2. PCB DesignPCB Design
Schematic DevelopmentSchematic Development
Library Development & maintenanceLibrary Development & maintenance
SI AnalysisSI Analysis
Board FabricationBoard Fabrication
Board AssemblyBoard Assembly
DFx AnalysisDFx Analysis
Our core ServicesOur core Services
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3. PCB DesignPCB Design
•• Scratch to Gerber and support for manufacturingScratch to Gerber and support for manufacturing
•• Constraint driven Auto-routingConstraint driven Auto-routing
•• Creation of topology templates and routing rulesCreation of topology templates and routing rules
Library creationLibrary creation
•• Footprint CreationFootprint Creation
Schematic entrySchematic entry
•• Design and Schematics EntryDesign and Schematics Entry
•• Symbol creationSymbol creation
•• Conversion of Paper based into CAD basedConversion of Paper based into CAD based
CAD TranslationCAD Translation
•• Conversion of PCB from one Layout tool to another tool.Conversion of PCB from one Layout tool to another tool.
•• Conversion of Schematic from one tool to another tool.Conversion of Schematic from one tool to another tool.
SI / EMI AnalysisSI / EMI Analysis
•• Pre-route and Post-route AnalysisPre-route and Post-route Analysis
•• Timing ,reflection and crosstalk AnalysisTiming ,reflection and crosstalk Analysis
•• EMI AnalysisEMI Analysis
Fabrication & AssemblyFabrication & Assembly
Our CapabilitiesOur Capabilities
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4. Specialized in Analog,digital,mixed & RF designs.Specialized in Analog,digital,mixed & RF designs.
High density PCB : 540 pin/Sq. inchHigh density PCB : 540 pin/Sq. inch
High layer count boards : 24 layersHigh layer count boards : 24 layers
High speed interconnects : 10GbpsHigh speed interconnects : 10Gbps
Max. Component count: >4000Max. Component count: >4000
Min BGA pitch: 0.4mmMin BGA pitch: 0.4mm
Max. BGA pin count: 1156 pinsMax. BGA pin count: 1156 pins
Via used: Blind, buried and microVia used: Blind, buried and micro
Rule setup: Constraint managerRule setup: Constraint manager
Topology definition: SigXplorerTopology definition: SigXplorer
DFM,DFA & DFT Analysis for high-yield &low-cost productionDFM,DFA & DFT Analysis for high-yield &low-cost production
Extreme DesignsExtreme Designs
confidentialconfidential dhakshinamoorthy@ohmcadsystem.com
7. Case study-1Case study-1
Ultra high density Mobile phoneUltra high density Mobile phone
Consumer electronicsConsumer electronics
8 layer board8 layer board
High Speed Digital & critical powerHigh Speed Digital & critical power
requirementsrequirements
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8. Case study-2Case study-2
Ultra high density SBC Module – 540 Pins per sq inchUltra high density SBC Module – 540 Pins per sq inch
Military ApplicationMilitary Application
20 layer20 layer
High Speed DigitalHigh Speed Digital
confidentialconfidential
9. Case study-3Case study-3
Low layer & High Routing densityLow layer & High Routing density
Networking & SAN application usingNetworking & SAN application using Intel chipsetsIntel chipsets
8 layer8 layer
High Speed Digital with DDR-II & PCIe InterfacesHigh Speed Digital with DDR-II & PCIe Interfaces
confidentialconfidential
10. Case study-4Case study-4
Low densityLow density
Wireless LAN ApplicationWireless LAN Application
4 layer – PCB Printed Antenna4 layer – PCB Printed Antenna
High Speed Digital, RF DesignHigh Speed Digital, RF Design
Cost effective & High volume productCost effective & High volume product
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11. Case study-5Case study-5
High Routing densityHigh Routing density
Networking applicationNetworking application
16 layer16 layer
Used Blind, buried & through holes viaUsed Blind, buried & through holes via
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12. Case study-6Case study-6
Large Form factor - ATCA cardLarge Form factor - ATCA card
Telecom Application – 24 layersTelecom Application – 24 layers
High pin count BGA – 1156 pinsHigh pin count BGA – 1156 pins
High Speed DigitalHigh Speed Digital
confidentialconfidential
13. Case study-7Case study-7
High density RoutingHigh density Routing
Semicondutor ATE applicationSemicondutor ATE application
24 layer24 layer
High Speed Digital & controlled impedanceHigh Speed Digital & controlled impedance
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14. Case study-8Case study-8
Networking applicationNetworking application
14 layer14 layer
High Speed Digital with DDR-III,10G Ethernet,DIMM & PCIeHigh Speed Digital with DDR-III,10G Ethernet,DIMM & PCIe
InterfacesInterfaces
PCIe form factorPCIe form factor
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15. Business ModelBusiness Model
We work on two different model as per the requirement and convenience ofWe work on two different model as per the requirement and convenience of
the customer.the customer.
Fixed development modelFixed development model
Based on the design input received from the customer will provide theBased on the design input received from the customer will provide the
quote.quote.
Assuming there will not be major ECO after the evaluation.Assuming there will not be major ECO after the evaluation.
Invoice will be raised after the completion of the project for the number ofInvoice will be raised after the completion of the project for the number of
hours agreed.hours agreed.
Time & Material modelTime & Material model
Based on the input received we will provide the rough estimationBased on the input received we will provide the rough estimation
After the completion of the project we will be raising the invoice for theAfter the completion of the project we will be raising the invoice for the
actual number of hours spend.actual number of hours spend.
confidentialconfidential dhakshinamoorthy@ohmcadsystem.com
