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Automated spike analysis
For IC production testing solutions
Abstract
When a semiconductor company delivers a component to a customer, this compo-
nent has to work perfectly. A series of tests is carried out at the end of the production
line to ensure that the final product is not flawed.
One takes care of potential damages that can be caused to the component during
testing. Undesirable high frequency voltage spikes can damage the component during
the test sequence. These have to be detected during the validation of the test sequence
and suppressed.
In this document, two main goals are developed. First, the design and the creation
of an automated way of testing a sequence of tests to ensure that no spikes are
submitted to the tested component. Secondly, the research and the implementation
of an automated way of spike source localization to support the test engineer.
To reach the first goal of the thesis, several high frequency PCBs as well as an
acquisition program controlling a PC-based oscilloscope were designed and created.
To reach the second goal of the thesis, a mechanism was conceived to synchronize the
test equipment via TCP/IP with the computer that runs the acquisition program.
Finally, the tool created in the framework of this master thesis is able to detect
spikes and localize tests that produces these spikes, allowing the test engineer to work
more e ciently. A job that lasted, initially, days or weeks can now be accomplished
within hours.
By Maxime Javaux
Supervisor: Pr. Vanderbemden
University of Li`ege
Faculty of Applied Science
Graduation Studies conducted for obtaining the Master’s degree in Civil
Electrical Engineering
Academic year 2015-2016
Thesis illustrations
Figure 1: Overview of the thesis. The two orange boxes are the test equipment and the
tested component. The blue boxes are added to the test setup to detect and localize spikes.
The top right blue box represents the PCBs created to allow the detection of spikes. The
bottom right blue box represents the PC-based oscilloscope programmed to acquire the
waveforms. The computer is the master of the oscilloscope, in addition, it stores the data,
it synchronizes acquisitions with the test equipment via TCP/IP and it displays information.
Figure 2: Window displayed to show the acquired waveforms to the test engineer. The
useful signal is the green one. The ID of the test, that generated the spike, is shown on the
top.

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abstract

  • 1. Automated spike analysis For IC production testing solutions Abstract When a semiconductor company delivers a component to a customer, this compo- nent has to work perfectly. A series of tests is carried out at the end of the production line to ensure that the final product is not flawed. One takes care of potential damages that can be caused to the component during testing. Undesirable high frequency voltage spikes can damage the component during the test sequence. These have to be detected during the validation of the test sequence and suppressed. In this document, two main goals are developed. First, the design and the creation of an automated way of testing a sequence of tests to ensure that no spikes are submitted to the tested component. Secondly, the research and the implementation of an automated way of spike source localization to support the test engineer. To reach the first goal of the thesis, several high frequency PCBs as well as an acquisition program controlling a PC-based oscilloscope were designed and created. To reach the second goal of the thesis, a mechanism was conceived to synchronize the test equipment via TCP/IP with the computer that runs the acquisition program. Finally, the tool created in the framework of this master thesis is able to detect spikes and localize tests that produces these spikes, allowing the test engineer to work more e ciently. A job that lasted, initially, days or weeks can now be accomplished within hours. By Maxime Javaux Supervisor: Pr. Vanderbemden University of Li`ege Faculty of Applied Science Graduation Studies conducted for obtaining the Master’s degree in Civil Electrical Engineering Academic year 2015-2016
  • 2. Thesis illustrations Figure 1: Overview of the thesis. The two orange boxes are the test equipment and the tested component. The blue boxes are added to the test setup to detect and localize spikes. The top right blue box represents the PCBs created to allow the detection of spikes. The bottom right blue box represents the PC-based oscilloscope programmed to acquire the waveforms. The computer is the master of the oscilloscope, in addition, it stores the data, it synchronizes acquisitions with the test equipment via TCP/IP and it displays information. Figure 2: Window displayed to show the acquired waveforms to the test engineer. The useful signal is the green one. The ID of the test, that generated the spike, is shown on the top.