Successfully reported this slideshow.
We use your LinkedIn profile and activity data to personalize ads and to show you more relevant ads. You can change your ad preferences anytime.

Rockwell Profile


Published on

Resume/Portfolio of Steve Rockwell

  • Be the first to comment

  • Be the first to like this

Rockwell Profile

  1. 1. <ul><li>RF / Microwave / mm-Wave Design Expertise </li></ul><ul><ul><li>mm-Wave design & applications (1 thru 100 GHz) </li></ul></ul><ul><ul><li>Gigabit mm-Wave radio front end design & integration </li></ul></ul><ul><ul><li>Actives & Passives characterization & modeling (on-wafer specialist) </li></ul></ul><ul><ul><li>III-V MMIC design </li></ul></ul><ul><ul><li>EM design tools </li></ul></ul><ul><li>20+ years Experience </li></ul><ul><ul><li>Defense / Aerospace / Space / Commercial </li></ul></ul><ul><ul><li>Telecommunications / Semiconductor </li></ul></ul><ul><ul><li>Transistor > IC > Component > Front End > Sub-System > System </li></ul></ul><ul><li>Excellence in Varied Roles: </li></ul><ul><ul><li>Independent Contributor </li></ul></ul><ul><ul><li>Team Leader / Project Leader </li></ul></ul><ul><ul><li>Engineering Manager / Program Manager </li></ul></ul>Steve K. Rockwell - Overview
  2. 2. Key Accomplishments <ul><li>Demonstrated low cost 60GHz high multi-Gbps radio systems and front ends by developing prototype implementations in progressively smaller package sizes from 2003 to 2008. </li></ul><ul><li>Proved feasibility of high speed download in a cell phone by integrating a 60GHz transceiver in a Motorola Q in 2008. </li></ul><ul><li>Led prototype development and systems analysis of 60 GHz backhaul link for Motorola Broadband product division. Completed detailed link availability and budget analysis and supported successful field testing. </li></ul><ul><li>Successfully completed JDA with Phiar Corp. demonstrating metal-insulator electronics in high speed millimeter-wave front end. </li></ul>
  3. 3. Gigabit mm-Wave Radio <ul><li>Long Range for Backhaul & Networks </li></ul><ul><li>Short Range for consumer & portable </li></ul><ul><li>Link Budgets, Design & Analysis, Link Availability, Prototyping </li></ul>
  4. 4. Gigabit mm-Wave Radio – Handset Integration 60GHz TXCVR in a handset Handset Architecture to Download Files to Onboard USB Memory
  5. 5. Radio Systems Design / Analysis
  6. 6. Radio Systems Design / Analysis
  7. 7. Auto Radar Analysis tool to estimate target reflections, resolution, phase noise effects, etc.
  8. 8. MMIC Design <ul><li>30 GHz LNA Design on UMS PH25 (.25um) PHEMT </li></ul><ul><ul><li>Project canceled before going to fab </li></ul></ul><ul><li>8 Watt 3.5 GHz PA Design on Freescale High Voltage PHEMT </li></ul><ul><ul><li>Parts fabricated </li></ul></ul><ul><ul><li>Early/soft breakdown caused high gate leakage preventing full performance </li></ul></ul><ul><li>60 GHz MIIM Detector </li></ul>
  9. 9. Foundry / IC Technology GaAs Foundry Review Summary Compiled in 2002 for 60 GHz front end designs SiGe Foundry Review Summary Compiled in 2005 for mm-Wave GHz design
  10. 10. Passives & Packaging Design Vialess CPW Probe Transition Silicon 5 metal layer stack Integrated LCP on FR4
  11. 11. Device Modeling & Characterization <ul><li>Led on-wafer device characterization in support of modeling team at TI (1991-95) </li></ul><ul><ul><li>GaAs MESFET/HEMT/HBT </li></ul></ul><ul><ul><ul><li>S-Parms up to 50GHZ </li></ul></ul></ul><ul><ul><ul><li>Load / Source Pull </li></ul></ul></ul><ul><li>Lead Device Modeler for MMW projects at Mot Labs (2000-2005) </li></ul><ul><ul><li>Developed transmission line system approach for standard BiCmos silicon </li></ul></ul><ul><ul><li>Lead characterization and benchmarking of emerging mHEMT/ InP / SiGe technologies </li></ul></ul>
  12. 12. Silicon Technologies for mm-Wave
  13. 13. Measurement Expertise <ul><li>VNA </li></ul><ul><ul><li>Developed on-wafer LRM cal for silicon technologies </li></ul></ul><ul><li>Load Pull </li></ul><ul><ul><li>Familiar with load and source pull characterization up </li></ul></ul><ul><li>BERT </li></ul><ul><ul><li>Digital bit error rate up to 10 Gbps </li></ul></ul><ul><li>ICCAP </li></ul><ul><ul><li>Programming for characterization and modeling </li></ul></ul>
  14. 14. EM Simulation MIM Cap Model (Sonnet) Marchand Balun (Sonnet) CPW (HFSS) Asymmetric Rat Race Coupler (Sonnet) Coupled lines in multi-stage MMIC design (Sonnet)
  15. 15. ADS Simulations & Libraries
  16. 16. Team Leader / Project Leader <ul><li>Project Lead on Packaged MMIC design, assembly, and test for space qualified flight deliverables </li></ul><ul><ul><li>Led team of technicians and engineers in assembly and test phase of effort </li></ul></ul><ul><ul><li>Responsible for performance reviews </li></ul></ul><ul><li>Team leader on various research projects </li></ul><ul><ul><li>Led team meetings to set and define goals and track progress </li></ul></ul><ul><ul><li>Represented team’s efforts to business units sponsoring or supporting the research </li></ul></ul><ul><ul><li>Responsible for performance reviews of technicians on project </li></ul></ul>
  17. 17. Engineering Management <ul><li>Lead technical researcher on several projects to demonstrate Gbps wireless radios </li></ul><ul><ul><li>Defined/negotiated goals, objectives, schedule, and roles with business units </li></ul></ul><ul><ul><li>Made presentations and led status meetings with business units </li></ul></ul><ul><ul><li>Coordinated research/design efforts among several engineers and technicians </li></ul></ul><ul><li>Have been responsible for supervising 3-5 technical employees at various stages of career. </li></ul>
  18. 18. Experience & Education <ul><li>Experience </li></ul><ul><ul><li>Motorola Labs, mm-Wave & microwave design and applied research , 9 years </li></ul></ul><ul><ul><li>Motorola Government Business, space payloads, MMIC packaging and test, 4 years </li></ul></ul><ul><ul><li>Texas Instrument Defense and Electronics Division, GaAs MMIC, modeling, characterization, and components, 8 years </li></ul></ul><ul><li>Academics </li></ul><ul><ul><li>BSEE from Arizona State University, 1986 </li></ul></ul><ul><ul><li>Graduate courses at Southern Methodist University and University of Texas at Dallas, 1988-89 </li></ul></ul>
  19. 19. Affiliations & Conferences <ul><li>Professional Society Affiliations </li></ul><ul><ul><li>IEEE since 1983 </li></ul></ul><ul><ul><ul><li>Served as student chapter secretary 1986 </li></ul></ul></ul><ul><ul><ul><li>Serving as MTTS Representative in Phoenix Waves and Devices chapter from 2002 to 2007. </li></ul></ul></ul><ul><ul><ul><li>Serving as Vice Chair of Waves and Devices chapter 2007-2008. </li></ul></ul></ul><ul><ul><ul><li>Chapter Chair, IEEE Waves & Devices (2009 – present) </li></ul></ul></ul><ul><ul><ul><li>Technical reviewer for technical papers for refereed journals for: “IEEE Transactions on Microwave Theory and Techniques”; and “IEEE Microwave and Wireless Components Letters”; </li></ul></ul></ul><ul><li>Conferences </li></ul><ul><ul><li>Co-chair of Digest committee for International Microwave Symposium, Phoenix, AZ, 2001 </li></ul></ul><ul><ul><li>Session Chair, Non-linear Device Modeling, International Microwave Symposium, Seattle, WA, 2002. </li></ul></ul><ul><ul><li>Session Chair, Non-linear Device Modeling, International Microwave Symposium, Philadelphia, PA 2003. </li></ul></ul><ul><ul><li>Served on Technical and Vendor committees of CPMT/WAD annual Devices and Packaging 1 day workshops at ASU from 2001 thru 2008 </li></ul></ul>
  20. 20. Publications <ul><li>GaAs MESFETs fabricated on Si substrates using a SrTiO/sub 3/ buffer layer Eisenbeiser, K.; Emrick, R.; Droopad, R.; Yu, Z.; Finder, J.; Rockwell, S.; Holmes, J.; Overgaard, C.; Ooms, W. IEEE Electron Device Letters , Volume: 23 Issue: 6 , June 2002 Page(s): 300 –302 </li></ul><ul><li>An 8-Watt 3.5 GHz Power Amplifier with Tunable Matching </li></ul><ul><ul><li>Rockwell, Emrick, R.; Bosco, B.;Franson, S.; Miller, M.; Johnson, E.;Crowder, J. </li></ul></ul><ul><ul><li>GaAs IC Symposium, 2002, October 20-23 </li></ul></ul><ul><li>Performance of GaAs on silicon power amplifier for wireless handset applications Escalera, N.; Emrick, R.; Franson, S.; Farber, B.; Garrison, G.; Holmes, J.; Rockwell, S.; Bosco, B. Microwave Symposium Digest, 2002 IEEE MTT-S International , 2002 Page(s): 1031 -1034 vol.2 </li></ul><ul><li>RF Devices Implemented on GaAs on Si Substrates Using a SrTiO 3 Buffer Layer Eisenbeiser, K.; Emrick, R.; Droopad, R.; Yu, Z.; Finder, J.; Rockwell, S.; Holmes, J.; Overgaard, C.; Ooms, W.;Ramdani, J.;Yu, Z.; Hilt, L.;Talin, A.;Edwards Jr, J.; Curless, J.; O’Steen, M. GaAs IC Symposium, 2001, October 21-24 Page(s): 300 –302 </li></ul><ul><li>MMIC Power Amplifier Output Combiner Network Considerations for S-Band Applications Bosco, B.;Emrick, R.; Franson, S.; Rockwell, S. European Microwave Conference, 2001, September 24-28, London </li></ul><ul><li>A 60 GHz Transceiver with Multi-Gigabit Data Rate Capability Bosco, B.;Emrick, R.; Franson, S.; Rockwell, S.; Holmes, J Radio and Wireless Conference, 2004 IEEE </li></ul><ul><li>On-Wafer Characterization De-embedding and Transmission Line Optimization on Silicon for Millimeter-wave Applications Bosco, B.; Rockwell, S. Radio Frequency integrated Circuits (RFIC) Symposium, 2005. Digest of Papers. 2005 IEEE </li></ul><ul><li>Characterization and Modeling of Metal/Double-Insulator/Metal Diodes for Millimeter Wave Wireless Receiver Applications </li></ul><ul><ul><li>Stephen Rockwell, Derrick Lim, Bruce A. Bosco, Jeffrey H. Baker, Blake Eliasson, Keith Forsyth, Michael Cromar </li></ul></ul><ul><ul><li>Radio Frequency integrated Circuits (RFIC) Symposium, 2007. Digest of Papers. 2007 IEEE </li></ul></ul><ul><li>Gigabit Wireless Personal Area Networks: Motivation, Challenges and Implementation </li></ul><ul><ul><li>Stephen Rockwell, Bruce A. Bosco, Robert Lempkowski, Rudy Emrick, John Holmes </li></ul></ul><ul><ul><li>Radio and Wireless Conference 2009 </li></ul></ul>