1. KEY QUALIFICATION .
Semiconductor Processing/Integration: Graphene and (III-N) GaN/AlGaN Transistors, MEMS
TCAD Simulation: Device and Process
DC/RF Test/Measurement: On Wafer/ Bench Level
Expertise in Device Physics
Raman Spectroscopy
THz Image Sensor Characterization
EDUCATION .
PhD Candidate, EE, Florida International University, Miami, FL (expected 04/16) GPA 3.76
MS, EE, Florida International University, Miami, FL (04/12) GPA 4.00
BS, Applied Physics and Electronics, University of Dhaka, Bangladesh, 12/09 (1st Class 4th Position)
EXPERIENCE .
Florida International University, Miami, FL 08/10 – Present
Graduate Research Assistant
Model, fabricate/integrate Graphene RF transistors with 27.3% higher cutoff frequency
Model, fabricate/integrate GaN and Graphene THz sensors capable to detect THz in room temperature
Measure DC and RF characteristics of Graphene RF transistors
Measure THz response of GaN/AlGaN and Graphene THz sensors in roomand cryogenic temperature
Detect H2 adsorption in Graphene from Raman shift and engineer its bandgap (up to 83.6 meV)
Florida International University, Miami, FL 08/12 – 08/14
Graduate Teaching Assistant
Instructed junior level course: Circuits Lab (Spring – Summer, 2014) - Average class size of 35 students
Teaching Assistant for graduate level course: Fundamentals of Nanofabrication (Fall 2013) - fabricated and
characterized MEMS Pressure Sensor on Si/Si3N4 wafer with 20 students in clean room
Teaching Assistant for senior level course: Introduction to Fields and Waves (Fall 2012 - Spring 2013)
Teaching Assistant for senior level course: Power Systems I & III (Summer 2013 - Fall 2013)
SEMICONDUCTOR PROCESSING FACILITIES USED .
Oak Ridge National Laboratory, Center for Nanophase Materials Sciences, Oak Ridge, TN
o GaN/AlGaN Transistor Fabrication/Integration
Motorola Nanofabrication Research Facility, Advanced Materials Engineering Research Institute, FIU
o Graphene Transistor Fabrication/Integration
TECHNICAL SKILLS .
Clean Room Equipment and Techniques:
4.5 years’ experience of working in a Class 100 clean room with: Electron Beam Lithography (EBL),
Photolithography, Proximity Correction Software: GenISys Layout BEAMER; Atomic Layer Deposition
(ALD), Rapid Thermal Annealing (RTA), E-beam Metallization, Reactive Ion Etching (RIE), Wet Etching,
Liftoff, Mask Align, Spin Coating, Wire Bonding, Raman Spectroscopy, and Laser Engraving.
Metrology Tools:
Scanning Electron Microscope (SEM), Atomic Force Microscope (AFM), Surface Profilometer.
Bench Level Tool:
Keithley 2400, Spectrum Analyzer, RF Signal Generator, Oscilloscope and basic tools
On Wafer RF/DC Characterization:
Vector Network Analyzer (S-Parameter), WinCal XE, Semiconductor Parameter Analyzer, Vacuum Wafer
Prober
Simulation/Modeling/CAD Software:
4.5 years’ experience of TCAD Simulation: Silvaco Atlas, Athena; Lumerical FDTD Solution, MATLAB,
PSpice, Aim-Spice and Multisim, Layout Editor and 3D modeling using SketchUp
THz Sources:
Backward Wave Oscillator (BWO) and THz Time Domain Spectroscopy (TDS)
Programming Languages: NI LabVIEW, Assembly Language and C
Chowdhury Al-Amin
PhD Candidate, will graduate and be available on April 2016
Miami, FL 33174
Calam003@fiu.edu
Phone: (305)793-5173
LinkedIn: www.linkedin.com/in/calamin/
2. RELEVANT COURSES .
Fundamentals of Nanofabrication Advanced Solid State Devices
Semiconductor Device Theory Microwave Engineering
Antenna Theory Nanoelectronic Material
Introduction to Nanotechnology Thin Film Engineering
HONORS & AWARDS .
Dissertation Year Fellowship-2015
1st place in Electrical and Computer Engineering at the 2013 Florida International University Scholarly
Forum
Award for Distinguished Scientific Contributions to the First Statewide Graduate Student Research
Symposium at University of South Florida
GPSC, FIU Travel Award-2015
GPSC, FIU Travel Award-2014
Research Assistantship at FIU
Teaching Assistantship at FIU
AFFILIATIONS .
Student Member, IEEE
Student Member, SPIE
PUBLICATIONS .
Journal
1. Al-Amin, C., Karabiyik, M., Vabbina, P., Sinha, R. and Pala, N. , "Graphene FETs with Low-Resistance
Hybrid Contacts for Improved High Frequency Performance," IEEE Transactions on Electron Devices
(Submitted) (2015)
2. Al-Amin, C., Karabiyik, M., Vabbina, P., Sinha, R. and Pala, N. , "Field controlled RF Graphene FETs
with improved high frequency performance," Solid-State Electronics 95, 36-41 (2014)
3. Al-Amin, C., Vabbina, P. K., Karabiyik, M., Sinha, R., Pala, N. and Choi, W. , "Improving High-Frequency
Characteristics of Graphene FETs by Field-Controlling Electrodes," IEEE Electron Device Letter (2013)
Conference
1. Al-Amin, C., Sinha, R., Pala, N. and Choi, W., “Lowering contact resistance of graphene FETs with
capacitive extension of ohmic contacts for enhanced RF performance", SPIE DSS, 2015 (Accepted)
2. Al-Amin, C., Sinha, R., Pala, N. and Choi, W., “Novel graphene FETs with field-controlling electrodes to
improve RF performance", SPIE DSS, 2014