1. M. S. Ramaiah School of Advanced Studies
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M. Sc. (Engg.) in Electronics System Design Engineering
GREESHMA S
CWB0913004 , FT-2013
7thModule Presentation
Module code : ESE2507
Module name : Electronic Board Design
Module leader: Mr. Ugra Mohan Roy
Presentation on : 13/06/2014
Packaging issues of optical component

2. M. S. Ramaiah School of Advanced Studies
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•INTRODUCTION
•PACKAGESERVESMULTIPLEFUNCTIONS
•OPTICALPACKAGINGHIERARCHY
•OPTICALPACKAGINGMATERIALS
•EXAMPLE:WHYOPTICS?
•ISSUESOFOPTICALPACKAGING
•OPTICALPCBROADMAP
•CONCLUSION
•REFERENCES
Overview

3. M. S. Ramaiah School of Advanced Studies
3IntroductionThere are different types of packaging
Chip Scale Packages (CSP)
Surface Mounted Devices (SMD)
Dual in-line Package (DIP)
Thin Small Outline Package (TSOP)
Quad Flat Package (QFP)
Pin Grid Array (PGA)
Ceramic Leadless Chip Carrier (CLCC)
Small Outline Package (SOP)
Plastic Leadless Chip Carrier (PLCC)
Ball Grid Array (BGA)

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Introduction
Advanced Packaging are
Multi-chip-Modules (MCMs)
Chip Stacked Packages (CSP)

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Package Serves Multiple Functions
Protection –Environmental Management of Device
Connectivity and routing –Electrical, Optical, Material–Including Power Management and Signal Integrity
Mechanical Stress Control
Thermal Management
Testability and Burn-in

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6Optical Packaging Hierarchy

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7Optical Packaging Material

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8Example : Why Optics? Electrical Buses become increasingly difficult at high data rates (physics): • Increasing losses & cross-talk • Frequency resonant affects• Optical data transmission is easier: • Much lower loss, esp. at higher data rates• Additional advantages include: • Cable bulk, connector size, EMI… • Potential power savings
•BW * Distance > electrical

9. M. S. Ramaiah School of Advanced Studies
9Optical PCB technology has been researched for several years; however, significant issues remain before commercial implementation can be realized:
•Waveguide fabrication at production scale
•Optical PCB fabrication
•Optical coupling (such as device-board and board-to-backplane)
•Assembly
•Optoelectronic devices in standard ”IC-like” packages used in optical PCB
•Reliability (waveguide, connector, OE device, packaging materials, and system-level qualification)
•Test vehicles…
•Testing methods, equipments and applied standards

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Issues of Optical Packaging

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11Optical PCB Roadmap

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12ConclusionLithium Niobateis the best optical packaging material. FEM analysis is used to measure Mechanical stress of the optical component. Optical packaging is better than Electrical Packaging. The challenges and solutions of integration of high performance waveguides on packages and PCBs have dealt.

13. M. S. Ramaiah School of Advanced Studies
13Reference
1.Henning Schröder(2011). Optical Packaging . Germany TechnischeUniversitätBerlin 625-632.
2.YuzoIshii (2003). Fully SMT-Compatible Optical-I/O Package With MicrolensArray Interface. Japan JOURNAL OF LIGHTWAVE TECHNOLOGY 275-282.

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14Thank You