to uBGA's
Camarillo NPI Center - Flying Probe Camarillo NPI Center - X Ray Machine
Minimal up front 70 degree Oblique
NRE Angle Views
360 degrees around
Short programming the entire inspection
time area
Automated and
manual BGA analysis
Engineering Services DFM Feedback Example
051 Electronics desires to be involved at the inception Hole drilled in SMT pad -
of the program.The most cost effective time to find and fix
this will lead to insufficient
defects is at the initial requirements stage.
solder, as solder will fill the
We are able to provide this valuable manufac::turing feed- hole.
back when provided the following information:
• ASCII Output of the CAD data
• Fabrication drawing - DXF, Gerber or PDF
• Assembly drawing - DXF, Gerber or PDF 051 Electronics recommends removing vias from pads,
• Parts List - .XLS is preferred or add a note on the PCBfabrication drawing indicating
• Schematic - PDF is preferred that the PCBsupplier must epoxy fill the via.
For more information contact: Sales Corporate Headquarters: 805-499-6877 www.osielectronics.com