The document discusses micro-electro-mechanical systems (MEMS) and their evolution. It provides definitions of MEMS, describes their key components and manufacturing processes. MEMS applications are found in various fields like automotive, healthcare, instrumentation and consumer products. The document traces the history of MEMS from their inception in the late 1940s to more recent developments. It also outlines the advantages and disadvantages of MEMS and discusses their increasing role in systems that can sense and interact with their environment.
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MEMS & micro systems
1. MEHRAN UNIVERSITY
OF ENGINEERING & TECHNOLOGY, JAMSHORO
MASTERS IN MANUFACTURING
MEHRAN UNIVERSITY
OF ENGINEERING & TECHNOLOGY, JAMSHORO
MASTERS IN MANUFACTURING
MEMS &
MicrosystemsMICRO-ELECTRO-MECHANICAL SYSTEMS
”Machine on a chip” / “Micro-machine”
Or
”Anything designed and produced using Microelectronics toolset ”
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Contents
• MEMS Introduction
• MEMS Applications
• MEMS Examples
• MEMS in Daily life
• MEMS History
• MEMS Evolution
• MEMS Components
• MEMS Advantages and Disadvantages
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MEM
S
• “MEMS is a way of making things”. These “things”
merge the functions of sensing and actuation with
computation and communication to locally control
physical parameters at the micro-scale, yet cause
effects at much grander scales.
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MEMS system: It is a technology that combines
processor or computers with sensors and
other mechanical parts such as valves,
gears, mirrors and actuators, that are
essentially embedded in semiconductor
chips.
MEMS Technology: It is a technology, used to create
tiny integrated devices, micro components,
micro structures.
MEMS
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MEMS
• They are miniature embedded systems involving one
or many micro-machined components or structures.
They enable higher level functions.
• MEMS System differ from computer chips as they not
only move electrons but also small mechanical
components. MEMS sensors need to connect with the
environment requiring fluidic, gas, light input/output
channels as well as electrical connections.
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MEMS Applications• Automotive System
• Health Care
• Automated Manufacturing
• Instrumentation
• Environmental Monitoring & Control
• Consumer Products
• Aerospace
• Mass data storage systems
• RF and wireless electronics
electromechanical
Micro-switch
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MEMS Example
• Integrated Features
• - Control
• - Microcontroller
• - Power Management
• - Communication
• - RF Transceiver
• - Sensing
• - Pressure
• - Humidity
• - Temperature
• - Vibration
• - Packaging “Micro Cluster”
Environmental Monitoring Micro-instrument
A medical device that can be implanted into a tumor to
monitor how it responds to treatment. (Boston)
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nano-fighter jet (F-35B) with a wing
span of about 15 micrometer
micro-car (Formula 1)
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MEMS
in
Daily
Life
The average person uses MEMS every day.
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MEMS in Daily
Life
The average person uses MEMS every day.
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MEMS History
1948 Invention of the Germanium transistor at Bell Labs (William Shockley)
A TRANSISTOR is a semiconductor device used to amplify or switch
electronic signals and electrical power. It is composed of
semiconductor material usually with at least three terminals for
connection to an external circuit.
1954 Piezoresistive effect in Germanium and Silicon (C.S. Smith). The
PIEZORESISTIVE EFFECT is a change in the electrical resistivity
of a semiconductor or metal when mechanical strain is applied. In
contrast to the piezoelectric effect, the piezoresistive effect causes a
change only in electrical resistance, not in electric potential.
1958 First integrated circuit (IC) (J.S.Kilby 1958 / Robert Noyce 1959). IC is
a set of electronic circuits on one small flat piece of material.
1959 First silicon pressure sensor demonstrated (Kulite). SILICON
PRESSURE SENSORS have silicon based sensing diaphragms which
have a very high elasticity and semiconductor strain gauges implanted
in the silicon substrate which produce a high span sensitivity.
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MEMS History
1967 Anisotropic deep silicon etching (H.A. Waggener et al.). This process
used to create deep penetration, steep-sided holes and trenches in
wafers/substrates.
1968 Resonant Gate Transistor Patented (Surface Micromachining Process)
(H.Nathanson)
1970 Bulk etched silicon wafers used as pressure sensors (Bulk
Micromachining Process)
1971 The microprocessor is invented
1979 HP micromachined ink - jet nozzle
1982 "Silicon as a Structural Material," K. Petersen
1982 LIGA process (KfK, Germany)
1982 Disposable blood pressure transducer (Honeywell)
1983 Integrated pressure sensor (Honeywell)
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MEMS History
1985 The "Buckyball" is discovered. A buckyball is a molecule called
Buckminsterfullerene. Composed of 60 carbon atoms formed in the
shape of a hollow ball
1986 The atomic force microscope is invented.
1986 Silicon wafer bonding (M. Shimbo)
1988 Batch fabricated pressure sensors via wafer bonding (Nova Sensor)
1988 Rotary electrostatic side drive motors (Fan, Tai, Muller)
1991 Polysilicon hinge (Pister, Judy, Burgett, Fearing)
1991 The carbon nanotube is discovered
1992 Grating light modulator (Solgaard, Sandejas, Bloom)
1992 Bulk micromachining (SCREAM process, Cornell)
1993 Digital mirror display (Texas Instruments)
1993 MCNC creates MUMPS foundry service
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MEMS History
1993 First surface micromachined accelerometer in high volume production
(Analog Devices)
1994 Bosch process for Deep Reactive Ion Etching is patented
1996 Richard Smalley develops a technique for producing carbon nanotubes
of uniform diameter
1999 Optical network switch (Lucent)
2000s Optical MEMS boom
2000s BioMEMS proliferate
2000s The number of MEMS devices and applications continually increases
2000s onwards
NEMS applications and technology grows
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MEMS History
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MEMS Evaluation
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MEMS Key Components
Transducer:
It convert one form of energy into an other form of energy.
Sensor:
It sense or detect the level of energy.
Actuator:
An actuator is a device or set of mechanism that actuate or
respond mechanically by converting electrical
signals or processed data.
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MEMS Components
• It typically comprises components from one or
more of three classes:
1. Micro-sensors to detect changes in the system’s
environment, these are input devices.
2. An intelligent component that makes decisions based
on changes detected by the sensors, and
3. Micro-actuators by which the system changes its
environment, these are output devices.
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MEMS
MEMS Devices and Structures
– transducers
• micro-sensors and micro-actuators
– mechanically functional microstructures
• micro-fluidics: valves, pumps, flow channels
• micro-engines: gears, turbines, combustion engines
Integrated Micros-ystems
– integrated circuitry and transducers combined to perform a task
autonomously or with the aid of a host computer autonomously or with the aid
of a host computer.
– MEMS components provide interface to non-electrical world
• sensors provide inputs from non-electronic events
• actuators provide outputs to non-electronic events
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MEMS Advantages
• Suitable for high-volume and low-cost production
• Reduced size
• Light weight
• Low power consumption
• High functionality
• Improved reliability
• Novel solutions and new applications
• Low cost
• Minimize Materials
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MEMS Disadvantages
• It requires huge investment.
• Micro-components are costly as compared to
Macro-components.
• Design includes very much complex procedures or
Complex fabrication procedures
• Test masses (and thus inertial forces) tend to be
small.
• They cannot be loaded with large forces.
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EVOLUTION OF MEMS
• We have clear image that what is MEMS systems and MEMS
Technology.
• The next ambitious goal is to fabricate monolithic/huge/integrated chips
that can not only sense (with microsensors) but also actuate (with micro-
actuators), that is, to create a microsystem that encompasses the
information-processing art.
• The technology employed to make such a microsystem is commonly
referred to as MST (Micro-System-Technology) or (MEMS-Technology).
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EVOLUTION OF MEMS
• This figure provides an overview of MST together with some of the
application areas.
Overview of
microsystems
technology
and the
elements of a
MEMS chip
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EVOLUTION OF
MEMS
• Some of the many fundamental
techniques required to make
MEMS devices.
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EVOLUTION OF MEMS
• Work to achieve the goal of MST, started in the late 1980s, and there has
been enormous effort to fabricate micro-electro-mechanical systems
(MEMS) using MST.
• The reason for the relatively slow emergence of a complete MEMS has
been the complexity of the manufacturing process.
• Figure details some new materials for MEMS and the various micro-
technologies that need to be developed.
• For best MEMS, some of the new materials for MEMS should be
introduced and their fundamental properties should be compatible with
manufacturing processes.
• One attractive solution to the development of MEMS is to make all the
techniques compatible with silicon processing. In other words,
conventional complementary metal oxide semiconductor (CMOS)
processing is combined with a pre-CMOS or post-CMOS MST.
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EVOLUTION OF MEMS
• The major growth areas were identified as microfluidics, photonics and
communications.
• There have been some exciting developments in methods to fabricate
true three-dimensional structures on the micron scale.
• There are different techniques can be used to make a variety of three-
dimensional microparts, such as micro-springs, micro-gears,
microturbines, and so on.
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EVOLUTION OF MEMS
• There are two major challenges facing us today:
• FIRST, to develop methods that will manufacture microparts in high
volume at low cost and,
• SECOND, to develop micro-assembly techniques.
• To meet these challenges, certain industries have moved away from the
use of silicon to the use of glasses and plastics, and it can be seen that
the emergence of chips in biotechnology that include microfluidic
systems which can truly be regarded as MEMS devices.
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EMERGENCE OF
MICROMACHINES• Natural evolution will then lead to MEMS devices that move around by
themselves.
• Such chips are commonly referred to as micro-machines and the
concepts of micro-planes, micro-robots, micro-cars, and micro-
submarines.
• Micromachines, if developed, will need sophisticated microsensors so
that they can determine their location and orientation in space and
proximity to other objects.
• They should also be able to communicate with a remote operator and
hence will require a wireless communication link - especially if they are
asked to enter the human body.
• Wireless communication has already been realised in certain acoustic
microsensors, and MEMS devices.
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EMERGENCE OF
MICROMACHINES• Associated with this development, there is a further major problem to
solve, namely, miniaturization of a suitable power source.
• Moving a micromachine through space requires significant energy.
• If it is to then do something useful, such as removing a blood clot in an
artery, even more power will be required.
• Consequently, the future of MEMS devices may ultimately be limited by
the communication link and the size of its 'battery pack!'
• The road to practicable micromachines appears to be long and hard but
the first steps toward microsensors and MEMS devices have been taken.
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EMERGENCE OF
MICROMACHINES• Dimensions of microsensors, MEMS,
and micromachines; they are
compared with some everyday
objects.
• The horizontal axis has a logarithmic
scale.
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Essay Questions
• What are basic three challenges for MEMS fabrication?
• Give overview of MST with neat diagram?
• Enlist fundamental techniques required to make MEMS devices?
• Differentiate MEMS Systems and MEMS Technology?
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SHORT QUESTIONS
• What are MEMS?
• Why MEMS technology is growing fast?
• How MEMS affect on our daily life?
• What is difference between Transducer and Sensors?
• What materials are used for MEMS?
• What is Difference between IC and MEMS?
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ESSAY TYPE QUESTIONS
• Explain advantages and disadvantages of MEMS in
detail?
• Define MEMS key components in detail?
• How do you explain MEMS History & Evolution?
• Explain MEMS future?