Designing semiconductor equipment that maintains high levels of precision, speed, and uptime is one difficult job. With interference and contamination constantly threatening the success of your designs, selecting the right electrical conducting and EMI/RFI shielding components is critical.
2. Slide 2
Semiconductor Equipment
• Machines and systems used
to produce and test ICs
Deposition
Etching
Ion implantation
Lithography
More …
• Fabs demand high levels of
precision, speed, and uptime
from this equipment
• Radiated and conducted
interference, contamination,
and other disruptors can
lead to design failure
3. Slide 3
Semicon Equipment: Environments
• Distinct equipment types
Complex process of manufacturing ICs involves
unique fabrication, assembly, and test machines
• Broad service temperatures
-40 °F to 1000 °F (-40°C to 538 °C)
• Aggressive media exposure
Acids, bases
• Demand for longer service intervals to
increase productivity/yield
4. Slide 4
The Challenges
• As fab and test
equipment gets more
advanced, designers need
components that are:
Multi-functional
Able to reduce complexity,
simplify maintenance
Robust
Can withstand tough
conditions
Clean
Produce little to no
shedding/contamination
5. Slide 5
The Canted Coil Spring
• What is it?
A precision component made from
coiled wire with engineered coil
angles
Supplied in welded rings or lengths
Tested/proven to provide effective
shielding in EMI critical applications
Electrical and mechanical
capabilities
Shields, but also holds, latches, and
locks
Completely customizable
Resistance and mechanical forces are
adjustable
Example: Bal Seal Engineering’s
Bal Spring®
canted coil spring
6. Slide 6
Bal Spring® Connecting Performance
• Reliable latching OR locking
connections
• Precise control of connection
forces by engineering hardware
angles, spring design, spring
coil angles, and wire materials
• Capable of 10:1 repeatable
disconnect force to connect
force, and many other
connection configurations
Including “lock and quick release”
(LQR®
), and high force connection
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2
3
8. Slide 8
Bal Spring® EMI Shielding Performance
• Accredited third party
EMC test lab results
confirm shielding
effectiveness of Bal
Spring
Used a 50-Ω characteristic
impedance coaxial
connector with an overall
diameter of 0.725”
Tests followed IEC 61726
Standard
Spring closely matched the
noise floor
10. Slide 10
Bal Spring® Conducting Performance
• High performance
electrical contact element
capable of managing low,
medium, and high current
5,000+ A per spring
• Individual coils maintain
reliable contact, even after
many mating cycles
• Secure electrical
connection under high
vibration and thermal
shock
12. Slide 12
Spring Design Considerations
• Spring material
Chemical compatibility
Corrosive liquids, gases,
plasma, UV
Temperature resistance
Temperature range -40°F
to 1000°F +
• Spring force
Customizable loads
Axial or radial
Consistency over high
number of cycles
13. Slide 13
Spring Design Considerations
• Spring service type
Electrical
Small package with large current
carrying capability
Mechanical
Latching, locking, holding
EMI/RFI Shielding
Broad frequency range
Low magnetic permeability
• Spring configuration
Welded form or length
Groove optimized for service
type
Piston or housing mounted
14. Slide 14
Spring Properties: Impact on Design
• Design adaptability
Capability to meet circular, racetrack and
other unique groove configurations
Welded or length spring forms
• Durability
Consistent performance over time
Increased service life
Suitable for use in low and high
temperature environments
• Ease of installation
Tool-less, modular designs
Streamlined field maintenance,
replacement
• 3-in-1 functionality
Reduced design complexity
Lower transfer impedance
Resistance to compression set
Reliable connection
15. Slide 15
Case Study: Plasma Etcher
Requirements Recommended Solution
• EMI/RFI shielding
• Static interface
• Media: Fluorine‐
based gas
• Bal Spring® canted coil spring energizer
High resistance to compression set
Enables tool‐less assembly
Long term durability
• 316 SS material
Withstand temperature range of 20 °C to 180 °C
Compatible with housing material and media
• Tapered groove design
Ensures proper spring placement and performance
• Configuration
Welded for easy installation in process chamber
doors
16. Slide 16
Summary & Recommendations
• To eliminate costly mistakes and
delays, consider connecting,
conducting and EMI shielding
requirements as part of overall design
• In early design stages, collaborate
with Bal Seal Engineering to:
Get consultative engineering advice
Review hardware design
Evaluate spring environment
Define and estimate mechanical forces
Determine theoretical life cycles
Engage in collaborative spring design
discussion
Custom design a spring that meets all
your system/application requirements
Determine recommended test failure
criteria
Produce high-quality spring prototypes
Scale up to full production
17. Slide 17
Resources & Contact Information
marketing@balseal.com www.balseal.com +1 949.460.2100 Design request form
Karina Chavez
Global Market Manager
Semiconductor Products
P: 949.460.2118
kchavez@balseal.com