1. Craig Bushman
6865 Sharon Ct.
Columbus, OH 43229
(614) 203-3547
CSB.Engineering2016@gmail.com
Objective
An upcoming graduate with an ability to apply knowledge, techniques, skills and modern tools to broaden defined
engineering technology. Desires to work with a company that helps improve the quality of life of people.
Employment History
February 2013-Present
Electronic Commodity Corporation, Dublin, OH
Technician
 Utilize BOMs and top assembly drawings to place components on printed circuit boards and hand
solder SMT and through hole components when necessary.
 Utilize microscope and top assembly drawings to visually inspect the finished good for missing parts,
improperly placed parts, and solder issues.
 Test finished products for functionality utilizing a computer controlled bed of nails tester, RF chamber,
heat chamber, power supply, oscilloscope, multimeter, or standalone test fixture as per customer
specifications.
 Run a burn-in test to check for circuit board durability when requested by the customer.
 Utilize a multimeter and oscilloscope to troubleshoot failed finished goods down to the component
level.
 Replace faulty component and touch up solder issues where necessary.
 Retest the repaired board to confirm the failure is removed and board works to customer standards.
 Document any repairs done in an excel spreadsheet.
RSM Technician
 Assemble and test the cavity ISM Band Antennas, cables, and RF Module, making certain that
consistent range was available from the RF Link. This involves a sealed RF test chamber, and RF
interfaces for testing both of the design's antennas.
 Test Analog and ADC circuitry that energizes and gathers data from a strain gage, a semiconductor
based temperature sensor, and an associated microcontroller that digitizes and processes the analog
signal and then transmits that data via an RF ISM band module.
 Perform QC, testing, and inspection on the assembled PCB that is used in a complex compact
assembly for 10-year lifespan, outdoor operation.
 Utilizes potting technology to prevent ingress of moisture into the sealed assembly.
Engineer
 Work with customer to design test fixtures to check the functionality of finished goods per the
customer’s specifications. (i.e. computer controlled bed of nails, standalone units to mimic the final
environment, simple power supply and multimeter measurement tests)
 Write out test procedures to a level that no experience with electronics is needed in order to run the
testing properly.
 Analyze testing data to make suggestions to software engineers to improve testing speeds and
accuracy.
 Report any possible design flaws to board/circuit engineers that are identified during testing.
 Collaborate with Customer to develop Statements of work in addition to assembly procedure.
Project Manager
 Oversee two employees and their work.
 Work with customer to understand their expectations and needs.
 Discuss with customer any issues we are finding and develop a corrective action to improve quality of
products.
 Keep up-to-date files of all customer documents including lead free compliance, testing procedures,
testing results, schematics, inventory, purchase orders, and required labels.
 Keep project running on time.

2. October 2012-January 2013
Dynalab, Reynoldsburg, OH
Repair Technician
 Visually inspected printed circuit boards in accordance to IPC-610 standards.
 Utilized schematics, BOMs, Datasheets, oscilloscope, and multimeter to analyze PCB faults down to
the component level.
 Utilized a soldering iron, solder pot, hot air rework station, and heat gun to replace faulty components.
 Tested the PCB to verify the failure had been fixed.
 Maintained spreadsheets and updated repair database to identify trends with symptoms and repairs
needed.
 Performed necessary through hole and surface mount soldering.
 Worked under ISO 9001 regulations and standards.
November 2010-October 2012
Intelisol, Lockbourne, OH
Repair Technician
 Visually inspected Dell motherboards in accordance to IPC-610 standards.
 Utilized schematics, BOMs, Datasheets, oscilloscope, and multimeter to analyze Dell product faults
down to the component level.
 Utilized a soldering iron, solder pot, hot air rework station, and heat gun to replace faulty components.
 Tested the motherboard to verify the failure had been fixed.
 Maintained spreadsheets to identify trends with symptoms and repairs needed.
 Performed necessary through hole and surface mount soldering.
 Worked under ISO 9001 regulations and standards.
Quality Insurance Out of Box Auditor
 Visually inspected Dell finished products for items not in compliance with IPC-610 standards.
 Tested finished products for functionality.
 Documented all product issues that don’t meet Dell functionality and IPC-610 standards.
 Used documented failures to identify issues with product testing procedures and tests along with visual
inspection issues.
 Helped develop quality assurance guidelines and procedures for memory, CPUs, and power supplies.
 Helped with process improvement utilizing six sigma training to optimize testing procedures and
handling of memory, CPUs, and power supplies.
 Worked under ISO 9001 regulations.
Education
Bachelor of Science Electrical Engineering | 2016 | Devry University
GPA 3.1
Associates of Applied Science Computer Electronics and Engineering | 2012 | ITT Tech
GPA 3.44
Skills
Software Tools and Equipment
Programming
 Allen Bradley PLC Ladder Logic
 Microchip MPlab IDE
 Freescale CodeWarior
 Atmel 8051 Assembly language
 ProView32
 Eclipse
Other
 Altium Circuit Maker
 MultiSim
 Microsoft Visio
 Microsoft Project
 Microsoft Word
 Microsoft Excel
 Function Generator
 Frequency Counter
 Multimeter
 Oscilloscope
 Logic Analyzer
 Soldering / De-soldering Iron
 Hot air Rework Station