• Save
Wafer-Level RF MEMS Devices Characterization in Cryogenic Environment
Upcoming SlideShare
Loading in...5
×
 

Wafer-Level RF MEMS Devices Characterization in Cryogenic Environment

on

  • 1,501 views

In the following presentation, we highlight field-proven, relevant test solutions based on a cryogenic wafer-probe station. Special attention is given to overcoming the calibration standards ...

In the following presentation, we highlight field-proven, relevant test solutions based on a cryogenic wafer-probe station. Special attention is given to overcoming the calibration standards instability, contact repeatability and reliability issues caused by the extreme environmental conditions. We will present the solution that enabled characterizing of RF MEMS devices at cryogenic condition with the benchmarking level of measurement accuracy and confidence.

Statistics

Views

Total Views
1,501
Views on SlideShare
1,353
Embed Views
148

Actions

Likes
0
Downloads
0
Comments
0

2 Embeds 148

http://blog.cmicro.com 92
http://www.cascademicrotech.com 56

Accessibility

Upload Details

Uploaded via as Microsoft PowerPoint

Usage Rights

© All Rights Reserved

Report content

Flagged as inappropriate Flag as inappropriate
Flag as inappropriate

Select your reason for flagging this presentation as inappropriate.

Cancel
  • Full Name Full Name Comment goes here.
    Are you sure you want to
    Your message goes here
    Processing…
Post Comment
Edit your comment

Wafer-Level RF MEMS Devices Characterization in Cryogenic Environment Wafer-Level RF MEMS Devices Characterization in Cryogenic Environment Presentation Transcript

  • 16th IEEE European Test Symposium May 23-27, 2011Wafer-Level RF MEMS DevicesCharacterization in CryogenicEnvironmentGavin Fisher, Andrej Rumiantsev,Frank-Michael Werner, Stojan Kanev
  • Outline RF MEMS Test Challenges System Solution for RF MEMS Measurement Examples Conclusion
  • RF MEMS Test Challenges MEMS device: microsystem based planar fabrication technology combining mechanical and electrical functions (multi-physics interaction) Testing and characterization are extremely sensitive to ambient parameters Tests require: – Controlled (closed) environment – RF and microwave interface For RF testing thermal stability of probes and cables is essential to maintain calibration stability – Core solution, Keep probes and cables at DUT temperature – Calibration monitoring to provide accurate feedback of calibration state
  • RF MEMS Test Challenges (cont.) Probing of whole wafer, wafer pieces and dies Maintenance of calibration substrates Contact reliability Contact repeatability Electrical performance of RF probes Temperature stability of calibration standards Integration with various test instrumentation
  • Outline RF MEMS Test Challenges System Solution for RF MEMS Measurement Examples Conclusion
  • Putting a Prober Inside a Vacuum Chamber Reserve 4x RF Feedthrough 67 GHz Reserve for Reserve PH #8 for PH #9 DC Triax Fixed cold shield 4x DC Triax Feedthrough PH #6 PH #3 67GHz DC TriaxPH #5 PH #267GHz 67GHz PH #4 PH #1DC Triax 67GHz Removable cold shield PH #7 Reserve DC Triax for PH #10 Venting Valve Y X Z Chuck Stage Control
  • Putting a Prober Inside a Vacuum ChamberEnables:TemperatureVacuumGases composition Applications:High pressure RF MEMSLight and sound Emerging MEMSshielding Micro fuel cells MicrobolometersEMC GyroscopesHumidity Accelerometers Pressure sensors
  • Cryogenic System for Device Characterization Temperature range: 4K … 675K Up to 8 positioners Low signal IV/CV: <100fA High frequency: up to 67GHz Integration kits for Agilent and Keithley EM shielding and light tightness
  • Motion Monitoring in Cryogenic Environment Integration with Polytec MSA-500 Micro System AnalyzerExample of RF MEMS Switch
  • Features – Wafer, Sample and Die Carriers Carrier solution for Manual Systems prepared for fixing RF calibration substrates Special carrier solution for Special carrier solution for dicedStandard 200 mm wafer carrier fixing multiple single substrates pieces with various shapes
  • Features – Vacuum Positioners Easy and reliable probe landing Short and stiff arms Manipulation from outside by rotary feedthroughs Magnetic foot (standard) for highest flexibility in probe configuration 12 mm XYZ movement range Arms: – DC triaxial flex – DC for AP&T – RF for IZI Probe etc. – DC&RF for Multi IZI Probes
  • Features – Vacuum Positioners DC probes (triax, coax) AP&T probe for CV RF Probe up to 67GHz Multi IZI Probes Cryogenic probe arms with active probe and cable cooling to ensure stable measurements High vacuum feedthroughs Calibration substrates
  • Outline RF MEMS Test Challenges System Solution for RF MEMS Measurement Examples Conclusion
  • System Features: System Drift, 4 Hours |Sij - Sij|/|Sij| and |Sii - Sii| 0.15 System Drift, 4K System Drift, RT 0.10 0.05 0 0 10 20 30 40 Frequency (GHz) System drift @ 4K is comparable with the room temperatureH. Geissler, A. Rumiantsev, S. Schott, P. Sakalas, and M. Schroter, "A novel probe station for helium temperature on-wafermeasurements " in ARFTG Microwave Measurements Conference-Fall, 68th, 2006, pp. 67-73.
  • Wincal XE – Cal monitoring alarms Wincal can perform a spot measurement and provide alarm if system has drifted beyond limits
  • Measurement aid – Wincal XE Probing at cryogenic temperatures can be challenging and it is helpful to be able to check that good contact is established Wincal XE can do this with a single button press
  • Wincal XE Advanced reporting Wincal can perform pad parasitic removal de- embedding and parameter extraction“on the fly”
  • Temperature Stability of Standards Line (Thru) Load Temperature stable wafer-level calibration standards for accurate measurements down to 4KA. Rumiantsev, R. Doerner, and P. Sakalas, "Verification of wafer-level calibration accuracy at cryogenic temperatures " inARFTG Microwave Measurements Conference-Fall, 68th, 2006, pp. 134-140.
  • Cryogenic |Z| Probe Contact Repeatability @ 4K First Contact Second Contact 0 DB(|S[1,1]|) 0 Thru DB(|S[1,1]|) -10 -10 Thru_2 -20 DB(|S[2,2]|) -20 Thru DB(|S[2,2]|) -30 -30 Thru_2 -40 -40 -50 -50 -60 -60 -70 -70 -80 -80 -90 -90-100 -100 0 10 20 30 40 50 0.04 10.04 20.04 30.04 40.04 50 Frequency (GHz) FREQUENCY (GHz)Excellent contact repeatability guarantees reliable andtrustable results *Measured with thru standard
  • RF MEMS Switch Procedure: – S parameters measurement before cycling – C(V) measurement – Cycling @ 100 Hz, unipolar, 55V, 50% duty cycle – S-parameters after cycling To do and outcome : – Extraction of ∆V vs. cycles – Pull-in Pull-out parameters dependence on the environment conditions
  • CV Curves for Different Testing Conditions 1 .2 1 (1 ) 2 1 .0 (2 ) 3 10 (3) 4 (4) 0.8 C (p F ) 0.6∆V (V) 0.4 1 0.2 0.0 10 1 00 1 000 -80 -60 -40 -2 0 0 20 40 60 80 N b o f c yc le s Vo ltag e (V) 1: Room ambient @ ~296°C, 45% RH 2: Vacuum @ 1.4E-5 mbar – 296K 3: N2 @ 1.02 atm – 296K 4: Vacuum @ 2.2E-6 mbar – 223K
  • S-Parameters for Different Testing Conditions B E F O R E C YC L IN G B E F O R E C YC L IN G 0 0.0Before cycling -0.5 -2 0 -1 .0 S 1 1 (d B ) S 2 1 (d B ) -1 .5 -40 (1 ) (1 ) (2 ) (2 ) -2 .0 (3) (3) -60 (4) (4) -2 .5 0 10 20 30 40 50 60 -3.0 0 10 20 30 40 50 60 GHz GHz 0.0 0After 1000 cycles -0.5 -2 0 -1 .0 S 2 1 (d B ) S 1 1 (d B ) (1 ) -1 .5 -40 (1 ) (2 ) (2 ) (3) -2 .0 (4) (3) (4) -60 -2 .5 0 10 20 30 40 50 60 0 10 20 30 40 50 60 GHz GHz
  • Outline RF MEMS Test Challenges System Solution for RF MEMS Measurement Examples Conclusion
  • Conclusion Wafer-level testing of RF MEMS significantly reduces fabrication cost and time to market Cryogenic Probe Systems covering the whole range of RF MEMS test requirements are available System design and measurement know-how of Cascade Microtech provides you with “environment independent” measurement accuracy, repeatability and confidence in your results
  • Acknowledgement Jason Ruan, Alexandre Rumeau, Laurent Bary and Fabio Coccettifrom CNRS, LAAS, Toulouse (France) for excellent support with the measurement results of the RF Switches
  • Questions?If you have any questions or comments, pleasecontact:Frank-Michael WernerBusiness ManagerVAC / CRYO Systems and MEMS TestE-mail: frank-michael.werner@cmicro.comOffice: +49 (35240) 73-330Mobile: +49 151 1210 8668